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Drive）とは根本的に異なります。OptiNANDは、HDDの制御基板上にiNAND（UFSインターフェースの組み込みフラッシュメモリ）を搭載し、**メタデータ**と**制御プレーン**の処理をオフロードする技術です。","quote_start":68,"quote_end":199,"text_sha256":"fef5dfb1a1428605347e4e4ae05cd05dfbc91dbd3982c20f0d8505b0a05ad37a","block_sha256":"fef5dfb1a1428605347e4e4ae05cd05dfbc91dbd3982c20f0d8505b0a05ad37a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_01fd9ef5-e950-489e-8feb-7c8ac4a60ef9/#blk_e57ecf8a-c8c9-442f-ace6-b356eee176a3"},{"id":"occ_f263283665c53775bfe241df","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_20a0be95-482f-4726-bc91-d2189e9636b5","section_id":"sec_c5607d03-f325-47f6-8f5e-4d3c2bbb0958","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":42,"end":44,"exact":"基板","quote":"- 演算器とキャッシュは上下へ近接\n- HBMは横へ大容量接続\n- パッケージ外へは基板経由\n- 光I/Oはエッジへ配置","quote_start":0,"quote_end":60,"text_sha256":"d399cdc5212899cc7a627ee54e06b5d3c8a6a16e957ad52fa0607dd1b0de45f0","block_sha256":"d399cdc5212899cc7a627ee54e06b5d3c8a6a16e957ad52fa0607dd1b0de45f0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_20a0be95-482f-4726-bc91-d2189e9636b5"},{"id":"occ_9948a1f8c1859149503402be","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_6221f1e6-8c7b-46cb-8f66-472621bcb981","section_id":"sec_02716166-71cc-45f6-815a-ecae941b467f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":76,"end":78,"exact":"基板","quote":"局所温度、熱勾配、機械応力が性能と信頼性へ影響する。熱解析はチップ単体ではなく、ダイ、接合、インターポーザー、基板、冷却器までを含めて行う必要がある。([login.cadence.com](https://login.cadence.com/content/dam/cadence-www/global/en_U","quote_start":21,"quote_end":178,"text_sha256":"0d4a6d91c17186215621d6b5a0c07e5aabe309d6b14776e9954e3bb05b9e21f2","block_sha256":"0d4a6d91c17186215621d6b5a0c07e5aabe309d6b14776e9954e3bb05b9e21f2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_6221f1e6-8c7b-46cb-8f66-472621bcb981"},{"id":"occ_91fd3b8fd945f0540412dab7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_6bf4aedb-7f34-4c22-bdb1-c589ee5239f3","section_id":"sec_7a28f7eb-dc02-488b-ad38-dc43d4dce31a","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":138,"end":140,"exact":"基板","quote":"         │\n下層：NoC・I/O・電源・制御\n              │\n      パッケージ基板\n```","quote_start":83,"quote_end":144,"text_sha256":"353b44870b0a5787c9eb42acf97483367c473ce0bcf1a8ee58bdaef1c6fd5001","block_sha256":"353b44870b0a5787c9eb42acf97483367c473ce0bcf1a8ee58bdaef1c6fd5001","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_6bf4aedb-7f34-4c22-bdb1-c589ee5239f3"},{"id":"occ_af8130c57671e55530a4e163","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_dae28387-9b50-48d2-b4e9-0ec53726770b","section_id":"sec_d189e7e6-dbe2-46ae-a11a-e84080f85c69","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":86,"end":88,"exact":"基板","quote":" Bonding\n非常に近い\n\n\nマイクロバンプ3D\n中程度\n\n\n2.5Dインターポーザー\nより長い\n\n\n有機基板\n最も長い\n```","quote_start":31,"quote_end":97,"text_sha256":"527ebcd9784e2fecf9900efb9b63a370f8fcfc899ed12662c50dc6dacff91b11","block_sha256":"527ebcd9784e2fecf9900efb9b63a370f8fcfc899ed12662c50dc6dacff91b11","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_dae28387-9b50-48d2-b4e9-0ec53726770b"},{"id":"occ_01e5e1fc7fb180e90c4d5826","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_f185ae76-8aab-4392-b6a3-c6d7b90fcf98","section_id":"sec_bcc78d26-8f0a-456b-ab15-2014427f2f0b","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":383,"end":385,"exact":"基板","quote":"Chiplet\nPCIe／CXL／UALink系I/O\n\n────────────────────\nパッケージ基板・冷却・電源\n```","quote_start":328,"quote_end":395,"text_sha256":"eddc9a4122b36c3cefcf9946c1df14d35231bbda9bc92013c3055d7a3f9ab165","block_sha256":"eddc9a4122b36c3cefcf9946c1df14d35231bbda9bc92013c3055d7a3f9ab165","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_f185ae76-8aab-4392-b6a3-c6d7b90fcf98"},{"id":"occ_e5c14221ab1ffb0f784015f0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_f1c4f273-2d11-48f6-aacf-dd9cf68fbf5f","section_id":"sec_00e8949d-9524-4c72-9d68-6173dc83fd9a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":23,"end":25,"exact":"基板","quote":"- ドライバー電力\n- イコライザー電力\n- 基板損失\n- ケーブル損失","quote_start":0,"quote_end":36,"text_sha256":"2165344d31608ecd6ef18e679441386a330847b1cce20a1a0f51592d1e281138","block_sha256":"2165344d31608ecd6ef18e679441386a330847b1cce20a1a0f51592d1e281138","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_f1c4f273-2d11-48f6-aacf-dd9cf68fbf5f"},{"id":"occ_932086cdcf7cbe128ab41707","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_1ad317fc-495f-4082-92b7-23cc01d55711","section_id":"sec_75e61cb7-99b8-47b4-9c68-b5b9cf69cade","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":73,"end":75,"exact":"基板","quote":"なシリコンインターポーザーへ載せれば最適になるわけではない。逆に、UCIe-Aの弱い低電圧ドライバーで長い有機基板配線を安定して駆動できるとは限らない。","quote_start":18,"quote_end":94,"text_sha256":"27e1d8d065aec122d79ac67f4ecaf2babfb654e9fe45b127b1cfcef589515f30","block_sha256":"27e1d8d065aec122d79ac67f4ecaf2babfb654e9fe45b127b1cfcef589515f30","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_1ad317fc-495f-4082-92b7-23cc01d55711"},{"id":"occ_a4a30b0f8ff1b6def6b42afa","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_1d971701-45c7-4f08-bd61-8b48869e046d","section_id":"sec_f0a94295-2ee4-41f2-ac2d-2e5b784d9cde","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":262,"end":264,"exact":"基板","quote":"現するのではなく、CXL.cacheやCHIなどの上位プロトコルが担当する。\n- **UCIe-S**は、有機基板を使う比較的長距離・低コストな2D接続向けである。\n- **UCIe-A**は、インターポーザーやブリッジを使う短距離・高密度な2.5D接続向けである。\n- **UCIe-3D**は、Hybrid B","quote_start":207,"quote_end":364,"text_sha256":"7863c77a7789b5af9b7017b121dda2ad5da39128807ddce4299ed82e0ca42ebf","block_sha256":"7863c77a7789b5af9b7017b121dda2ad5da39128807ddce4299ed82e0ca42ebf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_1d971701-45c7-4f08-bd61-8b48869e046d"},{"id":"occ_fa87a2e5a685caba553be8d3","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_266e6d27-d5aa-468a-b4d1-5ea65692cd08","section_id":"sec_7236bd50-0f80-4c2a-824c-17b94368ca18","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":173,"end":175,"exact":"基板","quote":"───┘\n════════════════════════════════\n          有機パッケージ基板\n```","quote_start":118,"quote_end":179,"text_sha256":"d8fadc372eb8e0c44fdd9c615bc006ab6e18c1962e71d7db7d8401be7732ff93","block_sha256":"d8fadc372eb8e0c44fdd9c615bc006ab6e18c1962e71d7db7d8401be7732ff93","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_266e6d27-d5aa-468a-b4d1-5ea65692cd08"},{"id":"occ_c40bf5724de9e0021f20f3f9","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_28d206b2-d844-4264-aa5d-a3705c7eee26","section_id":"sec_db91fd4a-af29-4987-8be0-62f32163079b","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":27,"end":29,"exact":"基板","quote":"```\nUCIe-S\n\nダイ\n ↓\nバンプ\n ↓\n有機基板内の複数配線層\n ＝＝＝＝＝＝＝＝＝＝＝＝\n ↓\n相手側ダイ\n```","quote_start":0,"quote_end":63,"text_sha256":"4e1cd300300ee405f9e71c57f8d63d15d5f966c863b93b93cb65125739299c6d","block_sha256":"4e1cd300300ee405f9e71c57f8d63d15d5f966c863b93b93cb65125739299c6d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_28d206b2-d844-4264-aa5d-a3705c7eee26"},{"id":"occ_15b2de50d7e037a0076cb4da","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_2b545772-c54e-4a8c-9c93-0a03217fcf06","section_id":"sec_0b7529f7-d68d-4e06-8325-f8486dfab410","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"UCIe-Sは低コストな有機基板接続を可能にする。","quote_start":0,"quote_end":25,"text_sha256":"06d8ba822063c8227a16d481100f900dcddc40827f64537bf05efeae3f5fa47a","block_sha256":"06d8ba822063c8227a16d481100f900dcddc40827f64537bf05efeae3f5fa47a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_2b545772-c54e-4a8c-9c93-0a03217fcf06"},{"id":"occ_6ad2d97aff3723fee573b4b3","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_6a57b108-48d4-49fe-8e83-54fe08a6d335","section_id":"sec_996283cc-6452-4117-a950-15ceeddd3a27","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":194,"end":196,"exact":"基板","quote":"ニング\n              ↓\nPackage Channel\nバンプ・RDL・インターポーザー・有機基板\n```","quote_start":139,"quote_end":200,"text_sha256":"e018297b0724556c69482b4596b69d0e4622e8ce05e51f9841c09c0a7b012ea8","block_sha256":"e018297b0724556c69482b4596b69d0e4622e8ce05e51f9841c09c0a7b012ea8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_6a57b108-48d4-49fe-8e83-54fe08a6d335"},{"id":"occ_7e5da0dab36637d64716ede6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_8c8aa7f4-3c4b-4947-899b-c19f43a1fc8b","section_id":"sec_db91fd4a-af29-4987-8be0-62f32163079b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"有機基板では、シリコンインターポーザーほど細かな配線を形成できない。","quote_start":0,"quote_end":34,"text_sha256":"48850ee66804d2aef27b42165b203f655e809cbcae3f9725e5a11b14519a0769","block_sha256":"48850ee66804d2aef27b42165b203f655e809cbcae3f9725e5a11b14519a0769","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_8c8aa7f4-3c4b-4947-899b-c19f43a1fc8b"},{"id":"occ_b0f5c42b9b57e9b46ad206bb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_96b10e1e-fceb-4c07-8ed8-4cf95f7c1f1b","section_id":"sec_bc01db18-7b44-44d6-acfd-c3ed11b2f5ce","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":132,"end":134,"exact":"基板","quote":"tandard Package | Advanced Package | 3D積層 |\n| 主な配線 | 有機基板 | インターポーザー、ブリッジ、RDL | Hybrid Bonding |\n| 接続距離 | 比較的長い | 短い | 極めて短い |\n| 接続密度 | 低～中 | 高い | 非常に高い |\n| 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高級T-glass\n- CCL\n- 銅\n- 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Bridgeを埋め込む。","quote_start":0,"quote_end":47,"text_sha256":"4db4c22e17bf2bc8a4e26ee25f7b2a340d9839724de19d9da5c3ffda3e1411b6","block_sha256":"4db4c22e17bf2bc8a4e26ee25f7b2a340d9839724de19d9da5c3ffda3e1411b6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_30b9f8ef-6fc3-4565-81f8-daf86d455772"},{"id":"occ_dcf49b3ce9b3bfb06d433810","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_3384392e-2a3d-4618-b4ef-6f88a8754f29","section_id":"sec_53bb81fe-ab50-4ba6-8d73-dd939830856a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":22,"end":24,"exact":"基板","quote":"**微細配線を作る能力と、Bridgeを巨大基板へ機械的に配置する能力は別問題**","quote_start":0,"quote_end":41,"text_sha256":"1d34254f75358dc44fa651531166fd66aa2f219eee25f4d291eb2e4ff6e048ff","block_sha256":"1d34254f75358dc44fa651531166fd66aa2f219eee25f4d291eb2e4ff6e048ff","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_3384392e-2a3d-4618-b4ef-6f88a8754f29"},{"id":"occ_473798f0e1e0736fc0ac0078","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_3f8a12a6-bf58-468b-b346-0db3f68796b5","section_id":"sec_4d645e38-d961-46ef-8cd7-aac891b07362","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"通常の有機基板を使いながら、**高速・高密度接続が必要な部分だけ小さなシリコンブリッジを埋め込む。**","quote_start":0,"quote_end":51,"text_sha256":"39b0ad5a15e124386d4130129e6742df7fc59364a2c8c2f36b0fc6270b0a8850","block_sha256":"39b0ad5a15e124386d4130129e6742df7fc59364a2c8c2f36b0fc6270b0a8850","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_3f8a12a6-bf58-468b-b346-0db3f68796b5"},{"id":"occ_47e91b56c7c4c026a00632a5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_4860dc34-3ffd-4e94-82c6-22850ed89458","section_id":"sec_4089da87-979b-4861-a813-3b6114738a98","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":38,"end":40,"exact":"基板","quote":"**Silicon Bridgeそのものを製造することから、巨大なパッケージ基板へBridgeを正確に埋め込み、それを量産することへ移っている。**","quote_start":0,"quote_end":74,"text_sha256":"757881dc9cd95a062c0dba34496d72bfd363853ec70f51e2ba852b75f22963c0","block_sha256":"757881dc9cd95a062c0dba34496d72bfd363853ec70f51e2ba852b75f22963c0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_4860dc34-3ffd-4e94-82c6-22850ed89458"},{"id":"occ_55a0b04ccfe0f39031117f84","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_667eed97-4acd-4948-abf2-392bda37780b","section_id":"sec_0156b33c-cbf0-43a5-a0cf-a7abe865741c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"EMIBは基板内へ埋め込まれているため、従来構造では電源配線がEMIBを迂回しなければならない。","quote_start":0,"quote_end":48,"text_sha256":"7b2746481b6f9af38adcf8af266a0a7976fb847b25c8d03437bc7785e304af31","block_sha256":"7b2746481b6f9af38adcf8af266a0a7976fb847b25c8d03437bc7785e304af31","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_667eed97-4acd-4948-abf2-392bda37780b"},{"id":"occ_e8eb2fdebc1ac808ffa00657","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_6e74208b-d025-489a-8502-a54c5968259c","section_id":"sec_52f833de-8786-4ba6-befb-6b3402bf2499","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":8,"end":10,"exact":"基板","quote":"## 第16章　基板メーカーが重要になる理由","quote_start":0,"quote_end":22,"text_sha256":"1971b216fd15af8e0804ab1f002ea2fb9b71553831f44f204c32e14aee63adc3","block_sha256":"1971b216fd15af8e0804ab1f002ea2fb9b71553831f44f204c32e14aee63adc3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_6e74208b-d025-489a-8502-a54c5968259c"},{"id":"occ_2e01acb1b124c0bb8ea3af03","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_73cdb549-c0bb-462c-8a20-5d3df2881ec6","section_id":"sec_117f6fec-51b8-48ed-9961-07d39ee93f16","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"有機基板が巨大化すると、","quote_start":0,"quote_end":12,"text_sha256":"ab1dc3513e2bdfbc36ee9974ffa333a6a186dd1e4686ab15eb9d8bf372c27565","block_sha256":"ab1dc3513e2bdfbc36ee9974ffa333a6a186dd1e4686ab15eb9d8bf372c27565","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_73cdb549-c0bb-462c-8a20-5d3df2881ec6"},{"id":"occ_0a24615482abc3a6def123c1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_7d37ea06-97b6-4d60-b390-980192788f8a","section_id":"sec_aef86a99-2e73-4fec-917b-3aed44081e53","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"- 設備稼働率\n- 材料費\n- 基板ASP\n- 粗利益率\n- 顧客への供給能力","quote_start":0,"quote_end":39,"text_sha256":"4558151e1346f972b52fc2c1c413b59fc33f7ed1986e89bbf2be25f6124182ce","block_sha256":"4558151e1346f972b52fc2c1c413b59fc33f7ed1986e89bbf2be25f6124182ce","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_7d37ea06-97b6-4d60-b390-980192788f8a"},{"id":"occ_f74c95b5041b5cb2e6ff3c20","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_808d6a4e-b265-4aa3-b835-2a45e2a55dbe","section_id":"sec_16a3eaba-7e3f-4d90-bc78-6627b2fbe80c","layer":"body","character_id":null,"count":1,"matched_aliases":["T-glass"],"evidence":{"text_basis":"markdown","start":16,"end":23,"exact":"T-glass","quote":"Unimicronは2026年にT-glassなど高級substrate材料の供給制約を指摘している。([TechNews 科技新報](https://technews.tw/2026/02/25/emib-t/?utm_source=chatg","quote_start":0,"quote_end":123,"text_sha256":"067a5a6656088c07ac8ee866dbec306c6d6f24ecbc20b8b886ba03f8d3003b68","block_sha256":"067a5a6656088c07ac8ee866dbec306c6d6f24ecbc20b8b886ba03f8d3003b68","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_808d6a4e-b265-4aa3-b835-2a45e2a55dbe"},{"id":"occ_629ce8aac8c92f73fc6e04d6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_81b3fde0-84ff-432b-963b-02779d81ba43","section_id":"sec_de6ff487-20e9-4696-803d-3780a749275a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":0,"end":2,"exact":"基板","quote":"基板がわずかに反っただけでも、中央部と端部で高さが変わる。","quote_start":0,"quote_end":29,"text_sha256":"5cbd88196270e1c74f7a50a8d141ba1b7d061384e186111a6c0e86d9ba1acaff","block_sha256":"5cbd88196270e1c74f7a50a8d141ba1b7d061384e186111a6c0e86d9ba1acaff","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_81b3fde0-84ff-432b-963b-02779d81ba43"},{"id":"occ_e4caac6e0489da1f3bc92f68","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_86c386b7-c808-477b-93a5-b1c54941dcc5","section_id":"sec_f53c84c7-20b2-48e3-ab4e-d9f32454bdd7","layer":"code","character_id":null,"count":1,"matched_aliases":["T-glass"],"evidence":{"text_basis":"markdown","start":65,"end":72,"exact":"T-glass","quote":"WoS\n ↓\n不足\n\n\n将来\n\nAdvanced Packaging\n ↓\nABF substrate\n ↓\nT-glass\n ↓\nHBM\n ↓\nTesting\n ↓\nThermal\n```","quote_start":10,"quote_end":105,"text_sha256":"f483003014c811c70276adaad42d8457f815cd3b9499e262e0c4974170d3027d","block_sha256":"f483003014c811c70276adaad42d8457f815cd3b9499e262e0c4974170d3027d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_86c386b7-c808-477b-93a5-b1c54941dcc5"},{"id":"occ_9dcd03e9dbb7fe41b5da0d9e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_947399d1-158a-4ae3-9a7c-de38a0752801","section_id":"sec_52f833de-8786-4ba6-befb-6b3402bf2499","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":53,"end":55,"exact":"基板","quote":"ただしIntelのより広いEMIB supply chainにはAT&Sなども含まれるため、「EMIB-T基板は世界でこの3社しか作れない」と理解するのは適切ではない。","quote_start":0,"quote_end":84,"text_sha256":"b9af81426a45b3d346d40944bd225b4ea24819310d7cd11046ee6243db3771f2","block_sha256":"b9af81426a45b3d346d40944bd225b4ea24819310d7cd11046ee6243db3771f2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_947399d1-158a-4ae3-9a7c-de38a0752801"},{"id":"occ_61ce962a9c71003f75fb4679","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_97f842d6-3305-41b5-813a-a45ba454de0b","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["T-glass"],"evidence":{"text_basis":"markdown","start":85,"end":92,"exact":"T-glass","quote":" assembly yield、HBM qualification、Bridge数、ABF capacity、T-glass、顧客前払い、backlog**","quote_start":30,"quote_end":108,"text_sha256":"05af2df9ddbf2ca4dba4daad7e8f0cefdf451778f909c589f9b5de941b9a31ae","block_sha256":"05af2df9ddbf2ca4dba4daad7e8f0cefdf451778f909c589f9b5de941b9a31ae","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_97f842d6-3305-41b5-813a-a45ba454de0b"},{"id":"occ_9a7b686d519b13976ca880ff","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_cbfbf3dd-c21d-49bb-b6d1-a652897d5d2f","section_id":"sec_16a3eaba-7e3f-4d90-bc78-6627b2fbe80c","layer":"body","character_id":null,"count":1,"matched_aliases":["T-glass"],"evidence":{"text_basis":"markdown","start":9,"end":16,"exact":"T-glass","quote":"## KPI 8　T-glass supply","quote_start":0,"quote_end":23,"text_sha256":"7b318d8f0b11bec48f63e5b0d2b0746cc658dbb038e4221eac0ab46a74952a55","block_sha256":"7b318d8f0b11bec48f63e5b0d2b0746cc658dbb038e4221eac0ab46a74952a55","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_cbfbf3dd-c21d-49bb-b6d1-a652897d5d2f"},{"id":"occ_c58ac02381d7747e477f7bba","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_ce2542a7-e05d-4a89-bf0e-345e026b898c","section_id":"sec_6cfe0fb4-a41b-4823-8d54-dbd0caaa63cc","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"## 第14章　EMIB-T基板歩留まり50%問題","quote_start":0,"quote_end":25,"text_sha256":"a333ef10344953ed0cbfd1f648c1c678ade5c8b9f0db3896ad1916a4d21550ac","block_sha256":"a333ef10344953ed0cbfd1f648c1c678ade5c8b9f0db3896ad1916a4d21550ac","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_ce2542a7-e05d-4a89-bf0e-345e026b898c"},{"id":"occ_e04b55af2bbaae834a105fba","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_d444381b-9489-4874-a1a6-b13bed5ff3f1","section_id":"sec_397a87cc-96e2-4b0e-ab26-52ce3f26c9b0","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"のように基板が反る。","quote_start":0,"quote_end":10,"text_sha256":"ecd0506364e29722b96d087214e2b6fe204c4fa323fdcd4cdfe713c009c2b3b7","block_sha256":"ecd0506364e29722b96d087214e2b6fe204c4fa323fdcd4cdfe713c009c2b3b7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_d444381b-9489-4874-a1a6-b13bed5ff3f1"},{"id":"occ_bddde2067e5ed705625e681b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_e54e1bd1-a853-47fe-8975-4ab9b874799f","section_id":"sec_de6ff487-20e9-4696-803d-3780a749275a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":10,"end":12,"exact":"基板","quote":"**120mm級巨大基板＋25µm級接続**","quote_start":0,"quote_end":22,"text_sha256":"684860fb64a602635b9c8cb993448c3aef0bacee08c875d693d273c9439aed24","block_sha256":"684860fb64a602635b9c8cb993448c3aef0bacee08c875d693d273c9439aed24","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_e54e1bd1-a853-47fe-8975-4ab9b874799f"},{"id":"occ_a988555ad93e2307c3c84381","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_f179599e-c66f-455b-9ff9-eddc0e4e673c","section_id":"sec_3e639240-12d6-4b49-b362-1f32424a2e54","layer":"body","character_id":null,"count":2,"matched_aliases":["CCL","T-glass"],"evidence":{"text_basis":"markdown","start":8,"end":15,"exact":"T-glass","quote":"**ABF → T-glass → CCL → substrate capacity**","quote_start":0,"quote_end":44,"text_sha256":"781b95136c7bd6797fe67c7847a5ebd208e98ec21242fb126576efc6c1d666a8","block_sha256":"781b95136c7bd6797fe67c7847a5ebd208e98ec21242fb126576efc6c1d666a8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_f179599e-c66f-455b-9ff9-eddc0e4e673c"},{"id":"occ_3a661c2cbf573b03ba566d7d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0d8f6bbc-636e-4d8d-8ba4-920514c5aff2","work_id":"wrk_c5776fd4-c51f-4d7f-811d-7493ad4e5e3f","block_id":"blk_e170b9e8-3206-476c-8f2f-50a67934dfc0","section_id":"sec_200e060a-102a-4365-b986-0288208e4cce","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":46,"end":48,"exact":"基板","quote":"- **現行実装の上限は8スタック**が主流（B200、MI3xx、Gaudi 3 など）。基板サイズ／シリコンインターポーザ面積（“ビーチフロント”）／熱設計が制約。\n- **次の増加ポイントは12スタック**：TSMCはCoWoS-Lの拡張で\\*\\*“最大12 HBMスタック”\\*\\*を公式","quote_start":0,"quote_end":148,"text_sha256":"612aa1c1e44fe2811f918bda678732919569bccdd2596d44ca684d8c1bff775d","block_sha256":"612aa1c1e44fe2811f918bda678732919569bccdd2596d44ca684d8c1bff775d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0d8f6bbc-636e-4d8d-8ba4-920514c5aff2/#blk_e170b9e8-3206-476c-8f2f-50a67934dfc0"},{"id":"occ_058034456d2705e39bc89b18","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0e8f98f5-ea3d-4d3b-847a-a6846f2569e9","work_id":"wrk_dcad52cb-128a-418b-a311-a794c37abfc3","block_id":"blk_246259b1-9f3c-4452-9689-8498500c3dbf","section_id":"sec_304743fb-6004-4c21-844f-f9853cdafab8","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":141,"end":144,"exact":"PCB","quote":"Bladeに合計72基のNVLink 7 Switchを配置する構成とされています。GPU側とスイッチ側は大型PCBミッドプレーンと銅フライオーバー配線で接続するという分析です。これはNVIDIA公式の詳細仕様ではなく、試作機とサプライチェーンに基づく推定です。([newsletter.semianalysis.c","quote_start":86,"quote_end":244,"text_sha256":"38e401cd34de26512cc20fe2fbee8a5a8b84e72b77090d84ca6c6c4b441e2a01","block_sha256":"38e401cd34de26512cc20fe2fbee8a5a8b84e72b77090d84ca6c6c4b441e2a01","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0e8f98f5-ea3d-4d3b-847a-a6846f2569e9/#blk_246259b1-9f3c-4452-9689-8498500c3dbf"},{"id":"occ_fd1d8a7d29ea892c427c015c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_0e8f98f5-ea3d-4d3b-847a-a6846f2569e9","work_id":"wrk_dcad52cb-128a-418b-a311-a794c37abfc3","block_id":"blk_f0c01638-df09-4201-948c-f6ed72876d46","section_id":"sec_304743fb-6004-4c21-844f-f9853cdafab8","layer":"code","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":98,"end":101,"exact":"PCB","quote":"の単一NVLinkドメイン\n縦置きCompute Blade\n背面NVLink Switch Blade\n大型PCBミッドプレーン\n基本的に銅Scale-up\n800VDC電源\n```","quote_start":43,"quote_end":135,"text_sha256":"4b7480dcc159316239435eb569199e78cd5036eb11e0d008534a2718b24e87a5","block_sha256":"4b7480dcc159316239435eb569199e78cd5036eb11e0d008534a2718b24e87a5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0e8f98f5-ea3d-4d3b-847a-a6846f2569e9/#blk_f0c01638-df09-4201-948c-f6ed72876d46"},{"id":"occ_1c7f9c8f4b7945089aa86cd2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1246df84-dae2-49be-ab7b-94b8c8902078","work_id":"wrk_850e2d1d-c6db-443c-b02a-baac2573c6d3","block_id":"blk_01f918d5-6b0c-4973-8a55-7288e0f83850","section_id":"sec_e507faf7-fef1-44dd-9b30-8f9766004c08","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":15,"end":17,"exact":"基板","quote":"Samsung電機はガラスコア基板の試作ラインを持ち、2027年以降の量産を目指している。","quote_start":0,"quote_end":45,"text_sha256":"75e1afae3f90c74f692434937ebeb0e21766d0dc62d86184b7fefb13d2a51dd5","block_sha256":"75e1afae3f90c74f692434937ebeb0e21766d0dc62d86184b7fefb13d2a51dd5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1246df84-dae2-49be-ab7b-94b8c8902078/#blk_01f918d5-6b0c-4973-8a55-7288e0f83850"},{"id":"occ_aef6befb30aae974ef20741c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1246df84-dae2-49be-ab7b-94b8c8902078","work_id":"wrk_850e2d1d-c6db-443c-b02a-baac2573c6d3","block_id":"blk_0c728ae5-d048-45e5-b317-198698b69df2","section_id":"sec_5d08f87a-4214-4bcf-a478-10dce3de0e15","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":32,"end":34,"exact":"基板","quote":"FCBGAは、GPU、CPU、ASICなどの半導体ダイとサーバー基板を接続する高密度パッケージ基板である。","quote_start":0,"quote_end":53,"text_sha256":"e9af5c64445fdf6178ac0f963103e410a994f8af4fa8203f09da53a0d2e0244a","block_sha256":"e9af5c64445fdf6178ac0f963103e410a994f8af4fa8203f09da53a0d2e0244a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1246df84-dae2-49be-ab7b-94b8c8902078/#blk_0c728ae5-d048-45e5-b317-198698b69df2"},{"id":"occ_d53ec1e04eca428f9ed8a426","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1246df84-dae2-49be-ab7b-94b8c8902078","work_id":"wrk_850e2d1d-c6db-443c-b02a-baac2573c6d3","block_id":"blk_0e9f3f07-dd1c-4ed7-87a9-6ca919838c5a","section_id":"sec_5d08f87a-4214-4bcf-a478-10dce3de0e15","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"## FCBGA――AIチップと基板をつなぐ","quote_start":0,"quote_end":22,"text_sha256":"b5673c32f8d05b2e258ed328b4291f325ae2388249605bbad2b99ca658e0afac","block_sha256":"b5673c32f8d05b2e258ed328b4291f325ae2388249605bbad2b99ca658e0afac","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1246df84-dae2-49be-ab7b-94b8c8902078/#blk_0e9f3f07-dd1c-4ed7-87a9-6ca919838c5a"},{"id":"occ_a1fe97d1be65e2f0c242cb87","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1246df84-dae2-49be-ab7b-94b8c8902078","work_id":"wrk_850e2d1d-c6db-443c-b02a-baac2573c6d3","block_id":"blk_62bc30ce-b0b0-4504-b60b-7bb6cf4c319a","section_id":"sec_67ebc293-d70a-4bf5-8090-eff4c62c42e2","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"これはSamsung電機が、基板上の受動部品メーカーから、GPU・HBMパッケージ内部の電力供給網へ近づく可能性を示す。","quote_start":0,"quote_end":60,"text_sha256":"21860a02e69d2e5da4d6f54cf1881f6c390af2f6bb000374c559624001ff37dd","block_sha256":"21860a02e69d2e5da4d6f54cf1881f6c390af2f6bb000374c559624001ff37dd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1246df84-dae2-49be-ab7b-94b8c8902078/#blk_62bc30ce-b0b0-4504-b60b-7bb6cf4c319a"},{"id":"occ_67f86f820cc538ac3af99f05","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1246df84-dae2-49be-ab7b-94b8c8902078","work_id":"wrk_850e2d1d-c6db-443c-b02a-baac2573c6d3","block_id":"blk_f06f1972-243e-4e7e-9c88-a23e5ca16a2d","section_id":"sec_e507faf7-fef1-44dd-9b30-8f9766004c08","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":17,"end":19,"exact":"基板","quote":"AIパッケージが大型化すると、有機基板では反りや微細配線が難しくなる。","quote_start":0,"quote_end":35,"text_sha256":"57e62e90af31ce43aee08ab54a87188d95d290ac51c6cb50d7eaf7377ada35bf","block_sha256":"57e62e90af31ce43aee08ab54a87188d95d290ac51c6cb50d7eaf7377ada35bf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1246df84-dae2-49be-ab7b-94b8c8902078/#blk_f06f1972-243e-4e7e-9c88-a23e5ca16a2d"},{"id":"occ_6d06290cfc739fd752fb8271","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_17972011-3c15-4377-a2ea-f36af8fa6c2f","work_id":"wrk_fbc5cb25-a3fe-4368-a659-4a3d7a753309","block_id":"blk_3c1b7067-909b-4168-8196-c0ae364aac23","section_id":"sec_560a0f2d-09fd-4c9d-b87b-e0dd5179caba","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"光。ガラスコア基板。半導体テスト。電源。冷却。JabilのようなAIハードウェア製造基盤。そして、DDOG、SNOW、PLTR、NETのようなAI SaaS・データ基盤。","quote_start":0,"quote_end":85,"text_sha256":"1a0fb04308750a8c6c9ff82e799b38319febf4fdc4569a6636ea20ff45094870","block_sha256":"1a0fb04308750a8c6c9ff82e799b38319febf4fdc4569a6636ea20ff45094870","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_17972011-3c15-4377-a2ea-f36af8fa6c2f/#blk_3c1b7067-909b-4168-8196-c0ae364aac23"},{"id":"occ_113a8b017460acd95048f06b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1c3b81f6-696c-4d69-acf7-ad589032ce63","work_id":"wrk_34a8dbe0-b5df-4af3-9515-dede6c8eb815","block_id":"blk_3cf1531f-d58e-4ce6-aa36-17c819ee2482","section_id":"sec_823643b9-b539-4832-b583-b4297c494090","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":27,"end":29,"exact":"基板","quote":"- **概念:** 光エンジンをスイッチASICと同じ基板上（パッケージ内）に実装し、電気配線の距離を極限まで短くする技術。\n- **メリット:** 究極の低消費電力と高密度実装。\n- **課題:** 故障した際にスイッチごと交換が必要になる（保守性の問題）","quote_start":0,"quote_end":129,"text_sha256":"2a8f9926d7dded194d49f03cb5a0e14f812157d956f95fc82ab426cb52ef0358","block_sha256":"2a8f9926d7dded194d49f03cb5a0e14f812157d956f95fc82ab426cb52ef0358","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1c3b81f6-696c-4d69-acf7-ad589032ce63/#blk_3cf1531f-d58e-4ce6-aa36-17c819ee2482"},{"id":"occ_2d68473e5683be2e5312d137","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1c3b81f6-696c-4d69-acf7-ad589032ce63","work_id":"wrk_34a8dbe0-b5df-4af3-9515-dede6c8eb815","block_id":"blk_891e8151-953a-4389-8213-568e05087d35","section_id":"sec_bbe174b6-5572-4952-a0b5-f456671cdd31","layer":"body","character_id":null,"count":4,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":182,"end":184,"exact":"基板","quote":"気自動車のパワー半導体や再生エネルギーの高効率電力変換器に用いられています。Coherent社は実は**SiC基板の世界的サプライヤー**の一つで、1990年代にLitton社からSiC事業を獲得し、近年まで150mm径SiCウェハを量産してきました。現在は200mm径SiC基板の製造にも取り組んでおり、**世界","quote_start":127,"quote_end":284,"text_sha256":"d1b1c29d0bb173021bfb211386c614d934320339b7685bb4cf617095ab7d97cf","block_sha256":"d1b1c29d0bb173021bfb211386c614d934320339b7685bb4cf617095ab7d97cf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1c3b81f6-696c-4d69-acf7-ad589032ce63/#blk_891e8151-953a-4389-8213-568e05087d35"},{"id":"occ_fe8fbc8cad653263a52963a1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1c3b81f6-696c-4d69-acf7-ad589032ce63","work_id":"wrk_34a8dbe0-b5df-4af3-9515-dede6c8eb815","block_id":"blk_8b7eb741-ad31-4c53-b0a7-b73501b05495","section_id":"sec_dfdb5f71-922a-4ef5-9acb-f05f749b044d","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":180,"end":182,"exact":"基板","quote":"モジュール）として実装され、電気信号でホストと接続されていますが、周波数が50GHzを超えるとパッケージピンや基板配線での損失・レイテンシが無視できなくなります。CPOでは光エンジンを至近距離に配置することで電気配線長を短縮し、**帯域幅向上と消費電力削減**を図ります。一方で、CPOはメンテナンス性やモジュール","quote_start":125,"quote_end":282,"text_sha256":"b5a54dfc07a637b829777e731f080219170660a9ec67255a973ecacae3e1a7db","block_sha256":"b5a54dfc07a637b829777e731f080219170660a9ec67255a973ecacae3e1a7db","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1c3b81f6-696c-4d69-acf7-ad589032ce63/#blk_8b7eb741-ad31-4c53-b0a7-b73501b05495"},{"id":"occ_bb5536cd3ed6737116dad765","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1c3b81f6-696c-4d69-acf7-ad589032ce63","work_id":"wrk_34a8dbe0-b5df-4af3-9515-dede6c8eb815","block_id":"blk_b369ae30-dc4b-4e07-99dd-94d84683ab07","section_id":"sec_cdaee10b-9e5e-4193-959b-b1ac26362046","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":527,"end":529,"exact":"基板","quote":"Vのインバーターに不可欠。\n  - **Coherentの強み:** 難易度の高い200mm（8インチ）SiC基板の製造に成功しており、Wolfspeed等と競合しつつも、主要なサプライヤーの地位を確立している。","quote_start":472,"quote_end":578,"text_sha256":"f9db9000d244e184b1c6ee05aed11ddfd64bd1ca815b0ad7f7c1c2aa4cac5da5","block_sha256":"f9db9000d244e184b1c6ee05aed11ddfd64bd1ca815b0ad7f7c1c2aa4cac5da5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1c3b81f6-696c-4d69-acf7-ad589032ce63/#blk_b369ae30-dc4b-4e07-99dd-94d84683ab07"},{"id":"occ_47311ae7d671226c106a0f57","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1c3b81f6-696c-4d69-acf7-ad589032ce63","work_id":"wrk_34a8dbe0-b5df-4af3-9515-dede6c8eb815","block_id":"blk_d97042e0-6d83-4e4a-b8c3-cb1460e61e00","section_id":"sec_82e24949-1417-4d49-96fd-e04c3d10093c","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":156,"end":158,"exact":"基板","quote":"3つの主要セグメントで事業を展開する、世界的な光学・電子部品メーカーです。材料セグメントでは化合物半導体材料や基板（SiC基板など）や結晶・特殊金属の製造供給を行い、ネットワーキングセグメントではデータセンターや通信向けの光トランシーバー、光モジュール、光スイッチ等の光通信部品を提供しています。レーザーセグメント","quote_start":101,"quote_end":258,"text_sha256":"b84261057355919b73c37d28ceaaf069b123f957db20791c154841e96953c170","block_sha256":"b84261057355919b73c37d28ceaaf069b123f957db20791c154841e96953c170","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1c3b81f6-696c-4d69-acf7-ad589032ce63/#blk_d97042e0-6d83-4e4a-b8c3-cb1460e61e00"},{"id":"occ_e4531b5ed04b1cc3107e9e35","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1c3b81f6-696c-4d69-acf7-ad589032ce63","work_id":"wrk_34a8dbe0-b5df-4af3-9515-dede6c8eb815","block_id":"blk_dcf1babb-5826-4012-a0a1-50f247475bad","section_id":"sec_0da35849-dd58-45cf-ad12-bf56fecff174","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":248,"end":250,"exact":"基板","quote":"車体骨格の溶接工程）向けレーザーやEVモーター製造向けの微細加工レーザーを提案しています。電子分野ではプリント基板の微細穴あけや半導体チップ加工にフェムト秒レーザーが利用され、Coherentの**超短パルスレーザー**は微細加工の精度とスループット向上に寄与しています。医療分野では、Coherent社製の医療用","quote_start":193,"quote_end":350,"text_sha256":"08b0c5ad70c4b4fab68ab45d85313cd9858c5a090303f66aed56b246e07a761f","block_sha256":"08b0c5ad70c4b4fab68ab45d85313cd9858c5a090303f66aed56b246e07a761f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_1c3b81f6-696c-4d69-acf7-ad589032ce63/#blk_dcf1babb-5826-4012-a0a1-50f247475bad"},{"id":"occ_fd959085d8081a1f69aad58e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_1c3b81f6-696c-4d69-acf7-ad589032ce63","work_id":"wrk_34a8dbe0-b5df-4af3-9515-dede6c8eb815","block_id":"blk_e2b50a1b-1cf0-46cd-86c6-aa4fb115c6ff","section_id":"sec_82e24949-1417-4d49-96fd-e04c3d10093c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":205,"end":207,"exact":"基板","quote":"0年代以降は光学部品企業の買収を重ねて事業領域を拡大しました。1990年代には**シリコンカーバイド（SiC）基板部門**の買収（1990年代後半）や光学部品メーカーVirgo社・Lightning社の買収（1995–1996年）を行い、2000年代にもLaser 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(ユデン)","quote_start":0,"quote_end":69,"text_sha256":"ebbba35bd013c63ee131d639b061724e83e2009ffc46a669b63931278067c540","block_sha256":"ebbba35bd013c63ee131d639b061724e83e2009ffc46a669b63931278067c540","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_214b9034-b7c9-47c2-b4c9-4fc2638813c2/#blk_a47b73ab-e89e-4232-b012-7eee372570fb"},{"id":"occ_547465300588d1b2e94fea7c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_214b9034-b7c9-47c2-b4c9-4fc2638813c2","work_id":"wrk_9749f686-e40c-44ba-b4bb-ffa5b232f684","block_id":"blk_a554f633-4fe2-4692-8684-2a676379d5da","section_id":"sec_dd824308-871f-40e1-9ce8-b1cda0b8107d","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":10,"end":13,"exact":"PCB","quote":"Package / PCB\n══════════════════\n  [ Embedded Coil 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returnを合わせたcurrent loop全体が寄生インダクタンスを持つ。","quote_start":0,"quote_end":75,"text_sha256":"80a89396ed97fa068b8c9532ee44a05b5757828c340a4d8ad16c58fa97c0e868","block_sha256":"80a89396ed97fa068b8c9532ee44a05b5757828c340a4d8ad16c58fa97c0e868","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_214b9034-b7c9-47c2-b4c9-4fc2638813c2/#blk_a71a7f71-6735-4c39-a479-f437efee6f70"},{"id":"occ_83f7a2ba0fb13b5303d61c6d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_214b9034-b7c9-47c2-b4c9-4fc2638813c2","work_id":"wrk_9749f686-e40c-44ba-b4bb-ffa5b232f684","block_id":"blk_a7ab6636-e08b-4b39-a059-8adbf45edbf0","section_id":"sec_a01ac65b-bd9a-49d8-90db-cb214c1aabd9","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":22,"end":25,"exact":"PCB","quote":"MLCC\n↓\nsolder / pad\n↓\nPCB power plane\n↓\nvia\n↓\nGPU package BGA\n↓\npackage substrate\n↓\nmicrobump\n↓\nGPU die power grid\n↓\ntransist","quote_start":0,"quote_end":125,"text_sha256":"0e6a54c3fab74ee0bdbc94a0cdb09b6907f2c858b063600ae716a7a02d91f149","block_sha256":"0e6a54c3fab74ee0bdbc94a0cdb09b6907f2c858b063600ae716a7a02d91f149","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_214b9034-b7c9-47c2-b4c9-4fc2638813c2/#blk_a7ab6636-e08b-4b39-a059-8adbf45edbf0"},{"id":"occ_345000d0dbb352812aecd236","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_3d4e1ba8-e82e-480e-b8f9-9806b6b6cbc9","section_id":"sec_9ffe652e-f54e-4193-975c-a81af487d454","layer":"code","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":35,"end":38,"exact":"PCB","quote":"```\n特に伸びが大きい項目\n\nMemory       +435%\nPCB          +233%\nMLCC         +182%\nNVLink chip  +122%\nNetworking   +121%\nGPU           +57%\nPower su","quote_start":0,"quote_end":138,"text_sha256":"141967e2862fa011b76214260b69dc4241a1ffa298274a588f8bd9aedc3cc6c0","block_sha256":"141967e2862fa011b76214260b69dc4241a1ffa298274a588f8bd9aedc3cc6c0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_3d4e1ba8-e82e-480e-b8f9-9806b6b6cbc9"},{"id":"occ_e7461c366da58e8a7210b75f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_4012e7fe-f20d-40c1-b79b-7a4965536bbd","section_id":"sec_4519dde8-3e9e-41c9-b11a-73e9726fec69","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":25,"end":27,"exact":"基板","quote":"```\nΔV = L × di/dt\n\nL：配線・基板・パッケージの寄生インダクタンス\ndi/dt：電流変化の速さ\n```","quote_start":0,"quote_end":61,"text_sha256":"6f6876ce1579afb999a7e0589a566ece1463a33a0afa66e420ea84ee2af5d48d","block_sha256":"6f6876ce1579afb999a7e0589a566ece1463a33a0afa66e420ea84ee2af5d48d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_4012e7fe-f20d-40c1-b79b-7a4965536bbd"},{"id":"occ_c29ea0373ba5b4f822f86475","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_5290aeab-ead8-420c-b182-bedba6619dd7","section_id":"sec_1c55d940-0026-4624-9f6c-513ab8c5261f","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":4,"end":7,"exact":"PCB","quote":"### PCB/ABF/MLCCは「高密度実装」の受益","quote_start":0,"quote_end":27,"text_sha256":"7cef804701086dbd1fdb7246285c8e4d3a3244eed03c4cefbfd98a8f09d3f95f","block_sha256":"7cef804701086dbd1fdb7246285c8e4d3a3244eed03c4cefbfd98a8f09d3f95f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_5290aeab-ead8-420c-b182-bedba6619dd7"},{"id":"occ_198827d7eca0934122836ca4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_57e44690-6f25-40de-9f98-705de80196c5","section_id":"sec_c0e9464c-4a7f-482a-90ce-a240931c0ce8","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":84,"end":86,"exact":"基板","quote":"する\n2. 大電流を安定供給する\n3. 変換損失を減らす\n4. 発熱を抑える\n5. 電源ノイズを抑える\n6. 基板面積を削減する\n7. GPU負荷変動に高速応答する\n```","quote_start":29,"quote_end":115,"text_sha256":"e96d3ece2f9a282a4f16d0de90ea3c714c227aab2d5f33bd883d199e277574ed","block_sha256":"e96d3ece2f9a282a4f16d0de90ea3c714c227aab2d5f33bd883d199e277574ed","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_57e44690-6f25-40de-9f98-705de80196c5"},{"id":"occ_e6826817d3b7ca73171178f2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_5950974a-05f9-414f-a8ee-6caf69c91460","section_id":"sec_4acaa155-95b3-4a57-a3f7-be28ffb280e7","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"コモンモードノイズは、ケーブルや基板をアンテナのようにして外へ放射されやすいです。  \nこれには、**コモンモードチョーク**が使われます。","quote_start":0,"quote_end":70,"text_sha256":"bf36c558c4450f871c06079ef444b1b83edcda1b738ee8288f13526fee3710d5","block_sha256":"bf36c558c4450f871c06079ef444b1b83edcda1b738ee8288f13526fee3710d5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_5950974a-05f9-414f-a8ee-6caf69c91460"},{"id":"occ_ec30e88afd3bc47bf0e308d1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_5e091e64-45d3-4655-877e-bc7750b7affb","section_id":"sec_64d46907-fe9b-4d9a-92a9-6e8389d81840","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"GPUやASICの近くでは、基板面積が限られています。周囲にはHBM、MLCC、電源IC、MOSFET、インダクタ、通信ICが密集します。その中で、インダクタだけが大きいと電源回路全体の面積が増えてしまいます。","quote_start":0,"quote_end":105,"text_sha256":"0c1bdc639b3c72bc259713cace1c4a18352268e1bd9e281631b24f9654165f27","block_sha256":"0c1bdc639b3c72bc259713cace1c4a18352268e1bd9e281631b24f9654165f27","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_5e091e64-45d3-4655-877e-bc7750b7affb"},{"id":"occ_97b41287cc32c36b6e4cb786","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_68a15f65-10f6-41f7-88a1-2378b033744b","section_id":"sec_d019967c-cb90-4e4e-9564-9c11c29668cc","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":27,"end":29,"exact":"基板","quote":"ただし、セラミックには弱点もあります。硬くて脆いため、基板が曲がると割れることがあります。また、材料によってはDC電圧をかけると実効容量が大きく下がります。これがMLCC設計で非常に重要です","quote_start":0,"quote_end":95,"text_sha256":"04d7ce5982dbfef9587955ba02654411db147eb072b479b7a0d93643544d4d49","block_sha256":"04d7ce5982dbfef9587955ba02654411db147eb072b479b7a0d93643544d4d49","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_68a15f65-10f6-41f7-88a1-2378b033744b"},{"id":"occ_4698404ad8682cf315bbda2e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_81409e0e-3cf8-42c1-9ad8-af568d683030","section_id":"sec_beefac95-90c8-4b0e-848b-b63e3498aef8","layer":"code","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":46,"end":49,"exact":"PCB","quote":"```\nAIDCの成長\n  =\nGPU/HBM\n  +\nNVLink/ネットワーク\n  +\nPCB/ABF\n  +\nMLCC\n  +\nインダクタ/EMI\n  +\n電源モジュール\n  +\n冷却\n  +\nBBU/UPS\n```","quote_start":0,"quote_end":111,"text_sha256":"a9dcb731b427c18c3dfc125625cbca971895897414f084c7ae7b4fa4bd3c2625","block_sha256":"a9dcb731b427c18c3dfc125625cbca971895897414f084c7ae7b4fa4bd3c2625","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_81409e0e-3cf8-42c1-9ad8-af568d683030"},{"id":"occ_d5ffc54d15d02d4e8b9ae674","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_8eafd901-4cd8-4000-98ce-1b31c6210403","section_id":"sec_8e513104-67bb-45ca-96e5-e0a33b57638f","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":79,"end":81,"exact":"基板","quote":"CR\n  ↓\n導通損失を減らす\n\n高飽和電流\n  ↓\n大電流でも磁気飽和しにくい\n\n低背・小型\n  ↓\nGPU基板や電源モジュールに載せやすい\n\n高放熱\n  ↓\n高密度ラックの熱問題を緩和\n\n高周波特性\n  ↓\n高速スイッチング・光通信周辺で使いやすい\n\n低ノイズ\n  ↓\nSerDes / HBM / NICの信","quote_start":24,"quote_end":181,"text_sha256":"7a91a45477911e10b7cde390d607419fef096ce9222e911cffc7e072f658a9db","block_sha256":"7a91a45477911e10b7cde390d607419fef096ce9222e911cffc7e072f658a9db","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_8eafd901-4cd8-4000-98ce-1b31c6210403"},{"id":"occ_041bb7433aae6cf9080c3b11","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_beb52c43-0ab2-48bf-b869-1b5ffff6ce39","section_id":"sec_beefac95-90c8-4b0e-848b-b63e3498aef8","layer":"body","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":46,"end":49,"exact":"PCB","quote":"添付表を見ると、GPUとメモリが圧倒的です。  \nしかし、VR200でMLCCが+182%、PCBが+233%、Power supplyが+32%になっていることは、AIラックの進化が**電力供給・基板・実装・受動部品の限界にぶつかっている**ことを示しています。","quote_start":0,"quote_end":132,"text_sha256":"6c2550ecbda202f4bd9a8a30589685cabf2a6dcc4b904f4c39f6fb1f1d8b4c16","block_sha256":"6c2550ecbda202f4bd9a8a30589685cabf2a6dcc4b904f4c39f6fb1f1d8b4c16","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_beb52c43-0ab2-48bf-b869-1b5ffff6ce39"},{"id":"occ_db891068dcc3fb4adc7721e6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_c1dd37ae-0dd4-4e09-8eea-f0f7c270c4ac","section_id":"sec_beefac95-90c8-4b0e-848b-b63e3498aef8","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":29,"end":31,"exact":"基板","quote":"AIDC時代の本質は、  \n**GPUの性能競争が、電源・基板・受動部品・冷却の性能競争へ波及している**  \nということです。  \nその波及先の中で、MLCC、インダクタ、電源モジュールは、今後も高付加価値化しながら伸びる可能性が高い分野だと考えられます。","quote_start":0,"quote_end":129,"text_sha256":"a992dcb23ca97899b46845c1cf8b7e5dfc64985be019fd45bceeadc9c15e276f","block_sha256":"a992dcb23ca97899b46845c1cf8b7e5dfc64985be019fd45bceeadc9c15e276f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_c1dd37ae-0dd4-4e09-8eea-f0f7c270c4ac"},{"id":"occ_4a08685c7425917ac6561782","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_217016cb-4b97-4b15-993e-73dded8489d4","work_id":"wrk_35685b88-0221-425f-a965-66ae13b66c00","block_id":"blk_e7c6e21b-3594-48eb-9172-c3d95e51f934","section_id":"sec_1c55d940-0026-4624-9f6c-513ab8c5261f","layer":"body","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":0,"end":3,"exact":"PCB","quote":"PCBは+233%、MLCCは+182%です。これは、GPUとメモリが増えただけではなく、**基板上の電源レール、信号配線、デカップリング、電源品質要求が一段上がる**ことを示しています。","quote_start":0,"quote_end":94,"text_sha256":"c616cc071eccf56c32cea3ae8329fc06994be062a9130bc279a71c647c753a5a","block_sha256":"c616cc071eccf56c32cea3ae8329fc06994be062a9130bc279a71c647c753a5a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_217016cb-4b97-4b15-993e-73dded8489d4/#blk_e7c6e21b-3594-48eb-9172-c3d95e51f934"},{"id":"occ_f9e1a81e96f41afe48f548fa","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_24eb030e-0590-42b8-bd89-6a25a4dfc487","work_id":"wrk_a6aa5646-83cd-40dd-87e3-3b3f438804da","block_id":"blk_1ea360d8-98d9-4a94-b6df-a70864d913aa","section_id":"sec_e4625764-c457-476e-af73-cbbd8a3def43","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":122,"end":124,"exact":"基板","quote":"tics）**：**スイッチ/NICのASICに超近接**して光トランシーバを**同一パッケージ（あるいは同一基板上の極近距離）に統合**する方式。","quote_start":67,"quote_end":141,"text_sha256":"cf34e23e0c88c542a0dd80a8257eaace8de386b839d19d6258b6facd053095b3","block_sha256":"cf34e23e0c88c542a0dd80a8257eaace8de386b839d19d6258b6facd053095b3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_24eb030e-0590-42b8-bd89-6a25a4dfc487/#blk_1ea360d8-98d9-4a94-b6df-a70864d913aa"},{"id":"occ_fed7f50de8a1d14906e3e1ef","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_24eb030e-0590-42b8-bd89-6a25a4dfc487","work_id":"wrk_a6aa5646-83cd-40dd-87e3-3b3f438804da","block_id":"blk_23657c9e-99a6-4c61-a94b-d302ecbc5c06","section_id":"sec_c4dba5ff-ba6d-4e6a-9a60-bcd6eb865fb5","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":270,"end":272,"exact":"基板","quote":"も。\n2. **On-board/Near-packaged optics（中間形態）**\n   \n   - 基板上でASICの**近く**に光トランシーバを実装（ただし**着脱式ではない**）。\n   - 電気経路が短くなり、損失/電力を抑えやすいが、現場交換性は下がる。\n3. **CPO（Co-Package","quote_start":215,"quote_end":372,"text_sha256":"7c94197fdea9b0e44ec5ee6543bd9ddee3b7a10ec3c19f1ea382546cdafbd2e3","block_sha256":"7c94197fdea9b0e44ec5ee6543bd9ddee3b7a10ec3c19f1ea382546cdafbd2e3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_24eb030e-0590-42b8-bd89-6a25a4dfc487/#blk_23657c9e-99a6-4c61-a94b-d302ecbc5c06"},{"id":"occ_de9b04a1a2cdeace5ea6b7b1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_24eb030e-0590-42b8-bd89-6a25a4dfc487","work_id":"wrk_a6aa5646-83cd-40dd-87e3-3b3f438804da","block_id":"blk_819672d3-8a82-4e80-9512-6a22bf09cfb2","section_id":"sec_e4625764-c457-476e-af73-cbbd8a3def43","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":28,"end":30,"exact":"基板","quote":"```\n(プラガブル)\nASIC ──(長めの電気配線/基板/リタイマ)── [前面の光モジュール] ⇄ 光ファイバ\n\n(CPO)\n[ASIC][光エンジン群] ─(極短電気/直結)─  光ファイバ  ※前面モジュールなし\n```","quote_start":0,"quote_end":115,"text_sha256":"5374808157e5550a7b9f291965935cee2ee7bd26425d5a21c383e12ec8535d1f","block_sha256":"5374808157e5550a7b9f291965935cee2ee7bd26425d5a21c383e12ec8535d1f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_24eb030e-0590-42b8-bd89-6a25a4dfc487/#blk_819672d3-8a82-4e80-9512-6a22bf09cfb2"},{"id":"occ_a8bbb6976b453eec0c05ef49","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_25c19733-e8bf-4666-a96e-91917803878b","work_id":"wrk_d1c18d7c-505e-4f07-bfb5-ac5d6eb8e10d","block_id":"blk_0a89bbf1-a091-42e9-9eba-665953a8afe0","section_id":"sec_77bddea7-6a41-4fa0-a190-d0ee10d6806f","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":117,"end":119,"exact":"基板","quote":"───────┤\n│ Mo/Si反射多層膜       │\n├────────────────┤\n│ 低熱膨張基板          │\n└────────────────┘\n   ↗\n反射した光を投影\n```","quote_start":62,"quote_end":167,"text_sha256":"b4ec468b83735c4d0e74953f56b587fd3d9e6394dd3efe8de729a042b7a05bdd","block_sha256":"b4ec468b83735c4d0e74953f56b587fd3d9e6394dd3efe8de729a042b7a05bdd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_25c19733-e8bf-4666-a96e-91917803878b/#blk_0a89bbf1-a091-42e9-9eba-665953a8afe0"},{"id":"occ_a78a565bed16da757c6ca6dd","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_25c19733-e8bf-4666-a96e-91917803878b","work_id":"wrk_d1c18d7c-505e-4f07-bfb5-ac5d6eb8e10d","block_id":"blk_1cef8d5f-fd45-4496-9d89-e640e8de6984","section_id":"sec_e3a6397b-e326-4f42-aa39-9e05f37687bf","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":20,"end":22,"exact":"基板","quote":"DUV用レチクルは、基本的に光を通す透明基板上へ遮光パターンを形成する。","quote_start":0,"quote_end":36,"text_sha256":"2fde366d81259b95bbbc7442094b5d7e35faa811377b26f41fb317fdc45a3d00","block_sha256":"2fde366d81259b95bbbc7442094b5d7e35faa811377b26f41fb317fdc45a3d00","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_25c19733-e8bf-4666-a96e-91917803878b/#blk_1cef8d5f-fd45-4496-9d89-e640e8de6984"},{"id":"occ_22128b873ee2dc6ba81f83ab","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_28e52d32-205e-4601-9fe8-535cce2d0600","work_id":"wrk_012e50f2-e203-488b-b14f-8859b652eece","block_id":"blk_adafc025-bc73-46ea-8ccd-fe351babd9df","section_id":"sec_d5122696-d495-42e2-b13c-0353612bf826","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":208,"end":210,"exact":"基板","quote":"すい（例：SiO₂対Si₃N₄）。大面積の**段差除去・平坦度確保**に実績があります。\n- **フォトマスク基板・石英窓（合成石英）の鏡面仕上げ**  \n  用途: DUVマスク基板の最終研磨、露光装置の石英窓・各種石英治具の仕上げ。  \n  理由: **サブnm級の表面粗さ**と欠陥低減が必要で、CeO₂系ス","quote_start":153,"quote_end":310,"text_sha256":"5f4835074d9ed2b005531f16ae3f2d922b793d55bba3fba6812de7ad81a5b707","block_sha256":"5f4835074d9ed2b005531f16ae3f2d922b793d55bba3fba6812de7ad81a5b707","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_28e52d32-205e-4601-9fe8-535cce2d0600/#blk_adafc025-bc73-46ea-8ccd-fe351babd9df"},{"id":"occ_6fddd35429ccd3b804e0e104","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_28e52d32-205e-4601-9fe8-535cce2d0600","work_id":"wrk_012e50f2-e203-488b-b14f-8859b652eece","block_id":"blk_e8d3e3c5-fbcb-4ad1-8e07-e57843e255f0","section_id":"sec_e96d225d-9832-4d3d-81ed-ec4b463c4570","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":201,"end":203,"exact":"基板","quote":"3nm）において合成石英（fused silica）とCaF₂**が光学材料の柱となり、**DUVフォトマスク基板**にも合成石英が用いられます（EUVは反射光学が主体で構成が異なります）。","quote_start":146,"quote_end":241,"text_sha256":"a66782e2e417b7359f52117ae7e590e254aa264faf296e4250f398f21ae59782","block_sha256":"a66782e2e417b7359f52117ae7e590e254aa264faf296e4250f398f21ae59782","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_28e52d32-205e-4601-9fe8-535cce2d0600/#blk_e8d3e3c5-fbcb-4ad1-8e07-e57843e255f0"},{"id":"occ_5b513b3098090e06bd68a4dc","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_2b771286-9bc4-45c0-b45d-6524baf27996","work_id":"wrk_371c7035-898a-4ffb-9036-25fc84c21bd7","block_id":"blk_06b98f9d-8cf6-41aa-a1e4-f20e8c8c6784","section_id":"sec_f0ab0e6e-9999-42ca-a353-14ddb64b37d8","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":166,"end":169,"exact":"PCB","quote":"広帯域・高クロック） 低い（3D積層設計） **コスト** 安価 高価 **配置** GPUコアの外部に配置（PCB上） GPUと積層される（パッケージ内）","quote_start":111,"quote_end":189,"text_sha256":"d817d450ff520af24b4088d105675b11d61b761ad1107f95d80f14caf061ca0a","block_sha256":"d817d450ff520af24b4088d105675b11d61b761ad1107f95d80f14caf061ca0a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_2b771286-9bc4-45c0-b45d-6524baf27996/#blk_06b98f9d-8cf6-41aa-a1e4-f20e8c8c6784"},{"id":"occ_e20076d95187b18dde3eaf16","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_2dcad1b1-3b1a-4999-bd4c-d504dda3eae6","work_id":"wrk_2db98011-2753-489b-8cfb-dadd8a65739b","block_id":"blk_5008b181-10d0-403c-9d0c-21f99756d1cd","section_id":"sec_ab402904-db45-430e-81ad-ccee05df4d74","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":59,"end":61,"exact":"基板","quote":"タイミングデバイスが、GPUやCPUよりもはるかに速いクロックを直接流しているわけではありません。多くの場合、基板上の基準クロックは **25MHz、50MHz、100MHz、156.25MHz** などの比較的低い周波数です。","quote_start":4,"quote_end":118,"text_sha256":"8b2ea0a6430fc50f505fbb588bedb0946a633fccbe08f8ca5d046d99ef32e432","block_sha256":"8b2ea0a6430fc50f505fbb588bedb0946a633fccbe08f8ca5d046d99ef32e432","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_2dcad1b1-3b1a-4999-bd4c-d504dda3eae6/#blk_5008b181-10d0-403c-9d0c-21f99756d1cd"},{"id":"occ_48719226d6b9a5100691dd52","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_2dcad1b1-3b1a-4999-bd4c-d504dda3eae6","work_id":"wrk_2db98011-2753-489b-8cfb-dadd8a65739b","block_id":"blk_c32d2594-df6a-4286-8b44-7d6cded51a4e","section_id":"sec_8052cba5-4209-4582-b327-959b1aa5f5bc","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":29,"end":31,"exact":"基板","quote":"クロックジェネレータは、1つまたは複数の基準クロックから、基板内で必要な複数の周波数を作るICです。","quote_start":0,"quote_end":50,"text_sha256":"0a14c3d7b674d7954b7d19840cdd80a853c1a38aa11a94da99deff2b157fdfda","block_sha256":"0a14c3d7b674d7954b7d19840cdd80a853c1a38aa11a94da99deff2b157fdfda","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_2dcad1b1-3b1a-4999-bd4c-d504dda3eae6/#blk_c32d2594-df6a-4286-8b44-7d6cded51a4e"},{"id":"occ_828fcfc6142a62d42629ed05","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_2dcad1b1-3b1a-4999-bd4c-d504dda3eae6","work_id":"wrk_2db98011-2753-489b-8cfb-dadd8a65739b","block_id":"blk_c7a31455-7ce5-4bf7-a68e-75faa63c5ca7","section_id":"sec_3c90caee-54cf-4944-a87c-78d4b063660f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"高速基板では、このズレが問題になるため、低スキューなクロックバッファが必要になります。","quote_start":0,"quote_end":43,"text_sha256":"6994bdffbc1867e7b2fa143ff5f268da078d914fd0b8075148ab46c0891eca30","block_sha256":"6994bdffbc1867e7b2fa143ff5f268da078d914fd0b8075148ab46c0891eca30","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_2dcad1b1-3b1a-4999-bd4c-d504dda3eae6/#blk_c7a31455-7ce5-4bf7-a68e-75faa63c5ca7"},{"id":"occ_bb85bb062b290065387e5d73","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_2ed1383f-5c73-49bd-bd5b-f19deda1814c","work_id":"wrk_209cb693-e035-4d91-b959-d2a9b4df1de3","block_id":"blk_b3b0eda3-ae5e-44c3-a356-cccc2a514e9a","section_id":"sec_20493d28-d38d-4235-983f-e413c0766bfd","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":22,"end":24,"exact":"基板","quote":"光接続の為に、Infineraを買収しinp基板の内製化の手段を得た、ここは面白い試みだと思った","quote_start":0,"quote_end":48,"text_sha256":"0fc098dd223cf512bb855f4fe4947015b67726abc2ab8e6ef73bad8449948414","block_sha256":"0fc098dd223cf512bb855f4fe4947015b67726abc2ab8e6ef73bad8449948414","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_2ed1383f-5c73-49bd-bd5b-f19deda1814c/#blk_b3b0eda3-ae5e-44c3-a356-cccc2a514e9a"},{"id":"occ_8e5a8c7226021e3c0cf4b85e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_2ed1383f-5c73-49bd-bd5b-f19deda1814c","work_id":"wrk_209cb693-e035-4d91-b959-d2a9b4df1de3","block_id":"blk_e5d636e5-8c09-4dad-8d2a-4db389c3c2e5","section_id":"sec_6368a9f0-14dd-4404-9af6-0fc5781abe00","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":30,"end":32,"exact":"基板","quote":"Nokiaが内製を進めるInPは、一般的な電子機器のプリント基板ではない。","quote_start":0,"quote_end":37,"text_sha256":"c0ebeaa3444b2db897444b7e11233e1b7c331c2cc87efcb5ed087c1b0900a049","block_sha256":"c0ebeaa3444b2db897444b7e11233e1b7c331c2cc87efcb5ed087c1b0900a049","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_2ed1383f-5c73-49bd-bd5b-f19deda1814c/#blk_e5d636e5-8c09-4dad-8d2a-4db389c3c2e5"},{"id":"occ_94ac947dc9c9b0891411fbbd","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_2ed1383f-5c73-49bd-bd5b-f19deda1814c","work_id":"wrk_209cb693-e035-4d91-b959-d2a9b4df1de3","block_id":"blk_e6be5bd5-bd62-40e8-9902-0f6c265efdd0","section_id":"sec_520929c1-d9b5-43e8-befa-6be0b0c1b157","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":9,"end":11,"exact":"基板","quote":"- スイッチ筐体と基板、電源、冷却の設計\n- SR LinuxやSONiCへの対応\n- EDAによる設計・導入・運用自動化\n- 光モジュールやルーターとの相互接続検証\n- IP、光、WANを含むネットワーク全体の設計\n- ","quote_start":0,"quote_end":111,"text_sha256":"9d7c35eb0c7df6783749a1e3fac2a12941a9ac6b810fe104ee2501dff0e57a29","block_sha256":"9d7c35eb0c7df6783749a1e3fac2a12941a9ac6b810fe104ee2501dff0e57a29","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_2ed1383f-5c73-49bd-bd5b-f19deda1814c/#blk_e6be5bd5-bd62-40e8-9902-0f6c265efdd0"},{"id":"occ_eb833df33a7586bf1d4c0785","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_038b558f-5fa4-4a9e-86af-ed2d9f0868ab","section_id":"sec_3c6f4ace-7456-4f21-b504-428d06b19b4d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":13,"end":15,"exact":"基板","quote":"ただし、ノイスの構想では、基板の上へ部品を載せるのではない。","quote_start":0,"quote_end":30,"text_sha256":"dd7237e7eb30353170461639221885d5221874c3383e63cdcb9579ab978ef5c5","block_sha256":"dd7237e7eb30353170461639221885d5221874c3383e63cdcb9579ab978ef5c5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_038b558f-5fa4-4a9e-86af-ed2d9f0868ab"},{"id":"occ_98d4b7a4877e2c71b53d697a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_06be1bdf-8e08-46c3-a113-946d3dfe28e4","section_id":"sec_a21b44c3-8f28-4af8-a71a-137da64742c2","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":26,"end":28,"exact":"基板","quote":"同じシリコン上に素子Aと素子B\n        ↓\n基板を通じた不要な電流\n        ↓\n回路が正しく動かない","quote_start":0,"quote_end":58,"text_sha256":"a7e3674092dc1c1fa97b1211de46e4fa94c7471dff9988d55a55d163d7e61ab9","block_sha256":"a7e3674092dc1c1fa97b1211de46e4fa94c7471dff9988d55a55d163d7e61ab9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_06be1bdf-8e08-46c3-a113-946d3dfe28e4"},{"id":"occ_ed309d03e99e8e124b73488b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_0b1c4f36-8960-4017-aaca-543593d5b764","section_id":"sec_3dc6af70-2702-4231-9246-b785758580a4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"コレクタは基板全体につながっているため、裏面側から電極を取り出すことができる。","quote_start":0,"quote_end":39,"text_sha256":"042e80bce66d63c778fb1b67ed92de3b9b227ece8b47654e09e4afc23c458837","block_sha256":"042e80bce66d63c778fb1b67ed92de3b9b227ece8b47654e09e4afc23c458837","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_0b1c4f36-8960-4017-aaca-543593d5b764"},{"id":"occ_4634fd4f2bb7608c9fce6362","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_15a0cf68-a509-4f9b-bd08-d9011d692af6","section_id":"sec_2b740047-5e3e-4209-a9c2-717f57a42d0d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":112,"end":114,"exact":"基板","quote":"  │ ← 接合端が側面へ露出\n───────┘          └───────\n          n型基板","quote_start":57,"quote_end":114,"text_sha256":"bcaefb8906eecc6012d787109a94cc8da0a8029b3b383c3f26778ca512d3a196","block_sha256":"bcaefb8906eecc6012d787109a94cc8da0a8029b3b383c3f26778ca512d3a196","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_15a0cf68-a509-4f9b-bd08-d9011d692af6"},{"id":"occ_ef08d43cced7ac09b01e0288","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_306fc3de-6f60-41ac-8d6a-8c9d2a65c722","section_id":"sec_3c6f4ace-7456-4f21-b504-428d06b19b4d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"プリント基板","quote_start":0,"quote_end":6,"text_sha256":"dbee2d80f4acb0e0614acf4c434947abc8cbf1f9dae38c439a582f778d0bd0a2","block_sha256":"dbee2d80f4acb0e0614acf4c434947abc8cbf1f9dae38c439a582f778d0bd0a2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_306fc3de-6f60-41ac-8d6a-8c9d2a65c722"},{"id":"occ_b7aced562276980a76c8e2a1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_3528eb0c-f245-4040-aa72-c3f6875566e1","section_id":"sec_3c6f4ace-7456-4f21-b504-428d06b19b4d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":13,"end":15,"exact":"基板","quote":"これは、前章で見たプリント基板とよく似ている。","quote_start":0,"quote_end":23,"text_sha256":"aca3b3f42efed650ec021eab7eaed5b5a1ad88d997594d58e75e49e85fdca507","block_sha256":"aca3b3f42efed650ec021eab7eaed5b5a1ad88d997594d58e75e49e85fdca507","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_3528eb0c-f245-4040-aa72-c3f6875566e1"},{"id":"occ_946a6211cb60908b2023108d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_35ebc487-205a-4bd1-830a-1668d89f33a3","section_id":"sec_dd6a83a0-dbcf-4f3c-b7c0-27c580e07687","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":56,"end":58,"exact":"基板","quote":"ランジスタを作る\n        ↓\n抵抗を作る\n        ↓\nコンデンサーを作る\n        ↓\n基板へ取り付ける\n        ↓\n金属配線ではんだ付けする\n        ↓\n回路として検査する","quote_start":1,"quote_end":107,"text_sha256":"e76e86fccdb50588ddac071ac445724af229db7a984b1801293a52a0318c7801","block_sha256":"e76e86fccdb50588ddac071ac445724af229db7a984b1801293a52a0318c7801","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_35ebc487-205a-4bd1-830a-1668d89f33a3"},{"id":"occ_216283ed3d6395af8f7cf348","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_577dd3b4-b722-4023-9433-a40ddcfe363e","section_id":"sec_c9b186c5-7a61-4886-b037-bdb6de8d0c7a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":41,"end":43,"exact":"基板","quote":"ドーパントは真下だけでなく、酸化膜の下へも横方向に広がる。そのため、p型領域とn型基板の境界は、窓の縁より内側ではなく、酸化膜の下へ入り込む。","quote_start":0,"quote_end":71,"text_sha256":"7b115b5330f0d4463ed7d2589ee0f8e1991ed839b55d95d1b260c5151b2d336c","block_sha256":"7b115b5330f0d4463ed7d2589ee0f8e1991ed839b55d95d1b260c5151b2d336c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_577dd3b4-b722-4023-9433-a40ddcfe363e"},{"id":"occ_9c3a45bd74aca9baae37ce33","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_6051a67a-1004-42e0-a277-c7ee90c829cf","section_id":"sec_dd6a83a0-dbcf-4f3c-b7c0-27c580e07687","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":62,"end":64,"exact":"基板","quote":"トランジスタ回路では、トランジスタ、抵抗、コンデンサー、ダイオードをそれぞれ独立した部品として製造し、プリント基板や端子板の上へ取り付けなければならなかった。","quote_start":7,"quote_end":86,"text_sha256":"a83fb51b65a4084d454661f3f7c477b7d4fc5200b407079fd2f68c379e942d8d","block_sha256":"a83fb51b65a4084d454661f3f7c477b7d4fc5200b407079fd2f68c379e942d8d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_6051a67a-1004-42e0-a277-c7ee90c829cf"},{"id":"occ_17dc98fb1c33398a14205f37","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_62f2ae9b-8822-49c8-8861-91d70ca86de8","section_id":"sec_5cdcfff6-5516-46e0-b485-bbd90e91442f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":6,"end":8,"exact":"基板","quote":"シリコン\n＝基板であり部品","quote_start":0,"quote_end":13,"text_sha256":"b34bcae35eef0d34ed0c17d1e0448a69fcd50958b3ae8e29fb5acd3e096e042c","block_sha256":"b34bcae35eef0d34ed0c17d1e0448a69fcd50958b3ae8e29fb5acd3e096e042c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_62f2ae9b-8822-49c8-8861-91d70ca86de8"},{"id":"occ_9bc7bbb19b35d6bd8322c9d6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_644f0702-3e56-4042-accb-0e2c5e4fda24","section_id":"sec_5cdcfff6-5516-46e0-b485-bbd90e91442f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"22．ICは、プリント基板をシリコンの中へ折り畳んだ","quote_start":0,"quote_end":26,"text_sha256":"895a3e9a88873516a8bb0e2aa29f2ca86a6407bf29189c17f902a7112aea425d","block_sha256":"895a3e9a88873516a8bb0e2aa29f2ca86a6407bf29189c17f902a7112aea425d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_644f0702-3e56-4042-accb-0e2c5e4fda24"},{"id":"occ_4f9564917ee320fd82c6c39f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_6732e25f-f1f8-4c5f-a682-045a624bb024","section_id":"sec_685f2ea1-55ab-46c8-a804-8b6da0bc546d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":147,"end":149,"exact":"基板","quote":"            素子B\n────────────────────────\n          シリコン基板","quote_start":92,"quote_end":149,"text_sha256":"89575e4ece3a77e7fa4f44447a2671930bff6f6dd70563303fdf05017517f783","block_sha256":"89575e4ece3a77e7fa4f44447a2671930bff6f6dd70563303fdf05017517f783","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_6732e25f-f1f8-4c5f-a682-045a624bb024"},{"id":"occ_e384bf09a3328d45a7f85643","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_6ccf92c8-7a13-4ae0-badb-d6bcd51dfb29","section_id":"sec_7b9c8be7-022d-4e5b-ab78-17a44bfd016a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":35,"end":37,"exact":"基板","quote":"トランジスタの数が増えるほど、それらをつなぐ金属線、はんだ接合、端子、基板上の配線も増える。一個のトランジスタが十分に信頼できても、一万個を組み合わせれば、接続箇所は数万、数十万に達する。","quote_start":0,"quote_end":94,"text_sha256":"a93008313ef931d91bb300fb5537b1747039de56d467080d012ae8844ed495ef","block_sha256":"a93008313ef931d91bb300fb5537b1747039de56d467080d012ae8844ed495ef","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_6ccf92c8-7a13-4ae0-badb-d6bcd51dfb29"},{"id":"occ_ce53958156887c51e701e024","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_713c42cf-c315-40b8-b76e-79855ea826e7","section_id":"sec_c9b186c5-7a61-4886-b037-bdb6de8d0c7a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":99,"end":101,"exact":"基板","quote":"      │ p型ベース  │\n───────┴──────────┴──────\n          n型基板\n       ↑            ↑\n   接合端は酸化膜の下","quote_start":44,"quote_end":136,"text_sha256":"5c7bf6114fe0f237cf9fe7a8264d2548637a7c12df514aa638a3ac136e5b259e","block_sha256":"5c7bf6114fe0f237cf9fe7a8264d2548637a7c12df514aa638a3ac136e5b259e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_713c42cf-c315-40b8-b76e-79855ea826e7"},{"id":"occ_969ea2ea9fc75cadb3414c9b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_764597b7-9b01-4f39-82f7-677b79a70206","section_id":"sec_d36429df-72fd-426b-80ff-dae54570810e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":95,"end":97,"exact":"基板","quote":"───\np型ベース\n────────────────\nn型コレクタ\n────────────────\nシリコン基板","quote_start":40,"quote_end":97,"text_sha256":"6fdd6860a41b603071476402240e6e6700006725e9853dfec939a9d7b9c63e50","block_sha256":"6fdd6860a41b603071476402240e6e6700006725e9853dfec939a9d7b9c63e50","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_764597b7-9b01-4f39-82f7-677b79a70206"},{"id":"occ_782dbf480cb5df03d91e99e7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_8310ff3f-5831-4399-be95-745177cde648","section_id":"sec_3c6f4ace-7456-4f21-b504-428d06b19b4d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":0,"end":2,"exact":"基板","quote":"基板内部に部品を作り、その表面へ配線まで形成する。","quote_start":0,"quote_end":25,"text_sha256":"e25c8688be6e7416fb7ea49519f44eac3d55bf0c4d36ad1129db693fed1dbee3","block_sha256":"e25c8688be6e7416fb7ea49519f44eac3d55bf0c4d36ad1129db693fed1dbee3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_8310ff3f-5831-4399-be95-745177cde648"},{"id":"occ_48fc5d99e6e09fdc04c990b8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_a20f3d68-b7d0-4f38-91f8-34d7ac0a32e2","section_id":"sec_5cdcfff6-5516-46e0-b485-bbd90e91442f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"プリント基板","quote_start":0,"quote_end":6,"text_sha256":"dbee2d80f4acb0e0614acf4c434947abc8cbf1f9dae38c439a582f778d0bd0a2","block_sha256":"dbee2d80f4acb0e0614acf4c434947abc8cbf1f9dae38c439a582f778d0bd0a2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_a20f3d68-b7d0-4f38-91f8-34d7ac0a32e2"},{"id":"occ_43c3a0fb0ab40e5c26c722ca","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_afb859a0-e047-487e-b584-ba571c4f7385","section_id":"sec_d36429df-72fd-426b-80ff-dae54570810e","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":32,"end":34,"exact":"基板","quote":"典型的なn-p-n型の二重拡散トランジスタでは、まずn型シリコン基板を用意する。この基板の大部分がコレクタとして働く。","quote_start":0,"quote_end":59,"text_sha256":"5aa3758b4d7a23f37c20980424ff8dba31a430b6b699309ad65c247e7a46e252","block_sha256":"5aa3758b4d7a23f37c20980424ff8dba31a430b6b699309ad65c247e7a46e252","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3510f3d4-8673-4b01-866a-65778298be5c/#blk_afb859a0-e047-487e-b584-ba571c4f7385"},{"id":"occ_8b8f0135695687ab53565939","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_3510f3d4-8673-4b01-866a-65778298be5c","work_id":"wrk_5b17f7bd-2ecb-4f66-88b2-ae8aca30fb14","block_id":"blk_b363b665-6e6e-47ca-8ef5-b9e9717d7fcf","section_id":"sec_3c6f4ace-7456-4f21-b504-428d06b19b4d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"絶縁基板\n＋\n銅配線\n＋\n個別部品","quote_start":0,"quote_end":17,"text_sha256":"4cbcb93de25fc32c4868101b99a535fe1abe8b51265f102a1a0ae72e3e1d792e","block_sha256":"4cbcb93de25fc32c4868101b99a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       ↓\n基板へ載せる\n        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SCH\nMQW活性層\nLower SCH\nn-InPバッファ\nn-InP基板\n────────────────\nn側電極","quote_start":46,"quote_end":125,"text_sha256":"9355a47236268bbc0de26a9a8e5f1f8fb1531935c8f552da4e5c4121efef9dd8","block_sha256":"9355a47236268bbc0de26a9a8e5f1f8fb1531935c8f552da4e5c4121efef9dd8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_35ce45f7-18dc-4fd9-90f1-01040dfe8822/#blk_35049aed-689c-4418-98b0-c009c048154c"},{"id":"occ_3692e9b9a2f5a3cff331dbea","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_35ce45f7-18dc-4fd9-90f1-01040dfe8822","work_id":"wrk_66096382-8b63-40cb-a42e-9ca851e790ea","block_id":"blk_4163a2d2-4fa9-4608-9b76-4726aa1591b4","section_id":"sec_b9ddb07a-f849-4b30-9c1c-381e5170a374","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":15,"end":17,"exact":"基板","quote":"しかし、材料の格子定数がInP基板と異なるほど歪みが増え、井戸を厚くしすぎると転位や界面欠陥が発生します。NTTは、高In組成のInGaAs・InAs量子井戸について、臨界膜厚、成長温度、組成を制御し、5nm厚のInAs MQWを構造","quote_start":0,"quote_end":117,"text_sha256":"38bb7cf8243325fd1c5dbf93ca50057a3aaed068da976dca0fd2007cec9167ee","block_sha256":"38bb7cf8243325fd1c5dbf93ca50057a3aaed068da976dca0fd2007cec9167ee","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_35ce45f7-18dc-4fd9-90f1-01040dfe8822/#blk_4163a2d2-4fa9-4608-9b76-4726aa1591b4"},{"id":"occ_8483f325826b62570d79d4fd","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_35ce45f7-18dc-4fd9-90f1-01040dfe8822","work_id":"wrk_66096382-8b63-40cb-a42e-9ca851e790ea","block_id":"blk_438935d7-1900-4305-bae0-cb8d2d1f3729","section_id":"sec_a1ffa67b-8e7a-4ca3-accc-aca385a301b2","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":76,"end":78,"exact":"基板","quote":"やAlGaInAsなどと組み合わせることで、光通信に使われる1.3～1.55µm帯の発光層を形成できる。InP基板上には、格子整合するInGaAsやInGaAsPなどをエピタキシャル成長できる。(DISCO 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 │     │  ████████\n────────────────────\n             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図解｜InP基板と通信波長","quote_start":0,"quote_end":17,"text_sha256":"46b30e4a3d076d127ecc1988734893f583d7594352233ecbcf0dd4c5e250a806","block_sha256":"46b30e4a3d076d127ecc1988734893f583d7594352233ecbcf0dd4c5e250a806","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_35ce45f7-18dc-4fd9-90f1-01040dfe8822/#blk_f2dd41d3-cb34-4ff7-98dc-7a019a415238"},{"id":"occ_ad34cb79980d1d726fc21f56","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_35ce45f7-18dc-4fd9-90f1-01040dfe8822","work_id":"wrk_66096382-8b63-40cb-a42e-9ca851e790ea","block_id":"blk_f3f1ee65-2f3f-475a-9195-afa1ba5752e9","section_id":"sec_35dc1343-d1f8-4181-a8e3-a5d702d26b73","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":25,"end":27,"exact":"基板","quote":"光変調、シリコンフォトニクス、CWレーザー、InP基板、化合物半導体は、なぜ発展してきたのか","quote_start":0,"quote_end":46,"text_sha256":"ccf22d3075456f84df3d8b05d4a5b05ee612e652e2a41efa07f1e788712b4f6c","block_sha256":"ccf22d3075456f84df3d8b05d4a5b05ee612e652e2a41efa07f1e788712b4f6c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_35ce45f7-18dc-4fd9-90f1-01040dfe8822/#blk_f3f1ee65-2f3f-475a-9195-afa1ba5752e9"},{"id":"occ_b4f04e32911c933e591d7c4f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_35ce45f7-18dc-4fd9-90f1-01040dfe8822","work_id":"wrk_66096382-8b63-40cb-a42e-9ca851e790ea","block_id":"blk_fc380c7b-0368-4087-9299-b1878bc64cb5","section_id":"sec_97299f02-2694-4804-acb8-0bc4b29494a6","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"8-1．InP基板","quote_start":0,"quote_end":9,"text_sha256":"466c973443766e432300b155acc806346076132bc47272e94e05c90a0192ee44","block_sha256":"466c973443766e432300b155acc806346076132bc47272e94e05c90a0192ee44","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_35ce45f7-18dc-4fd9-90f1-01040dfe8822/#blk_fc380c7b-0368-4087-9299-b1878bc64cb5"},{"id":"occ_03b408d20296a424acb132b0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_187b81a8-8e76-43b2-b03f-d98aec7c9462","section_id":"sec_bbe85741-012d-453b-bc8a-cfee86047463","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"```text\nInP基板\n   ↓\nエピ成長\n   ↓\nDFBグレーティング形成\n   ↓\nリッジ/埋め込み/再成長\n   ↓\n電極形成\n   ↓\n端面コーティング\n   ↓\nチップ化・検査\n   ↓\nDFBレーザー\n   ","quote_start":0,"quote_end":113,"text_sha256":"ad599bf84d49fd41b9ddba2ee11174287b2f341e0bc503c829c0cc790ec835b1","block_sha256":"ad599bf84d49fd41b9ddba2ee11174287b2f341e0bc503c829c0cc790ec835b1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_187b81a8-8e76-43b2-b03f-d98aec7c9462"},{"id":"occ_b295d9e8e8c840e174fa54ee","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_46cca5b2-5aa7-4a3a-abcc-1873fac1b807","section_id":"sec_e4e18863-e22f-4465-b76f-453046433b41","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":76,"end":78,"exact":"基板","quote":"あたりの速度** である。100G/laneから200G/laneへ進むと、DSP、レーザー、変調器、TIA、基板、コネクタの難度が一気に上がる。","quote_start":21,"quote_end":94,"text_sha256":"f2bab017cef39105d3e433acf5931b1546168dcf220538966a8a22330c209292","block_sha256":"f2bab017cef39105d3e433acf5931b1546168dcf220538966a8a22330c209292","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_46cca5b2-5aa7-4a3a-abcc-1873fac1b807"},{"id":"occ_de120521c65eb916872b7f70","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_4c60da5a-7cf3-44ef-953b-50b1b40b80ef","section_id":"sec_b274be96-5820-4a38-ad2c-df3528f48220","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":9,"end":11,"exact":"基板","quote":"# 第4部：InP基板からCWレーザーアレイまでの工程","quote_start":0,"quote_end":27,"text_sha256":"e46abdfec0580be2e5031240667a1af96c78619a23f12656e31b76b20a11f7c1","block_sha256":"e46abdfec0580be2e5031240667a1af96c78619a23f12656e31b76b20a11f7c1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_4c60da5a-7cf3-44ef-953b-50b1b40b80ef"},{"id":"occ_7c517e61ef8839f61ddec1e2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_4c6c07e5-325a-4546-bb55-bfe8b28357a5","section_id":"sec_ed0cd90a-ca90-4135-9cf9-b98df5aa7bc4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":39,"end":41,"exact":"基板","quote":"高速化すると、DSP、ドライバ、TIA、光変調器、レーザー、フォトダイオード、基板、実装、熱設計、検査装置の難度が上がる。特にAI向けでは大量導入が前提になるため、性能だけでなく、歩留まり、信頼性、供給能力、顧客認証が重くなる。","quote_start":0,"quote_end":114,"text_sha256":"ce37be959730b1f715adccac0899f03344ab9cc5e21d59f6d4a5e81aff90cb76","block_sha256":"ce37be959730b1f715adccac0899f03344ab9cc5e21d59f6d4a5e81aff90cb76","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_4c6c07e5-325a-4546-bb55-bfe8b28357a5"},{"id":"occ_dd5c4202cc0086b15316c376","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_4ee764d1-fd8e-414c-a923-0db74f625a5d","section_id":"sec_ed0cd90a-ca90-4135-9cf9-b98df5aa7bc4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":52,"end":54,"exact":"基板","quote":"このため、AI光通信の勝ち筋は「最も派手な部品」だけではない。高出力CWレーザー、DFBレーザー、InP基板、MOCVD装置、パッケージング、DSP、テスト工程など、量産の首を押さえる場所に価値が出る。","quote_start":0,"quote_end":101,"text_sha256":"1d449791318dbdf7b854b72c28a7d0ad8aed31dbcb987326213d8b4f3058d175","block_sha256":"1d449791318dbdf7b854b72c28a7d0ad8aed31dbcb987326213d8b4f3058d175","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_4ee764d1-fd8e-414c-a923-0db74f625a5d"},{"id":"occ_207ea30283f5b24ab667f510","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_543c987b-6757-4856-8450-806c9c89039a","section_id":"sec_be072737-f95a-459d-a43a-7201777f0ca6","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":308,"end":310,"exact":"基板","quote":"mW CWレーザー、InPファブ拡張  |\n| **住友電工**                  | InP基板、EML、CW-LDを持つ     |\n| **古河電工**                  | DFBレーザチップ、CPO向けELS     |\n| **MACOM / AAOI**       ","quote_start":253,"quote_end":410,"text_sha256":"7d22e4d12a31e07ba54f7c949531070b414b0a8e14cbe002c24faf42f0e9576b","block_sha256":"7d22e4d12a31e07ba54f7c949531070b414b0a8e14cbe002c24faf42f0e9576b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_543c987b-6757-4856-8450-806c9c89039a"},{"id":"occ_8017a35429800a2e56b44018","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_5943c649-a8c3-4a0d-9eec-006b40425ed1","section_id":"sec_6dcdf1fa-0bdf-47dc-9bd4-626354d401be","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":9,"end":11,"exact":"基板","quote":"住友電工は、InP基板について4〜6インチの大口径・高品質を特徴に挙げ、2023年比で2028年にInP基板能力を2.4倍、データセンター内向け光デバイス能力を12倍に拡大する計画を示している。([Sumitomo Ele","quote_start":0,"quote_end":111,"text_sha256":"3ab552004f9e3335810861e3e7daaad36ecf67b90cefbf9fa84544490fee59d1","block_sha256":"3ab552004f9e3335810861e3e7daaad36ecf67b90cefbf9fa84544490fee59d1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_5943c649-a8c3-4a0d-9eec-006b40425ed1"},{"id":"occ_3905531bb537f05174d9aa10","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_6ca18ecc-2fbd-4f9a-a811-efd0b7dcf591","section_id":"sec_0fd1c0a9-31fc-4691-b87c-047b453477e5","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":175,"end":177,"exact":"基板","quote":"----------------------------- | --------------- |\n| InP基板       | **住友電工、AXT、Coherent**                            | レーザーの土台         |\n| エピ成長/エピウェハ  | **IQE、","quote_start":120,"quote_end":277,"text_sha256":"6adc837ff5e6a0889a8a8f514eecc40b6e7f68a8109220316fee59c8d0ffa8cb","block_sha256":"6adc837ff5e6a0889a8a8f514eecc40b6e7f68a8109220316fee59c8d0ffa8cb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_6ca18ecc-2fbd-4f9a-a811-efd0b7dcf591"},{"id":"occ_20e42d6ef384382a1961b65e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_77ce8a1b-a213-410b-942a-a7d0c7ee02c4","section_id":"sec_93908414-f81f-4c43-8958-c2ea1d4497e5","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":44,"end":46,"exact":"基板","quote":"| category | multiple |\n| --- | ---: |\n| InP基板能力 | 2.4 |\n| データセンター内向け光デバイス能力 | 12 |","quote_start":0,"quote_end":83,"text_sha256":"baf2f4c032f6f3c81d57f0b3cb3bd6767b068b19b91a5547ece2e2a144eab000","block_sha256":"baf2f4c032f6f3c81d57f0b3cb3bd6767b068b19b91a5547ece2e2a144eab000","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_77ce8a1b-a213-410b-942a-a7d0c7ee02c4"},{"id":"occ_0fa191ad373ca5a4eaf8e4f9","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_7e88471b-0942-4069-b48a-67c5f29f9c1f","section_id":"sec_6dcdf1fa-0bdf-47dc-9bd4-626354d401be","layer":"body","character_id":null,"count":4,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":119,"end":121,"exact":"基板","quote":" | ---------------------------- |\n| **住友電工**      | InP基板、CW-LD、EML、光デバイスまで持つ    |\n| **AXT**       | InP/GaAs/Ge基板を扱う化合物半導体基板メーカー |\n| **Coherent**  | InPデバイス","quote_start":64,"quote_end":221,"text_sha256":"d1d37d2bd85e3479869385203825403c5f43bf1da4d4ca2fbc389a75d0a1a7db","block_sha256":"d1d37d2bd85e3479869385203825403c5f43bf1da4d4ca2fbc389a75d0a1a7db","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_7e88471b-0942-4069-b48a-67c5f29f9c1f"},{"id":"occ_e6559c1d3647a862f1b42ea7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_7eb6f11e-e8d4-41c4-8ade-3646595f1ed8","section_id":"sec_940620e4-e818-476d-a500-ca2f6eaf9ad2","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":3,"end":5,"exact":"基板","quote":"InP基板の上には、MOCVD/MOVPEで発光層、量子井戸、クラッド層を積む。これがエピ成長である。","quote_start":0,"quote_end":51,"text_sha256":"c681c6d035056c48f7d1d1f120dc6c4a17a4672102e5efb41906c4620bbe0227","block_sha256":"c681c6d035056c48f7d1d1f120dc6c4a17a4672102e5efb41906c4620bbe0227","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_7eb6f11e-e8d4-41c4-8ade-3646595f1ed8"},{"id":"occ_1efec6a431e4d2e7a7220c47","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_9cfa4e9e-a8e8-433c-9797-b3525ff97e3c","section_id":"sec_93908414-f81f-4c43-8958-c2ea1d4497e5","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":100,"end":102,"exact":"基板","quote":"h、TIA、Driverが重要になる。\nその先のCPO/光I/O時代には、外部光源、CWレーザーアレイ、InP基板、MOCVD/IBD装置、SiPhパッケージングがさらに重要になる。","quote_start":45,"quote_end":136,"text_sha256":"fab9c6b5c7718877166ca4425193a1f6f2c2314083634e4b192c5ecc1152ce8c","block_sha256":"fab9c6b5c7718877166ca4425193a1f6f2c2314083634e4b192c5ecc1152ce8c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_9cfa4e9e-a8e8-433c-9797-b3525ff97e3c"},{"id":"occ_0486a3e7f72c69680baa5640","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_9e4852c5-0a5a-4f9f-a840-9556d58a5d77","section_id":"sec_6dcdf1fa-0bdf-47dc-9bd4-626354d401be","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":9,"end":11,"exact":"基板","quote":"## 9. InP基板：レーザーの土台","quote_start":0,"quote_end":19,"text_sha256":"e8bb52478cf80c5b3ac1fe78dae105788d42bcd66d34084e2284c7475e446e4b","block_sha256":"e8bb52478cf80c5b3ac1fe78dae105788d42bcd66d34084e2284c7475e446e4b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_9e4852c5-0a5a-4f9f-a840-9556d58a5d77"},{"id":"occ_f92272e75b35506864d779a0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_a1aae48d-a322-4485-8e7d-4dfb16cf851f","section_id":"sec_940620e4-e818-476d-a500-ca2f6eaf9ad2","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":80,"end":82,"exact":"基板","quote":"ド層\n光閉じ込め層\nInGaAsP / AlGaInAs 量子井戸\n光閉じ込め層\nn-InPクラッド層\nInP基板\n```","quote_start":25,"quote_end":86,"text_sha256":"ddca7689cdaa1b70b5ac023ffd80574ba84f872b431835a96e2b5a481bafb7a7","block_sha256":"ddca7689cdaa1b70b5ac023ffd80574ba84f872b431835a96e2b5a481bafb7a7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_a1aae48d-a322-4485-8e7d-4dfb16cf851f"},{"id":"occ_1a0bf095322caa8b7ac07874","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_a8c2c6c0-c71b-40d9-8afb-3ef34787f505","section_id":"sec_bbe85741-012d-453b-bc8a-cfee86047463","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":3,"end":5,"exact":"基板","quote":"InP基板からCWレーザーアレイを作る流れは、概念的にはこうなる。","quote_start":0,"quote_end":33,"text_sha256":"34b67a41e804606ef1e082cb899675ba2f824611582fe2bc99c2fd7ff46a0e82","block_sha256":"34b67a41e804606ef1e082cb899675ba2f824611582fe2bc99c2fd7ff46a0e82","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_a8c2c6c0-c71b-40d9-8afb-3ef34787f505"},{"id":"occ_5a4f09eecdba7c525091dc93","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_b413489f-c48d-464c-b889-ce44a1bfa58b","section_id":"sec_3490b513-7e7f-4566-aa1f-8ce7ecb16b0a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":160,"end":162,"exact":"基板","quote":"光源をどう安定供給するかが重要になる。\n- 800G/1.6Tでは、DSP、レーザー、光エンジン、検査、装置、基板まで付加価値が広がる。\n- 光通信は、AIデータセンターを巨大な分散計算機として成立させる神経系である。","quote_start":105,"quote_end":214,"text_sha256":"a0e064b7b5601ec5dbb1fd02d59be01f301403fc2fe57dcb515f4004a7f51a00","block_sha256":"a0e064b7b5601ec5dbb1fd02d59be01f301403fc2fe57dcb515f4004a7f51a00","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_b413489f-c48d-464c-b889-ce44a1bfa58b"},{"id":"occ_c7856f8d00d1e769e80158a3","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_b70091af-b806-4a86-b203-2730e19a3686","section_id":"sec_6dcdf1fa-0bdf-47dc-9bd4-626354d401be","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":13,"end":15,"exact":"基板","quote":"この差は重要である。InP基板だけでなく、その上に作る **EML、CW-LD、レーザーアレイ** の数量拡大と高付加価値化が進むことを示している。","quote_start":0,"quote_end":74,"text_sha256":"64f8d442c88e251e6eaab66caeabf306f4dd67e5fbdfc752501bf45db70f7ae3","block_sha256":"64f8d442c88e251e6eaab66caeabf306f4dd67e5fbdfc752501bf45db70f7ae3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_b70091af-b806-4a86-b203-2730e19a3686"},{"id":"occ_42c7c8ac6292894b9b3306ea","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_cd5c91d8-333d-4564-a9d3-a9a71ff08dd4","section_id":"sec_b1957726-2198-426f-a1fc-cba19e537486","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":9,"end":11,"exact":"基板","quote":"住友電工は、InP基板、EML、CW-LD、光デバイス、光ファイバー、光配線まで持つ。\nAIデータセンター光通信では、**上流材料から光部品まで持つ垂直統合型プレーヤー** である。情報通信セグメントの中期成長計画も強く、","quote_start":0,"quote_end":111,"text_sha256":"4f97b1e72b2dfb1299344e26aee0c9a5d17236aa07fb9128e4931eef11004afc","block_sha256":"4f97b1e72b2dfb1299344e26aee0c9a5d17236aa07fb9128e4931eef11004afc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_cd5c91d8-333d-4564-a9d3-a9a71ff08dd4"},{"id":"occ_2f8b8eeb141093a060ff1fe1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_e2b85728-5d2e-4f6e-a743-bd0c9461ba25","section_id":"sec_93908414-f81f-4c43-8958-c2ea1d4497e5","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":25,"end":27,"exact":"基板","quote":"2023年比で見た2028年の能力拡大倍率。InP基板よりも光デバイス側の増強倍率が大きい。","quote_start":0,"quote_end":46,"text_sha256":"44b4e503ace3fda8f3f484b1f0b291d1c0f0da9eaf1a0ea9aabb75fc271072cd","block_sha256":"44b4e503ace3fda8f3f484b1f0b291d1c0f0da9eaf1a0ea9aabb75fc271072cd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_e2b85728-5d2e-4f6e-a743-bd0c9461ba25"},{"id":"occ_70974e6bb2ab503624f19eca","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_37ec6023-d760-4f21-887c-7dd94c473806","work_id":"wrk_48893baf-fbd1-4353-8bc8-5b83bc4aae4f","block_id":"blk_eea10f84-ca99-4d1f-8e87-e864aa4fb672","section_id":"sec_6dcdf1fa-0bdf-47dc-9bd4-626354d401be","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"最初に必要なのがInP基板である。基板の品質、欠陥密度、口径、面内均一性は、後工程の歩留まりに効く。","quote_start":0,"quote_end":50,"text_sha256":"cbdd6e745b1d29af1d62d6cf5530f19e0bfe54fac5f6cedd2f53cd611b5846fc","block_sha256":"cbdd6e745b1d29af1d62d6cf5530f19e0bfe54fac5f6cedd2f53cd611b5846fc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_37ec6023-d760-4f21-887c-7dd94c473806/#blk_eea10f84-ca99-4d1f-8e87-e864aa4fb672"},{"id":"occ_31a771021bac95817fdf0db2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_402559ee-01e9-43f3-a0e9-719e30746fc3","work_id":"wrk_67925a7e-ce57-455f-b9a5-38cd3e4c1881","block_id":"blk_00d2be44-c036-4410-8181-696ed447e0d9","section_id":"sec_3f405d80-fcac-4ee8-839c-9bf43000d5b6","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":47,"end":50,"exact":"PCB","quote":"DSP\n+\nLaser\n+\nEML / SiPh\n+\nDriver\n+\nTIA\n+\nPD\n+\nPCB\n+\nFirmware\n+\nFiber Coupling\n+\nThermal Design\n+\nAssembly\n+\nBurn-in\n+\nTesting","quote_start":0,"quote_end":126,"text_sha256":"d23c626e27fff285933f0bcada648d7bacef140e385a6051d4747528e391149b","block_sha256":"d23c626e27fff285933f0bcada648d7bacef140e385a6051d4747528e391149b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_402559ee-01e9-43f3-a0e9-719e30746fc3/#blk_00d2be44-c036-4410-8181-696ed447e0d9"},{"id":"occ_4159d12cd5afcee7322c7f7b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_402559ee-01e9-43f3-a0e9-719e30746fc3","work_id":"wrk_67925a7e-ce57-455f-b9a5-38cd3e4c1881","block_id":"blk_4aa7ed8f-19a0-40b1-ad8e-b7e18faf3910","section_id":"sec_7f5bb67f-ae4e-4855-b40d-042e64cebf91","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":26,"end":29,"exact":"PCB","quote":"Switch ASIC\n     │\n     │ PCB上の電気信号\n     ▼\nOSFP\n     │\n     ▼\nFiber","quote_start":0,"quote_end":67,"text_sha256":"f04c2c3027dadb9b652f6be99ffd6d903789416865879d103e271d4bd69c750a","block_sha256":"f04c2c3027dadb9b652f6be99ffd6d903789416865879d103e271d4bd69c750a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_402559ee-01e9-43f3-a0e9-719e30746fc3/#blk_4aa7ed8f-19a0-40b1-ad8e-b7e18faf3910"},{"id":"occ_9f9ed4ed977e428f0350e6e6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_402559ee-01e9-43f3-a0e9-719e30746fc3","work_id":"wrk_67925a7e-ce57-455f-b9a5-38cd3e4c1881","block_id":"blk_a23e32dd-90ef-4ee9-b304-d0f0d6966ad3","section_id":"sec_42edf763-6c2c-4a93-9e1b-8b8b79a77249","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":0,"end":3,"exact":"PCB","quote":"PCB、","quote_start":0,"quote_end":4,"text_sha256":"e25b33c2d6637a0652b4d8d7a78695b66463478bdb72f0146e26dd9bee59a848","block_sha256":"e25b33c2d6637a0652b4d8d7a78695b66463478bdb72f0146e26dd9bee59a848","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_402559ee-01e9-43f3-a0e9-719e30746fc3/#blk_a23e32dd-90ef-4ee9-b304-d0f0d6966ad3"},{"id":"occ_6db4dd0387c12c930921fc47","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_402559ee-01e9-43f3-a0e9-719e30746fc3","work_id":"wrk_67925a7e-ce57-455f-b9a5-38cd3e4c1881","block_id":"blk_a64eca6a-0ef9-49e9-ad28-930af54dead4","section_id":"sec_87221633-9702-4dcc-990d-5b97897db555","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":7,"end":10,"exact":"PCB","quote":"高速電気信号はPCBやコネクタを通るうちに、","quote_start":0,"quote_end":22,"text_sha256":"b83a8460553b8dd2ca740e4576685797efbd93b67ba000ce72671a3df59c79a4","block_sha256":"b83a8460553b8dd2ca740e4576685797efbd93b67ba000ce72671a3df59c79a4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_402559ee-01e9-43f3-a0e9-719e30746fc3/#blk_a64eca6a-0ef9-49e9-ad28-930af54dead4"},{"id":"occ_7157cf3b74b5408d0a11bd0a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_434ed8d3-8167-4144-9b6e-d003da6dda05","work_id":"wrk_3a0c5c0e-1aa0-4c0a-919b-6fdb8f3ded2d","block_id":"blk_472f5678-f0b2-4724-8851-9c6036cc7767","section_id":"sec_6e6dd18c-a4ac-4261-8061-54b1d1771303","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":3,"end":5,"exact":"基板","quote":"GaN基板上にGaNデバイスを形成し、電流を縦方向に流す。","quote_start":0,"quote_end":29,"text_sha256":"268495fa27323a382f803c338fde121ebc3817bef0e401205f48c94455e9d3a9","block_sha256":"268495fa27323a382f803c338fde121ebc3817bef0e401205f48c94455e9d3a9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_434ed8d3-8167-4144-9b6e-d003da6dda05/#blk_472f5678-f0b2-4724-8851-9c6036cc7767"},{"id":"occ_0c51b4b0d138c45c7ae59da8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_434ed8d3-8167-4144-9b6e-d003da6dda05","work_id":"wrk_3a0c5c0e-1aa0-4c0a-919b-6fdb8f3ded2d","block_id":"blk_55fd147f-fab3-4036-ae7e-9e142bed24cc","section_id":"sec_628f4d16-5cba-4e8e-83ca-444bf69b763f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":60,"end":62,"exact":"基板","quote":"iはvGaNの用途としてAerospace / Defenseも明示している。Vertical GaNはGaN基板上で電流を縦方向に流し、700V/1,200V品をEarly Access CustomerへSampling中である。 (onsemi)","quote_start":5,"quote_end":131,"text_sha256":"44cda5f6ec5e88b4178f9f6da27b68e13a8032f665466ebe89a05c186330d464","block_sha256":"44cda5f6ec5e88b4178f9f6da27b68e13a8032f665466ebe89a05c186330d464","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_434ed8d3-8167-4144-9b6e-d003da6dda05/#blk_55fd147f-fab3-4036-ae7e-9e142bed24cc"},{"id":"occ_e6429a18c34eb0e38e993f38","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_434ed8d3-8167-4144-9b6e-d003da6dda05","work_id":"wrk_3a0c5c0e-1aa0-4c0a-919b-6fdb8f3ded2d","block_id":"blk_b4b0a5b9-e102-462b-9719-dac3ce59333b","section_id":"sec_c766e7b9-d489-4ebb-a765-dc24ef5987ff","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":4,"end":7,"exact":"PCB","quote":"を離してPCB配線するとGaN本来のSwitching Speedを使い切れない。","quote_start":0,"quote_end":41,"text_sha256":"267cce12cf2a442a74a69d9a060955ece4083856d50353c8b1ef62e2b65c230d","block_sha256":"267cce12cf2a442a74a69d9a060955ece4083856d50353c8b1ef62e2b65c230d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_434ed8d3-8167-4144-9b6e-d003da6dda05/#blk_b4b0a5b9-e102-462b-9719-dac3ce59333b"},{"id":"occ_4d980e370898a025d607c6ed","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_44c73f5c-647d-467e-8aa2-527eb6352a8a","work_id":"wrk_45578dda-8dcf-452e-909d-3f4c17ea166c","block_id":"blk_cc40735c-c2ef-4188-82e0-ac28adfc4330","section_id":"sec_07e25edc-7a88-498a-90d8-24c1e67ec925","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":63,"end":65,"exact":"基板","quote":"ysisによると、HBM3EではAIアクセラレーターとHBMの間に1000本以上の信号線が必要となり、一般的な基板ではなく、2.5Dパッケージが必要になる。([SemiAnalysis](https://newsletter.semianalysis.com/p/scaling-the-memory-wall-t","quote_start":8,"quote_end":165,"text_sha256":"a19948f649642587a84193527163d18b48543bcaee319506452862a660e826fe","block_sha256":"a19948f649642587a84193527163d18b48543bcaee319506452862a660e826fe","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_44c73f5c-647d-467e-8aa2-527eb6352a8a/#blk_cc40735c-c2ef-4188-82e0-ac28adfc4330"},{"id":"occ_794e6c3ffd5b2d3e20e2d1d3","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_0a39f32f-9753-477b-acf6-8013c920fcc6","section_id":"sec_0b2124b8-c0dc-42d4-ac2e-b00f4dc05170","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":22,"end":24,"exact":"基板","quote":"- シリコンへの電流漏れを防ぐ\n- TSVと基板間の絶縁耐圧を確保する\n- 銅がシリコンへ直接触れるのを防ぐ\n- デバイス回路への電気的影響を抑える","quote_start":0,"quote_end":74,"text_sha256":"d4b1bede189a2420ad1b99d807a217f005899843a3ffcc9752cc4fe45256ddeb","block_sha256":"d4b1bede189a2420ad1b99d807a217f005899843a3ffcc9752cc4fe45256ddeb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_0a39f32f-9753-477b-acf6-8013c920fcc6"},{"id":"occ_0d46dbb7a47aa8854785daa9","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_24dd710d-5870-4fc7-9dac-55a5a917adb3","section_id":"sec_e7e837b0-e363-4093-85f4-e2dee46bba9d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":36,"end":38,"exact":"基板","quote":"一方、TSVはその信号や電源をインターポーザーの下面へ降ろし、パッケージ基板へ接続する。","quote_start":0,"quote_end":44,"text_sha256":"ce04b0799468fbec8b689b20473f8df483ba47d4a2f349fe77830ed071e77c1e","block_sha256":"ce04b0799468fbec8b689b20473f8df483ba47d4a2f349fe77830ed071e77c1e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_24dd710d-5870-4fc7-9dac-55a5a917adb3"},{"id":"occ_dd9d2423f98680e3bd985229","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_3645c0c8-7388-4f26-9068-32be68829d08","section_id":"sec_f5b6700e-ac82-43f2-a129-b0f85d322136","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":23,"end":25,"exact":"基板","quote":"```\nTSV信号線\n   │\n   ├── 基板との寄生容量\n   │\n   ├── 隣接TSVとの結合\n   │\n   └── 導体抵抗・インダクタンス\n```","quote_start":0,"quote_end":82,"text_sha256":"f382963963af67ac040820ab1f8ab7e70aaa0289ca49eb06b0d043937de51272","block_sha256":"f382963963af67ac040820ab1f8ab7e70aaa0289ca49eb06b0d043937de51272","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_3645c0c8-7388-4f26-9068-32be68829d08"},{"id":"occ_09b390a6e0457306947b7a56","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_4eba93de-9eaf-4560-81b8-f7afccbe56c2","section_id":"sec_90c339de-62e8-478b-a40f-1617102ebce0","layer":"body","character_id":null,"count":1,"matched_aliases":["低誘電"],"evidence":{"text_basis":"markdown","start":20,"end":23,"exact":"低誘電","quote":"- シリコン結晶\n- トランジスタ\n- 低誘電率膜\n- TSV界面\n- 上下の金属配線","quote_start":0,"quote_end":43,"text_sha256":"2a0d255a80fcfc1fe28e9d85622edadedafb0e183e44b0e4355efdb5efae4e4c","block_sha256":"2a0d255a80fcfc1fe28e9d85622edadedafb0e183e44b0e4355efdb5efae4e4c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_4eba93de-9eaf-4560-81b8-f7afccbe56c2"},{"id":"occ_425ca8ff36b736eabda0f02c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_552eab1a-9ae3-49c9-ae7c-6b14b6ccd1d7","section_id":"sec_0b2124b8-c0dc-42d4-ac2e-b00f4dc05170","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":28,"end":30,"exact":"基板","quote":"```\n銅TSV\n  ↓\n絶縁ライナー\n  ↓\nシリコン基板\n```","quote_start":0,"quote_end":34,"text_sha256":"dddc6e410657cc0b476ac0dddf853167e78e3b47a316cd5cf08dd36400c285d2","block_sha256":"dddc6e410657cc0b476ac0dddf853167e78e3b47a316cd5cf08dd36400c285d2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_552eab1a-9ae3-49c9-ae7c-6b14b6ccd1d7"},{"id":"occ_d69e408c5c5bb1de9979e192","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_bc7fede6-febb-4dfa-a97c-1e153908b9c7","section_id":"sec_b1e51e98-9f17-4a07-a857-bed833ac1cf9","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":76,"end":78,"exact":"基板","quote":"上面と下面を接続する垂直配線である。\n- 一般的なTSVは、銅導体、シード層、バリア層、絶縁ライナー、シリコン基板から構成される。\n- 絶縁ライナーは漏れ電流を防ぎ、バリア層は銅の拡散を防ぐ。\n- シード層は電解めっきで銅を成長させるための導電性の下地になる。\n- Deep RIEやボッシュプロセスで深い穴を形成","quote_start":21,"quote_end":178,"text_sha256":"3a5487509f8506a8bcb5d2989c26124ed5e20113537d484be6d9849f4ecb3eaa","block_sha256":"3a5487509f8506a8bcb5d2989c26124ed5e20113537d484be6d9849f4ecb3eaa","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_bc7fede6-febb-4dfa-a97c-1e153908b9c7"},{"id":"occ_9be0a48edd6e03493ca738a2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_ca7bd5dc-0272-4ef0-bacb-9a3a3a46f5d2","section_id":"sec_f5b6700e-ac82-43f2-a129-b0f85d322136","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":21,"end":23,"exact":"基板","quote":"- 抵抗\n- インダクタンス\n- シリコン基板との容量\n- 隣接TSVとの結合容量\n- 基板への漏れ","quote_start":0,"quote_end":50,"text_sha256":"6df72d0235f34e3af0a4bacc02d684af71d16479a8d45b96dd22c07e34df6d41","block_sha256":"6df72d0235f34e3af0a4bacc02d684af71d16479a8d45b96dd22c07e34df6d41","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_ca7bd5dc-0272-4ef0-bacb-9a3a3a46f5d2"},{"id":"occ_b20924b73c12aea8328d1b9b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_d5e41ea9-4dd9-4b37-bf10-2d74274deaa6","section_id":"sec_8d8462de-aa9d-4536-bcb9-8a526668b56f","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":8,"end":10,"exact":"基板","quote":"```\nシリコン基板\n┌─────────────────────┐\n│     絶縁ライナー          │\n│   ┌────────────────┐ │\n│   │ バリア層             │ │","quote_start":0,"quote_end":110,"text_sha256":"3dcdcbd860e83486707508b36372aa80d148b4c2e6dab4f6e9b1374ebcb71fca","block_sha256":"3dcdcbd860e83486707508b36372aa80d148b4c2e6dab4f6e9b1374ebcb71fca","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_d5e41ea9-4dd9-4b37-bf10-2d74274deaa6"},{"id":"occ_6ea206d5564464a214cb949a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_ea016b16-83c5-487b-9ef5-289cbf696690","section_id":"sec_0b2124b8-c0dc-42d4-ac2e-b00f4dc05170","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":23,"end":25,"exact":"基板","quote":"銅をシリコンへ直接埋め込むと、銅配線とシリコン基板の間で電気的な絶縁を確保できない。","quote_start":0,"quote_end":42,"text_sha256":"906d85cf9d08bd1f0e7ef0410bb0fb41ca2adcb6b7b30e1d4636201d3c331522","block_sha256":"906d85cf9d08bd1f0e7ef0410bb0fb41ca2adcb6b7b30e1d4636201d3c331522","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_ea016b16-83c5-487b-9ef5-289cbf696690"},{"id":"occ_fb2b3d26e4b581ba9b015a82","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_f27ed086-b4b4-4218-a5af-c2d41497dc13","section_id":"sec_e7e837b0-e363-4093-85f4-e2dee46bba9d","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":111,"end":113,"exact":"基板","quote":"        ↓\nインターポーザーTSV\n        ↓\nC4バンプ\n        ↓\n有機パッケージ基板\n```","quote_start":56,"quote_end":117,"text_sha256":"70cd6b0b7d14b70a527a323f0aaa54707b65249dc2c55c992a4ca14168a72700","block_sha256":"70cd6b0b7d14b70a527a323f0aaa54707b65249dc2c55c992a4ca14168a72700","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_f27ed086-b4b4-4218-a5af-c2d41497dc13"},{"id":"occ_5062e82ecce77e8f2509245d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_037e5ac4-1f20-4565-b8b5-60978d558ab7","section_id":"sec_3238d8bf-1b25-43f5-b51f-d5c09df28207","layer":"code","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":250,"end":252,"exact":"基板","quote":" レーザー\n  └─ ファイバーアタッチ\n────────────────\nABF / ガラスコア / 低損失基板\n────────────────\nPCB / ラック配線\n────────────────\nCPO Switch / Optical Fabric\n```","quote_start":195,"quote_end":330,"text_sha256":"2093fd68f17b5e3586ea66e1a987a025fd86d38f51d5e0b283fd9b09d57836d9","block_sha256":"2093fd68f17b5e3586ea66e1a987a025fd86d38f51d5e0b283fd9b09d57836d9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_037e5ac4-1f20-4565-b8b5-60978d558ab7"},{"id":"occ_de115d5229807afb888cd960","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_10c0ce1d-a823-4704-ba6c-32166e082265","section_id":"sec_df1d1b25-2486-4f01-a77f-24d12b0cb671","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":52,"end":54,"exact":"基板","quote":"```\nGPU / HBMパッケージ\n────────────────\nGPUボード / アクセラレータ基板\n────────────────\nPCIe / CXL / 専用高速リンク\n────────────────\nHBFモジュール / XL-FLASH SSD / AI SSD\n```","quote_start":0,"quote_end":146,"text_sha256":"89a45b68cc7074c989661f2d0d5f15b9df0203849a100008d9cfdbbc724688f4","block_sha256":"89a45b68cc7074c989661f2d0d5f15b9df0203849a100008d9cfdbbc724688f4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_10c0ce1d-a823-4704-ba6c-32166e082265"},{"id":"occ_3873506333ad97d47f586067","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_10c180bc-eaf9-4e29-ab4b-e9874e8bff0e","section_id":"sec_1a62dcca-b07e-491c-8abe-34dbf9e9b7f3","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":40,"end":42,"exact":"基板","quote":"シリコンインターポーザやチップレットの下には、**ABF/FC-BGAパッケージ基板**がある。","quote_start":0,"quote_end":48,"text_sha256":"60ecb7793f709d2db1a6f59f9471a4967aa3dd3b08bf390a55db39c4e2ce6f1d","block_sha256":"60ecb7793f709d2db1a6f59f9471a4967aa3dd3b08bf390a55db39c4e2ce6f1d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_10c180bc-eaf9-4e29-ab4b-e9874e8bff0e"},{"id":"occ_15208f4cfd1fc1880ed1d09c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_1aa97ffd-8b08-4716-998d-7f4c07213ba2","section_id":"sec_1a62dcca-b07e-491c-8abe-34dbf9e9b7f3","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":79,"end":82,"exact":"PCB","quote":"/ Ajinomoto Fine-Techno、Ibiden、新光電気工業、Unimicron、Nan Ya PCB、AT&S、Samsung Electro-Mechanics、TOPPAN、Kyocera** などである。","quote_start":24,"quote_end":137,"text_sha256":"84fc4dcecbed4e7ca8984ad093511382b8e9b959d2fec9e9939a008da2b1e4d3","block_sha256":"84fc4dcecbed4e7ca8984ad093511382b8e9b959d2fec9e9939a008da2b1e4d3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_1aa97ffd-8b08-4716-998d-7f4c07213ba2"},{"id":"occ_a4488fa2c79dd71890171c16","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_2a264987-a373-4295-9327-e96830f0d835","section_id":"sec_a21fb7ac-fedc-4118-b2e1-e125af64e4ba","layer":"body","character_id":null,"count":4,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":8,"end":10,"exact":"基板","quote":"一方、パッケージ基板のコア層や厚いPCBでは、メカニカルドリルも重要である。ここで強いのが **ユニオンツール** である。ユニオンツールはレーザードリル装置メーカーではないが、PCB・パッケージ基板向けの超精密メカニカ","quote_start":0,"quote_end":110,"text_sha256":"5e8c2755e4b5c7a91386da3e010767787d09a9a5bd3bcac7159456f9c33ed8b9","block_sha256":"5e8c2755e4b5c7a91386da3e010767787d09a9a5bd3bcac7159456f9c33ed8b9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_2a264987-a373-4295-9327-e96830f0d835"},{"id":"occ_66460f1bed781e731ec4d13b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_32f0462b-df8f-431e-ad6b-4b4dcb946c08","section_id":"sec_f99c60bf-298a-4808-bad4-d5e461d2d139","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":15,"end":17,"exact":"基板","quote":"## 5-1. Tガラス：大型基板を反らせない骨格","quote_start":0,"quote_end":25,"text_sha256":"18c232a7684e6b41894c23692daf672eb543f82c91293056f56f89c9f12ef350","block_sha256":"18c232a7684e6b41894c23692daf672eb543f82c91293056f56f89c9f12ef350","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_32f0462b-df8f-431e-ad6b-4b4dcb946c08"},{"id":"occ_28bdb7f67f0c065ae9594195","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_3532c279-82f6-43b4-afed-4b73fbaefd0c","section_id":"sec_db109102-2a60-4efa-81f5-5f380848d0d6","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":117,"end":119,"exact":"基板","quote":"\n └──── シリコンインターポーザ ────┘\n              │\n          ABF基板\n```","quote_start":62,"quote_end":123,"text_sha256":"fe6e8c41ec08302b6db7651c6b366d41860b55b7f70f789f93f915cba01b6eb5","block_sha256":"fe6e8c41ec08302b6db7651c6b366d41860b55b7f70f789f93f915cba01b6eb5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_3532c279-82f6-43b4-afed-4b73fbaefd0c"},{"id":"occ_b65f5668ad065e41ebd8cb68","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_4356f53a-bbf2-4f71-94a6-7bab969ad532","section_id":"sec_a21fb7ac-fedc-4118-b2e1-e125af64e4ba","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":9,"end":11,"exact":"基板","quote":"後工程・パッケージ基板では、微細な穴を開け、多層配線をつなぐ技術が必要になる。","quote_start":0,"quote_end":39,"text_sha256":"2f7605a6f5263e9a990d13de8e58c17bf549906fd69427a8035663249cc5b536","block_sha256":"2f7605a6f5263e9a990d13de8e58c17bf549906fd69427a8035663249cc5b536","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_4356f53a-bbf2-4f71-94a6-7bab969ad532"},{"id":"occ_cb2ef5356a8e1b6d479797ca","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_4d62d01d-17c9-4774-ad81-f7d6acae3fc6","section_id":"sec_b096ef5b-f66e-4fc5-9e83-e096ae58fc36","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":43,"end":45,"exact":"基板","quote":"```\nGPU / AI ASIC\n＋ HBM\n＋ シリコンインターポーザ\n＋ ABF基板\n＋ 電源・冷却・テスト\n```","quote_start":0,"quote_end":61,"text_sha256":"6c6fc48db796f08e27fb4e29a4133e757560b31aee070c56b773a3c6c1ecb205","block_sha256":"6c6fc48db796f08e27fb4e29a4133e757560b31aee070c56b773a3c6c1ecb205","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_4d62d01d-17c9-4774-ad81-f7d6acae3fc6"},{"id":"occ_b12f536e821d556be4535b9d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_555da520-76af-4fac-bd58-b969f9feb993","section_id":"sec_e35e4ca6-848b-411a-8ce5-1c2aa70d191c","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":147,"end":149,"exact":"基板","quote":"/ RDLインターポーザ ────┘\n                 │\n              ABF基板\n```","quote_start":92,"quote_end":153,"text_sha256":"8e03ef3230e08b11246e9b73b9891cb67db2b9d2fa96d88498ede25bfdfc89ad","block_sha256":"8e03ef3230e08b11246e9b73b9891cb67db2b9d2fa96d88498ede25bfdfc89ad","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_555da520-76af-4fac-bd58-b969f9feb993"},{"id":"occ_b3dc58a7da6a5dcf625c02a5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_61e12300-9686-4c1d-8f8d-c8fa90c17f3a","section_id":"sec_1a62dcca-b07e-491c-8abe-34dbf9e9b7f3","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":49,"end":51,"exact":"基板","quote":"ABFは、Ajinomoto Build-up Filmの略で、高性能CPU/GPU向けパッケージ基板のビルドアップ絶縁フィルムである。味の素は、ABFがナノメートル級のCPU回路をミリメートル級の電子部品やシステムへ接続するためのビルドアップ基板形成を支える材料であり、レーザー加工や銅めっきに適した","quote_start":0,"quote_end":151,"text_sha256":"3c27cc3d58c5d58c21fe1e273effa471c5193e5ed72883087337aabec3783de5","block_sha256":"3c27cc3d58c5d58c21fe1e273effa471c5193e5ed72883087337aabec3783de5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_61e12300-9686-4c1d-8f8d-c8fa90c17f3a"},{"id":"occ_e9cd1bf9a587e6ef240cc610","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_6ae0fc74-9d7b-4a86-917a-7ef5d77b2072","section_id":"sec_5a553eff-e018-4fbd-b9c4-a96e94324cad","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":21,"end":23,"exact":"基板","quote":"MLCCは、チップ内部ではなく、パッケージ基板、GPUモジュール基板、マザーボード、VRM周辺で使われる。","quote_start":0,"quote_end":53,"text_sha256":"f54b05a03c74bc4a92a4a67b38356c4d6db85e7ab542f2fbae3434d6623ef27f","block_sha256":"f54b05a03c74bc4a92a4a67b38356c4d6db85e7ab542f2fbae3434d6623ef27f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_6ae0fc74-9d7b-4a86-917a-7ef5d77b2072"},{"id":"occ_d61c4888dbbce4c1f52bd401","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_6b58cfb4-2824-477f-8472-c4cb94fe6a76","section_id":"sec_fb43b0fc-7bca-4997-b268-c08e190841d2","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":134,"end":136,"exact":"基板","quote":"I GPUやサーバーCPU、AI ASICは、**トランジスタ層、金属配線層、接合層、インターポーザ層、ABF基板層、電源安定化層、冷却層、テスト層**が重なった巨大な工学システムである。","quote_start":79,"quote_end":173,"text_sha256":"2150c11b203e0fe0a2c31e64f333e069c80c78e76540f549e38f7dbd5341f3ba","block_sha256":"2150c11b203e0fe0a2c31e64f333e069c80c78e76540f549e38f7dbd5341f3ba","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_6b58cfb4-2824-477f-8472-c4cb94fe6a76"},{"id":"occ_1210039961a5f83408e8581f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_6b6a67da-a7be-4ccf-a9df-794f5293a551","section_id":"sec_f99c60bf-298a-4808-bad4-d5e461d2d139","layer":"code","character_id":null,"count":1,"matched_aliases":["ガラスクロス"],"evidence":{"text_basis":"markdown","start":60,"end":66,"exact":"ガラスクロス","quote":"BFビルドアップ層\n────────────────\nコア材 / プリプレグ\n  └─ Tガラス / 低CTEガラスクロス\n────────────────\nABFビルドアップ層\n```","quote_start":5,"quote_end":98,"text_sha256":"63907ccf8bd7c07fecf05449b10eb807bed09ea5829d1e482d9322de38a64b69","block_sha256":"63907ccf8bd7c07fecf05449b10eb807bed09ea5829d1e482d9322de38a64b69","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_6b6a67da-a7be-4ccf-a9df-794f5293a551"},{"id":"occ_5ff591471280bc58c8210e0a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_71ed055d-bf07-4ebd-a185-0507cdf1839d","section_id":"sec_f99c60bf-298a-4808-bad4-d5e461d2d139","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"役割は、基板の反りを抑えること。  \nAI GPUのような巨大パッケージでは、シリコン、樹脂、銅、ガラスの熱膨張差によって反りが起こる。反りが大きいと、バンプ割れ、接続不良、歩留まり低下が起きる。","quote_start":0,"quote_end":98,"text_sha256":"ff1aed31ace635239600d3447d629ad0a5d32f3902981ea357688c669c066bf0","block_sha256":"ff1aed31ace635239600d3447d629ad0a5d32f3902981ea357688c669c066bf0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_71ed055d-bf07-4ebd-a185-0507cdf1839d"},{"id":"occ_264bffdb53b93a0db19aba2d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_7c40604c-b86f-4045-b297-41cf6f7d5163","section_id":"sec_3238d8bf-1b25-43f5-b51f-d5c09df28207","layer":"code","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":63,"end":65,"exact":"基板","quote":"/ HBM\n────────────────\nシリコンインターポーザ\n────────────────\nABF基板\n────────────────\nPCB\n────────────────\n電気配線 / プラガブル光モジュール\n```","quote_start":8,"quote_end":126,"text_sha256":"29c4a6e5be4a20ebc503166078691a633dba314e0eeca424495f4538bcff7c64","block_sha256":"29c4a6e5be4a20ebc503166078691a633dba314e0eeca424495f4538bcff7c64","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_7c40604c-b86f-4045-b297-41cf6f7d5163"},{"id":"occ_c837a65f78564a80f7b19b0d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_930e459b-6b83-4d5b-8036-a4baa25f515e","section_id":"sec_37c8d7ab-72e9-4b9c-bdce-62127c095205","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":9,"end":12,"exact":"PCB","quote":"従来は、電気信号がPCB上を長く走り、ボード端のプラガブル光トランシーバで光に変換されていた。","quote_start":0,"quote_end":47,"text_sha256":"019fc3037df3c755601b3dc5c81e89abc2993eeb3a14900faf412f25e81bc0a8","block_sha256":"019fc3037df3c755601b3dc5c81e89abc2993eeb3a14900faf412f25e81bc0a8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_930e459b-6b83-4d5b-8036-a4baa25f515e"},{"id":"occ_e2d3691845a1db1537fabc68","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_945b0cff-951a-440d-9d5f-f9d091b7fd27","section_id":"sec_9dd8cd28-26e8-4757-814f-cc7bd673fc71","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":60,"end":62,"exact":"基板","quote":"の裏側では、NANDメーカー、SiPhファウンドリ、レーザー企業、光接着剤メーカー、ファイバー企業、パッケージ基板メーカー、光電混載テスト企業まで含めた、巨大な新サプライチェーンが立ち上がっていく。","quote_start":5,"quote_end":104,"text_sha256":"cc22909d3bac926f0e5a6dc0008c377efb864af8497276aa2a1fb402349e74d5","block_sha256":"cc22909d3bac926f0e5a6dc0008c377efb864af8497276aa2a1fb402349e74d5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_945b0cff-951a-440d-9d5f-f9d091b7fd27"},{"id":"occ_107761c118aa7389d08c9cd6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_94e0d91e-81a8-4e40-888c-4d3db985460c","section_id":"sec_0a711cb8-a272-47cd-ad9b-6b89eba7cb70","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":55,"end":57,"exact":"基板","quote":"```\nウェハ検査\nプローブテスト\nKnown Good Die選別\nHBMテスト\nインターポーザ検査\nABF基板検査\nパッケージテスト\nバーンイン\nシステムレベルテスト\n```","quote_start":0,"quote_end":89,"text_sha256":"52cc9ab37513de9ba93616f233472f9d512f7ffd57489eb1ce7376a360f97a91","block_sha256":"52cc9ab37513de9ba93616f233472f9d512f7ffd57489eb1ce7376a360f97a91","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_94e0d91e-81a8-4e40-888c-4d3db985460c"},{"id":"occ_a6d18744f0d129daf76c73bb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_9ec329d6-a4de-4089-bc63-0359b6748cf7","section_id":"sec_c44de584-c98f-40d0-ad3c-047d8f554403","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":34,"end":36,"exact":"基板","quote":"> **シリコン、銅、ガラス、樹脂、セラミック、薬液、ガス、研磨材、基板、冷却、検査を組み合わせて、巨大な計算システムを作る総合工学**","quote_start":0,"quote_end":68,"text_sha256":"0957b7543d1a338e9153ffebac03113939eb711c44c96799b005f4cfc286816f","block_sha256":"0957b7543d1a338e9153ffebac03113939eb711c44c96799b005f4cfc286816f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_9ec329d6-a4de-4089-bc63-0359b6748cf7"},{"id":"occ_f0ed51ae630add2f1d28cbdb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_a1b39f7a-ff24-41b6-9a41-194286a20d83","section_id":"sec_af927ad7-e596-47c8-b0c8-9ca194c0d7d3","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":59,"end":61,"exact":"基板","quote":"では、電流が導体表面を流れるため、銅箔表面が粗いと伝送損失が増える。したがって、AIサーバーや高速ネットワーク基板では、表面が極めて滑らかな **HVLP銅箔** が重要になる。","quote_start":4,"quote_end":93,"text_sha256":"5afdea45ede124873a5ff01261c6b43f0f708d017c503e48552f2c31304568d7","block_sha256":"5afdea45ede124873a5ff01261c6b43f0f708d017c503e48552f2c31304568d7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_a1b39f7a-ff24-41b6-9a41-194286a20d83"},{"id":"occ_9d94decaa9b70f5832491769","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_a37fb1e3-fa6b-4eb1-85e7-0a0df9459143","section_id":"sec_26ac09ba-9d61-4648-a5a4-dcfe0669c2ed","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":55,"end":57,"exact":"基板","quote":"主な材料は、銅、low-k絶縁膜、SiN、Ta/TaN、TiN、Co、Ruなどである。  \nチップ内部の銅は、基板で使われる「電解銅箔」ではなく、ダマシン配線、めっき、成膜、CMPによって形成される。","quote_start":0,"quote_end":100,"text_sha256":"c800d839ba01558d1f46719515f6ba39eea13b73a65cf5db765a6b04a6d82a9c","block_sha256":"c800d839ba01558d1f46719515f6ba39eea13b73a65cf5db765a6b04a6d82a9c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_a37fb1e3-fa6b-4eb1-85e7-0a0df9459143"},{"id":"occ_80ce3149c6e8113c361028eb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_b4557b6b-c44b-48ee-971b-b022c89cc1a7","section_id":"sec_1a62dcca-b07e-491c-8abe-34dbf9e9b7f3","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":51,"end":53,"exact":"基板","quote":"```\nGPU / HBM / インターポーザ\n        │\nABF / FC-BGAパッケージ基板\n        │\nマザーボード\n```","quote_start":0,"quote_end":74,"text_sha256":"faeb45fdd33a4e63cdd40dab8e759734c99fe031f767c8e8c629e6a97f7d6640","block_sha256":"faeb45fdd33a4e63cdd40dab8e759734c99fe031f767c8e8c629e6a97f7d6640","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_b4557b6b-c44b-48ee-971b-b022c89cc1a7"},{"id":"occ_91f2b2b4f016ee0f01ded91c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_b76143ab-e716-41da-99c3-ea213664b42c","section_id":"sec_d5629fe8-cd20-4e63-8fba-79e8d1424ab2","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":47,"end":49,"exact":"基板","quote":"```\n良いトランジスタ\n＋ 良い配線\n＋ 良いHBM\n＋ 良いインターポーザ\n＋ 良いABF基板\n＋ 良い電源安定化\n＋ 良い冷却\n＋ 良いテスト\nを統合できるサプライチェーンが強い\n```","quote_start":0,"quote_end":96,"text_sha256":"c742ca895eab1545872906f15ff64af7a2ca2d6e00ff43f2d209ea68f3fa5558","block_sha256":"c742ca895eab1545872906f15ff64af7a2ca2d6e00ff43f2d209ea68f3fa5558","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_b76143ab-e716-41da-99c3-ea213664b42c"},{"id":"occ_ac55409a9153f20944e451db","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_c00c55c2-92ee-4691-9a5d-5558dc03d2c4","section_id":"sec_2769c995-b6a1-4e12-aeae-007d98194234","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":64,"end":66,"exact":"基板","quote":"半導体は単に「トランジスタを作る産業」ではないことが分かる。  \nトランジスタを作り、配線し、メモリとつなぎ、基板に載せ、電源を安定させ、熱を逃がし、最後に検査する。これらすべてが成立して初めて、AI GPUやCPUは動く。","quote_start":9,"quote_end":121,"text_sha256":"a4d99e12ccf1f4c4b042b63409d15b5bfb817fc5122b243418ee3fe31d785d05","block_sha256":"a4d99e12ccf1f4c4b042b63409d15b5bfb817fc5122b243418ee3fe31d785d05","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_c00c55c2-92ee-4691-9a5d-5558dc03d2c4"},{"id":"occ_d64d6d655e1f424c9f15ddac","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_c47373f4-299f-43fa-b176-8f1a9b0fb0fc","section_id":"sec_c44de584-c98f-40d0-ad3c-047d8f554403","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":53,"end":55,"exact":"基板","quote":"前工程は、シリコンウェハ上にトランジスタと配線を作る。  \n後工程は、そのチップを切り出し、つなぎ、守り、基板に載せ、電源を安定させ、冷却し、検査する。","quote_start":0,"quote_end":76,"text_sha256":"802faa59388081e6ebc5b2fe2b37220a1d46ca409d581ffe555d632e1e2a724f","block_sha256":"802faa59388081e6ebc5b2fe2b37220a1d46ca409d581ffe555d632e1e2a724f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_c47373f4-299f-43fa-b176-8f1a9b0fb0fc"},{"id":"occ_171462d27617d1b514090903","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_cc0e0dcb-569d-40f2-8f91-e5ef6bf56c02","section_id":"sec_98e0b423-8842-48d2-81f7-35b75e03eaea","layer":"code","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":12,"end":15,"exact":"PCB","quote":"```\nASIC\n ↓\nPCB上の電気配線\n ↓\nQSFP / OSFPなどのプラガブル光モジュール\n ↓\n光ファイバー\n```","quote_start":0,"quote_end":64,"text_sha256":"e6f3907b34335d6a2dac9a95cc2ecf4b7ce2379e1cd3e677311c0027b6f0cab5","block_sha256":"e6f3907b34335d6a2dac9a95cc2ecf4b7ce2379e1cd3e677311c0027b6f0cab5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_cc0e0dcb-569d-40f2-8f91-e5ef6bf56c02"},{"id":"occ_e774b496d65cd82959262f14","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_cc8d32ec-ec9c-4412-8ba3-c905070421da","section_id":"sec_2769c995-b6a1-4e12-aeae-007d98194234","layer":"code","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":208,"end":210,"exact":"基板","quote":"DLインターポーザ / EMIB\n────────────────────\nABF / FC-BGAパッケージ基板\n────────────────────\nMLCC / VRM / 電源安定化部品\n────────────────────\nマザーボード / 高速PCB\n────────────────────\n","quote_start":153,"quote_end":310,"text_sha256":"2e2fa5628aec1ff04858f04670cf80af0017b14a0e1eac4f02b27a3edc13ed2e","block_sha256":"2e2fa5628aec1ff04858f04670cf80af0017b14a0e1eac4f02b27a3edc13ed2e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_cc8d32ec-ec9c-4412-8ba3-c905070421da"},{"id":"occ_4b29abeae662d73c50ff873c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_d1910164-36ae-4c36-ad39-8e1b1bceadef","section_id":"sec_5a553eff-e018-4fbd-b9c4-a96e94324cad","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"```\nABF / FC-BGA基板\n  └─ 裏面MLCC / 埋め込みMLCC\n\nGPUボード\n  └─ 大量のMLCC\n\nマザーボード / VRM\n  └─ MLCC + ポリマーコンデンサ + インダクタ\n```","quote_start":0,"quote_end":110,"text_sha256":"4edd8dac164ff51dcd17217dc0e152944f6b6d212809f6cc1f454c32a6a6ada6","block_sha256":"4edd8dac164ff51dcd17217dc0e152944f6b6d212809f6cc1f454c32a6a6ada6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_d1910164-36ae-4c36-ad39-8e1b1bceadef"},{"id":"occ_fb34d54fc58b8fd063a35469","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_d31eae7c-2de1-4982-b459-7f2d2871ee06","section_id":"sec_f99c60bf-298a-4808-bad4-d5e461d2d139","layer":"body","character_id":null,"count":5,"matched_aliases":["PCB","ガラスクロス","基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"Tガラスは、主にABF基板、BT基板、FC-BGA基板、高速PCBで使われる低CTEガラスクロスである。","quote_start":0,"quote_end":52,"text_sha256":"a66772653df9d75dcef6b9282e42fc3d169db6a8218d3f189abb108f2cbe2240","block_sha256":"a66772653df9d75dcef6b9282e42fc3d169db6a8218d3f189abb108f2cbe2240","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_d31eae7c-2de1-4982-b459-7f2d2871ee06"},{"id":"occ_82e5acc06554d114ecbd9e48","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_d348b7e4-40b8-4a0b-b0e8-2322085728a8","section_id":"sec_37c8d7ab-72e9-4b9c-bdce-62127c095205","layer":"code","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":28,"end":31,"exact":"PCB","quote":"```\n従来：\nSwitch ASIC\n ↓ 電気配線\nPCB\n ↓\nプラガブル光トランシーバ\n ↓\n光ファイバー\n```","quote_start":0,"quote_end":61,"text_sha256":"a5e4442cfceb110143a3ead2361eb5f0dc5fe436320fc63d54fbcda5e70473a3","block_sha256":"a5e4442cfceb110143a3ead2361eb5f0dc5fe436320fc63d54fbcda5e70473a3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_d348b7e4-40b8-4a0b-b0e8-2322085728a8"},{"id":"occ_f8e9b7a9d834941a4f9b8e86","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_dc591e8b-5519-4506-987d-34056d4bbd5a","section_id":"sec_289022db-dc16-43ad-82a1-8dd163dcc858","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":77,"end":79,"exact":"基板","quote":"と見られていた。しかしAI時代には違う。GPUとHBMを結ぶCoWoS、シリコンインターポーザ、RDL、ABF基板、マイクロバンプ、ハイブリッドボンディング、MLCC、テストは、もはや性能そのものを決める。TSMCのCoWoS-Sは大面積シリコンインターポーザ上でロジックチップレットとHBMを統合する技術であり、","quote_start":22,"quote_end":179,"text_sha256":"19e42ad07fc24b84be811763bb8cf89fe81824b4b93a180e3f777706c1e4237d","block_sha256":"19e42ad07fc24b84be811763bb8cf89fe81824b4b93a180e3f777706c1e4237d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_dc591e8b-5519-4506-987d-34056d4bbd5a"},{"id":"occ_1e0bc6e38a9be9aba1192147","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_e950784d-0cb7-40f0-913f-d5e691c6baee","section_id":"sec_1a62dcca-b07e-491c-8abe-34dbf9e9b7f3","layer":"body","character_id":null,"count":1,"matched_aliases":["ガラスクロス"],"evidence":{"text_basis":"markdown","start":21,"end":27,"exact":"ガラスクロス","quote":"ここで重要な材料は、ABF、銅、Tガラス、ガラスクロス、エポキシ、ソルダーレジスト、はんだボールである。","quote_start":0,"quote_end":52,"text_sha256":"3a69f46ad78f075aa6241a3e4bfd36e9ca4bb5b2739e52a464a6177f1a5654e9","block_sha256":"3a69f46ad78f075aa6241a3e4bfd36e9ca4bb5b2739e52a464a6177f1a5654e9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_e950784d-0cb7-40f0-913f-d5e691c6baee"},{"id":"occ_53570c33f46e6fe5f3a54d99","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_ee1bf055-f5dc-4eb9-8924-abb58655e639","section_id":"sec_1a62dcca-b07e-491c-8abe-34dbf9e9b7f3","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":25,"end":27,"exact":"基板","quote":"## 4-4. ABF / FC-BGAパッケージ基板層","quote_start":0,"quote_end":28,"text_sha256":"de32ab6e9ac3c17d338608c4ad8e53cc85a6451383231c4fbb9238d784fe9d64","block_sha256":"de32ab6e9ac3c17d338608c4ad8e53cc85a6451383231c4fbb9238d784fe9d64","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_ee1bf055-f5dc-4eb9-8924-abb58655e639"},{"id":"occ_264b8c6462fc139f79715077","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_f0c1fa60-6129-4c6c-80b6-992568ce3120","section_id":"sec_612e54a2-be4e-4849-a294-7bb2dc4a351a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":70,"end":72,"exact":"基板","quote":"PICの土台になる。SoitecはPhotonics-SOIを、AIデータセンター向け統合光接続などに使われる基板プラットフォームとして説明している。([TSMC 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面積単価 |\n| 一般サーバーCPU向け | 50〜70mm級 | 12〜18層 | 100〜500ドル/枚 | 3〜10ドル/cm² |\n| 現行AI","quote_start":0,"quote_end":108,"text_sha256":"1c0f05b71d6a73888f812af7833a90b3bbab8333000ac6a6a00478c645f2ffd0","block_sha256":"1c0f05b71d6a73888f812af7833a90b3bbab8333000ac6a6a00478c645f2ffd0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_0934e5ff-7fea-4726-9b0b-1a088ac087c2"},{"id":"occ_6307c8049546ae2ea0730981","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_127212b6-b0b0-4c90-b45d-3fd2e0fb66dd","section_id":"sec_cc226e44-f497-49d3-8fb7-38badeb8637e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":18,"end":20,"exact":"基板","quote":"2030年は、CoPoSとガラスコア基板が本格化するかの答え合わせです。","quote_start":0,"quote_end":36,"text_sha256":"ec1bbc1a232b7832e24714ebb95491161751376a683199d986c9a2c3b6ca3bbd","block_sha256":"ec1bbc1a232b7832e24714ebb95491161751376a683199d986c9a2c3b6ca3bbd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_127212b6-b0b0-4c90-b45d-3fd2e0fb66dd"},{"id":"occ_fbf4850c36a8533162101af1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_1cadde42-ca7f-4ebc-bbc5-e8decb333a1a","section_id":"sec_9e78bca8-b595-4b7d-8592-157c7b9ee9c1","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":20,"end":22,"exact":"基板","quote":"2027年は、ガラスコアより先に、ABF基板とテスト工程が利益化します。","quote_start":0,"quote_end":36,"text_sha256":"d07e772da49669287b0f2494a3cff60f40dd1e093f321ea296597b41e945c532","block_sha256":"d07e772da49669287b0f2494a3cff60f40dd1e093f321ea296597b41e945c532","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_1cadde42-ca7f-4ebc-bbc5-e8decb333a1a"},{"id":"occ_2b06d893c53ff4790793af13","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_1d1f5644-534c-49fc-9593-78eeb91372cc","section_id":"sec_a241fd9e-6dfc-4b4c-a648-4fb03a8dc73b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"ガラスコア基板が出ると、ABFが不要になるように見えますが、実際は逆です。","quote_start":0,"quote_end":37,"text_sha256":"5ae75426e26f6ccc9ff5e0634cdc192099e1f7f55135b3f144bb60258ec2bdae","block_sha256":"5ae75426e26f6ccc9ff5e0634cdc192099e1f7f55135b3f144bb60258ec2bdae","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_1d1f5644-534c-49fc-9593-78eeb91372cc"},{"id":"occ_76a5ff294e01dbf7c7f3942e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_1dfe7323-d8ac-4a7c-91a8-cf62de59ab7b","section_id":"sec_1d9b902c-75d7-4448-bbe3-73461573b9d5","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":56,"end":58,"exact":"基板","quote":"の流れの中で重要になるのが、TSMCのCoWoS、その次の選択肢であるCoPoS、そしてそれを支えるガラスコア基板とABFです。","quote_start":1,"quote_end":65,"text_sha256":"5628e44fd4c2c39b7db6d7904825d585be2d6ee0f384bb65c95c7292853984a8","block_sha256":"5628e44fd4c2c39b7db6d7904825d585be2d6ee0f384bb65c95c7292853984a8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_1dfe7323-d8ac-4a7c-91a8-cf62de59ab7b"},{"id":"occ_8863a0e53d18064c0eea74c9","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_1fa9f761-5207-4c31-884b-507f18cdd4c4","section_id":"sec_3654a8b2-246d-4705-9c62-3dca7a906684","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":66,"end":68,"exact":"基板","quote":"場規模・営業利益レンジは、公開済みの会社資料や報道を起点にしたシナリオ試算です。特にガラスコア、TGV加工済み基板、CoPoS/FOPLP工程は量産前なので、**顧客認定・歩留まり・量産単価が出た段階で大きく修正が必要**です。","quote_start":11,"quote_end":125,"text_sha2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味の素ABFの価格・数量\n- IbidenのAI基板受注\n- AdvantestのAI/HBMテスター\n- FormFactor、日本マイクロニクス、日本電子材料のプローブカード\n- KLA、Onto、Camtekの先端パッケージ検査","quote_start":0,"quote_end":119,"text_sha256":"75efeae7a88a2fa86a99b2d843b59d6d79d3fe67a4c7f61a4e998bc5d9f60d82","block_sha256":"75efeae7a88a2fa86a99b2d843b59d6d79d3fe67a4c7f61a4e998bc5d9f60d82","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_2b929a26-e7e1-410b-84a0-016b6e858e98"},{"id":"occ_c1564043111896d76853b651","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_2cae3ed6-928f-415e-abed-a4a2a5a7f2a1","section_id":"sec_e71e306d-270d-4e84-b6e5-b5eb284cca2f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"ABFフィルムは、完成基板の中の絶縁フィルムです。単純な面積だけでなく、層数を掛けた使用量が重要になります。","quote_start":0,"quote_end":54,"text_sha256":"0f37787f2c1dc3797544960950a8d3c16c1778082798fc61de9485759c0aff36","block_sha256":"0f37787f2c1dc3797544960950a8d3c16c1778082798fc61de9485759c0aff36","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_2cae3ed6-928f-415e-abed-a4a2a5a7f2a1"},{"id":"occ_8014d0c5f406e0151aa7ad61","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_2eca98e2-bd37-441e-876b-e494e0401a9b","section_id":"sec_3654a8b2-246d-4705-9c62-3dca7a906684","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"ガラスコア基板ではさらに、","quote_start":0,"quote_end":13,"text_sha256":"534d695889f3a5d39813dc69f53f6b79584b271088bb4eeb361b0ac1fe94f278","block_sha256":"534d695889f3a5d39813dc69f53f6b79584b271088bb4eeb361b0ac1fe94f278","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_2eca98e2-bd37-441e-876b-e494e0401a9b"},{"id":"occ_25d947790687241a67cf459d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_310e90bb-8ba4-4a8e-aa75-f0bdfd72c590","section_id":"sec_3654a8b2-246d-4705-9c62-3dca7a906684","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":103,"end":105,"exact":"基板","quote":"補と報じられ、CoWoSを直ちに置き換えるものではなく補完技術とされています。イビデンはAI向けICパッケージ基板で5000億円投資、CY30以降に130×130mm超・14-X-14・Glass Coreを示しています。味の素はHPC基板でPC向け比10倍超のABF使用量を説明し、DNP、日本電気硝子、AGC、","quote_start":48,"quote_end":205,"text_sha256":"49d11a9068c4673015ed1934ef6577cf5fb9e74abbb83f450a96aafaeaa21c52","block_sha256":"49d11a9068c4673015ed1934ef6577cf5fb9e74abbb83f450a96aafaeaa21c52","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_310e90bb-8ba4-4a8e-aa75-f0bdfd72c590"},{"id":"occ_53b07a4674c7c972c66d429d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_31885655-e107-4556-94a3-07249cf7f921","section_id":"sec_3654a8b2-246d-4705-9c62-3dca7a906684","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"CoPoSとガラスコア基板は、まだ本格量産前の技術です。しかし、AIパッケージが巨大化し続ける限り、2030年前後にかけて、ABF、ガラス、TGV、RDL、検査、テストを巻き込む巨大な後工程サプライチェーンを作る可能性がありま","quote_start":0,"quote_end":113,"text_sha256":"36b0cdffe30f2f99d8cabad61c6d8145a34e938a29793c179bb558ba35c04067","block_sha256":"36b0cdffe30f2f99d8cabad61c6d8145a34e938a29793c179bb558ba35c04067","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_31885655-e107-4556-94a3-07249cf7f921"},{"id":"occ_412d56a0a6f12785736f893f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_3625decf-b2f3-4371-8c31-23b5f74241df","section_id":"sec_1d9b902c-75d7-4448-bbe3-73461573b9d5","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":96,"end":98,"exact":"基板","quote":"ろ、CoWoSが大型化していく中で、さらに先の超大型AIパッケージを作るための補完技術です。そして、ガラスコア基板はCoPoSだけでなく、CoWoS大型化の限界突破にも使われる可能性があります。","quote_start":41,"quote_end":138,"text_sha256":"958ad583bcc721c0c83c043debf721466a7f5b95525fcd66c2166e13f2a97eef","block_sha256":"958ad583bcc721c0c83c043debf721466a7f5b95525fcd66c2166e13f2a97eef","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_3625decf-b2f3-4371-8c31-23b5f74241df"},{"id":"occ_806b00cc9f54181a8160b487","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_3a2da195-cff8-4f81-8910-baa2fa02aa29","section_id":"sec_e71e306d-270d-4e84-b6e5-b5eb284cca2f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"**ABF使用量 = 基板面積 × ABF層数**","quote_start":0,"quote_end":25,"text_sha256":"593bab21c9a32a248a8bb60649ce1e5a531df412209e84b310e4089c1d5b0b18","block_sha256":"593bab21c9a32a248a8bb60649ce1e5a531df412209e84b310e4089c1d5b0b18","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_3a2da195-cff8-4f81-8910-baa2fa02aa29"},{"id":"occ_23f475b6221143be3e73227a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_3ff03c74-4df2-48d1-befd-7167a509a144","section_id":"sec_b06184ed-1027-4365-9f91-76da9e8254bc","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":69,"end":71,"exact":"基板","quote":"、**Chip-on-Wafer-on-Substrate**です。つまり、チップをウェハ上で組み立て、それを基板に載せる技術です。一方、CoPoSでは、丸いウェハではなく、四角い大型パネルを使います。","quote_start":14,"quote_end":115,"text_sha256":"3d6d41cc9f897ec428edec75cb1501b70fc1f31cc6757979cb4cf95cf06d55a3","block_sha256":"3d6d41cc9f897ec428edec75cb1501b70fc1f31cc6757979cb4cf95cf06d55a3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_3ff03c74-4df2-48d1-befd-7167a509a144"},{"id":"occ_2583f17a75107e2e443ecc06","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_45974198-7d8f-4cf1-888c-956111af3e42","section_id":"sec_3654a8b2-246d-4705-9c62-3dca7a906684","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"**基板サイズ × ABF層数 × SAP負荷 × 歩留まり × 価格転嫁率**","quote_start":0,"quote_end":40,"text_sha256":"096037d9281f5e02043dc0fe08cd6f4c458a2bbdfa05778707da539d0a95260f","block_sha256":"096037d9281f5e02043dc0fe08cd6f4c458a2bbdfa05778707da539d0a95260f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_45974198-7d8f-4cf1-888c-956111af3e42"},{"id":"occ_02a987930c93835f91f8fd36","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_474b9add-1e74-4f8b-8d11-d155f938c832","section_id":"sec_f39a4477-e742-4178-9221-9b1bbf65afbb","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":12,"end":14,"exact":"基板","quote":"## \\3. ガラスコア基板とは何か","quote_start":0,"quote_end":18,"text_sha256":"92b9c0aaea0f6d0486b9f206ac309a04d8964f9912415c5b0f07b13b5250a38c","block_sha256":"92b9c0aaea0f6d0486b9f206ac309a04d8964f9912415c5b0f07b13b5250a38c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_474b9add-1e74-4f8b-8d11-d155f938c832"},{"id":"occ_edfaf995171740b408d47d1e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_47abe070-5c33-4397-aeb3-4c57218c4853","section_id":"sec_ed483eff-f180-49c0-ac69-cfd391667bf9","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"## CoPoS・ガラスコア基板・ABFの基本と投資指標","quote_start":0,"quote_end":28,"text_sha256":"0347ae628c4bbe757d2b533df6a6e74cf9c5c7ffe534db4c958a10a3bc2b14b6","block_sha256":"0347ae628c4bbe757d2b533df6a6e74cf9c5c7ffe534db4c958a10a3bc2b14b6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_47abe070-5c33-4397-aeb3-4c57218c4853"},{"id":"occ_a50efed65df61b3ad786ce21","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_48788537-148c-44e5-a792-2dbcdbc48082","section_id":"sec_f39a4477-e742-4178-9221-9b1bbf65afbb","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"ガラスコア基板は、従来の有機コアをガラスに置き換えた基板です。","quote_start":0,"quote_end":31,"text_sha256":"8c848c883853bb503b845b0354b3a3132f850c71fd64ae8cdaaca0d2b8774589","block_sha256":"8c848c883853bb503b845b0354b3a3132f850c71fd64ae8cdaaca0d2b8774589","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_48788537-148c-44e5-a792-2dbcdbc48082"},{"id":"occ_3fe5f6724e55dd2fc6d23e9f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_5c7dd3eb-cc97-4637-8986-d3cdd4a9f073","section_id":"sec_163046c4-7ba9-4c1c-a356-50327fc8aea9","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":8,"end":10,"exact":"基板","quote":"## 完成ABF基板","quote_start":0,"quote_end":10,"text_sha256":"51aaa16fb8d5001a9a48dfa811dd95ab23e23a909d3ee136736a6e95e5c5a562","block_sha256":"51aaa16fb8d5001a9a48dfa811dd95ab23e23a909d3ee136736a6e95e5c5a562","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_5c7dd3eb-cc97-4637-8986-d3cdd4a9f073"},{"id":"occ_bc17c8eed5356ca6d22b7503","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_5e14009d-3369-4123-9314-92c1355d9e27","section_id":"sec_2b5a6810-3626-4788-8941-a376c815567c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"完成基板は、単価/枚だけでなく、面積単価と層数単価で見る必要があります。","quote_start":0,"quote_end":36,"text_sha256":"894a6b9a90afb62926a59a0b93baf50d97788b059466ac7f40ac05cd2956a1e1","block_sha256":"894a6b9a90afb62926a59a0b93baf50d97788b059466ac7f40ac05cd2956a1e1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_5e14009d-3369-4123-9314-92c1355d9e27"},{"id":"occ_7344e36caa13dbeddbdc8205","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_5e743ebf-c7d6-4279-916c-1acbcd0da680","section_id":"sec_32e7bb09-8717-42db-bc93-5b33877a7561","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":28,"end":30,"exact":"基板","quote":"仮にTGV加工済みパネルが300万円、130×130mm基板を9枚取り、総合歩留まり80%なら、","quote_start":0,"quote_end":48,"text_sha256":"2a81c3d4e5d63010d674319f9a82a81e484943ebf3e4b4d01d857659b4294f8a","block_sha256":"2a81c3d4e5d63010d674319f9a82a81e484943ebf3e4b4d01d857659b4294f8a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_5e743ebf-c7d6-4279-916c-1acbcd0da680"},{"id":"occ_a9b3d378aa707923912e12a6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_5f00ed98-f639-4717-8244-24fb3dd5b572","section_id":"sec_1d9b902c-75d7-4448-bbe3-73461573b9d5","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":22,"end":24,"exact":"基板","quote":"## AIパッケージの次の主戦場は「後工程・基板・テスト」へ移る","quote_start":0,"quote_end":32,"text_sha256":"5eaea54b04ac64501b73e35670b066a06602cc9c17fea81c67061708969e2d00","block_sha256":"5eaea54b04ac64501b73e35670b066a06602cc9c17fea81c67061708969e2d00","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_5f00ed98-f639-4717-8244-24fb3dd5b572"},{"id":"occ_c2a627111742c3d06aac02de","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_5f1ca1f4-728c-43c3-ae0f-f18ec0c1a605","section_id":"sec_fc94819f-d858-48ec-a3a9-b522d62bbb73","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":31,"end":33,"exact":"基板","quote":"DNPはガラス母材メーカーというより、TGV加工済みガラスコア基板を作る側です。","quote_start":0,"quote_end":40,"text_sha256":"410acb7b1a0df4bbfb1720e71f5e45021a1746947d5ff85b8d004c8170e5fb69","block_sha256":"410acb7b1a0df4bbfb1720e71f5e45021a1746947d5ff85b8d004c8170e5fb69","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_5f1ca1f4-728c-43c3-ae0f-f18ec0c1a605"},{"id":"occ_1134456557b8e4cdcdbf9434","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_5f55f044-1c35-4dac-a981-e99c0fe8b68e","section_id":"sec_2b5a6810-3626-4788-8941-a376c815567c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":12,"end":14,"exact":"基板","quote":"## \\7. 完成ABF基板：ドル/枚、ドル/cm²、ドル/cm²/層","quote_start":0,"quote_end":35,"text_sha256":"ed9b9cf309b241cf9653cd363d922b27f1660529ee5773875ed3379d8f59a9e4","block_sha256":"ed9b9cf309b241cf9653cd363d922b27f1660529ee5773875ed3379d8f59a9e4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_5f55f044-1c35-4dac-a981-e99c0fe8b68e"},{"id":"occ_7b94667bd90e9bdec9a0866c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_65c2d403-dd7f-4669-8640-766176c3b78f","section_id":"sec_163046c4-7ba9-4c1c-a356-50327fc8aea9","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":24,"end":27,"exact":"PCB","quote":"Ibiden、Unimicron、Nan Ya PCB、SEMCOなどが中心です。大型化・多層化・SAP負荷増により、枚数以上に売上が増えます。","quote_start":0,"quote_end":72,"text_sha256":"42e218def7ace681d218a13bc136907831908b2e0c7fa3eb716204da94239239","block_sha256":"42e218def7ace681d218a13bc136907831908b2e0c7fa3eb716204da94239239","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_65c2d403-dd7f-4669-8640-766176c3b78f"},{"id":"occ_535ab94b3e612de9ece891e4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_6a4345e0-1643-43a7-9f9f-c62cbb453bc9","section_id":"sec_9e78bca8-b595-4b7d-8592-157c7b9ee9c1","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":42,"end":44,"exact":"基板","quote":"IbidenはCell6/Cell8でAI ASIC/GPU向け高性能ICパッケージ基板の量産開始を計画しています。DNPはTGVガラスコア基板でFY2027売上50億円を目指すとされていますが、全社業績への影響はまだ限定的です。","quote_start":0,"quote_end":115,"text_sha256":"12e12287743c8023b3e9bce29df93553f99df0471152916a289b6b9dd623b26c","block_sha256":"12e12287743c8023b3e9bce29df93553f99df0471152916a289b6b9dd623b26c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_6a4345e0-1643-43a7-9f9f-c62cbb453bc9"},{"id":"occ_7ade395221fe72fa5187ea32","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_70f39122-4294-450f-851e-d06bdfb353f5","section_id":"sec_96629702-804b-48db-be0a-984ccc470179","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":18,"end":20,"exact":"基板","quote":"2026年は、CoPoSとガラスコア基板がテーマ化する年です。ただし、売上の本体はまだCoWoS、ABF、HBM、AIテストです。","quote_start":0,"quote_end":65,"text_sha256":"60d3acc983eae9be8e13d12213c8bff85cd0861d7300c13fd8159c2cce5d548d","block_sha256":"60d3acc983eae9be8e13d12213c8bff85cd0861d7300c13fd8159c2cce5d548d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_70f39122-4294-450f-851e-d06bdfb353f5"},{"id":"occ_9b82fb8aa4b6312f7f7171aa","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_73e52f48-bfcc-4c0d-93bb-54b3a4d7b9b9","section_id":"sec_f39a4477-e742-4178-9221-9b1bbf65afbb","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":9,"end":11,"exact":"基板","quote":"これは、ガラスコア基板が単なる「反り対策」ではなく、AIチップの電源品質・動作安定性・性能余地に直結する部材であることを示しています。","quote_start":0,"quote_end":67,"text_sha256":"899fb606815fae99c9022e7fe71520a2b2fbdede44b337ba735e896bcf3dc28c","block_sha256":"899fb606815fae99c9022e7fe71520a2b2fbdede44b337ba735e896bcf3dc28c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_73e52f48-bfcc-4c0d-93bb-54b3a4d7b9b9"},{"id":"occ_00a488f12be029a530e681cb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_7bf2eb86-f1be-43ee-8c94-13dbadf9e628","section_id":"sec_32e7bb09-8717-42db-bc93-5b33877a7561","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":40,"end":42,"exact":"基板","quote":"これにABFビルドアップ層、RDL、検査、マージンが乗るため、ガラスコア入り完成基板はかなり高価になります。","quote_start":0,"quote_end":54,"text_sha256":"d3758b760fa31efb099bfa387451487c80a5f090a1ccbce6744efad90a77e845","block_sha256":"d3758b760fa31efb099bfa387451487c80a5f090a1ccbce6744efad90a77e845","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_7bf2eb86-f1be-43ee-8c94-13dbadf9e628"},{"id":"occ_d089f709a89e07537398b41c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_7c0c2b3e-896e-4764-8c94-13b827a8d796","section_id":"sec_3cc1c1fc-2867-45d3-a0d7-6c9dbf886f24","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":51,"end":53,"exact":"基板","quote":"```\n| 分野 | 重要な単位 |\n| ABFフィルム | 円/㎡、円/層cm² |\n| 完成ABF基板 | ドル/枚、ドル/cm²、ドル/cm²/層 |\n| ガラス母材 | 円/510×515mmパネル |\n| TGV加工済みガラスコア | 円/パネル、円/良品コア |\n| CoPoS/FOPLP工程","quote_start":0,"quote_end":153,"text_sha256":"ed7defe5ae30eadefa6edb7a4e995a5b0e0e892c1b29cdef99704152c1c2b373","block_sha256":"ed7defe5ae30eadefa6edb7a4e995a5b0e0e892c1b29cdef99704152c1c2b373","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_7c0c2b3e-896e-4764-8c94-13b827a8d796"},{"id":"occ_cbcc88e2d273cd2b46412390","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_7f6caba9-7d80-4be7-b47c-b0d02d9dbd5c","section_id":"sec_e71e306d-270d-4e84-b6e5-b5eb284cca2f","layer":"code","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":75,"end":77,"exact":"基板","quote":" ABFフィルム単価 | 数万円〜十数万円/㎡ |\n| 高性能ABF | 十数万円〜数十万円/㎡ |\n| AI基板1枚あたりABF材料価値 | 数千円〜数万円 |\n| 完成AI基板BOMに占めるABF比率 | おおむね10〜15%程度のイメージ |\n```","quote_start":20,"quote_end":148,"text_sha256":"930ae8c3c60b593220b89c06120bf22210f7a07d51fedcbaf35fc7cb4cf4da94","block_sha256":"930ae8c3c60b593220b89c06120bf22210f7a07d51fedcbaf35fc7cb4cf4da94","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_7f6caba9-7d80-4be7-b47c-b0d02d9dbd5c"},{"id":"occ_b9d253f3827b38bcf3dd9a3c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_8fbdba94-5cf2-481e-971a-67606d6bc617","section_id":"sec_40193249-0017-4cee-a93c-0304f2c87dd9","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":71,"end":73,"exact":"基板","quote":"上インパクトが限定的であることです。本当に大きな付加価値は、TGV加工、端面処理、検査、RDL、ABFとの複合基板化にあります。","quote_start":16,"quote_end":80,"text_sha256":"d8e568857db5db8e4fa6167e4fc3178284ccc2c2c011e5dbccae32d7b012d625","block_sha256":"d8e568857db5db8e4fa6167e4fc3178284ccc2c2c011e5dbccae32d7b012d625","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_8fbdba94-5cf2-481e-971a-67606d6bc617"},{"id":"occ_3bb95f71891ab36fb80a1d17","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_9804bf71-7881-4f3b-8986-935a96d3a53c","section_id":"sec_cc226e44-f497-49d3-8fb7-38badeb8637e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":65,"end":67,"exact":"基板","quote":"アが最上位AI GPU/ASICの標準的な選択肢になれば、ガラス母材だけでなく、TGV加工、RDL、ABF複合基板、検査、テストまで一気に市場が広がります。","quote_start":10,"quote_end":88,"text_sha256":"f4f91af96d8fc0716f213c461c88a862d25792572556580778de5d086bcbde6f","block_sha256":"f4f91af96d8fc0716f213c461c88a862d25792572556580778de5d086bcbde6f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_9804bf71-7881-4f3b-8986-935a96d3a53c"},{"id":"occ_0f4dd0216be77d99d1f10e95","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_9c7dfd2b-f03f-4207-81d1-dbb692416da0","section_id":"sec_2b5a6810-3626-4788-8941-a376c815567c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"AI基板では、単価上昇以上に、歩留まり改善と価格転嫁率が利益を決めます。","quote_start":0,"quote_end":36,"text_sha256":"a30837fca427faf49b60188f175b963c46f8de6a54136856bb557da814c28591","block_sha256":"a30837fca427faf49b60188f175b963c46f8de6a54136856bb557da814c28591","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_9c7dfd2b-f03f-4207-81d1-dbb692416da0"},{"id":"occ_f5739e0c8f2008a21749e879","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_a30752b1-2e9a-420a-923e-edcf478a1390","section_id":"sec_1d9b902c-75d7-4448-bbe3-73461573b9d5","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"重要なのは、ガラスコア基板がABFを消すわけではないことです。実際には、","quote_start":0,"quote_end":36,"text_sha256":"804316dc6ffb8f293f8741b6f56db6a46ef28ec672f05d7781b5702b5b12240a","block_sha256":"804316dc6ffb8f293f8741b6f56db6a46ef28ec672f05d7781b5702b5b12240a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_a30752b1-2e9a-420a-923e-edcf478a1390"},{"id":"occ_c3a36ad014ad0918c0f89cbb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_a86b3acc-3624-4183-9b0e-97a4b1ce3c81","section_id":"sec_9e78bca8-b595-4b7d-8592-157c7b9ee9c1","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":12,"end":14,"exact":"基板","quote":"## 2027年：ABF基板とテストが先に利益化","quote_start":0,"quote_end":24,"text_sha256":"ea98e1656aa4af1e7c3376a7797a5af28af05140981aea38120dc0565f50e523","block_sha256":"ea98e1656aa4af1e7c3376a7797a5af28af05140981aea38120dc0565f50e523","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_a86b3acc-3624-4183-9b0e-97a4b1ce3c81"},{"id":"occ_6aeae807142bf9e515ffa92c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_aa052cf9-d4ab-47da-8c54-0a71b9fda9ec","section_id":"sec_2b5a6810-3626-4788-8941-a376c815567c","layer":"body","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"完成ABF基板は、Ibiden、Unimicron、Nan Ya PCB、SEMCOなどが関わる領域です。","quote_start":0,"quote_end":53,"text_sha256":"526823ca57333ade0c9c5fd62d839498677e2e29e19e674679cc5e7a29c3ac7b","block_sha256":"526823ca57333ade0c9c5fd62d839498677e2e29e19e674679cc5e7a29c3ac7b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_aa052cf9-d4ab-47da-8c54-0a71b9fda9ec"},{"id":"occ_b514ceca27700dd42ffb1284","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_ba123b5a-0b40-4719-8b78-825d38fa46e3","section_id":"sec_3654a8b2-246d-4705-9c62-3dca7a906684","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":60,"end":62,"exact":"基板","quote":"2027年は、CoWoS、ABF、HBM、ATE、プローブカードが先に伸びます。  \n2028年は、ガラスコア基板とCoPoSの初期採用が見えるかの分岐点です。  \n2030年は、CoPoSとガラスコアが本格的に事業化するかの答え合わせです。","quote_start":5,"quote_end":126,"text_sha256":"f9226c16ff0bed61c624d57f8ebd460bcc4fdcec9ae034dc9361c6b86bf3f276","block_sha256":"f9226c16ff0bed61c624d57f8ebd460bcc4fdcec9ae034dc9361c6b86bf3f276","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_ba123b5a-0b40-4719-8b78-825d38fa46e3"},{"id":"occ_383ef8857d99a02ab366e409","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_bc68395c-2711-4973-8628-f62feae0764a","section_id":"sec_8ee46d70-0976-4c9d-a162-90e7cc533414","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":51,"end":53,"exact":"基板","quote":"領域CoPoS普及時の影響CoWoS-S一部の超大型品が移行する可能性CoWoS-L併存しやすいABF基板減りにくい。むしろ高層化ABF材料減りにくい。高性能化で増えるガラスコア新規に増えるRDL/パネル工程新規に増える検査・テスト挿入点増加で増える","quote_start":0,"quote_end":125,"text_sha256":"28c53930b3858b879353955f1913447b3cafd4080a624d0a4ac4f2dd8ba75f59","block_sha256":"28c53930b3858b879353955f1913447b3cafd4080a624d0a4ac4f2dd8ba75f59","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_bc68395c-2711-4973-8628-f62feae0764a"},{"id":"occ_47f2d2138f541d74cd8e9f9f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_bd5f0943-a4c3-4b6e-90d8-5952a174bcc7","section_id":"sec_3654a8b2-246d-4705-9c62-3dca7a906684","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"がABF基板の利益を決めます。","quote_start":0,"quote_end":15,"text_sha256":"8f20518f794232039634bbdd714137f123475001cc022c76c7389eca1cbcfb26","block_sha256":"8f20518f794232039634bbdd714137f123475001cc022c76c7389eca1cbcfb26","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_bd5f0943-a4c3-4b6e-90d8-5952a174bcc7"},{"id":"occ_d1d90125c884ab99e411ccb7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_be40bcd4-be3d-4c6a-b64d-b7203f6fd1ca","section_id":"sec_f39a4477-e742-4178-9221-9b1bbf65afbb","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":10,"end":12,"exact":"基板","quote":"この試験では、ガラス基板により、反り・平坦性関連指標が16%改善、実効CTEが19%低下、実効弾性率が31%向上、電源抵抗が27%低下、インダクタンスが42%低下したと報じられています。","quote_start":0,"quote_end":93,"text_sha256":"da67fe3aed1344d2c5e3ffab2ac77c0cd5af0bfadc7bc17f782af5e7fb4cf002","block_sha256":"da67fe3aed1344d2c5e3ffab2ac77c0cd5af0bfadc7bc17f782af5e7fb4cf002","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_be40bcd4-be3d-4c6a-b64d-b7203f6fd1ca"},{"id":"occ_079415952c9e8efca0d3a3fb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_be7c1607-4f8c-41c7-96c9-d5e7bb9af4aa","section_id":"sec_44e13f33-8624-48f1-8f54-c61cac3a2ab7","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":59,"end":61,"exact":"基板","quote":"Sでは、最終完成品だけをテストするのでは不十分です。高価なGPU、ASIC、HBM、RDL、ガラスコア、ABF基板を組み合わせるため、途中で不良を見つける必要があります。","quote_start":4,"quote_end":89,"text_sha256":"4f396300c60c388c3145704c146c441f40cab3cac31f3cf82359dd4a0dd2a220","block_sha256":"4f396300c60c388c3145704c146c441f40cab3cac31f3cf82359dd4a0dd2a220","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_be7c1607-4f8c-41c7-96c9-d5e7bb9af4aa"},{"id":"occ_064bd85d460c9f86240f1104","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_c1e46c8f-32c5-49c8-9f03-27c884485766","section_id":"sec_f39a4477-e742-4178-9221-9b1bbf65afbb","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":27,"end":29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GPU相当サイズで、反りや剥離が深刻化しなかったとされています。","quote_start":0,"quote_end":96,"text_sha256":"f74df2e11c31138bcb57d1d3d1cd19246aec7da364066244a2205c3b7f08b9ae","block_sha256":"f74df2e11c31138bcb57d1d3d1cd19246aec7da364066244a2205c3b7f08b9ae","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_c1e46c8f-32c5-49c8-9f03-27c884485766"},{"id":"occ_d50fe5f1f882694c7483c484","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_cec1806d-cf31-4610-a998-fd3dc81d64c9","section_id":"sec_2b5a6810-3626-4788-8941-a376c815567c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":65,"end":67,"exact":"基板","quote":"しても、歩留まりが90%なら良品原価は111、60%なら167、50%なら200になります。つまり、完成ABF基板では、","quote_start":10,"quote_end":70,"text_sha256":"da287840d54ac24bdb2a7026df8b447bf5d0a837b624bf6ab8f525ae320589be","block_sha256":"da287840d54ac24bdb2a7026df8b447bf5d0a837b624bf6ab8f525ae320589be","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_cec1806d-cf31-4610-a998-fd3dc81d64c9"},{"id":"occ_93c001d2ffaa6ebe4b9dfcfc","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_cf892e97-6cc4-427d-a319-1f56929e30e4","section_id":"sec_3654a8b2-246d-4705-9c62-3dca7a906684","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"- 何mm角の基板か\n- 何層のABFか\n- TGV径とピッチはどれくらいか\n- per-via歩留まりはどれくらいか\n- 背割れ率はどれくらいか\n- パネルから何個の良品が取れるか\n- 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ガラス破損リスク","quote_start":26,"quote_end":183,"text_sha256":"2f39a2b9c5f52a37a88f545265cd4b5ef029c49e67d248294cafbee441efafd1","block_sha256":"2f39a2b9c5f52a37a88f545265cd4b5ef029c49e67d248294cafbee441efafd1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_f57f2cce-9706-41b7-9bfa-a11a0b41db05"},{"id":"occ_82b5e276edced85cc03716b2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_f6b59b65-cee4-4025-8e1d-f084cef4e0e1","section_id":"sec_9e78bca8-b595-4b7d-8592-157c7b9ee9c1","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"**ABF基板メーカー・ABF材料・ATE・プローブカードが本命**  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 \n筐体は薄くなる。  \nカメラは大型化する。  \n放熱は厳しくなる。  \nその結果、スマホの基板も単純な安物PCBでは済まなくなる。","quote_start":14,"quote_end":89,"text_sha256":"3a9d81e02ffdc84f688cbc1a68af7d106dd459a8d7b7018a9f697bbf7b15ffc5","block_sha256":"3a9d81e02ffdc84f688cbc1a68af7d106dd459a8d7b7018a9f697bbf7b15ffc5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_53605de4-06cc-4e0b-9bc9-21f393408c0a/#blk_2d686185-736e-4b6c-a7d2-9cde9f136c61"},{"id":"occ_5cdee5d2fd26ba188b1542ca","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_53605de4-06cc-4e0b-9bc9-21f393408c0a","work_id":"wrk_006833f6-f225-48d3-8754-46fe28d6bd8e","block_id":"blk_331914b4-21b1-45d3-a0cf-06a90a96a08a","section_id":"sec_7c91db57-1adf-4ae2-ad6f-5ced1a9ebb9b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":0,"end":2,"exact":"基板","quote":"基板も高付加価値化する。","quote_start":0,"quote_end":12,"text_sha256":"86ad43955165f837bc29c48ba7ee51db0d2ce4901eab9a5d82a9f05f81788c2e","block_sha256":"86ad43955165f837bc29c48ba7ee51db0d2ce4901eab9a5d82a9f05f81788c2e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_53605de4-06cc-4e0b-9bc9-21f393408c0a/#blk_331914b4-21b1-45d3-a0cf-06a90a96a08a"},{"id":"occ_ae396afb57c64d096521450e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_53605de4-06cc-4e0b-9bc9-21f393408c0a","work_id":"wrk_006833f6-f225-48d3-8754-46fe28d6bd8e","block_id":"blk_5e4efa00-e175-439d-888e-a5ba8b90ca4f","section_id":"sec_7c91db57-1adf-4ae2-ad6f-5ced1a9ebb9b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":35,"end":37,"exact":"基板","quote":"低価格スマホであっても、現代スマホとして成立させるには、一定水準以上の基板、電源、MLCC、ストレージ、DRAMが必要になる。","quote_start":0,"quote_end":63,"text_sha256":"55eb30862f5c0ee7f926a30425df77fe8563f97ebd361f5b62779838ad124987","block_sha256":"55eb30862f5c0ee7f926a30425df77fe8563f97ebd361f5b62779838ad124987","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_53605de4-06cc-4e0b-9bc9-21f393408c0a/#blk_5e4efa00-e175-439d-888e-a5ba8b90ca4f"},{"id":"occ_780a6adaaa609fae172e94e9","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_53605de4-06cc-4e0b-9bc9-21f393408c0a","work_id":"wrk_006833f6-f225-48d3-8754-46fe28d6bd8e","block_id":"blk_8759b92e-ef0e-4fb9-8156-903ce485430e","section_id":"sec_7c91db57-1adf-4ae2-ad6f-5ced1a9ebb9b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":113,"end":115,"exact":"基板","quote":"を安くすることもできる。  \nしかし、最低限のスマホ体験を成立させるには、DRAM、NAND、電源、MLCC、基板を完全には削れない。","quote_start":58,"quote_end":125,"text_sha256":"6bd07c1a46835ab71f29a0bda637d02836b1062eb00757019a02c40eab6e5b5b","block_sha256":"6bd07c1a46835ab71f29a0bda637d02836b1062eb00757019a02c40eab6e5b5b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_53605de4-06cc-4e0b-9bc9-21f393408c0a/#blk_8759b92e-ef0e-4fb9-8156-903ce485430e"},{"id":"occ_598e7b37f76f139dbce95fcb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_53605de4-06cc-4e0b-9bc9-21f393408c0a","work_id":"wrk_006833f6-f225-48d3-8754-46fe28d6bd8e","block_id":"blk_88e83d72-bb6f-4e74-bf3d-9b40815f5d9b","section_id":"sec_7c91db57-1adf-4ae2-ad6f-5ced1a9ebb9b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":92,"end":94,"exact":"基板","quote":"ザが使え、決済ができ、音楽が聴け、認証ができ、仕事もできる。  \nその裏には、安いDRAM、安いNAND、安い基板、安いMLCC、安い電源IC、巨大な中国製造、薄利大量販売があった。","quote_start":37,"quote_end":128,"text_sha256":"69c5ee628243d2d2f512bb96aac9d555a8d3710aaeabc433bc80b29764b0d5b3","block_sha256":"69c5ee628243d2d2f512bb96aac9d555a8d3710aaeabc433bc80b29764b0d5b3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_53605de4-06cc-4e0b-9bc9-21f393408c0a/#blk_88e83d72-bb6f-4e74-bf3d-9b40815f5d9b"},{"id":"occ_b5164ed07865cf92240f8db7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_53605de4-06cc-4e0b-9bc9-21f393408c0a","work_id":"wrk_006833f6-f225-48d3-8754-46fe28d6bd8e","block_id":"blk_918ccdbf-e084-43b4-904a-00d103a80bd1","section_id":"sec_7c91db57-1adf-4ae2-ad6f-5ced1a9ebb9b","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":33,"end":35,"exact":"基板","quote":"薄利で売る。  \n大量に売る。  \n部品を共通化する。  \n筐体や基板設計を使い回す。  \nオンライン販売で流通コストを削る。  \n広告やプリインストールアプリ、サービス収益で補う。  \n深圳、東莞、蘇州などの巨大サプライチェーンを使う。  \nディスプレイ、カメラ、スト","quote_start":0,"quote_end":135,"text_sha256":"b285a28f0fdfc50f88ee882882573c0bce53716e6245c8fb351e8885bc151f9f","block_sha256":"b285a28f0fdfc50f88ee882882573c0bce53716e6245c8fb351e8885bc151f9f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_53605de4-06cc-4e0b-9bc9-21f393408c0a/#blk_918ccdbf-e084-43b4-904a-00d103a80bd1"},{"id":"occ_b452eb07abc81c80d8947526","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_53605de4-06cc-4e0b-9bc9-21f393408c0a","work_id":"wrk_006833f6-f225-48d3-8754-46fe28d6bd8e","block_id":"blk_91929880-9813-4b09-8841-689ac16a8af2","section_id":"sec_7c91db57-1adf-4ae2-ad6f-5ced1a9ebb9b","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":67,"end":70,"exact":"PCB","quote":"ても、DRAMとNANDが100ドル上がれば意味がない。  \n組立コストを5ドル削っても、MLCC、PMIC、PCBで20ドル上がれば意味がない。  \n広告収益で補っても、メモリがBOMの30〜40%、場合によっては40〜50%を占めるようになれば、低価格モデルの利益は消える。","quote_start":12,"quote_end":151,"text_sha256":"8dd96c44e4caa3d128722adebccc545cbcc60d77e19d7470b30a8c1365d9ae91","block_sha256":"8dd96c44e4caa3d128722adebccc545cbcc60d77e19d7470b30a8c1365d9ae91","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_53605de4-06cc-4e0b-9bc9-21f393408c0a/#blk_91929880-9813-4b09-8841-689ac16a8af2"},{"id":"occ_8a1491b2adbc8858d4ae5b0c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_53605de4-06cc-4e0b-9bc9-21f393408c0a","work_id":"wrk_006833f6-f225-48d3-8754-46fe28d6bd8e","block_id":"blk_f51c3693-e884-426b-a21e-23e7ee1a45e6","section_id":"sec_7c91db57-1adf-4ae2-ad6f-5ced1a9ebb9b","layer":"body","character_id":null,"count":2,"matched_aliases":["CCL","PCB"],"evidence":{"text_basis":"markdown","start":19,"end":22,"exact":"PCB","quote":"メモリ、NAND、MLCC、PMIC、PCB、CCL、先端パッケージ、ファウンドリ、電源、冷却、データセンター、送電。  \nこれらは実需が強い。  \nだから企業業績には追い風になる。","quote_start":0,"quote_end":91,"text_sha256":"1e29b02d392341078aabdb70d9b0a21870a98b1cc8b533fd922eb1006fa3a27c","block_sha256":"1e29b02d392341078aabdb70d9b0a21870a98b1cc8b533fd922eb1006fa3a27c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_53605de4-06cc-4e0b-9bc9-21f393408c0a/#blk_f51c3693-e884-426b-a21e-23e7ee1a45e6"},{"id":"occ_53a92500ac736dbe81ff3e68","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_53605de4-06cc-4e0b-9bc9-21f393408c0a","work_id":"wrk_006833f6-f225-48d3-8754-46fe28d6bd8e","block_id":"blk_f82f2998-eaea-481d-a1dc-977a5c0a7e71","section_id":"sec_7c91db57-1adf-4ae2-ad6f-5ced1a9ebb9b","layer":"body","character_id":null,"count":3,"matched_aliases":["CCL","PCB","基板"],"evidence":{"text_basis":"markdown","start":115,"end":118,"exact":"PCB","quote":"  \nRF部品が必要になる。  \nカメラ用センサーが必要になる。  \nディスプレイドライバが必要になる。  \nPCB、FPCB、SLP基板、CCL、プリプレグ、銅箔、樹脂材料も必要になる。  \nバッテリー、放熱部材、筐体、コネクタ、アンテナも必要になる。","quote_start":60,"quote_end":187,"text_sha256":"55c6f45e925dd2a221b45ab35990cfd0663f7bcc4911d02cc1749b15c72c0407","block_sha256":"55c6f45e925dd2a221b45ab35990cfd0663f7bcc4911d02cc1749b15c72c0407","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_53605de4-06cc-4e0b-9bc9-21f393408c0a/#blk_f82f2998-eaea-481d-a1dc-977a5c0a7e71"},{"id":"occ_e770d20d43b84501916a801c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_005f16f8-8108-437c-a791-ed293dd3b7ff","section_id":"sec_935e972d-6492-4525-996e-3aa0ef30efdb","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":59,"end":61,"exact":"基板","quote":"ンシーバー（SerDesなど）**  \n→ **アナログ/RF設計 + EM/SI/PI解析 + パッケージ/基板込みのチャネル解析** が主役です。 ([Cadence](https://www.cadence.com/en_US/home/tools/custom-ic-analog-rf-design/vi","quote_start":4,"quote_end":161,"text_sha256":"94a7eacfa964f24b211bd776a05e0ac5caf56e68d546a7e73486bfbee1dcc832","block_sha256":"94a7eacfa964f24b211bd776a05e0ac5caf56e68d546a7e73486bfbee1dcc832","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_005f16f8-8108-437c-a791-ed293dd3b7ff"},{"id":"occ_f299b47fc7ff39e1867e8b91","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_01f362e4-cb7c-4330-bf3b-d3ae47f40928","section_id":"sec_1d16124e-ce89-419d-a9fb-035f04e0dc57","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":61,"end":63,"exact":"基板","quote":"ーキ検討 → 回路/RTL/モデル作成 → 検証 → レイアウト/実装 → 抽出/サインオフ → パッケージ/基板/システム解析**","quote_start":6,"quote_end":72,"text_sha256":"125bb5b86d72501b87c7b9940284100a60c9569fa5e73e84cb52339f1e4ea80c","block_sha256":"125bb5b86d72501b87c7b9940284100a60c9569fa5e73e84cb52339f1e4ea80c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_01f362e4-cb7c-4330-bf3b-d3ae47f40928"},{"id":"occ_f9237d728b7513ba9e75b771","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_04a1505d-0cef-435d-affd-f1e0b2c725f7","section_id":"sec_5f61db41-6f4f-4204-979c-5c05cc36163b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":0,"end":2,"exact":"基板","quote":"基板は、**その皿を載せる大きな配膳トレー**です。","quote_start":0,"quote_end":26,"text_sha256":"aa02fecc093bab53b252b78eae4aaa7a450bebebf2627aa1183039cd7f8e8fbd","block_sha256":"aa02fecc093bab53b252b78eae4aaa7a450bebebf2627aa1183039cd7f8e8fbd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_04a1505d-0cef-435d-affd-f1e0b2c725f7"},{"id":"occ_35f83ab2e503e38f20452c76","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_05f44c3f-f728-46e9-99af-6ec9d073990f","section_id":"sec_5081923d-c47e-4566-9e0e-333c802bf2ae","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":57,"end":59,"exact":"基板","quote":"rDesや高速トランシーバーは、**送受信アナログ回路、PLL/CDR、等化、ドライバ/レシーバ、パッケージ、基板チャネル** が全部つながって性能が決まります。Cadence Virtuoso Studio RF は、schematic と layout の同時設計、RF/system simulation、E","quote_start":2,"quote_end":159,"text_sha256":"2367af72c6ffe013327012da1e905efaa46ad6255ba8093ae531b6e606b7c9f2","block_sha256":"2367af72c6ffe013327012da1e905efaa46ad6255ba8093ae531b6e606b7c9f2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_05f44c3f-f728-46e9-99af-6ec9d073990f"},{"id":"occ_b86d527f0baaa275228da496","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_0807e0cc-6153-470a-b5d4-905ab92b1a57","section_id":"sec_9037dc85-459a-4cb0-bd2c-3a3ede1bf6ab","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":30,"end":32,"exact":"基板","quote":"- GPUダイ\n- HBMスタック\n- インターポーザ\n- 基板\n- パッケージ","quote_start":0,"quote_end":40,"text_sha256":"62e5666106b39ad6fc98704bdd8b88996274ffa9168e5a47a08253de0f7b01fb","block_sha256":"62e5666106b39ad6fc98704bdd8b88996274ffa9168e5a47a08253de0f7b01fb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_0807e0cc-6153-470a-b5d4-905ab92b1a57"},{"id":"occ_79ee377238775cef379d800d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_0b802806-b976-4389-a09a-17919a839f52","section_id":"sec_876b603d-e324-4bf6-9020-8af3b44e0ba3","layer":"body","character_id":null,"count":2,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":111,"end":114,"exact":"PCB","quote":"そのものが **analog / RF / mixed-signal** であり、さらに package / PCB を通した **SI/PI / EM / thermal** が性能を左右します。Cadence は Custom IC/Analog/RF、IC Package Design and 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Allegro X, Sigrity X, Clarity 3D Solver, Celsius Thermal Solver, Fidelity CFD, Reality DC。 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 \n  デジタル実装、カスタム/アナログ/RF、検証、IP、パッケージ、マルチフィジクス、PCB。 ([Cadence](https://www.cadence.com/en_US/home/tools.html))\n- **Arm**  \n  CPU/GPU/NPU、Compute 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RF/EM解析EDA + SI/PI/基板EDA」**  \nの比率が高いです。 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PrimeSim のような custom IC・回路シミュレーション系が中心になります。さらに、パッケージや基板まで効く製品では、Ansys や Cadence Sigrity / Clarity のような SI/PI/熱/EM 解析が後半で強く効きます。 ([Synopsys](https://www.syn","quote_start":181,"quote_end":338,"text_sha256":"dc7d5d3f13fa07a81a0ae130e5b6813e40565750a92f41a2d29ebe0debb0bf47","block_sha256":"dc7d5d3f13fa07a81a0ae130e5b6813e40565750a92f41a2d29ebe0debb0bf47","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_5dfc2250-e93d-4b5d-9114-ef1222428575"},{"id":"occ_9a26b42c5c2035012febc876","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_64064af2-07b5-4958-a6d1-002f242eb130","section_id":"sec_5f61db41-6f4f-4204-979c-5c05cc36163b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":3,"end":5,"exact":"基板","quote":"つまり基板は、  \n**主役を活かすための“配膳の土台”**  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Sigrity SystemSI は、serial link analysis で eye diagram、bathtub curve、BER 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Design and Analysis**  \n  PCB設計、PCB向け SI/PI、RF/マイクロ波、PSpice など。 ([Cadence](https://www.cadence.com/","quote_start":1046,"quote_end":1204,"text_sha256":"818c8cde6107194e7078fd77c9a0b77861425ea0b89de7a6a8ee0cc9856c1732","block_sha256":"818c8cde6107194e7078fd77c9a0b77861425ea0b89de7a6a8ee0cc9856c1732","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_c4ec8c85-c51a-4b75-a143-9aceb3a963d0"},{"id":"occ_415f21b92b47f0db5105429e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_cbbf4465-4b81-47a2-8bd5-f7454aa4086f","section_id":"sec_89d57724-139e-4cf5-bd77-f710454f16cb","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"### 基板","quote_start":0,"quote_end":6,"text_sha256":"715f6a2e3e8802778b73a9d4f7a3a5cf97d7cffd2af1f05758e762764d52622d","block_sha256":"715f6a2e3e8802778b73a9d4f7a3a5cf97d7cffd2af1f05758e762764d52622d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_cbbf4465-4b81-47a2-8bd5-f7454aa4086f"},{"id":"occ_e4fedc40fb68776361475316","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_db126009-359c-4f07-8775-0ba2c8d440dd","section_id":"sec_5f61db41-6f4f-4204-979c-5c05cc36163b","layer":"body","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"## \\4. 基板（PCB）は何に当たるか","quote_start":0,"quote_end":21,"text_sha256":"2166c4aae2cb6673c059364b9607e02f9891dca95c107ad17b860d86d63624d0","block_sha256":"2166c4aae2cb6673c059364b9607e02f9891dca95c107ad17b860d86d63624d0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_db126009-359c-4f07-8775-0ba2c8d440dd"},{"id":"occ_59130a855faf4a093a2bb0e1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_dd02f955-14da-4f0c-b309-7273b862ab67","section_id":"sec_5f61db41-6f4f-4204-979c-5c05cc36163b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"半導体でいうと基板は、","quote_start":0,"quote_end":11,"text_sha256":"8dc78eeba72702c111b4f38abc5f40783480c88e3107243a9a4ec58fd8a376c2","block_sha256":"8dc78eeba72702c111b4f38abc5f40783480c88e3107243a9a4ec58fd8a376c2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_dd02f955-14da-4f0c-b309-7273b862ab67"},{"id":"occ_7a34ec6cfe860532dd59f0ba","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_e767ce2b-2620-47a1-9d16-85b474153ffd","section_id":"sec_4623f903-7567-4d72-9a1a-47099e5f072a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":10,"end":12,"exact":"基板","quote":"### パッケージ/基板/システム","quote_start":0,"quote_end":17,"text_sha256":"69278e172e6a6cbbabf7c9c711156bf449c75db8d0651d5df93fef38d3fefd05","block_sha256":"69278e172e6a6cbbabf7c9c711156bf449c75db8d0651d5df93fef38d3fefd05","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_e767ce2b-2620-47a1-9d16-85b474153ffd"},{"id":"occ_8300a5a92d99c1c65c5a6502","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_f027fba3-320f-4968-a5a0-cb3dcdc06b62","section_id":"sec_2d495d61-0928-429c-8a57-7519b8803e50","layer":"body","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":109,"end":111,"exact":"基板","quote":"け合わせ\n- **パッケージ/インターポーザ** = メインとソースを最適な距離で載せる特注プレート\n- **基板（PCB）** = その皿を載せるお盆・配膳トレー\n- **サーバー1台** = 1人前のコースセット\n- **サーバーラック** = 何人前も同時に出す巨大な配膳棚・厨房ライン","quote_start":54,"quote_end":200,"text_sha256":"a33c4b0cea6559b907d832b1db35e7d73b7d0df6918895501ee300636fa1a05d","block_sha256":"a33c4b0cea6559b907d832b1db35e7d73b7d0df6918895501ee300636fa1a05d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_f027fba3-320f-4968-a5a0-cb3dcdc06b62"},{"id":"occ_d188d2ff254b872bdc737194","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_fb0108a9-51a2-43d2-a720-a626a70a9ab4","section_id":"sec_088d1b0f-0bb0-43d4-bd28-1ec0b6f7a641","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":182,"end":185,"exact":"PCB","quote":"gn and Analysis**, **Multiphysics System Analysis**, **PCB Design and Analysis** です。さらに System Design & Analysis の箱として、Allegro, Sigrity, AWR, Reality DC, Fide","quote_start":127,"quote_end":285,"text_sha256":"2425b718512dbc4c03c68fae3ef4cb6b83232202819c76fe15ae7d5102583e9a","block_sha256":"2425b718512dbc4c03c68fae3ef4cb6b83232202819c76fe15ae7d5102583e9a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_fb0108a9-51a2-43d2-a720-a626a70a9ab4"},{"id":"occ_7a193b7094f0c5006b140de4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_fcbadab8-b8ee-42ef-a53d-a97198557cd1","section_id":"sec_73c42597-c031-4101-86c6-ef6d71469bb6","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":35,"end":37,"exact":"基板","quote":"- HBMが弱いとソース不足\n- パッケージが悪いと盛り付け失敗\n- 基板が悪いと配膳が不安定\n- サーバー設計が悪いと一人前として成立しない\n- ラック運用が悪いと店全体が回らない","quote_start":0,"quote_end":91,"text_sha256":"6d88eb69699834f4d6fab1d5c06144b587df153eb0ca8b8a164845b4602ae680","block_sha256":"6d88eb69699834f4d6fab1d5c06144b587df153eb0ca8b8a164845b4602ae680","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_fcbadab8-b8ee-42ef-a53d-a97198557cd1"},{"id":"occ_29df9bc10ffda2268e565411","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_584d62bb-c9f7-4d1f-b637-8fac93976f1b","work_id":"wrk_b4bdeaca-dc31-448c-8f47-03f9e39c14b0","block_id":"blk_5cfdf2f6-28f1-4f10-bcd3-c23ff44bb333","section_id":"sec_ac059bbb-dc4c-4bb9-92e8-e01d065e608e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":151,"end":153,"exact":"基板","quote":"先端ノード、I/Oや一部機能は成熟ノード」などの異種ノード混在を早期から許容し、パッケージ制約（HBM実装数、基板、CoWoS能力）をボトルネックではなく入力条件として最適化することです。","quote_start":96,"quote_end":190,"text_sha256":"b7b3d6c0e8ccf3c8e6ae8a3837f47f17b28c16decbd5e3617af5d51ba4557902","block_sha256":"b7b3d6c0e8ccf3c8e6ae8a3837f47f17b28c16decbd5e3617af5d51ba4557902","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_584d62bb-c9f7-4d1f-b637-8fac93976f1b/#blk_5cfdf2f6-28f1-4f10-bcd3-c23ff44bb333"},{"id":"occ_1f7045befe1460e379c00ba2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5c1381d3-461d-40ab-acea-997127510f6e","work_id":"wrk_153585aa-ce70-48f0-8fcf-0c54fb47c7a9","block_id":"blk_284677e1-419a-49fa-b105-ea6d03342441","section_id":"sec_1c28964f-1995-4372-a8e5-c24e6621f210","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":6,"end":8,"exact":"基板","quote":"- シリコン基板の上に**非常に小さな鏡（数十〜数百 µm）をアレイ状**に並べ、\n- ミラーを支える梁（ヒンジ）と、**静電力などでミラーを傾ける駆動電極**を作っておき、\n- 電圧をかけてミラーの角度を変えること","quote_start":0,"quote_end":108,"text_sha256":"9ef56cc87860e98108a9048cb255a6f28fac9d7c08aac28cda17f0261f5b9eec","block_sha256":"9ef56cc87860e98108a9048cb255a6f28fac9d7c08aac28cda17f0261f5b9eec","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5c1381d3-461d-40ab-acea-997127510f6e/#blk_284677e1-419a-49fa-b105-ea6d03342441"},{"id":"occ_00175962924b029137f664eb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5c1381d3-461d-40ab-acea-997127510f6e","work_id":"wrk_153585aa-ce70-48f0-8fcf-0c54fb47c7a9","block_id":"blk_4dccb32c-fcca-4417-b8e7-9e848f29a4ef","section_id":"sec_50b89999-49ef-4e42-9e1c-d72d7bce72a6","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":332,"end":335,"exact":"PCB","quote":"ベースに、**スイッチASICと光エンジンを同じパッケージに実装**。  \n  これによって、\n  \n  - PCB上の電気配線距離を 14–16 inch → 0.5 inch以下に短縮\n  - DSPレスで信号品質を確保\n  - **従来のプラガブル光モジュール比で最大3.5倍の電力削減**  \n    などを","quote_start":277,"quote_end":435,"text_sha256":"6a7f8d634f83a48657c52765f402fa6cfb3fa7c132376287b8e4fdda8ce86926","block_sha256":"6a7f8d634f83a48657c52765f402fa6cfb3fa7c132376287b8e4fdda8ce86926","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5c1381d3-461d-40ab-acea-997127510f6e/#blk_4dccb32c-fcca-4417-b8e7-9e848f29a4ef"},{"id":"occ_447deac3335f7f95cf19e7f1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5ed1cac5-83cc-4660-89c7-643aae40960d","work_id":"wrk_5b8f2ea4-f2a5-484d-9b6e-1ec16d2a1a3e","block_id":"blk_13ecb57e-9d82-4eba-963e-84bccf983082","section_id":"sec_1c89ea40-d6ce-4365-be1d-162ee88f7337","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":79,"end":81,"exact":"基板","quote":"istor\n- TSV\n- ダイ薄化\n- 接合\n- UCIe PHY\n- メモリコントローラー\n- パッケージ基板\n- テスト装置\n- 顧客認証","quote_start":24,"quote_end":96,"text_sha256":"56104a23b449373b6f9553ee52bf49fec3994715332f3ae0ca33248ea4a62cfb","block_sha256":"56104a23b449373b6f9553ee52bf49fec3994715332f3ae0ca33248ea4a62cfb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5ed1cac5-83cc-4660-89c7-643aae40960d/#blk_13ecb57e-9d82-4eba-963e-84bccf983082"},{"id":"occ_7edb459d8b092be83edeade2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5ed1cac5-83cc-4660-89c7-643aae40960d","work_id":"wrk_5b8f2ea4-f2a5-484d-9b6e-1ec16d2a1a3e","block_id":"blk_22ca9749-eb07-4c62-8e2a-2aff28cf2db9","section_id":"sec_8be6d81c-98cc-4b23-85bc-18bd2436519d","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":15,"end":17,"exact":"基板","quote":"- メモリスタックをパッケージ基板へ搭載するMemory-on-Package\n- メモリ用の中間基板を省く構造\n- モールド内へメモリスタックを埋め込む構造\n- Reversed Overhang Memory-on-Package","quote_start":0,"quote_end":117,"text_sha256":"1cb76513658504f1c0a8f09dced19f0fa089138ea3599dcd1cf3b40421c3488c","block_sha256":"1cb76513658504f1c0a8f09dced19f0fa089138ea3599dcd1cf3b40421c3488c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5ed1cac5-83cc-4660-89c7-643aae40960d/#blk_22ca9749-eb07-4c62-8e2a-2aff28cf2db9"},{"id":"occ_f1819f959d18be27cbbb5cb3","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5ed1cac5-83cc-4660-89c7-643aae40960d","work_id":"wrk_5b8f2ea4-f2a5-484d-9b6e-1ec16d2a1a3e","block_id":"blk_7453bcb9-6cae-4217-9c56-290f40cc45ed","section_id":"sec_8427feac-27ad-41fb-bf73-206d102d18cd","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"```\nDDR時代\nメモリは基板上の外部部品\n\n        ↓\n\nHBM時代\nメモリはGPUに隣接する積層部品\n\n        ↓\n\nXBMが示す方向\nメモリはパッケージ内ネットワークへ参加するチップレット\n```","quote_start":0,"quote_end":110,"text_sha256":"2cebe46043f1baaf4c9b603a33cec0eee94d1b13496f2ffebb8fb3a32746b5b6","block_sha256":"2cebe46043f1baaf4c9b603a33cec0eee94d1b13496f2ffebb8fb3a32746b5b6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5ed1cac5-83cc-4660-89c7-643aae40960d/#blk_7453bcb9-6cae-4217-9c56-290f40cc45ed"},{"id":"occ_98b89f04bd5887f7b24c5808","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5ed1cac5-83cc-4660-89c7-643aae40960d","work_id":"wrk_5b8f2ea4-f2a5-484d-9b6e-1ec16d2a1a3e","block_id":"blk_98977771-e4f5-47e7-8f8c-47e485e178ad","section_id":"sec_8be6d81c-98cc-4b23-85bc-18bd2436519d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":48,"end":50,"exact":"基板","quote":"UCIeによる接続で十分な帯域と電力効率を得られれば、全面シリコンインターポーザーを使わず、有機基板、ブリッジ、RDLなどを組み合わせる余地が広がる。","quote_start":0,"quote_end":75,"text_sha256":"0faec51a8ed1061091daa765bedaa6e0ed4157ad135cd3f20f062d979dc0b910","block_sha256":"0faec51a8ed1061091daa765bedaa6e0ed4157ad135cd3f20f062d979dc0b910","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5ed1cac5-83cc-4660-89c7-643aae40960d/#blk_98977771-e4f5-47e7-8f8c-47e485e178ad"},{"id":"occ_b06d0e0aefc7fbce6295b343","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5ed1cac5-83cc-4660-89c7-643aae40960d","work_id":"wrk_5b8f2ea4-f2a5-484d-9b6e-1ec16d2a1a3e","block_id":"blk_a7707d3e-5258-4d63-8ced-44d7bd28bfc2","section_id":"sec_a4a0f36f-2468-4c40-9949-9a65757f5ebc","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":410,"end":412,"exact":"基板","quote":"必ずシリコンインターポーザーを完全排除するわけではない。\n- 特許にはインターポーザー型と、メモリをパッケージ基板へ直接載せる構造の両方が含まれる。\n- XBMはHybrid Bondingそのものではなく、メモリ全体のアーキテクチャである。\n- Logic Foldingと同様に、メモリ、通信、制御、修復を異な","quote_start":355,"quote_end":512,"text_sha256":"e60d9e033ab0fbd10d363003f0a9056db6e555875291a9b139e20336a1b68f8f","block_sha256":"e60d9e033ab0fbd10d363003f0a9056db6e555875291a9b139e20336a1b68f8f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5ed1cac5-83cc-4660-89c7-643aae40960d/#blk_a7707d3e-5258-4d63-8ced-44d7bd28bfc2"},{"id":"occ_d1711b876eb53c5c46f89d98","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5ed1cac5-83cc-4660-89c7-643aae40960d","work_id":"wrk_5b8f2ea4-f2a5-484d-9b6e-1ec16d2a1a3e","block_id":"blk_b1c74490-23de-46a9-905d-f612a0b76e1b","section_id":"sec_1c89ea40-d6ce-4365-be1d-162ee88f7337","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":40,"end":42,"exact":"基板","quote":"HBMはすでにメモリメーカー、GPUメーカー、ファウンドリ、OSAT、パッケージ基板メーカーによる巨大な供給網を持つ。","quote_start":0,"quote_end":59,"text_sha256":"e60ba93074dc84a788d105b5d751bb4481e5c4e6cbd780a4d721f1a1bbb26656","block_sha256":"e60ba93074dc84a788d105b5d751bb4481e5c4e6cbd780a4d721f1a1bbb26656","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5ed1cac5-83cc-4660-89c7-643aae40960d/#blk_b1c74490-23de-46a9-905d-f612a0b76e1b"},{"id":"occ_44ef2d142c0114539b063537","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5ed1cac5-83cc-4660-89c7-643aae40960d","work_id":"wrk_5b8f2ea4-f2a5-484d-9b6e-1ec16d2a1a3e","block_id":"blk_c764bc68-0c79-489d-95c0-c0d797c62e75","section_id":"sec_e4f843d9-420a-47c9-a7a5-21287321eac9","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":63,"end":65,"exact":"基板","quote":"ターポーザーが大きくなる\n- マイクロバンプの数が増える\n- パッケージ内部の配線が複雑になる\n- パッケージ基板が大型化する\n- 電源供給が難しくなる\n- パッケージ反りの管理が難しくなる\n- 組み立て後の検査コストが増える","quote_start":8,"quote_end":121,"text_sha256":"f3a0d7bf4652da5d17c16028c76ee4cf22ca23205d9659d985d6e96839f4a519","block_sha256":"f3a0d7bf4652da5d17c16028c76ee4cf22ca23205d9659d985d6e96839f4a519","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5ed1cac5-83cc-4660-89c7-643aae40960d/#blk_c764bc68-0c79-489d-95c0-c0d797c62e75"},{"id":"occ_d56dd46df95da53ae31fdc7d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5ed1cac5-83cc-4660-89c7-643aae40960d","work_id":"wrk_5b8f2ea4-f2a5-484d-9b6e-1ec16d2a1a3e","block_id":"blk_df6818dc-196c-41f7-afd8-d4096f8cf0c5","section_id":"sec_4024d15e-004c-4b15-8f97-fb51e6a8ef4e","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":125,"end":127,"exact":"基板","quote":"───────────────\nトランジスタ層      FEOL\n────────────────\nシリコン基板\n下側\n```","quote_start":70,"quote_end":134,"text_sha256":"dd401ef27c5855a2968d5ff41380bee43cd22293e95c190344450da3422ff491","block_sha256":"dd401ef27c5855a2968d5ff41380bee43cd22293e95c190344450da3422ff491","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5ed1cac5-83cc-4660-89c7-643aae40960d/#blk_df6818dc-196c-41f7-afd8-d4096f8cf0c5"},{"id":"occ_8e3f45e62cacdfb026abb5e3","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5ed1cac5-83cc-4660-89c7-643aae40960d","work_id":"wrk_5b8f2ea4-f2a5-484d-9b6e-1ec16d2a1a3e","block_id":"blk_e788decf-82f7-420f-b9a5-58a586013c6b","section_id":"sec_a07cac00-fe15-490e-8830-5fe94e9f263c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"シリコン基板へ、","quote_start":0,"quote_end":8,"text_sha256":"f252bb15737c3fe63a25644a6ee26cd6d07ff73a18d5495e9c42c08cd052f33c","block_sha256":"f252bb15737c3fe63a25644a6ee26cd6d07ff73a18d5495e9c42c08cd052f33c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5ed1cac5-83cc-4660-89c7-643aae40960d/#blk_e788decf-82f7-420f-b9a5-58a586013c6b"},{"id":"occ_3bbf9c136e57bc4c11b36c53","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5f90a6d0-abcb-4341-ad3f-bf14f2e88363","work_id":"wrk_aa1fc199-17d1-43c9-9656-8cee3a08fa75","block_id":"blk_99fb9d86-db38-45a7-9290-6f362d842bf1","section_id":"sec_0ac34d12-bd0a-437a-bfde-8e00a1219726","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":380,"end":382,"exact":"基板","quote":"   | ダイキン、荏原、三菱電機              | チラー、ポンプ、冷却設備      |\n| 基板・材料      | イビデン、新光電工、メイコー、太陽HD、レゾナック | AIサーバー・パッケージ基板    |\n| 半導体装置      | 東京エレクトロン、アドバンテスト、ディスコ     ","quote_start":325,"quote_end":482,"text_sha256":"5811a705350809c1590cb9ad1e2b45e5f44bfd0006d5c8998262e36ae77c2322","block_sha256":"5811a705350809c1590cb9ad1e2b45e5f44bfd0006d5c8998262e36ae77c2322","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5f90a6d0-abcb-4341-ad3f-bf14f2e88363/#blk_99fb9d86-db38-45a7-9290-6f362d842bf1"},{"id":"occ_73f0af4ba6747b231ad356ee","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_5f90a6d0-abcb-4341-ad3f-bf14f2e88363","work_id":"wrk_aa1fc199-17d1-43c9-9656-8cee3a08fa75","block_id":"blk_fe06412a-0cbf-41ae-ba07-7b5a46ab4f17","section_id":"sec_12857a9e-0151-410c-baba-67a1809f2289","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":180,"end":182,"exact":"基板","quote":"だけでなく、**HBM、DDR、NAND、SSD、HDD、ネットワークASIC、光DSP、電源IC、パッケージ基板**まで一気に需要を押し上げているということです。([IDC][1])","quote_start":125,"quote_end":217,"text_sha256":"589f607bf685190af24a52a1ef9221b2ec0089b733fb982c1cc515d83e2557c7","block_sha256":"589f607bf685190af24a52a1ef9221b2ec0089b733fb982c1cc515d83e2557c7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5f90a6d0-abcb-4341-ad3f-bf14f2e88363/#blk_fe06412a-0cbf-41ae-ba07-7b5a46ab4f17"},{"id":"occ_ad4cd0ddb45ef3fbd27a3171","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_61f118e1-20e7-486f-b830-cae804dd9f14","work_id":"wrk_7a4ffab3-0117-4e75-821b-23feb00ad9c5","block_id":"blk_5b2371c6-223e-4ccc-bf6e-cc4b974ef49e","section_id":"sec_e8df9340-c71a-49f9-a855-36e12b3ad53c","layer":"body","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":107,"end":109,"exact":"基板","quote":"工程名から見ても、この計画が本格化すれば、露光、成膜、エッチング、イオン注入のような前工程だけでなく、マスク、基板、封止、検査、冷却、薬液、ガス、パッケージ関連まで影響が及ぶ可能性があります。さらに Broadcom は、半導体そのものだけでなくレーザーや光部品、PCB 周辺でも供給制約が広がっていると指摘してい","quote_start":52,"quote_end":209,"text_sha256":"e43f09445049ca08f1a1d54e785b5c9570db6ce9a6fa9495289e68a63b9c3e86","block_sha256":"e43f09445049ca08f1a1d54e785b5c9570db6ce9a6fa9495289e68a63b9c3e86","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_61f118e1-20e7-486f-b830-cae804dd9f14/#blk_5b2371c6-223e-4ccc-bf6e-cc4b974ef49e"},{"id":"occ_865ffd8421748048c693e50b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_61f118e1-20e7-486f-b830-cae804dd9f14","work_id":"wrk_7a4ffab3-0117-4e75-821b-23feb00ad9c5","block_id":"blk_9fce586a-e694-4b00-83f0-e50315b03979","section_id":"sec_e8df9340-c71a-49f9-a855-36e12b3ad53c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":172,"end":174,"exact":"基板","quote":" 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材料・基板・ウェハ","quote_start":0,"quote_end":12,"text_sha256":"7f7375bc09c292d9447c7bd13e68e5d7c4bade824ad66167facb3f46dbde2a12","block_sha256":"7f7375bc09c292d9447c7bd13e68e5d7c4bade824ad66167facb3f46dbde2a12","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_66313feb-6eff-400e-94b9-3dd889eabe3e/#blk_0b3ad200-44b2-4608-b5b3-c64ad66178de"},{"id":"occ_fe28d0417228340badcc2340","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_66313feb-6eff-400e-94b9-3dd889eabe3e","work_id":"wrk_75063f69-d242-41d4-aaa2-d86b2bdecc9e","block_id":"blk_cb5ab186-459b-4624-a044-a59a60326ce2","section_id":"sec_2fb20f03-607e-4a84-88db-a63783c16fb3","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"半導体指数が弱くても、基板や材料株が強ければ、設備投資の中で資金移動が起きている可能性がある。","quote_start":0,"quote_end":47,"text_sha256":"882fa43d282ef6072782c8632365c24bbe98ef60962664c458d78479c248ac60","block_sha256":"882fa43d282ef6072782c8632365c24bbe98ef60962664c458d78479c248ac60","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_66313feb-6eff-400e-94b9-3dd889eabe3e/#blk_cb5ab186-459b-4624-a044-a59a60326ce2"},{"id":"occ_4fa8c6e7d81327976f2f4432","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_66313feb-6eff-400e-94b9-3dd889eabe3e","work_id":"wrk_75063f69-d242-41d4-aaa2-d86b2bdecc9e","block_id":"blk_dc0104be-a0de-4a14-be00-93f6546218b8","section_id":"sec_a7c23fdc-f780-49b1-b670-d84d881d2d33","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":51,"end":53,"exact":"基板","quote":"特にAIインフラ市場は、ハイパースケーラーの設備投資から始まり、GPU、HBM、ネットワーク、光通信、基板、電力、冷却設備へと需要が波及する。したがって、投資判断でも個別銘柄だけでなく、資金がAIインフラのどこへ移動しているのかを見る必要がある。","quote_start":0,"quote_end":123,"text_sha256":"edbbbc048398d111ffe85f1cac2c57ac17c2123938a03521eb54a482ee368b59","block_sha256":"edbbbc048398d111ffe85f1cac2c57ac17c2123938a03521eb54a482ee368b59","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_66313feb-6eff-400e-94b9-3dd889eabe3e/#blk_dc0104be-a0de-4a14-be00-93f6546218b8"},{"id":"occ_360a80a76c8dc90bc4babd1e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_028f9f6d-5200-4b0d-8958-2eacd45e687b","section_id":"sec_f42a627d-dd4b-49eb-b5e2-d587e552e202","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":9,"end":11,"exact":"基板","quote":"ここでは、プリント基板と半導体はまだ別のものだった。","quote_start":0,"quote_end":26,"text_sha256":"d5e2244035372777601f44a38c022ea508607fcea6e11ffedb1ad3eb2743ca29","block_sha256":"d5e2244035372777601f44a38c022ea508607fcea6e11ffedb1ad3eb2743ca29","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_028f9f6d-5200-4b0d-8958-2eacd45e687b"},{"id":"occ_fcc210d5f4850ff8c48262a1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_132e66b1-0e98-4102-9f5b-4fc4e943e1af","section_id":"sec_588a9de9-c7c3-4f30-9263-9c3c8fcc266e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":27,"end":29,"exact":"基板","quote":"アイスラーは1930年代から1940年代にかけて、絶縁基板と金属箔を組み合わせ、耐食インクで回路図形を印刷し、不要な金属をエッチングで除去する方法を研究した。1942年ごろに作られたアイスラーのラジオ受信機には、初期のプリント回路板が使用されている。([Sc","quote_start":0,"quote_end":129,"text_sha256":"7d340829d67307574c225ced92b24a653c1b62a0069fba89d582099537657552","block_sha256":"7d340829d67307574c225ced92b24a653c1b62a0069fba89d582099537657552","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_132e66b1-0e98-4102-9f5b-4fc4e943e1af"},{"id":"occ_4b544dc12c0af418eec2b9a7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_13b5bdbc-5f85-4769-b388-3397258684bd","section_id":"sec_9e08290a-3975-4a60-a682-4994667434c5","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":8,"end":10,"exact":"基板","quote":"ただし、プリント基板や半導体に必要なのは、美しい階調ではない。","quote_start":0,"quote_end":31,"text_sha256":"7e5fe696cd1fd3d0a1486f34f8597098c6f74a020ee2fcc4b173000d14126341","block_sha256":"7e5fe696cd1fd3d0a1486f34f8597098c6f74a020ee2fcc4b173000d14126341","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_13b5bdbc-5f85-4769-b388-3397258684bd"},{"id":"occ_88f8b93bc0310bd00ff27d77","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_13efdf09-9df6-4056-a14a-1e074d09feb5","section_id":"sec_f42a627d-dd4b-49eb-b5e2-d587e552e202","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":9,"end":11,"exact":"基板","quote":"```\nセラミック基板\n        ↓\n写真技術で金属配線を作る\n        ↓\n個別トランジスタを載せる\n```","quote_start":0,"quote_end":61,"text_sha256":"6ab94cbaab2a90f8f38f8b090925270bf0e1dcae9325a244de1116d968d4d258","block_sha256":"6ab94cbaab2a90f8f38f8b090925270bf0e1dcae9325a244de1116d968d4d258","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_13efdf09-9df6-4056-a14a-1e074d09feb5"},{"id":"occ_79ba0dbf820ac9c73601f9a6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_22f3db02-813a-4f73-b7b6-0a82a3571fd3","section_id":"sec_399db824-7dfd-42dc-aeb3-ae6d2fa87e20","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"プリント基板は、この段階で完成された一つの規格ではなかった。","quote_start":0,"quote_end":30,"text_sha256":"d5cb8bd3a898da8216dfce8262ff28024efc5948a4f3663ec84e45dae58aa31c","block_sha256":"d5cb8bd3a898da8216dfce8262ff28024efc5948a4f3663ec84e45dae58aa31c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_22f3db02-813a-4f73-b7b6-0a82a3571fd3"},{"id":"occ_1075760c9a730a30274f7be8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_2432f6e9-8cc4-45fc-beed-3747bfa86cf5","section_id":"sec_b34a90c1-1d4a-4cb9-baa0-c1b9deb78950","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"```\n従来のプリント基板\n\n絶縁板\n＋\n銅配線\n＋\n個別部品\n\n\nノイスの集積回路\n\nシリコン内部\n＝部品\n\n酸化膜上の金属\n＝配線\n```","quote_start":0,"quote_end":71,"text_sha256":"0440b2199beeffd0e3329854d27a77b8e61cde8ec367a749eef2845fbc2df47f","block_sha256":"0440b2199beeffd0e3329854d27a77b8e61cde8ec367a749eef2845fbc2df47f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_2432f6e9-8cc4-45fc-beed-3747bfa86cf5"},{"id":"occ_0696a1d6aaa56bce8bfe8b2b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_52e53d6c-73f5-47fd-9077-1d27247765be","section_id":"sec_8629f592-31cc-4cfc-a433-5d015076e157","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"プリント基板では、絶縁板の上へ銅配線を作り、その上へ個別部品を接続する。","quote_start":0,"quote_end":36,"text_sha256":"e6e994b66bec14b34c1e278d8d5decc7ae386748b0906c651379e9aed0209ff2","block_sha256":"e6e994b66bec14b34c1e278d8d5decc7ae386748b0906c651379e9aed0209ff2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_52e53d6c-73f5-47fd-9077-1d27247765be"},{"id":"occ_8135f22b88929d5157c97f4a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_6b7f5559-ed8b-4150-8929-ef45c326e463","section_id":"sec_588a9de9-c7c3-4f30-9263-9c3c8fcc266e","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":6,"end":8,"exact":"基板","quote":"```\n絶縁基板へ金属箔を貼る\n        ↓\n必要な配線を耐食膜で覆う\n        ↓\n不要な金属をエッチングする\n        ↓\n配線だけが残る\n```","quote_start":0,"quote_end":84,"text_sha256":"113ba96779eeb37115055b42370ddae92f128efcc469e71e17f057740ac9b5df","block_sha256":"113ba96779eeb37115055b42370ddae92f128efcc469e71e17f057740ac9b5df","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_6b7f5559-ed8b-4150-8929-ef45c326e463"},{"id":"occ_2b75872b87b30bf8b4b0311b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_84aaf05e-a2f8-457d-b609-9ccfe4ffcfaf","section_id":"sec_b34a90c1-1d4a-4cb9-baa0-c1b9deb78950","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"プリント基板では、板の上へ部品を載せ、金属配線でつないでいた。","quote_start":0,"quote_end":31,"text_sha256":"162034cdc225472a9708ef340f063fe13e0ba1bc662309bb7bfa154a585fc147","block_sha256":"162034cdc225472a9708ef340f063fe13e0ba1bc662309bb7bfa154a585fc147","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_84aaf05e-a2f8-457d-b609-9ccfe4ffcfaf"},{"id":"occ_ac5ee46ae18ce7f20e353aad","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_87a67d69-d0c3-4a9b-9f53-509ae8582946","section_id":"sec_f42a627d-dd4b-49eb-b5e2-d587e552e202","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"二人は1957年、セラミック基板上へ幅約200マイクロメートルの金属薄膜配線を形成し、個別トランジスタを接続する技術を特許化した。また、二酸化シリコン膜へ穴を開け、ダイオード配列を作ることにも写真製版を利用した。1958年には、プリ","quote_start":0,"quote_end":116,"text_sha256":"4ecb085d2010f16cc693306ee2d9c57fa77186726cd990346c37ede726385a91","block_sha256":"4ecb085d2010f16cc693306ee2d9c57fa77186726cd990346c37ede726385a91","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_87a67d69-d0c3-4a9b-9f53-509ae8582946"},{"id":"occ_2db38118c6a3f5a865148255","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_af3d0856-bde7-4989-ad6f-5737156c751c","section_id":"sec_ab430d0d-610a-489c-97a2-1a717423e0f6","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":13,"end":16,"exact":"PCB","quote":"## 11．ベル研究所――PCB用の写真製版をシリコンへ縮小した","quote_start":0,"quote_end":32,"text_sha256":"f9b904111d4c33db96189af578730062349491b9a2816da88855f96cb21f9dce","block_sha256":"f9b904111d4c33db96189af578730062349491b9a2816da88855f96cb21f9dce","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_af3d0856-bde7-4989-ad6f-5737156c751c"},{"id":"occ_9d5d173ed3efb033a25c64c1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_b181feae-257b-4a12-8437-16364a2caa72","section_id":"sec_8629f592-31cc-4cfc-a433-5d015076e157","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":137,"end":139,"exact":"基板","quote":"█\n   素子A         素子B\n──────────────────────\n       シリコン基板\n```","quote_start":82,"quote_end":143,"text_sha256":"83c7ed15339864d9e1087c9fa0750c41684ef1dcf1040b5eb9a7c17876c5604d","block_sha256":"83c7ed15339864d9e1087c9fa0750c41684ef1dcf1040b5eb9a7c17876c5604d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_b181feae-257b-4a12-8437-16364a2caa72"},{"id":"occ_0b698449f846de50fcf12683","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_b258d403-0f10-4793-97d1-d545ebf03e51","section_id":"sec_ab430d0d-610a-489c-97a2-1a717423e0f6","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"プリント基板では、銅箔を配線へ変えるために使った。","quote_start":0,"quote_end":25,"text_sha256":"23263ed43db62afe82933922c623037fac2d7d2babc02310f620cea3a01ef8f0","block_sha256":"23263ed43db62afe82933922c623037fac2d7d2babc02310f620cea3a01ef8f0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_b258d403-0f10-4793-97d1-d545ebf03e51"},{"id":"occ_d67c2c60d0b38560e1448892","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_b8a6af2c-b86f-4c64-a8c4-2ee1d30cefc8","section_id":"sec_8629f592-31cc-4cfc-a433-5d015076e157","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":15,"end":17,"exact":"基板","quote":"この意味で、金属蒸着はプリント基板の思想をシリコン表面へ移す技術でもあった。","quote_start":0,"quote_end":38,"text_sha256":"17ab356e831bebec3c76b6edf1262769d2a9ccb2b4c5d4ceda70907db8818dbe","block_sha256":"17ab356e831bebec3c76b6edf1262769d2a9ccb2b4c5d4ceda70907db8818dbe","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_b8a6af2c-b86f-4c64-a8c4-2ee1d30cefc8"},{"id":"occ_8ffd72325432093749abf5f2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_c16288fb-5876-4a28-8e8c-148d20cd99f9","section_id":"sec_588a9de9-c7c3-4f30-9263-9c3c8fcc266e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":8,"end":10,"exact":"基板","quote":"現代的なプリント基板へ直接つながる人物として知られるのが、オーストリア出身のポール・アイスラーである。","quote_start":0,"quote_end":51,"text_sha256":"6757606673a0fe6005ec6ef951711895816f953fabeb397e19f49941755269ed","block_sha256":"6757606673a0fe6005ec6ef951711895816f953fabeb397e19f49941755269ed","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_c16288fb-5876-4a28-8e8c-148d20cd99f9"},{"id":"occ_69a29fb42fe9e2274b4074d8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_c23e80f9-4b68-4bbf-9d15-f5fe7809f09d","section_id":"sec_e5bd9b1c-68a1-42b4-be23-093410c35b36","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"現代的な銅箔エッチング基板ではなかったが、平面状の導体、絶縁層、表裏や層間の接続といった考え方を含み、後のフレキシブル回路や多層基板を思わせる構造だった。([Google Patents](https://patents.go","quote_start":0,"quote_end":113,"text_sha256":"432adc42511971927158dd37e725ea1aff2e96d067f589af083e797cb4c444e4","block_sha256":"432adc42511971927158dd37e725ea1aff2e96d067f589af083e797cb4c444e4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_c23e80f9-4b68-4bbf-9d15-f5fe7809f09d"},{"id":"occ_a716719954ed7791f3f1f193","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_c7f72632-174c-4b8b-9dc4-0822a4123e55","section_id":"sec_b34a90c1-1d4a-4cb9-baa0-c1b9deb78950","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":19,"end":21,"exact":"基板","quote":"## 22．ノイスとラスト――プリント基板をシリコンの中へ入れた","quote_start":0,"quote_end":32,"text_sha256":"02ead074986986dda67071fa79b43de5070e6b849aa12139de2aeb6391dcb881","block_sha256":"02ead074986986dda67071fa79b43de5070e6b849aa12139de2aeb6391dcb881","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_c7f72632-174c-4b8b-9dc4-0822a4123e55"},{"id":"occ_e7e40635f118339e7aa4ce60","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_cabc263c-f703-409e-b1a9-d63703ead20b","section_id":"sec_98902e3f-d905-41a3-ab59-c8ed2e9c345e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":12,"end":14,"exact":"基板","quote":"## 写真製版、プリント基板、そしてフェアチャイルドを作った工程技術","quote_start":0,"quote_end":34,"text_sha256":"b08cc28cc3fe51671eb108b3a71dac36539f97059feb588a1f613d07ded1ad1e","block_sha256":"b08cc28cc3fe51671eb108b3a71dac36539f97059feb588a1f613d07ded1ad1e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_cabc263c-f703-409e-b1a9-d63703ead20b"},{"id":"occ_59a7f18535ca6a6242ba1103","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_d719cf69-a2c6-4879-add1-0983dfdbdfb1","section_id":"sec_c42755f0-8224-4ee8-9db9-f00c0d1a811e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"## プリント基板――回路を手配線から図形へ変える","quote_start":0,"quote_end":25,"text_sha256":"4842ef737b3678d931023474d51cffe8e96a2f237ee039df55acdd6f84a6fd2f","block_sha256":"4842ef737b3678d931023474d51cffe8e96a2f237ee039df55acdd6f84a6fd2f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_d719cf69-a2c6-4879-add1-0983dfdbdfb1"},{"id":"occ_966e78917ebe383a433006c8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_dc1dc07c-ee94-4912-8433-4a5603ebcf77","section_id":"sec_588a9de9-c7c3-4f30-9263-9c3c8fcc266e","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":2,"end":5,"exact":"PCB","quote":"後のPCBだけでなく、半導体の金属配線加工にも通じる考え方だった。","quote_start":0,"quote_end":33,"text_sha256":"27e960c4d69dad772f23abb9423c176a15b6dc350193d0ddbdee35b7ed126a5e","block_sha256":"27e960c4d69dad772f23abb9423c176a15b6dc350193d0ddbdee35b7ed126a5e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_dc1dc07c-ee94-4912-8433-4a5603ebcf77"},{"id":"occ_52b0f0bd9c50fdfbfb56fc25","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_e3097364-1b45-4ae3-a543-e4521692c126","section_id":"sec_9ba73ab9-575c-4d6f-a8b3-03bf9f3ae8f7","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":12,"end":14,"exact":"基板","quote":"しかし、ここにはプリント基板と同じ問いが生まれる。","quote_start":0,"quote_end":25,"text_sha256":"ea30d3e1494ddfbab2878fad1152bc974685716df9d4ac50cebef2ba2a602ac7","block_sha256":"ea30d3e1494ddfbab2878fad1152bc974685716df9d4ac50cebef2ba2a602ac7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_e3097364-1b45-4ae3-a543-e4521692c126"},{"id":"occ_913e90a6d06da14441622c53","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_e7f6b3dd-1397-4d1c-a368-42605fb4fb24","section_id":"sec_399db824-7dfd-42dc-aeb3-ae6d2fa87e20","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":24,"end":26,"exact":"基板","quote":"戦時中に開発された方式には、現在の銅箔エッチング基板だけでなく、セラミック板へ銀系導体を印刷する方法、導電塗料、金属溶射、真空蒸着、めっき、型押しなど、多数の方式が含まれていた。","quote_start":0,"quote_end":89,"text_sha256":"04c621d37eb66be8a29d86ac1c32f259735292210e790d7076a6288cae53b4e4","block_sha256":"04c621d37eb66be8a29d86ac1c32f259735292210e790d7076a6288cae53b4e4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_e7f6b3dd-1397-4d1c-a368-42605fb4fb24"},{"id":"occ_a3106fb531b4318e06fed5da","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6833af82-b753-4666-97ac-54dbe13aa888","work_id":"wrk_ccf13bdd-9e7c-4b49-8322-a41ecabe6fd1","block_id":"blk_fbf7bc8b-6dbb-4bc3-acf9-3b15e7863826","section_id":"sec_98902e3f-d905-41a3-ab59-c8ed2e9c345e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":34,"end":36,"exact":"基板","quote":"その理由を理解するには、半導体より前に成立していた写真製版とプリント基板の歴史まで戻らなければならない。","quote_start":0,"quote_end":52,"text_sha256":"060b62b9de85f38f28e4dbbead9ac33bc724ca557713adada26a8e010338a4d6","block_sha256":"060b62b9de85f38f28e4dbbead9ac33bc724ca557713adada26a8e010338a4d6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6833af82-b753-4666-97ac-54dbe13aa888/#blk_fbf7bc8b-6dbb-4bc3-acf9-3b15e7863826"},{"id":"occ_09c5242587324e98cc7ce8cd","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6e29e2ed-0ec1-4cab-83c2-87be4ab75459","work_id":"wrk_1f3708db-b3cc-4d98-a2fd-5c7829c99a3b","block_id":"blk_58f46d2b-c7e2-436a-be0a-00b74913a0fd","section_id":"sec_e6b34faa-1795-4179-8ad9-372da77349b7","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":113,"end":115,"exact":"基板","quote":"、シリコンスピン量子ビットが直面する深刻な均一性の問題が根本的に存在しない。さらに、イオンはノイズの多い固体の基板から物理的に隔離されているため、外部環境からの妨害を受けにくく、他のどの量子ビット技術よりも長いコヒーレンス時間と高い忠実度を本質的に達成しやすい 。","quote_start":58,"quote_end":190,"text_sha256":"b8c7b490cbf923c58f9b38e323757379c85a8cbe8695d26d2e2c20f4a735d4bd","block_sha256":"b8c7b490cbf923c58f9b38e323757379c85a8cbe8695d26d2e2c20f4a735d4bd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6e29e2ed-0ec1-4cab-83c2-87be4ab75459/#blk_58f46d2b-c7e2-436a-be0a-00b74913a0fd"},{"id":"occ_8cd6f7330700f260d29a8d10","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_6f7e9f1a-6c8f-457d-8fdf-eb9746d573f8","work_id":"wrk_47518fd9-227b-40aa-9d34-6134336449b9","block_id":"blk_f3bef160-2668-4ff1-8234-f067791ea9ce","section_id":"sec_e81cda4c-d771-4030-94f0-ccb944e3ec25","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":35,"end":37,"exact":"基板","quote":"EMFASYSでは、ACF-S、CXLメモリコントローラー、DDR5、基板、シャーシ、電源、制御ソフトウェアをまとめて提供する。","quote_start":0,"quote_end":64,"text_sha256":"895ce0a54600914cc69bb0c411ae4b72d142d11ef58be4ae4f6c494947f5f3b3","block_sha256":"895ce0a54600914cc69bb0c411ae4b72d142d11ef58be4ae4f6c494947f5f3b3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_6f7e9f1a-6c8f-457d-8fdf-eb9746d573f8/#blk_f3bef160-2668-4ff1-8234-f067791ea9ce"},{"id":"occ_8535b2f6244c197cb098cc85","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_70df7bb7-127f-4402-9374-f897f873bafb","work_id":"wrk_bd032fe1-66fd-4ecd-a7db-e046051c8671","block_id":"blk_22c718e7-afa1-4717-ba3b-b2e773517c1c","section_id":"sec_117d741b-0885-4624-baa4-748ed14b6374","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":55,"end":57,"exact":"基板","quote":"DIGITIMESは、BOEがAIパッケージング向けに**Micro LED光インターコネクト**と**ガラス基板CPO**を狙っていると報じた。BOEはディスプレイ、ガラス加工の技術蓄積を、AI向け光接続と先端パッケージ領域へ転用しようとしている。([DIGITIMES][5])","quote_start":0,"quote_end":141,"text_sha256":"c4ce6303e200b2579b14b842ddff1061f1505efa13390c1499d63709afd78df5","block_sha256":"c4ce6303e200b2579b14b842ddff1061f1505efa13390c1499d63709afd78df5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_70df7bb7-127f-4402-9374-f897f873bafb/#blk_22c718e7-afa1-4717-ba3b-b2e773517c1c"},{"id":"occ_664444aa7e846df72f82057b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_70df7bb7-127f-4402-9374-f897f873bafb","work_id":"wrk_bd032fe1-66fd-4ecd-a7db-e046051c8671","block_id":"blk_7713927a-81c1-498b-ac9d-19cdf784d1cd","section_id":"sec_d6b15d59-5cad-46cc-a637-157cfad33726","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":161,"end":163,"exact":"基板","quote":"t向けに大型DRAM供給契約を獲得したと報じられた。さらにBOEはMicro LED光インターコネクトとガラス基板CPOへ、MiTACは台湾、ベトナム、カリフォルニアへ、英国Kentでは300MW級AIデータセンター計画へ、CXLメモリープーリングはGPUサーバーのメモリウォール対策へ向かっている。","quote_start":106,"quote_end":256,"text_sha256":"23a3576112abd346ae2ec048261a87630d0679c30463a44120f4c62b871d35e8","block_sha256":"23a3576112abd346ae2ec048261a87630d0679c30463a44120f4c62b871d35e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_70df7bb7-127f-4402-9374-f897f873bafb/#blk_7713927a-81c1-498b-ac9d-19cdf784d1cd"},{"id":"occ_d9320ad349c79486be333fad","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_70df7bb7-127f-4402-9374-f897f873bafb","work_id":"wrk_bd032fe1-66fd-4ecd-a7db-e046051c8671","block_id":"blk_8ba06468-5c39-488d-85b5-44835dd6d77a","section_id":"sec_69efedd6-9f39-4003-9f3b-abc26aa274ff","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":184,"end":186,"exact":"基板","quote":"るか。\n4. CXMTのDDR5歩留まりとTencent向け供給能力に追加情報が出るか。\n5. BOEのガラス基板CPOが実際のAIパッケージ顧客を獲得するか。\n6. AIサーバーODMの米国、東南アジア移転が加速するか。\n7. 300MW級データセンター案件で電力接続、許認可の遅延が出るか。","quote_start":129,"quote_end":276,"text_sha256":"92deb95be3cd59375911d845474cdb2e93981a210c8061e77e5c7bf54c6c828a","block_sha256":"92deb95be3cd59375911d845474cdb2e93981a210c8061e77e5c7bf54c6c828a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_70df7bb7-127f-4402-9374-f897f873bafb/#blk_8ba06468-5c39-488d-85b5-44835dd6d77a"},{"id":"occ_9d0c1b9fb8b1ba1098c04a5e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_70df7bb7-127f-4402-9374-f897f873bafb","work_id":"wrk_bd032fe1-66fd-4ecd-a7db-e046051c8671","block_id":"blk_a558a5e7-303d-4cf8-b5e7-3961a5505ca1","section_id":"sec_117d741b-0885-4624-baa4-748ed14b6374","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":65,"end":67,"exact":"基板","quote":"GPU間、ラック間、データセンター内の通信電力が大きなボトルネックになっている。CPO、LPO、NPO、ガラス基板、外部光源、Micro LED光源などは、帯域を増やしながら電力を下げるための次の競争軸である。","quote_start":10,"quote_end":115,"text_sha256":"a9b10eb810049698e0132017fc89e15bb7d50baea9ce1fa5fa3e17c936d09770","block_sha256":"a9b10eb810049698e0132017fc89e15bb7d50baea9ce1fa5fa3e17c936d09770","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_70df7bb7-127f-4402-9374-f897f873bafb/#blk_a558a5e7-303d-4cf8-b5e7-3961a5505ca1"},{"id":"occ_2ebac69c0d1b760df31938be","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_70df7bb7-127f-4402-9374-f897f873bafb","work_id":"wrk_bd032fe1-66fd-4ecd-a7db-e046051c8671","block_id":"blk_f5ff19d7-e28e-4483-b21b-efb2ffc0889a","section_id":"sec_117d741b-0885-4624-baa4-748ed14b6374","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":51,"end":53,"exact":"基板","quote":"BOEの動きは、AIインフラが既存の半導体企業だけで完結しないことを示す。ディスプレイ、ガラス、光源、基板、接合、パッケージングの企業が、AIデータセンターの部材供給網へ入ろうとしている。量産時期、歩留まり、実顧客、NVIDIA、Broadcom、Marvell系エコシステムへの採用有無はまだ確認が必要だ","quote_start":0,"quote_end":153,"text_sha256":"1708299c95d891af9df10fde1aef7917b12e511f9c83d1dab62d38a203f2fd47","block_sha256":"1708299c95d891af9df10fde1aef7917b12e511f9c83d1dab62d38a203f2fd47","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_70df7bb7-127f-4402-9374-f897f873bafb/#blk_f5ff19d7-e28e-4483-b21b-efb2ffc0889a"},{"id":"occ_06adaf738568c73a7cd1f0ec","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_78657238-b40f-4a7c-b670-325df3688f39","work_id":"wrk_70fbeeef-5587-4e6a-a017-b7e323d0b279","block_id":"blk_549d73c3-a095-47b9-841d-422a21706688","section_id":"sec_73c03144-c3da-4ce8-b8f7-ae5b3dc45650","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":51,"end":53,"exact":"基板","quote":"AIサーバーの価格が上がる理由は、GPUダイだけではない。HBM、CoWoSや2.5Dパッケージング、基板、電源、冷却、ネットワーク部品が全て高付加価値化している。その中でもHBMは、供給制約と高単価が重なり、AIハードウェアの価格形成に大きく影響する。","quote_start":0,"quote_end":127,"text_sha256":"01880fbdf032853893a0f5025d3974c67bac5d245b4c53705bf04e2b033a241c","block_sha256":"01880fbdf032853893a0f5025d3974c67bac5d245b4c53705bf04e2b033a241c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_78657238-b40f-4a7c-b670-325df3688f39/#blk_549d73c3-a095-47b9-841d-422a21706688"},{"id":"occ_7c1def98fcc515e416b4530a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_78657238-b40f-4a7c-b670-325df3688f39","work_id":"wrk_70fbeeef-5587-4e6a-a017-b7e323d0b279","block_id":"blk_a6b407ad-d904-427e-8878-2a7ac52f3980","section_id":"sec_aff7d6ba-3890-4ea0-b8bf-0e3c832583e3","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":18,"end":20,"exact":"基板","quote":"HBM、パッケージング、冷却、電源、基板、光通信、ラック設計まで含めた総合インフラが、AIの性能を決める。","quote_start":0,"quote_end":53,"text_sha256":"7143d6f2a37f360b64ac6cd879119b90c1a80a195bc13237961146ddf8319684","block_sha256":"7143d6f2a37f360b64ac6cd879119b90c1a80a195bc13237961146ddf8319684","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_78657238-b40f-4a7c-b670-325df3688f39/#blk_a6b407ad-d904-427e-8878-2a7ac52f3980"},{"id":"occ_f9e1d59a12dff6045be33776","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_78657238-b40f-4a7c-b670-325df3688f39","work_id":"wrk_70fbeeef-5587-4e6a-a017-b7e323d0b279","block_id":"blk_cf4cd2e6-4c5b-414a-8195-f2904b6e2f67","section_id":"sec_791a5e3c-6f37-4cad-9675-3dca0307a4d8","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":154,"end":156,"exact":"基板","quote":"やGPU側最適化が重くなる |\n| 先端パッケージング | CoWoS、2.5D、SiP、インターポーザ、先端基板に依存する |\n| 冷却構造 | HBM5ではiHBM/ICEやHPBのような内蔵冷却が製造難度を上げる |\n| 顧客認証 | GPU/XPU側ロードマップと歩調を合わせる必要がある |","quote_start":99,"quote_end":249,"text_sha256":"a4cc70cf9dbfd93d9d0597eb0d43fc79676e949317bab13fc528668ab968cb19","block_sha256":"a4cc70cf9dbfd93d9d0597eb0d43fc79676e949317bab13fc528668ab968cb19","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_78657238-b40f-4a7c-b670-325df3688f39/#blk_cf4cd2e6-4c5b-414a-8195-f2904b6e2f67"},{"id":"occ_8603b28e6c8daf2f547f8653","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_0e5eea0b-fb7f-4845-9cf0-fd3cbda43380","section_id":"sec_82a3adcb-7423-4c77-a34b-39ce8699a149","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":246,"end":248,"exact":"基板","quote":"    EMIB Bridge\n────────────────────────\n       有機パッケージ基板\n```","quote_start":191,"quote_end":252,"text_sha256":"7cae856ef0573aa5cc602fe26975a6bdb8cf4ef15f7018bcc133ca155f344a49","block_sha256":"7cae856ef0573aa5cc602fe26975a6bdb8cf4ef15f7018bcc133ca155f344a49","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_0e5eea0b-fb7f-4845-9cf0-fd3cbda43380"},{"id":"occ_08b118200f74e0949a09843e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_460c6371-e729-49bf-bf45-480cf89325a0","section_id":"sec_4562cdc6-b457-45bb-be13-70dc378a8268","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"EMIBは有機基板へ埋め込んだ局所シリコンブリッジであり、CoWoS-Sは大型シリコンインターポーザーを使用する。CoWoS-LはRDLと局所シリコン接続を組み合わせるため、構造的にはEMIB的な思想にも近づいている。","quote_start":0,"quote_end":109,"text_sha256":"eda83b822187eb6398e82e07acafbca1c8f712595179b16e85b907362d1d96fd","block_sha256":"eda83b822187eb6398e82e07acafbca1c8f712595179b16e85b907362d1d96fd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_460c6371-e729-49bf-bf45-480cf89325a0"},{"id":"occ_93ebc4e88791dbd16f639920","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_70a34338-109f-4b96-b221-122752a27696","section_id":"sec_485b06a6-a1de-4a79-a1a2-e8aeaefb3a0b","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":112,"end":114,"exact":"基板","quote":"    │\nActive Base Die\n NoC・Cache・I/O・制御\n        │\nパッケージ基板\n```","quote_start":57,"quote_end":118,"text_sha256":"56f6aba5dd2d1e73af1873c66a0ea83c73b605d444ceb4c6bdfa074bbe358b0f","block_sha256":"56f6aba5dd2d1e73af1873c66a0ea83c73b605d444ceb4c6bdfa074bbe358b0f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_70a34338-109f-4b96-b221-122752a27696"},{"id":"occ_85dbfe5bb003ea923db55374","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_8176a0c7-ecff-40c4-950d-3f75be25712d","section_id":"sec_dbcfc5eb-39d9-449b-b07d-3e3d338b37d7","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":98,"end":100,"exact":"基板","quote":"       │\nHybrid Bonding\n       │\nCPU CCD\n       │\nパッケージ基板\n```","quote_start":43,"quote_end":104,"text_sha256":"07d24bee42b3b17e436d8ddcc1800df4c170e1ed3151ad90d7be885caffeb5d6","block_sha256":"07d24bee42b3b17e436d8ddcc1800df4c170e1ed3151ad90d7be885caffeb5d6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_8176a0c7-ecff-40c4-950d-3f75be25712d"},{"id":"occ_ffdc1dd77689bc93b4daddb4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_fb5a754b-378c-4837-b51b-4d601ab85811","section_id":"sec_0312c350-16b9-4d2a-984f-e29c9ad3b51a","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":209,"end":211,"exact":"基板","quote":"oser／RDL\n──────────────────────────────\n        有機パッケージ基板\n```","quote_start":154,"quote_end":215,"text_sha256":"a48fc86562e49c28366c106e5107d3fa274b4ba8d4a6a17e185dc94cb76395a4","block_sha256":"a48fc86562e49c28366c106e5107d3fa274b4ba8d4a6a17e185dc94cb76395a4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_fb5a754b-378c-4837-b51b-4d601ab85811"},{"id":"occ_a82a17941adc542f752ce8b3","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_ff212724-784e-4d2f-88de-a24786e0660f","section_id":"sec_f7d1119b-c08d-4c9a-856e-dd7d191c2d1d","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":89,"end":91,"exact":"基板","quote":"nding\n非常に細かい・短い\n\nマイクロバンプ\n数十µm級\n\n2.5Dインターポーザー\nmm級横配線\n\n有機基板\nさらに長い\n```","quote_start":34,"quote_end":101,"text_sha256":"145813b29edba96be0ae44f5cdaaa5022de61bb8a6205ca3b5af79599c7656d0","block_sha256":"145813b29edba96be0ae44f5cdaaa5022de61bb8a6205ca3b5af79599c7656d0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_ff212724-784e-4d2f-88de-a24786e0660f"},{"id":"occ_ec0bb63554f601726ef9e9a5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_7e52a252-3f2f-4e13-882c-c5b500b829e6","work_id":"wrk_48ec01f3-e772-499c-9405-af64580c1ccc","block_id":"blk_35597a50-9dda-44bd-ba46-e91ab8b68b33","section_id":"sec_76be5d35-37e4-4c80-aa1e-1ca2ee4009e8","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":130,"end":132,"exact":"基板","quote":"━━━━━━━━━━━━━\n       ゲルマニウム\n━━━━━━━━━━━━━━\n          金属基板\n```","quote_start":75,"quote_end":136,"text_sha256":"ffda277a2d864f915ca6f3d06c84528e20f3c34a394225e63e2dcabe4133f1e8","block_sha256":"ffda277a2d864f915ca6f3d06c84528e20f3c34a394225e63e2dcabe4133f1e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_7e52a252-3f2f-4e13-882c-c5b500b829e6/#blk_35597a50-9dda-44bd-ba46-e91ab8b68b33"},{"id":"occ_022f9c53e580038af01a3bdb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_82a7a6e0-7b98-4dbd-a2cb-f619eb332b23","work_id":"wrk_6b7cc31b-0ccb-4aeb-819d-546d9591fbdf","block_id":"blk_03284afd-4939-4a47-9e77-26e349722d5d","section_id":"sec_f286dca0-1795-4265-904a-a9e18b782472","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":57,"end":60,"exact":"PCB","quote":"Iサーバー需要で次に不足しやすい部材は何だと思いますか？  \nGPUやHBMだけでなく、MLCC、インダクタ、PCB、電源部材、光通信部材にも波及していく可能性があります。」","quote_start":2,"quote_end":89,"text_sha256":"a10fb2c72f8810c9c3861b831ffa5bc9d0fd49325eeccb553995d0356c414cf1","block_sha256":"a10fb2c72f8810c9c3861b831ffa5bc9d0fd49325eeccb553995d0356c414cf1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_82a7a6e0-7b98-4dbd-a2cb-f619eb332b23/#blk_03284afd-4939-4a47-9e77-26e349722d5d"},{"id":"occ_628b59cebd5c2de661f1d9e8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_82a7a6e0-7b98-4dbd-a2cb-f619eb332b23","work_id":"wrk_6b7cc31b-0ccb-4aeb-819d-546d9591fbdf","block_id":"blk_244c85d0-ae60-420e-a0ec-62c6726b0b30","section_id":"sec_2c058b6f-1ea6-4b10-9819-9156534b30f2","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":40,"end":43,"exact":"PCB","quote":"一方で、専門性の高い投稿、たとえばAIデータセンター、半導体、MLCC、HBM、PCB、電源部材、投資仮説のような投稿は、全体ランキングでは見えにくくても、特定の興味クラスタのFor Youでは強く出ることがあります。","quote_start":0,"quote_end":109,"text_sha256":"ebc622cde7fa98d5a7ca6532111690910a322daeb3d8db4c97e2e7b5b027ccc1","block_sha256":"ebc622cde7fa98d5a7ca6532111690910a322daeb3d8db4c97e2e7b5b027ccc1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_82a7a6e0-7b98-4dbd-a2cb-f619eb332b23/#blk_244c85d0-ae60-420e-a0ec-62c6726b0b30"},{"id":"occ_881c71384f1f1935809a2957","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_82a7a6e0-7b98-4dbd-a2cb-f619eb332b23","work_id":"wrk_6b7cc31b-0ccb-4aeb-819d-546d9591fbdf","block_id":"blk_3d74e661-389a-4565-929b-cc208dca128b","section_id":"sec_a691c074-b92e-4c3a-ac0b-1ef7004eecb8","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":13,"end":16,"exact":"PCB","quote":"MLCC離型膜やHBM4やPCB材料の投稿は、刺さる人には深く刺さりますが、母集団は限られます。","quote_start":0,"quote_end":48,"text_sha256":"07f2d238dbd253de6e8ebda30c8a39c0b84e856eec1019232057a445f0a40e99","block_sha256":"07f2d238dbd253de6e8ebda30c8a39c0b84e856eec1019232057a445f0a40e99","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_82a7a6e0-7b98-4dbd-a2cb-f619eb332b23/#blk_3d74e661-389a-4565-929b-cc208dca128b"},{"id":"occ_e7a0358d3f8e28c367875745","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_82a7a6e0-7b98-4dbd-a2cb-f619eb332b23","work_id":"wrk_6b7cc31b-0ccb-4aeb-819d-546d9591fbdf","block_id":"blk_b1428345-6cac-4fdd-8e4a-49b71743f3bf","section_id":"sec_40cdf521-338f-4dc5-a3bb-23c38b1e698e","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":19,"end":22,"exact":"PCB","quote":"AIデータセンター、MLCC、HBM、PCB、電源部材の投稿に継続的にいいねしているユーザーは、その分野に近い興味ベクトルを持つようになります。","quote_start":0,"quote_end":72,"text_sha256":"2dfc16c0776670d589c5b2a5d302c3d88e62ee1cdfb17c6aa06067452c3d56b7","block_sha256":"2dfc16c0776670d589c5b2a5d302c3d88e62ee1cdfb17c6aa06067452c3d56b7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_82a7a6e0-7b98-4dbd-a2cb-f619eb332b23/#blk_b1428345-6cac-4fdd-8e4a-49b71743f3bf"},{"id":"occ_eb6324faff3bac10bc0402de","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_84a77d25-ab82-4d74-abb1-c248dd75257f","work_id":"wrk_81581cb4-a4e2-4f51-afae-e8f5e3c41099","block_id":"blk_07408c26-5b27-4228-87ea-76219ac15bf1","section_id":"sec_ea9657ad-cb82-4263-94b2-059953e1c522","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":21,"end":23,"exact":"基板","quote":"この年に確認されるのは、HBM、ガラスコア基板、光インターコネクト、液冷、電力、データセンターの建設進捗だけではない。  \nもっと大きいのは、アメリカという国家が、AIインフラをどこまで背負い続けられるのかという政治的な確認である。","quote_start":0,"quote_end":116,"text_sha256":"3e790300a4204ccdfb820986b5de9e32a1ab5304beb4ea40ff2970fce3b39680","block_sha256":"3e790300a4204ccdfb820986b5de9e32a1ab5304beb4ea40ff2970fce3b39680","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_84a77d25-ab82-4d74-abb1-c248dd75257f/#blk_07408c26-5b27-4228-87ea-76219ac15bf1"},{"id":"occ_5b7ce4269473fbbb63b72e18","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_84a77d25-ab82-4d74-abb1-c248dd75257f","work_id":"wrk_81581cb4-a4e2-4f51-afae-e8f5e3c41099","block_id":"blk_42178da7-6a49-4b61-b408-24c375ea5580","section_id":"sec_c1c7e718-e13c-4d41-ae24-abb76abb9cab","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":59,"end":61,"exact":"基板","quote":"フラ相場は、技術的にはまだ強い。  \nHBM需要は続く。  \n光インターコネクトは本格化する。  \nガラスコア基板も最上位パッケージから採用確認に入る。  \n電力設備も不足する。","quote_start":4,"quote_end":93,"text_sha256":"643f63dff672057a6433e9056994896af59b7979752f05a00e70ef0f7642feec","block_sha256":"643f63dff672057a6433e9056994896af59b7979752f05a00e70ef0f7642feec","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_84a77d25-ab82-4d74-abb1-c248dd75257f/#blk_42178da7-6a49-4b61-b408-24c375ea5580"},{"id":"occ_e2841620cdc36e1901354942","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_84a77d25-ab82-4d74-abb1-c248dd75257f","work_id":"wrk_81581cb4-a4e2-4f51-afae-e8f5e3c41099","block_id":"blk_ab7053a8-f9f0-4a6a-be6a-4094512fdbd3","section_id":"sec_3a631e65-5ddb-4349-b603-baaccefc3eb7","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":9,"end":11,"exact":"基板","quote":"第三に、ガラスコア基板が夢から実装へ移るか。  \n最上位AIパッケージで実採用されるのか、量産歩留まりとコストが追いつくのか。","quote_start":0,"quote_end":63,"text_sha256":"152535ed73e5b71ed304b7c967868c935a6573361b3a05e8a63d3ce57301d958","block_sha256":"152535ed73e5b71ed304b7c967868c935a6573361b3a05e8a63d3ce57301d958","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_84a77d25-ab82-4d74-abb1-c248dd75257f/#blk_ab7053a8-f9f0-4a6a-be6a-4094512fdbd3"},{"id":"occ_cace02f61bd9505feb976ac0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_84a77d25-ab82-4d74-abb1-c248dd75257f","work_id":"wrk_81581cb4-a4e2-4f51-afae-e8f5e3c41099","block_id":"blk_f78a0746-fbe1-426b-8fdd-95c09a841ff8","section_id":"sec_9338da99-09b3-4034-bd64-08c21dda6883","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":30,"end":32,"exact":"基板","quote":"メモリーは足りるのか。  \n光は量産されるのか。  \nガラス基板は実装されるのか。  \n電力は確保できるのか。  \nデータセンターは地域に受け入れられるのか。  \n中間選挙後の議会はAIを支援するのか、監視するのか。  \n2028年候補はAIを成長産業として語るの","quote_start":0,"quote_end":132,"text_sha256":"2936fcfe2c4a58fa99bcd562e216c5730cf18d569c202bfcdb24522681107eff","block_sha256":"2936fcfe2c4a58fa99bcd562e216c5730cf18d569c202bfcdb24522681107eff","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_84a77d25-ab82-4d74-abb1-c248dd75257f/#blk_f78a0746-fbe1-426b-8fdd-95c09a841ff8"},{"id":"occ_276e074b3c98908fb6e08bf1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_007e999e-6e31-470f-878c-3b3d4d687d1f","section_id":"sec_66321005-4f49-4d05-9c60-7d5d7ff62ad6","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":21,"end":23,"exact":"基板","quote":"```\nDie A\n  ↓\n有機パッケージ基板\n＝＝＝＝＝＝＝＝＝＝＝＝＝＝\n  ↓\nDie B\n```","quote_start":0,"quote_end":52,"text_sha256":"274cd5c0476e7eb26fc2503d5f0a807b6062fb32541e5d9204b641087f5fff2f","block_sha256":"274cd5c0476e7eb26fc2503d5f0a807b6062fb32541e5d9204b641087f5fff2f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_007e999e-6e31-470f-878c-3b3d4d687d1f"},{"id":"occ_ed9943482226a003fe768508","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_1572f1af-fa26-4a07-93ec-b1509d59cb28","section_id":"sec_6f674bd5-4e39-4b60-8631-265a4ff7bcab","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":35,"end":37,"exact":"基板","quote":"- 接続端子数を減らせる\n- ダイ辺長を節約できる\n- 比較的粗い有機基板でも配線しやすい","quote_start":0,"quote_end":45,"text_sha256":"c36f5564f739684e8df45d4b7b6bbe1269fe6443d5db04583ff97aa139df4b20","block_sha256":"c36f5564f739684e8df45d4b7b6bbe1269fe6443d5db04583ff97aa139df4b20","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_1572f1af-fa26-4a07-93ec-b1509d59cb28"},{"id":"occ_f08804aec8b9d74d777052d8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_1a9c88fc-0481-42f5-b940-f49335ffdc77","section_id":"sec_923059a5-b8cc-49e2-adc5-bb6453ec300f","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":32,"end":34,"exact":"基板","quote":"```\n外部接続\n\n少数の高速SerDes\n        ↓\n基板・コネクタ・ケーブル\n\n\nパッケージ内接続\n\n多数の短距離レーン\n        ↓\nインターポーザー・ブリッジ\n```","quote_start":0,"quote_end":94,"text_sha256":"8f75e24a06ca036a772b545b9f43c8ae3f6bf54c7f9ce00c4a1d5d435bb882a6","block_sha256":"8f75e24a06ca036a772b545b9f43c8ae3f6bf54c7f9ce00c4a1d5d435bb882a6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_1a9c88fc-0481-42f5-b940-f49335ffdc77"},{"id":"occ_3c70cc5056f28316cb8dbd45","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_417e60bc-28d4-4fbd-9713-089c189188de","section_id":"sec_b186666c-414b-424e-b018-e157bfb8baff","layer":"code","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":95,"end":97,"exact":"基板","quote":" 距離 | サブmm～数十mm程度 | 数cm～数m以上 |\n| 経路 | バンプ、RDL、インターポーザー、基板 | パッケージ、PCB、コネクタ、ケーブル |\n| レーン数 | 多くしやすい | 端子制約で少なめ |\n| 1レーンの速度 | 中速～高速 | 非常に高速 |\n| 信号振幅 | 小さくしやすい |","quote_start":40,"quote_end":197,"text_sha256":"573f7fa080291b161ee119c1371796c95271e26c78d31f77e2568dab69d1c025","block_sha256":"573f7fa080291b161ee119c1371796c95271e26c78d31f77e2568dab69d1c025","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_417e60bc-28d4-4fbd-9713-089c189188de"},{"id":"occ_ff774558b7b52627433174ff","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_43c19c3f-d87a-4937-a7be-3f912178ccd2","section_id":"sec_fb6fbf44-18ee-4fc6-99d8-2680820807be","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":0,"end":3,"exact":"PCB","quote":"PCB、コネクタ、ケーブルを通るため、信号は大きく減衰する。","quote_start":0,"quote_end":30,"text_sha256":"7cd5614de8c9f45c4060fe927c483c17c4eacc7a19f9fdfc23e13b2c96415ad5","block_sha256":"7cd5614de8c9f45c4060fe927c483c17c4eacc7a19f9fdfc23e13b2c96415ad5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_43c19c3f-d87a-4937-a7be-3f912178ccd2"},{"id":"occ_ab7b5210f45f8f0a9cac7eac","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_5fa0e45e-6252-4f19-b94a-88a4515a8886","section_id":"sec_c7857852-2100-4428-8484-1baffa5d5154","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":23,"end":25,"exact":"基板","quote":"PHY側にレーンがあっても、インターポーザーや基板へ配線できなければ使えない。","quote_start":0,"quote_end":39,"text_sha256":"f1f404ac494f6581fc268e79d7b00603ac9339582032e1e99f44ef8256336e03","block_sha256":"f1f404ac494f6581fc268e79d7b00603ac9339582032e1e99f44ef8256336e03","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_5fa0e45e-6252-4f19-b94a-88a4515a8886"},{"id":"occ_051fe8d7be728073a4c2c410","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_98087183-b40a-467a-93bb-401d31f7161d","section_id":"sec_a9a4d05e-4b22-48d8-b433-6643c76c7998","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":15,"end":17,"exact":"基板","quote":"UCIeの初期実装例では、有機基板を使うStandard Packageについて最大約25mm、0.5～1pJ/bit、インターポーザーやブリッジを使うAdvanced 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| 120kW級ラックで従来DCとは別物になる    |\n|   6 | **光通信・スイッチ・PCB**  | 2026〜2029 | 800G/1.6T世代でリードタイム悪化     |\n|   7 | **運用人材・評価基盤**     | 常時        | 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     | S   | 上流と光源の双方を保有        |\n| 日本 | 三菱電機         |   6503 | 200G EML、PIN-PD       | A   | 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強力なSerDes・FFE・DFE\n          ↓\n PCB・コネクター\n          ↓\n┌──── LPOモジュール ────┐\n│ 線形ドライバー          │\n│ 線形TIA                 │\n│ レーザー・変調器   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↓\n非中国メーカーがInP基板を必要とする\n        ↓\nそのInP基板が中国から出てこない","quote_start":6,"quote_end":97,"text_sha256":"a41f255fd88f8b08163f55a7700addf4a4d5cc89b5638faca97d4896e8240140","block_sha256":"a41f255fd88f8b08163f55a7700addf4a4d5cc89b5638faca97d4896e8240140","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_5373b0dd-5e32-48a4-b3d9-3a36cd211eed"},{"id":"occ_9c06c62d28145fd644c29b33","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_5c018dc1-439e-4aff-b6b0-5e2abe9c7518","section_id":"sec_876a18a3-d2ad-4828-a3a0-175d6bd7e96e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":25,"end":27,"exact":"基板","quote":"そのためレアアース鉱山の代替よりも、認証済みInP基板能力の代替には時間がかかる可能性があります。","quote_start":0,"quote_end":49,"text_sha256":"46783cf39cc73e8060aae2bba90520b5a40c7cacc154ccfb9f9c793d6eda7dc9","block_sha256":"46783cf39cc73e8060aae2bba90520b5a40c7cacc154ccfb9f9c793d6eda7dc9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_5c018dc1-439e-4aff-b6b0-5e2abe9c7518"},{"id":"occ_fef6a6440363e12f1e66e2ef","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_5c869542-a1c0-4df6-a0c5-48e88abe6488","section_id":"sec_7aac2f9e-33aa-4d78-9091-0b0fc8ae4ded","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":25,"end":27,"exact":"基板","quote":"このため、インジウム金属の輸出を抑えながら、InP基板の輸出許可を個別に管理する政策は十分に考えられます。","quote_start":0,"quote_end":53,"text_sha256":"1aaee0f90bf4b9639f769ccdadc92c1b783741cffef5b6c8c568cd2b681a4443","block_sha256":"1aaee0f90bf4b9639f769ccdadc92c1b783741cffef5b6c8c568cd2b681a4443","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_5c869542-a1c0-4df6-a0c5-48e88abe6488"},{"id":"occ_a7844154498ca3502fdbcee2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_5e2e68df-768b-4922-ba1b-5a48c9b35317","section_id":"sec_f2c8b48a-205c-4721-8364-b6ae4cfc7159","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":21,"end":23,"exact":"基板","quote":"米国上場企業でありながら、すべてのウェハー基板を中国で製造し、中国政府の許可を得なければ海外顧客へ販売できません。","quote_start":0,"quote_end":57,"text_sha256":"e1716aaf6501129c8146223fbdddf66e6d5384822cc7c3edfbc328a54002a95d","block_sha256":"e1716aaf6501129c8146223fbdddf66e6d5384822cc7c3edfbc328a54002a95d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_5e2e68df-768b-4922-ba1b-5a48c9b35317"},{"id":"occ_eafa4bec098548aaaab323ef","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_6aead381-55ed-4feb-a0ae-0f4019f4a3ba","section_id":"sec_5aa5e0c7-c912-47fa-9bea-650290702ab4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":10,"end":12,"exact":"基板","quote":"この段階では、特定の基板会社へシェアが移るだけでなく、世界のInP供給量全体が減少します。","quote_start":0,"quote_end":45,"text_sha256":"2e25747db8fa59aeefac54fed7bfecebeb21270d8406415fa4843c1066c39894","block_sha256":"2e25747db8fa59aeefac54fed7bfecebeb21270d8406415fa4843c1066c39894","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_6aead381-55ed-4feb-a0ae-0f4019f4a3ba"},{"id":"occ_19b30dc257063dc7f76d243c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_7074aca3-5478-4450-b68f-834b77ba909f","section_id":"sec_360cdc14-8aaa-46c5-a1c3-30df861d71e5","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"これまで見てきたInP基板は、鉱山からそのまま採掘される材料ではありません。","quote_start":0,"quote_end":38,"text_sha256":"3207396520401dafde8e2cc13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  ↓\nエピ条件の再調整\n   ↓\nレーザー試作\n   ↓\n性能・波長評価\n   ↓\n寿命試験\n   ↓\n顧客認証","quote_start":0,"quote_end":63,"text_sha256":"27632845fc194d05d7ed5b8043865d391c51cdfb90a236e16fff3f54ee3eb9c0","block_sha256":"27632845fc194d05d7ed5b8043865d391c51cdfb90a236e16fff3f54ee3eb9c0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_811b4b81-2343-4128-8bf6-b86ac9947a63"},{"id":"occ_02d6c6b2bbbc7bf9bdf6b991","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_8224ff4d-6353-4125-916c-2cfd37895dac","section_id":"sec_f5f5f6d8-4e22-458a-a4ef-d15e2f19831f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"スイッチ基板","quote_start":0,"quote_end":6,"text_sha256":"709ab8cec3239845ddc425ea64098b3238706f3e4ac4b1dca2bb463def3e8ec9","block_sha256":"709ab8cec3239845ddc425ea64098b3238706f3e4ac4b1dca2bb463def3e8ec9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_8224ff4d-6353-4125-916c-2cfd37895dac"},{"id":"occ_1b206224bbe5d2bc90a4dcdf","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_83aecd71-7b44-4984-9ecd-e7b43b019833","section_id":"sec_f1741c75-e5b5-4643-a6ce-b6c6b9faacbb","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"AXTと住友電工で世界InP基板の約80％、JX金属が約10％を占めます。JX金属は2026年、今後4年間で最大1,200億円のInP能力増強方針を公表しました。AIXTRONはLumentumからInP向けG10-AsP装置を複数","quote_start":0,"quote_end":116,"text_sha256":"1c594a00fc670c08e4709608e62dc7e077eda53cc178ee15e3f62727f90a3cd6","block_sha256":"1c594a00fc670c08e4709608e62dc7e077eda53cc178ee15e3f62727f90a3cd6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_83aecd71-7b44-4984-9ecd-e7b43b019833"},{"id":"occ_c59731ac5e2de5748f41e626","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_840de03d-512b-4775-beee-6b03b4b240d0","section_id":"sec_f2c8b48a-205c-4721-8364-b6ae4cfc7159","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":3,"end":5,"exact":"基板","quote":"InP基板","quote_start":0,"quote_end":5,"text_sha256":"d202315c35ebdfe2887d1eb7b7ac6b55fd408d97c2066ea1aa78b9bdb4f85553","block_sha256":"d202315c35ebdfe2887d1eb7b7ac6b55fd408d97c2066ea1aa78b9bdb4f85553","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_840de03d-512b-4775-beee-6b03b4b240d0"},{"id":"occ_ce67db41ef6b0e231d3e5c68","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_8d263043-6a2a-439c-8c15-c0e0258cdbd8","section_id":"sec_5aa5e0c7-c912-47fa-9bea-650290702ab4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":8,"end":10,"exact":"基板","quote":"ケース1　InP基板の輸出許可だけが厳格化","quote_start":0,"quote_end":21,"text_sha256":"12748902bbd08b7935a1b3b772a93bad6bdc9c70d6bc55b507ea4fa1f57d7593","block_sha256":"12748902bbd08b7935a1b3b772a93bad6bdc9c70d6bc55b507ea4fa1f57d7593","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_8d263043-6a2a-439c-8c15-c0e0258cdbd8"},{"id":"occ_a7da574a90900bbd73f3411f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_93bd19f6-0357-4a63-8981-b32a91c079b9","section_id":"sec_7aac2f9e-33aa-4d78-9091-0b0fc8ae4ded","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"中国国内でInP多結晶、単結晶、基板へ加工し、付加価値を国内に残す","quote_start":0,"quote_end":33,"text_sha256":"c841412bfee1dc1c10c0df91c470d93d1313cb6f87a279d539336a77ad861c6f","block_sha256":"c841412bfee1dc1c10c0df9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DSP／CDR／Gearbox       │\n│ レーザードライバー      │\n│ レーザー・変調器        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1．InP基板・エピ・MOCVD","quote_start":0,"quote_end":20,"text_sha256":"712eb32b97033b963a71b4233bdbb086117bd3eb37e17bc4bcd66aa7ce9cfeb1","block_sha256":"712eb32b97033b963a71b4233bdbb086117bd3eb37e17bc4bcd66aa7ce9cfeb1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_ef6b9707-765e-4189-8813-6bff307829ee"},{"id":"occ_0f15a7eff199d055575389a5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_f11bf020-0075-4024-90c8-4385a7ab76eb","section_id":"sec_f2c8b48a-205c-4721-8364-b6ae4cfc7159","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":42,"end":44,"exact":"基板","quote":"誰が高純度インジウムとリンを確保し、\n誰が政府の許可に依存せず、\n誰が認証済みInP基板を継続出荷できるか","quote_start":0,"quote_end":53,"text_sha256":"a5e910684ef798765e3104ffc34a4ebe4574bdfd6b71d7655b059394a7eb7a18","block_sha256":"a5e910684ef798765e3104ffc34a4ebe4574bdfd6b71d7655b059394a7eb7a18","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_f11bf020-0075-4024-90c8-4385a7ab76eb"},{"id":"occ_2a642c809c49dcf74352437b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_f2da741f-51a6-4eac-8b63-4f299e4573ca","section_id":"sec_b940bfda-2371-4d17-a22e-62dd5061c6a4","layer":"caption","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"![基板・SiPh・装置・デバイスの公開シェア 06](media/6057275bc54a42e75f2c65f8eb400a9f7e64aac24267eb842af5458bc4906faa.webp)","quote_start":0,"quote_end":104,"text_sha256":"de3ea3b739e5bf5b8ec67a69f8a2fa67d428617dbf7a9386035a0470e0a7511e","block_sha256":"de3ea3b739e5bf5b8ec67a69f8a2fa67d428617dbf7a9386035a0470e0a7511e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_f2da741f-51a6-4eac-8b63-4f299e4573ca"},{"id":"occ_cfe5850acd4e45d7d302e336","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_f2e98a19-51ae-44f5-9bec-2be41de33ed4","section_id":"sec_5e38dab6-7784-425f-8aa6-6d5f9f6abd7b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"原料から基板まで中国国内にあるため、製品を完成させても海外へ出せない","quote_start":0,"quote_end":34,"text_sha256":"7da5597458cec95f5d571598d567a1038d306f21d4006ccc2ab1d3007e9ba437","block_sha256":"7da5597458cec95f5d571598d567a1038d306f21d4006ccc2ab1d3007e9ba437","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_f2e98a19-51ae-44f5-9bec-2be41de33ed4"},{"id":"occ_413b088dcc031a525527d431","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_f477c4c0-0409-485b-a3a9-8edf07166310","section_id":"sec_b394d048-ade5-418c-80a2-067d21c80a11","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":8,"end":10,"exact":"基板","quote":"しかし、その完成基板を海外へ出すには、引き続き輸出許可が必要です。","quote_start":0,"quote_end":33,"text_sha256":"d3a8802eb990a8263d8d9a0b295f2887380e9c6ea06ff81eeb6bd6da6c21b123","block_sha256":"d3a8802eb990a8263d8d9a0b295f2887380e9c6ea06ff81eeb6bd6da6c21b123","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_f477c4c0-0409-485b-a3a9-8edf07166310"},{"id":"occ_c0b225838f009af14ada0c7d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_f6337fa0-e2a2-4773-9750-63615be53b10","section_id":"sec_5aa5e0c7-c912-47fa-9bea-650290702ab4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":40,"end":42,"exact":"基板","quote":"原料不足\n   ↓\nInP多結晶不足\n   ↓\n単結晶炉の稼働率低下\n   ↓\n基板不足\n   ↓\nエピ不足\n   ↓\nCWレーザー・EML不足\n   ↓\n1.6T・CPOの出荷遅延","quote_start":0,"quote_end":91,"text_sha256":"cf20fcc901f716da12bd64774a95bca06ebbab47db42954e0066b0579a464b4b","block_sha256":"cf20fcc901f716da12bd64774a95bca06ebbab47db42954e0066b0579a464b4b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_f6337fa0-e2a2-4773-9750-63615be53b10"},{"id":"occ_28d00853eabc15c0767416f8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_f6e7bf39-1cfa-4f54-a208-4bd4a38dd25f","section_id":"sec_5e38dab6-7784-425f-8aa6-6d5f9f6abd7b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":47,"end":49,"exact":"基板","quote":"同社は、2004年以降、製品を中国で製造しており、InP、GaAs、Geを含むすべてのウェハー基板を中国で生産しています。","quote_start":0,"quote_end":61,"text_sha256":"80dffd411234e118604ca0567ab0af4efddb217ef26c1f2b4acd4ceaaa7158e0","block_sha256":"80dffd411234e118604ca0567ab0af4efddb217ef26c1f2b4acd4ceaaa7158e0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_f6e7bf39-1cfa-4f54-a208-4bd4a38dd25f"},{"id":"occ_b0f8719e36c8dfc52c379d17","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_fc8850b6-0258-408c-ab2c-200f610ce72f","section_id":"sec_da84dba6-9d1f-4a16-bef7-e9599a1a9fca","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":3,"end":5,"exact":"基板","quote":"InP基板","quote_start":0,"quote_end":5,"text_sha256":"d202315c35ebdfe2887d1eb7b7ac6b55fd408d97c2066ea1aa78b9bdb4f85553","block_sha256":"d202315c35ebdfe2887d1eb7b7ac6b55fd408d97c2066ea1aa78b9bdb4f85553","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_fc8850b6-0258-408c-ab2c-200f610ce72f"},{"id":"occ_4440ad87078b1ee24b6ce804","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_fc8d51b2-d566-4016-85a4-7850fdc919f3","section_id":"sec_5aa5e0c7-c912-47fa-9bea-650290702ab4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":146,"end":148,"exact":"基板","quote":"リスク上昇 |\n| Coherent | 非中国InP増産計画の原料確保が課題 |\n| Lumentum | 基板調達価格上昇 |\n| 中国のInPメーカー | 国内原料優先なら有利 |\n| 非中国のインジウム回収企業 | 中長期的に受益 |","quote_start":91,"quote_end":212,"text_sha256":"35a14f440c62b0488d882e16a7894a10d183c6d05e6824687c865a8e4f26e608","block_sha256":"35a14f440c62b0488d882e16a7894a10d183c6d05e6824687c865a8e4f26e608","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_fc8d51b2-d566-4016-85a4-7850fdc919f3"},{"id":"occ_019797e54bfbe40b6ab83d96","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_ff7ef5f8-c646-4fbb-99e2-f4d7e55dc932","section_id":"sec_b940bfda-2371-4d17-a22e-62dd5061c6a4","layer":"caption","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"![基板・SiPh・装置・デバイスの公開シェア 01](media/84ce3c4d1633f8d0433a1cbeefa072f3709a0a9820189a2617fc18b8c9f6d4f6.webp)","quote_start":0,"quote_end":104,"text_sha256":"6fc4d4c9250ad61e5dce951bd6df6e62c3e59dcee9503f11f030dd72932f52f6","block_sha256":"6fc4d4c9250ad61e5dce951bd6df6e62c3e59dcee9503f11f030dd72932f52f6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_ff7ef5f8-c646-4fbb-99e2-f4d7e55dc932"},{"id":"occ_83bf44b0c9f9703c28e1191d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_23a1648b-b537-41c6-9497-ee5c614dc587","section_id":"sec_9678b8f9-82e3-4228-9162-e64119936cc3","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":114,"end":116,"exact":"基板","quote":"NIC、ROCm、Heliosを組み合わせる戦略\n・台湾エコシステムへの100億ドル超投資\n・先端パッケージ、基板、ODM連携の強化\n```","quote_start":59,"quote_end":129,"text_sha256":"8999a5e6954c6a531a86422e2667fe75a8c73348799968d8c951023c75da3882","block_sha256":"8999a5e6954c6a531a86422e2667fe75a8c73348799968d8c951023c75da3882","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_23a1648b-b537-41c6-9497-ee5c614dc587"},{"id":"occ_3dc6ceffeb1d4244765d2755","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_2c6b5451-5aa6-4c21-9a20-d513346d0e07","section_id":"sec_8cc1538e-9ba8-4789-b55a-a22a135575a3","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":28,"end":30,"exact":"基板","quote":"これは、NVIDIAがTSMC、HBM、先端パッケージ、基板、サーバーODM、ネットワーク部品などをかなり先まで押さえていることを示します。単にGPUを売るだけでなく、Vera CPU、Rubin GPU、NVLink、ConnectX、BlueField、S","quote_start":0,"quote_end":130,"text_sha256":"3c69f145cbff2080fa48dfc406988b858cf05e2f6b2b6aaccf82b385fd887b8d","block_sha256":"3c69f145cbff2080fa48dfc406988b858cf05e2f6b2b6aaccf82b385fd887b8d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_2c6b5451-5aa6-4c21-9a20-d513346d0e07"},{"id":"occ_8b1ce1bbac85fed5b0060bb7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_32bb7908-5976-4f9f-bfe3-6fcbd901e97b","section_id":"sec_73474999-c3ed-43a9-8c63-e9b251832b04","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":25,"end":27,"exact":"基板","quote":"```\nTSMC N2/N3枠\n先端パッケージ枠\n基板\nメモリ\nテスト/後工程\n```","quote_start":0,"quote_end":43,"text_sha256":"ad58ccce3e4b13cc192a789e3d571af196a96c1d1597fcb6c9008742e9a6edba","block_sha256":"ad58ccce3e4b13cc192a789e3d571af196a96c1d1597fcb6c9008742e9a6edba","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_32bb7908-5976-4f9f-bfe3-6fcbd901e97b"},{"id":"occ_21bcd26e9a54264e0f1e9ec6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_3d45886c-1f78-4f4f-b8e0-1b44ebd35c13","section_id":"sec_9678b8f9-82e3-4228-9162-e64119936cc3","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":15,"end":17,"exact":"基板","quote":"```\n・HBM/CoWoS/基板/ODMの確保力はNVIDIAほど圧倒的ではない\n・MI400/MI450X、Heliosの供給網はこれから本格立ち上げ\n・ROCmやラック運用実績はNVIDIA CUDA/DGX系に比べて追う立場\n","quote_start":0,"quote_end":117,"text_sha256":"b7928f59d333a341b45019b51e3952acdc6a492dd8b7bc5dd55fcdbca21a7779","block_sha256":"b7928f59d333a341b45019b51e3952acdc6a492dd8b7bc5dd55fcdbca21a7779","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_3d45886c-1f78-4f4f-b8e0-1b44ebd35c13"},{"id":"occ_0354d80b9d0ecbfb71625eb6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_60ac0458-b01a-448e-a400-76fc78b0b5ed","section_id":"sec_73c88c5c-d00f-4152-a231-fb3b751d4978","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":63,"end":65,"exact":"基板","quote":"、NVIDIAが最も強いです。1190億ドル規模の供給関連コミットメントは、HBM、先端パッケージ、TSMC、基板、ODM、ラック全体を押さえる力を示します。([SEC](https://www.sec.gov/Archives/edgar/data/1045810/000104581026000052/nvda","quote_start":8,"quote_end":165,"text_sha256":"0de20a5286c94fd7841b33a4c04b001aa1438a5e0935a44353f7dbe91a75ea6f","block_sha256":"0de20a5286c94fd7841b33a4c04b001aa1438a5e0935a44353f7dbe91a75ea6f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_60ac0458-b01a-448e-a400-76fc78b0b5ed"},{"id":"occ_f0c9d4404efdba30847ae0d1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_6dc7b0da-9b6c-4a86-93aa-fad285654f2e","section_id":"sec_a932bbdb-5dfe-4d72-8505-edbe95be1e34","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":76,"end":78,"exact":"基板","quote":"アルダイ/チップレット向けパッケージ\n・DDR5-8800メモリ\n・PCIe Gen6 / CXL 3.0対応基板\n・サーバーODMによる1U/ラックシステム\n・空冷または液冷の電源・冷却設計\n```","quote_start":21,"quote_end":121,"text_sha256":"3b2cd0499693a092cc9a8333b3d7b35bd45245ccdd2d8089893ea570887f0a0f","block_sha256":"3b2cd0499693a092cc9a8333b3d7b35bd45245ccdd2d8089893ea570887f0a0f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_6dc7b0da-9b6c-4a86-93aa-fad285654f2e"},{"id":"occ_3f5672c4e7f0faa6867b0604","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_7d6ceb4a-32f1-415c-b2eb-830da75df242","section_id":"sec_9678b8f9-82e3-4228-9162-e64119936cc3","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":103,"end":105,"exact":"基板","quote":"tersによると、AMDはASE、SPIL、PTI、Wiwynnなどの台湾パートナーと協力し、先端パッケージ、基板、製造インフラを拡大し、CPU需要の高まりに対応する方針です。Lisa Su氏は、CPU供給は2026年を通じて四半期ごとに増え、2027年から2029年にかけても大きな拡張を計画していると述べていま","quote_start":48,"quote_end":205,"text_sha256":"654ec76cc42388b19e414a876d0931ba2e01ac9ecdbf18de719187df198cdd6a","block_sha256":"654ec76cc42388b19e414a876d0931ba2e01ac9ecdbf18de719187df198cdd6a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_7d6ceb4a-32f1-415c-b2eb-830da75df242"},{"id":"occ_1c5904d0128539b6d5fff3ca","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_b9c41a80-784e-412b-8e48-2d56afd87069","section_id":"sec_86d7bb2e-0c83-40ee-bba4-4a5db8633469","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":45,"end":47,"exact":"基板","quote":"つまりCPU競争は、**チップの設計競争であると同時に、TSMC・先端パッケージ・メモリ・基板・ODMを押さえる供給戦**です。","quote_start":0,"quote_end":64,"text_sha256":"98676466e6da27bb984f0410b695e3a1976c62de3041f9b77c75f3da1e145080","block_sha256":"98676466e6da27bb984f0410b695e3a1976c62de3041f9b77c75f3da1e145080","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_b9c41a80-784e-412b-8e48-2d56afd87069"},{"id":"occ_b29effe95c74bef40f532b7b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_d13e6d54-ae7b-4ec2-897b-c21cb7bff913","section_id":"sec_b797d78c-2c57-4558-840b-0d8b2e2b35dc","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":218,"end":220,"exact":"基板","quote":"は台湾エコシステムへの100億ドル超の投資で、Venice、MI450X、Heliosラック、先端パッケージ、基板、ODM製造能力を拡大すると説明しています。([Reuters](https://www.reuters.com/world/asia-pacific/amd-asking-partners-ramp","quote_start":163,"quote_end":320,"text_sha256":"6f5deb6d85c552edc99bbb63bbab8da6e225ffff91563e1ae6bd28bb209bc768","block_sha256":"6f5deb6d85c552edc99bbb63bbab8da6e225ffff91563e1ae6bd28bb209bc768","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_d13e6d54-ae7b-4ec2-897b-c21cb7bff913"},{"id":"occ_fbc583efc780d4efb9e9b7a7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_d163088d-4520-4af6-9bd1-e899542c87e2","section_id":"sec_92332045-5bba-42b3-8514-8957bb52a9a1","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":254,"end":256,"exact":"基板","quote":"urce=chatgpt.com))  \nこの規模を本気で狙うなら、ArmはTSMC、サーバーODM、メモリ、基板の供給網を長期で押さえる必要があります。","quote_start":199,"quote_end":276,"text_sha256":"6a10198d5fc6b580b8bd27221d50ca4b8f297c826b30cf1e576966a39b6f9ba8","block_sha256":"6a10198d5fc6b580b8bd27221d50ca4b8f297c826b30cf1e576966a39b6f9ba8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_d163088d-4520-4af6-9bd1-e899542c87e2"},{"id":"occ_44c2ac907a5a02c5fff3a0d2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_d356b7a7-a86c-42bc-ad75-1ae3fa453ab7","section_id":"sec_86d7bb2e-0c83-40ee-bba4-4a5db8633469","layer":"code","character_id":null,"count":4,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":129,"end":131,"exact":"基板","quote":"C、EFB、Foverosなど\n\nメモリ\n  DDR5、MRDIMM、LPDDR5X/SOCAMM、HBM\n\n基板\n  ABF基板、高多層基板、AIラック向け大型基板\n\nI/O部品\n  PCIe/CXL、SerDes、NIC、DPU、光トランシーバー\n\nラック組立能力\n  ODM、液冷、電源、配線、検査、バーンイ","quote_start":74,"quote_end":231,"text_sha256":"8967db1fd9f4f8e1571382e915af10aa02e2aa433385ef4d2e60effaa36eb90a","block_sha256":"8967db1fd9f4f8e1571382e915af10aa02e2aa433385ef4d2e60effaa36eb90a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_d356b7a7-a86c-42bc-ad75-1ae3fa453ab7"},{"id":"occ_8e277d963b57535b33bb4473","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_df79287c-7d5e-4712-847e-99570146c8ed","section_id":"sec_9fe50131-e42b-4f64-8f05-8ae596cbb73e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":102,"end":104,"exact":"基板","quote":"見なければなりません。NVIDIAは供給関連コミットメントを巨額に積み上げ、HBM、TSMC、先端パッケージ、基板、ODM、ネットワーク部材を長期で押さえる力があります。一方、Vera RubinはHBM4やCoWoS、液冷、電力まで絡むため、供給網は最も重く複雑です。","quote_start":47,"quote_end":182,"text_sha256":"90b1c7910b9fe709769c99735984a9b6efb65d07f62c5a78f9ecc474d66a7052","block_sha256":"90b1c7910b9fe709769c99735984a9b6efb65d07f62c5a78f9ecc474d66a7052","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_df79287c-7d5e-4712-847e-99570146c8ed"},{"id":"occ_7c86d50fdef98f847f4cd6c5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d","work_id":"wrk_f4b2ba6d-bd7a-4377-ba28-11230cbeac16","block_id":"blk_7d7a77d6-2d94-4c31-b161-5abf6607cc76","section_id":"sec_703dc0b3-1d3b-4cde-8168-bf89e291979a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"すると有機基板で、","quote_start":0,"quote_end":9,"text_sha256":"bb9d2255eb425d30c190c10d2e5c4f47eb5d18fae144e7fe0d2d138d80c62c0f","block_sha256":"bb9d2255eb425d30c190c10d2e5c4f47eb5d18fae144e7fe0d2d138d80c62c0f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d/#blk_7d7a77d6-2d94-4c31-b161-5abf6607cc76"},{"id":"occ_552c74f280840951d2eaec03","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d","work_id":"wrk_f4b2ba6d-bd7a-4377-ba28-11230cbeac16","block_id":"blk_83ffcaa2-441e-488e-8f8d-b0d21d2197e2","section_id":"sec_703dc0b3-1d3b-4cde-8168-bf89e291979a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"## 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**そもそもPCBは何でできているのか。**","quote_start":0,"quote_end":24,"text_sha256":"770e84afe374b03b7c493f66886195f0e6e9b30c9e8ec8fb3cf88bc18daaddf8","block_sha256":"770e84afe374b03b7c493f66886195f0e6e9b30c9e8ec8fb3cf88bc18daaddf8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_074f974e-4963-40bb-a0ad-a8d9e4695cb5"},{"id":"occ_b8b5301ad1608a41c3ba72dc","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_075266d6-71d3-41f1-bc87-0a2f36d2e293","section_id":"sec_82948751-a52c-4671-9d64-7ed13f5defb7","layer":"body","character_id":null,"count":1,"matched_aliases":["ガラスクロス"],"evidence":{"text_basis":"markdown","start":21,"end":27,"exact":"ガラスクロス","quote":"そして通信速度が上がるほど、樹脂だけでなくガラスクロス自体のDkやDfも無視できなくなる。","quote_start":0,"quote_end":45,"text_sha256":"4d6345b1bc4740c339f536be6a61f48a7241db1e5814e92cee532406fd3d0d74","block_sha256":"4d6345b1bc4740c339f536be6a61f48a7241db1e5814e92cee532406fd3d0d74","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_075266d6-71d3-41f1-bc87-0a2f36d2e293"},{"id":"occ_ddb875388f893e1bc9c0a644","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_07ee80bb-cfcf-4a03-a5b9-00a1f62658ac","section_id":"sec_4c67c845-cd1b-4745-b75b-bca621c776db","layer":"body","character_id":null,"count":1,"matched_aliases":["CCL"],"evidence":{"text_basis":"markdown","start":12,"end":15,"exact":"CCL","quote":"つまりHigh-end 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PCBの「見えない材料」では何が進化しているのか","quote_start":0,"quote_end":39,"text_sha256":"069745cf1498754ac3ef2e38b5ecf7e3b142c8a2cd386c9edbbd11a02a3877c9","block_sha256":"069745cf1498754ac3ef2e38b5ecf7e3b142c8a2cd386c9edbbd11a02a3877c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_6118fe8f-68cf-4060-b13c-253a5410a78e"},{"id":"occ_c0ef77815c5d3b74d26ec5c0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_634c1516-581c-453f-9236-5005ffa8ad7b","section_id":"sec_e0c10ad5-7684-4e5c-acbd-0b98574f40bc","layer":"body","character_id":null,"count":1,"matched_aliases":["CCL"],"evidence":{"text_basis":"markdown","start":40,"end":43,"exact":"CCL","quote":"これによって従来の粗いMatte Surfaceより低Profile化しながら、CCLとして必要な密着性を確保する。","quote_start":0,"quote_end":58,"text_sha256":"e246ebfa9956f517bbda0a6aa036853b604b4c8190997c4d25356a3ea986c60d","block_sha256":"e246ebfa9956f517bbda0a6aa036853b604b4c8190997c4d25356a3ea986c60d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_634c1516-581c-453f-9236-5005ffa8ad7b"},{"id":"occ_77cd6d1efc3a72656e12c7ed","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_63ea82f0-6e91-4646-9a17-f57094d451d8","section_id":"sec_42ed09f7-ea13-4c93-8e61-c1986f50563d","layer":"body","character_id":null,"count":1,"matched_aliases":["ガラスクロス"],"evidence":{"text_basis":"markdown","start":6,"end":12,"exact":"ガラスクロス","quote":"### ① ガラスクロスを作る","quote_start":0,"quote_end":15,"text_sha256":"cb273a90fe9c00568b7d504e345be46522c1fd7d8714e3a10e6448085ce9493a","block_sha256":"cb273a90fe9c00568b7d504e345be46522c1fd7d8714e3a10e6448085ce9493a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_63ea82f0-6e91-4646-9a17-f57094d451d8"},{"id":"occ_e3e793c69f5b94fba681e451","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_65b01e34-16ae-4452-ae7d-e102619e4fac","section_id":"sec_4ceed3db-2b17-4a9b-8fe7-f78e2def8b41","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"MECはV-Bondを、多層電子基板の一括積層前処理として利用されるBlack Oxide Alternativeとして展開している。([MEC](https://www.mec-co.com/technical/about/?utm_","quote_start":0,"quote_end":118,"text_sha256":"15731563dfe4c32149af2748e03624a79531791381b967f7cfb368fe23d28a75","block_sha256":"15731563dfe4c32149af2748e03624a79531791381b967f7cfb368fe23d28a75","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_65b01e34-16ae-4452-ae7d-e102619e4fac"},{"id":"occ_dfad129c399f3338f933a4fc","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_661e7eb8-4ca4-44ed-96ae-ae5f4751220f","section_id":"sec_47c44973-9609-47f2-bc32-e7744aee7c9c","layer":"body","character_id":null,"count":1,"matched_aliases":["CCL"],"evidence":{"text_basis":"markdown","start":2,"end":5,"exact":"CCL","quote":"**CCL = Copper Clad Laminate**","quote_start":0,"quote_end":30,"text_sha256":"d3901960a9e9239009a65e32acd02f39aeff1896de3b6618cb6468f3486072ce","block_sha256":"d3901960a9e9239009a65e32acd02f39aeff1896de3b6618cb6468f3486072ce","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_661e7eb8-4ca4-44ed-96ae-ae5f4751220f"},{"id":"occ_d252bac18db266bf15c915f5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_66dbcba3-bb78-4a3e-997e-1baaa1f9cb43","section_id":"sec_1cda10f0-2173-4ce6-aea2-eb3f9809ff9c","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":6,"end":9,"exact":"PCB","quote":"これはAI PCBのSupply Chainを見るうえでも重要である。","quote_start":0,"quote_end":35,"text_sha256":"6ecbdc8bbb8566d17fd10345d99acfca262f1fdea72567e3c800992f9476aa5d","block_sha256":"6ecbdc8bbb8566d17fd10345d99acfca262f1fdea72567e3c800992f9476aa5d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_66dbcba3-bb78-4a3e-997e-1baaa1f9cb43"},{"id":"occ_a34ef7a26efc7ed5da63fe62","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_66ec8a8e-e283-4dc3-a591-a5d0c78b9288","section_id":"sec_7fc46651-a5a7-4659-b4e9-c9bf04a5ab9d","layer":"body","character_id":null,"count":1,"matched_aliases":["ガラスクロス"],"evidence":{"text_basis":"markdown","start":25,"end":31,"exact":"ガラスクロス","quote":"## E GlassからNE・NER・NEZへ――ガラスクロスでは何が進化しているのか","quote_start":0,"quote_end":43,"text_sha256":"f753be23687be52bc97ed06a6858cb87bdf67cc765feed29b3a970ae3701c0e0","block_sha256":"f753be23687be52bc97ed06a6858cb87bdf67cc765feed29b3a970ae3701c0e0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_66ec8a8e-e283-4dc3-a591-a5d0c78b9288"},{"id":"occ_940190aecee20cf15d346041","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_6708acd7-bb49-4bbf-b4a4-1aba5d3ca385","section_id":"sec_4ceed3db-2b17-4a9b-8fe7-f78e2def8b41","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":33,"end":36,"exact":"PCB","quote":"例えばMECのV-Bond 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Oxideの代替となる技術である。","quote_start":0,"quote_end":89,"text_sha256":"9283dbe646fb6c48a2182f9996a103a1a08b9cc9f6e54d541251366aafd372f0","block_sha256":"9283dbe646fb6c48a2182f9996a103a1a08b9cc9f6e54d541251366aafd372f0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_6708acd7-bb49-4bbf-b4a4-1aba5d3ca385"},{"id":"occ_1df6cd1783431902cb25944c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_678bdab3-d4eb-484c-b91e-6151fab95495","section_id":"sec_9e264fdd-e97f-4796-b82d-fdcbf3d22533","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":2,"end":5,"exact":"PCB","quote":"高速PCBではPrepregは単なる構造材ではない。","quote_start":0,"quote_end":26,"text_sha256":"7eb184fef2c069c988f322def4995a0ae398a6014bcfca44ebd96a189851f471","block_sha256":"7eb184fef2c069c988f322def4995a0ae398a6014bcfca44ebd96a189851f471","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_678bdab3-d4eb-484c-b91e-6151fab95495"},{"id":"occ_0f83ed34c6838c63f43bf67f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_6b64252f-1919-46ec-a268-db41c34a9f16","section_id":"sec_6138e304-ffea-4f3e-87f8-bcba9ecb9105","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":5,"end":8,"exact":"PCB","quote":"## 1．PCBとは「絶縁体の中に作られた3次元の銅配線網」である","quote_start":0,"quote_end":33,"text_sha256":"d22a8d0edb778a6c300741a0294684db127fbafc62bd7fb9d85f4f5a2ba432bd","block_sha256":"d22a8d0edb778a6c300741a0294684db127fbafc62bd7fb9d85f4f5a2ba432bd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_6b64252f-1919-46ec-a268-db41c34a9f16"},{"id":"occ_ec01afef9151daa5fddf81ea","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_6d681c33-f4fd-468f-b11c-e88301613f0a","section_id":"sec_52e076e5-8250-473e-bc79-bd760dce463f","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":115,"end":118,"exact":"PCB","quote":"9/CPXには最大104層のM9級材料が採用され、Q GlassとHVLP4銅箔まで材料仕様が引き上げられる。PCB一枚の材料構成が、AIシステム全体の性能を左右する領域に入った。([TrendForce](https://www.trendforce.com/presscenter/news/20251120-1","quote_start":60,"quote_end":218,"text_sha256":"a2c3bcc490f2e3a43a629dfd2cc7ed6d4a9336dd9c4a652de62c0710be7e49b7","block_sha256":"a2c3bcc490f2e3a43a629dfd2cc7ed6d4a9336dd9c4a652de62c0710be7e49b7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_6d681c33-f4fd-468f-b11c-e88301613f0a"},{"id":"occ_c3910a643177770388f71285","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_6d689590-4d3c-4afa-9c81-44d7d3d89b4c","section_id":"sec_ed4b87ff-d96a-470b-a865-10ebfb6bee06","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":2,"end":5,"exact":"PCB","quote":"多層PCBを一枚の構造物へ変えるための、成形材料そのものなのである。","quote_start":0,"quote_end":34,"text_sha256":"bb8c7a9c4f34a2824c9f36fb65f11e1a65e9d190ab40dea5f34af271f4a07763","block_sha256":"bb8c7a9c4f34a2824c9f36fb65f11e1a65e9d190ab40dea5f34af271f4a07763","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9da93714-e603-4ed0-af29-80871392e458/#blk_6d689590-4d3c-4afa-9c81-44d7d3d89b4c"},{"id":"occ_20b3e1a7eaa697c252f93640","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_9da93714-e603-4ed0-af29-80871392e458","work_id":"wrk_d5b32e91-ddad-40bb-b75b-c80115e64a5e","block_id":"blk_6db5f93a-a342-4886-8011-58ed136d83e0","section_id":"sec_39bf296b-dc6a-464e-96ba-d285d86d7325","layer":"body","character_id":null,"count":1,"matched_aliases":["Low-Dk"],"evidence":{"text_basis":"markdown","start":9,"end":15,"exact":"Low-Dk","quote":"NEZ/DXII・Low-Dk 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|\n| Kyber NVL144 | Rubin Ultra世代、2027年ロードマップ | PCB問題で12カ月超遅れ、2028年 |\n| Kyber接続方式 | ケーブルレス・ミッドプレーンを持つ高密度ラック | ラック内は全銅、2枚のPCBミッドプレーン |\n| Kyberの主リスク | 詳細","quote_start":27,"quote_end":185,"text_sha256":"13239d6cd39765536dbc508b78a66d51e2d7724072ddd05bdc51e6e0684d124a","block_sha256":"13239d6cd39765536dbc508b78a66d51e2d7724072ddd05bdc51e6e0684d124a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_389167dd-87a6-4c83-97b6-7b61040c5053"},{"id":"occ_7655a86ff4bbef49b37bbeb7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_52325720-7e64-4680-9a69-cad406aea249","section_id":"sec_cddfcc10-8b18-493c-aeed-f6e9526a85fd","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":61,"end":64,"exact":"PCB","quote":"NVL144は、1ラックに144GPUを収容する高密度ラックである。ラック内は銅接続で、主なボトルネックは大型PCBミッドプレーンの製造性だ。","quote_start":6,"quote_end":77,"text_sha256":"f02bcaffbafb7a755a20337d63c987fbf451ce4027d73b04b85588b6aa70f9b8","block_sha256":"f02bcaffbafb7a755a20337d63c987fbf451ce4027d73b04b85588b6aa70f9b8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_52325720-7e64-4680-9a69-cad406aea249"},{"id":"occ_e3e600bb59c4b40a3f9745e6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_546eacd5-cd6f-4b40-934c-d4008d7d82b5","section_id":"sec_9c728492-db68-4711-a9b0-bd45987a5904","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":39,"end":41,"exact":"基板","quote":"FC-BGAはGPUやCPUなどの半導体パッケージ直下に置かれるICパッケージ基板である。","quote_start":0,"quote_end":45,"text_sha256":"590c9a47a8cc1f05a90d036e466b8d6ad186c63e2343ae5c78bfcdde3437805f","block_sha256":"590c9a47a8cc1f05a90d036e466b8d6ad186c63e2343ae5c78bfcdde3437805f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_546eacd5-cd6f-4b40-934c-d4008d7d82b5"},{"id":"occ_a1d0abfd834b485d8304dd47","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_55a95274-7872-4b32-96b7-36d106e6dfef","section_id":"sec_be078ccd-e32b-49bd-aab0-870949a30813","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":30,"end":33,"exact":"PCB","quote":"高電圧ケーブル、電力配線、接続部品の恩恵候補であり、システムPCB企業というより、ラック内外の配線・配電側の受益者になる。([NVIDIA Developer](https://developer.nvidia.com/blog/building-the-800-v","quote_start":0,"quote_end":133,"text_sha256":"f68bca52b791368a014cdc9ba53a023c2dc82372bb77a36e013d681ec1677e02","block_sha256":"f68bca52b791368a014cdc9ba53a023c2dc82372bb77a36e013d681ec1677e02","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_55a95274-7872-4b32-96b7-36d106e6dfef"},{"id":"occ_0b9e919e4e752f3681eedccb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_580dcb4c-e4e8-42d0-ae31-fb510f100173","section_id":"sec_cddfcc10-8b18-493c-aeed-f6e9526a85fd","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":10,"end":13,"exact":"PCB","quote":"そして、KyberのPCB問題とイビデンのFC-BGA問題を混同してはいけない。","quote_start":0,"quote_end":40,"text_sha256":"3641dd0eadb7ccb58493d8ba1a9681beab8776d886fc4730bb422c9e8d51453a","block_sha256":"3641dd0eadb7ccb58493d8ba1a9681beab8776d886fc4730bb422c9e8d51453a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_580dcb4c-e4e8-42d0-ae31-fb510f100173"},{"id":"occ_9fd57cb2e232df0b7fc2e71b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_59dcbf7f-ab18-493e-b4d0-492af9ad0f54","section_id":"sec_f7cff5b6-140e-4888-9995-b41446a8342c","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":49,"end":52,"exact":"PCB","quote":"したがって、Kyber 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合計72基のNVLink 7スイッチ\n- 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Electric](https://www.meiko-elec.com/exhibition/JPCA2026/pd","quote_start":0,"quote_end":142,"text_sha256":"08bd45fec95288af463261fddd39e6bb1aa72f3b9cf0eb4a798945b1438043f5","block_sha256":"08bd45fec95288af463261fddd39e6bb1aa72f3b9cf0eb4a798945b1438043f5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_901c0a91-8670-4cc9-b24a-9b1a3e2f6543"},{"id":"occ_2738f497554a7e47e0cd0953","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_a019c720-e68f-4f4c-8750-6c0a2e0046df","section_id":"sec_a78f55c5-2344-4c1d-9406-09c5a4d06df8","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":17,"end":20,"exact":"PCB","quote":"NVL576の問題は、KyberのPCBミッドプレーンではない。","quote_start":0,"quote_end":32,"text_sha256":"741069fe99c280fd51938fbe8d0057bdf04e3b0960172b0e2926c4437026855b","block_sha256":"741069fe99c280fd51938fbe8d0057bdf04e3b0960172b0e2926c4437026855b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_a019c720-e68f-4f4c-8750-6c0a2e0046df"},{"id":"occ_cf42159c3cde27906091763a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_a3955166-88a1-4d83-a693-a604487fc27a","section_id":"sec_cddfcc10-8b18-493c-aeed-f6e9526a85fd","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":65,"end":68,"exact":"PCB","quote":"027年に発表・限定出荷を維持する可能性がある。  \n> しかしKyberとNVL576の本格量産は、それぞれPCBとCPOの成熟度に左右される。","quote_start":10,"quote_end":83,"text_sha256":"46e363dc98368a0436c98ee3d720bb8e97aefa27a186b649df18c03826d92049","block_sha256":"46e363dc98368a0436c98ee3d720bb8e97aefa27a186b649df18c03826d92049","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_a3955166-88a1-4d83-a693-a604487fc27a"},{"id":"occ_162b99e6f4c0ff1c4c5d7f10","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_a857d4c5-7ed1-4cc6-af50-eda5c7776ed5","section_id":"sec_f6f16a5f-447e-40e0-96b5-0428b1d6722f","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":12,"end":15,"exact":"PCB","quote":"## 2．高多層システムPCBメーカー","quote_start":0,"quote_end":19,"text_sha256":"08d115b68f28730b82c527576068107c4d49e75cc9903697edc819275a14ca90","block_sha256":"08d115b68f28730b82c527576068107c4d49e75cc9903697edc819275a14ca90","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_a857d4c5-7ed1-4cc6-af50-eda5c7776ed5"},{"id":"occ_01b5069daedd03690c77e3c5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_af9d5035-ddee-49ad-8e3e-3d6f7bb23e14","section_id":"sec_5cd6b69e-e4b4-49e3-a055-8ce1743148d9","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":49,"end":51,"exact":"基板","quote":"SemiAnalysisはVera Rubin NVL72でAmphenolのPaladinHD2基板対基板コネクターが使われると分析している。Kyberでも同種の超高速・高密度接続技術が必要になるが、正式採用は未確認である。([SemiAnalysis](https://newsletter.sem","quote_start":0,"quote_end":151,"text_sha256":"b89139b8e7b627c48ad6a825da86a44cdef227b3b3a34731d9736d55a1bec944","block_sha256":"b89139b8e7b627c48ad6a825da86a44cdef227b3b3a34731d9736d55a1bec944","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_af9d5035-ddee-49ad-8e3e-3d6f7bb23e14"},{"id":"occ_b965249a60890873f2ab1cc2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_b0a6d0cb-b088-4f50-a7eb-3b9fc6051998","section_id":"sec_a98e2832-eed7-4fb5-864d-0441dcbe4135","layer":"body","character_id":null,"count":2,"matched_aliases":["CCL","低誘電"],"evidence":{"text_basis":"markdown","start":28,"end":31,"exact":"低誘電","quote":"Kyberのような大型・高多層・高速ミッドプレーンでは、低誘電率、低損失、低熱膨張率、高い寸法安定性を持つ高級CCLの使用量が増える。","quote_start":0,"quote_end":67,"text_sha256":"4c5b46ca946b8e37c655c211474d6950d0735a2b8bb0eabba689b3118ae9e18d","block_sha256":"4c5b46ca946b8e37c655c211474d6950d0735a2b8bb0eabba689b3118ae9e18d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_b0a6d0cb-b088-4f50-a7eb-3b9fc6051998"},{"id":"occ_823e0482450ce110bcaa42d1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_b8d4e3d4-bc28-435a-85c0-c95392a23f14","section_id":"sec_fbf92af0-3cc9-4c2f-96ab-6e1540c27be2","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":13,"end":15,"exact":"基板","quote":"- 積層時の位置ずれ\n- 基板の反り\n- 樹脂と銅の熱膨張差\n- ビアの接続不良\n- 層間剥離","quote_start":0,"quote_end":47,"text_sha256":"5be951f8c2370f9b00e40392a78c24bd3e6e7d1ce4389f9d890fa775d38b2415","block_sha256":"5be951f8c2370f9b00e40392a78c24bd3e6e7d1ce4389f9d890fa775d38b2415","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_b8d4e3d4-bc28-435a-85c0-c95392a23f14"},{"id":"occ_5d4b708a004c3928e241a2d0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_b9dc992f-9913-48b7-82cb-b1b3149940e6","section_id":"sec_fbf92af0-3cc9-4c2f-96ab-6e1540c27be2","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":10,"end":12,"exact":"基板","quote":"### 大型・高多層基板の歩留まり","quote_start":0,"quote_end":17,"text_sha256":"ec4e0a4cfa867889fdf7bb145066bfa8606a09a4649c612e49f9ff827d38f9e7","block_sha256":"ec4e0a4cfa867889fdf7bb145066bfa8606a09a4649c612e49f9ff827d38f9e7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_b9dc992f-9913-48b7-82cb-b1b3149940e6"},{"id":"occ_57cde557c8dad5e2749f0a0c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_ba55e79f-bd93-4253-9999-573d327a28ad","section_id":"sec_4e56bf1e-6816-4704-81f8-34772d7cfa94","layer":"code","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":55,"end":58,"exact":"PCB","quote":"```\nRubin Ultra GPUパッケージ\n　↓\nコンピュートブレード\n　↓\n高速コネクター\n　↓\n大型PCBミッドプレーン\n　↓\n銅フライオーバー\n　↓\nNVLinkスイッチブレード\n```","quote_start":0,"quote_end":99,"text_sha256":"650a826bec395342991f3001ca7a5ee18f8b25e4f1092f3b9084a80280912884","block_sha256":"650a826bec395342991f3001ca7a5ee18f8b25e4f1092f3b9084a80280912884","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_ba55e79f-bd93-4253-9999-573d327a28ad"},{"id":"occ_420e06314b34c07a536cd78a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_be0933d0-fb67-412b-bda6-69a7b7bdc2f6","section_id":"sec_c1cf65e3-3f13-4688-8371-1c5dcd59083a","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":47,"end":50,"exact":"PCB","quote":"Kyber NVL144で問題視されているのは、1ラックに144基のGPUを収容するための大型PCBミッドプレーンである。一方、NVL576で問題になるのは、72GPUラックを8台まとめ、576GPUを一つのNVLinkドメインとして動かすためのラック間光接続だ。","quote_start":0,"quote_end":132,"text_sha256":"4a9cbeb525e1ec44eb1460a4c32b6a9f982cce5f54d01636e47b0df3a7740b96","block_sha256":"4a9cbeb525e1ec44eb1460a4c32b6a9f982cce5f54d01636e47b0df3a7740b96","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_be0933d0-fb67-412b-bda6-69a7b7bdc2f6"},{"id":"occ_7ca74d9af5084556db0eef27","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_c3fb63b2-10c7-4bc6-90ca-d612990e2f1b","section_id":"sec_f7cff5b6-140e-4888-9995-b41446a8342c","layer":"code","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":48,"end":51,"exact":"PCB","quote":"```\nRubin Ultra GPU\n　↓\nコンピュートブレード\n　↓\n高速コネクター\n　↓\nPCBミッドプレーン\n　↓\n銅フライオーバーケーブル\n　↓\nNVLinkスイッチ\n```","quote_start":0,"quote_end":92,"text_sha256":"ae1515d41c6e557f87cc586fad6c841cb183dde238104f804ee3bb2abbd618cf","block_sha256":"ae1515d41c6e557f87cc586fad6c841cb183dde238104f804ee3bb2abbd618cf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_c3fb63b2-10c7-4bc6-90ca-d612990e2f1b"},{"id":"occ_fc5fb6eeacdb0c4c112e1545","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_c792761e-f357-4f4c-b730-ebec71a63b08","section_id":"sec_598d5b73-530d-443c-9822-91e835ae4066","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":0,"end":2,"exact":"基板","quote":"基板のわずかな反りやシャーシの公差でも、接触不良や挿抜時の破損につながる。","quote_start":0,"quote_end":37,"text_sha256":"16af7bf53b6ff6e6d75909bc4a9bd599bf66e6e78a51567c7c9e830a97397dda","block_sha256":"16af7bf53b6ff6e6d75909bc4a9bd599bf66e6e78a51567c7c9e830a97397dda","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_c792761e-f357-4f4c-b730-ebec71a63b08"},{"id":"occ_75d3986042094cce6478dee0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_cec6243c-6a68-4512-a521-bbf87887ad93","section_id":"sec_d1599f1e-16a3-40b1-b113-31b01151224f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":58,"end":60,"exact":"基板","quote":"基のGPUと72基規模のNVLinkスイッチを一つのラックで接続するには、膨大な数の200Gbps級信号を大型基板へ通す必要がある。","quote_start":3,"quote_end":69,"text_sha256":"c673b1b100a71bd4cb7f1cfc56b368ee8574f02a0ddc293b24e5d53ceda24dfd","block_sha256":"c673b1b100a71bd4cb7f1cfc56b368ee8574f02a0ddc293b24e5d53ceda24dfd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_cec6243c-6a68-4512-a521-bbf87887ad93"},{"id":"occ_61af43268c9c8a96ab2540e9","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_d1040998-2792-431b-9b26-4c9bc7c5fa9c","section_id":"sec_a98e2832-eed7-4fb5-864d-0441dcbe4135","layer":"body","character_id":null,"count":1,"matched_aliases":["CCL"],"evidence":{"text_basis":"markdown","start":8,"end":11,"exact":"CCL","quote":"## 1．低損失CCLメーカー","quote_start":0,"quote_end":15,"text_sha256":"0a90bd02ee6a33a8f3fcbd4f6cbcf376e890edb1c8415d8f14c92165a0461972","block_sha256":"0a90bd02ee6a33a8f3fcbd4f6cbcf376e890edb1c8415d8f14c92165a0461972","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_d1040998-2792-431b-9b26-4c9bc7c5fa9c"},{"id":"occ_eff5d7a4f6111038d8731312","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_d4b97902-b626-4d68-904e-1e5c31c85409","section_id":"sec_c1cf65e3-3f13-4688-8371-1c5dcd59083a","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":33,"end":36,"exact":"PCB","quote":"同じRubin Ultra世代のスケールアップシステムでも、片方はPCB、もう片方は光接続が主なリスクになる。","quote_start":0,"quote_end":55,"text_sha256":"46b94d101faef095181b38054c40dd9886a6d5dac9a6c20688b8078141638a61","block_sha256":"46b94d101faef095181b38054c40dd9886a6d5dac9a6c20688b8078141638a61","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_d4b97902-b626-4d68-904e-1e5c31c85409"},{"id":"occ_0339901174ebd4aa168ee1d7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_d92be0ad-d2e9-44d1-85b1-b035fe3b61c8","section_id":"sec_f7cff5b6-140e-4888-9995-b41446a8342c","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":26,"end":29,"exact":"PCB","quote":"NVLinkスイッチからミッドプレーンまでの距離は、PCB上の配線だけでは信号損失が大きいため、一部には銅製フライオーバーケーブルを使用するとSemiAnalysisは推定している。","quote_start":0,"quote_end":91,"text_sha256":"3b512cae3f38f9a55066027d62bcdcc3afffad1599b51cb1dfcb8c8b553e8100","block_sha256":"3b512cae3f38f9a55066027d62bcdcc3afffad1599b51cb1dfcb8c8b553e8100","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_d92be0ad-d2e9-44d1-85b1-b035fe3b61c8"},{"id":"occ_19dc23ec0414ad2722a0836c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_d9e2a2db-1ee3-4b94-8fe4-d3a6d0741bb2","section_id":"sec_71adb421-44c7-4c5c-9a7a-ba2b721dc462","layer":"body","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":18,"end":20,"exact":"基板","quote":"Kyber報道を受けてイビデンなどの基板関連企業が売られる場面があっても、イビデンが主力とするFC-BGAと、Kyberで問題視されるPCBミッドプレーンは別の製品だ。","quote_start":0,"quote_end":84,"text_sha256":"b9d983333cc65384a8bc95781fbd9c4a6e34a0827b01f8cbc0fcdde41d2f048f","block_sha256":"b9d983333cc65384a8bc95781fbd9c4a6e34a0827b01f8cbc0fcdde41d2f048f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_d9e2a2db-1ee3-4b94-8fe4-d3a6d0741bb2"},{"id":"occ_68d60b3b949497ff546f08a0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_da79ad00-bb58-4976-b16b-76fc3a3e1c55","section_id":"sec_4e56bf1e-6816-4704-81f8-34772d7cfa94","layer":"code","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":202,"end":205,"exact":"PCB","quote":"イクロビア | 大型高多層、信号損失、反り |\n| 代表企業群 | イビデン、シンコーなど | 高多層システムPCB企業 |\n| Kyber固有性 | 低い | 非常に高い |\n```","quote_start":147,"quote_end":239,"text_sha256":"6030a1fd6cd8a001193c8b36af0984ac7c93b592db72b1b898edd3587d51f784","block_sha256":"6030a1fd6cd8a001193c8b36af0984ac7c93b592db72b1b898edd3587d51f784","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_da79ad00-bb58-4976-b16b-76fc3a3e1c55"},{"id":"occ_b4c15c2904193275ebfc7467","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_dc7cceed-b9b3-49cc-b7ed-734f655526b5","section_id":"sec_cddfcc10-8b18-493c-aeed-f6e9526a85fd","layer":"body","character_id":null,"count":2,"matched_aliases":["CCL","PCB"],"evidence":{"text_basis":"markdown","start":21,"end":24,"exact":"CCL","quote":"Kyber量産時の直接的な受益候補は、高級CCL、高多層システムPCB、コネクター、800VDC、液冷、ラック統合企業である。","quote_start":0,"quote_end":63,"text_sha256":"805821c718b14def10f072ae64f855bffc9c1fa2771103b52f4f88b922966fc9","block_sha256":"805821c718b14def10f072ae64f855bffc9c1fa2771103b52f4f88b922966fc9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_dc7cceed-b9b3-49cc-b7ed-734f655526b5"},{"id":"occ_86c66c2c51822ac3862d039a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_de69adab-178e-4f03-944d-512fad0807fd","section_id":"sec_4e56bf1e-6816-4704-81f8-34772d7cfa94","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":22,"end":24,"exact":"基板","quote":"一方、Kyber専用ミッドプレーンやブレード基板は、Kyberの量産時期に直接左右される。","quote_start":0,"quote_end":45,"text_sha256":"8ae7dc12609441da7bd2d99564acd523a8f2d27568c604487e0f4bfb85f74f04","block_sha256":"8ae7dc12609441da7bd2d99564acd523a8f2d27568c604487e0f4bfb85f74f04","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_de69adab-178e-4f03-944d-512fad0807fd"},{"id":"occ_e26c5b5f2a6371cb0f713085","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_eb9c0cbd-9f38-4204-8aa8-cc718bb20c8e","section_id":"sec_f565484f-c517-4e54-b2bd-89b64dc7dd8b","layer":"code","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":23,"end":26,"exact":"PCB","quote":"```\nKyber NVL144\n主なリスク：PCBミッドプレーン\n\nNVL576\n主なリスク：ラック間光接続・CPO\n```","quote_start":0,"quote_end":63,"text_sha256":"005fe3f5d109710c42c2343b0e52b71ac2a293a8bf307764a7064f38a768564a","block_sha256":"005fe3f5d109710c42c2343b0e52b71ac2a293a8bf307764a7064f38a768564a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_eb9c0cbd-9f38-4204-8aa8-cc718bb20c8e"},{"id":"occ_0ffc91bbaa9ee331f6196542","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_eef902ca-b10b-47d4-b3bf-3439de884c94","section_id":"sec_cddfcc10-8b18-493c-aeed-f6e9526a85fd","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":3,"end":5,"exact":"基板","quote":"同じ「基板」でも、階層も用途も供給企業も全く異なる。","quote_start":0,"quote_end":26,"text_sha256":"afccfa84b6622063c7f897c180cd30443f4376d2803c7b434ee84549d34cbc85","block_sha256":"afccfa84b6622063c7f897c180cd30443f4376d2803c7b434ee84549d34cbc85","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_eef902ca-b10b-47d4-b3bf-3439de884c94"},{"id":"occ_63116a9aaeae24cb30057491","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_ef16dc47-59d1-4c99-a21d-18cb6bf43492","section_id":"sec_0c8189a7-ba12-4dcf-8255-d101f221f362","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":17,"end":19,"exact":"基板","quote":"試作品を数枚作ることと、同一性能の基板を数千枚単位で量産することは全く別の難しさになる。","quote_start":0,"quote_end":44,"text_sha256":"2d193d4fcae95b572cfb356dfefc700015c9c0a81e2c3ac58b9af8f38f6621ba","block_sha256":"2d193d4fcae95b572cfb356dfefc700015c9c0a81e2c3ac58b9af8f38f6621ba","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_ef16dc47-59d1-4c99-a21d-18cb6bf43492"},{"id":"occ_1679873fe70c2fe8eb1a567b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_f4bc1483-b79a-47eb-b968-20385ed6a50c","section_id":"sec_c8311b65-2f5d-4679-9bd7-8f9bc53b0ff5","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":2,"end":5,"exact":"PCB","quote":"> PCBミッドプレーンの量産可能性に問題があり、12カ月以上遅れて2028年へ移った","quote_start":0,"quote_end":43,"text_sha256":"993972d4fd37b650927a301026211cbc7fabb0d7d1678001e6bc954750a2a276","block_sha256":"993972d4fd37b650927a301026211cbc7fabb0d7d1678001e6bc954750a2a276","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_f4bc1483-b79a-47eb-b968-20385ed6a50c"},{"id":"occ_420fd444b377d918ae840b6e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_f8900758-0751-4ee9-96ee-dfe5b0d1be78","section_id":"sec_4e56bf1e-6816-4704-81f8-34772d7cfa94","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":74,"end":77,"exact":"PCB","quote":"GPUパッケージを載せたコンピュートブレードと、NVLinkスイッチブレードをラック内部で接続する大型システムPCBである。","quote_start":19,"quote_end":81,"text_sha256":"84617e2225a29deeb821ca60a91c35201ccade39bb30f265089dad1d308bfb45","block_sha256":"84617e2225a29deeb821ca60a91c35201ccade39bb30f265089dad1d308bfb45","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_f8900758-0751-4ee9-96ee-dfe5b0d1be78"},{"id":"occ_518c6ad5709e4863242d1ad5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_4402ca65-8d61-4f00-bcd9-d28f55aef66c","section_id":"sec_22bb2275-1e65-4eeb-98aa-91180c8a5827","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":40,"end":42,"exact":"基板","quote":"- ASICダイ\n- SRAM\n- HBM\n- インターポーザー\n- 接合\n- 基板\n- 電源\n- 熱","quote_start":0,"quote_end":51,"text_sha256":"a707d761dd472a7bdcb364296d26cdc1063e1ebb0b91a4a83aaa68c652beebf2","block_sha256":"a707d761dd472a7bdcb364296d26cdc1063e1ebb0b91a4a83aaa68c652beebf2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_4402ca65-8d61-4f00-bcd9-d28f55aef66c"},{"id":"occ_014544f01e3c31de178eb99a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_460b2ad6-e5de-40a9-b94b-ba8deb531e51","section_id":"sec_00749093-feed-4075-90b3-02fc2f52c640","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":42,"end":44,"exact":"基板","quote":"```\nTSMC：ASIC\nSK hynix：HBM\nOSAT：パッケージ\n別企業：基板\n別企業：SSD\n```","quote_start":0,"quote_end":56,"text_sha256":"c4776639eeb29ebfe029507ba97fc5a155e7fee8427425ce12869d32eb33e272","block_sha256":"c4776639eeb29ebfe029507ba97fc5a155e7fee8427425ce12869d32eb33e272","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_460b2ad6-e5de-40a9-b94b-ba8deb531e51"},{"id":"occ_c9942a52e07eb4fdae3257ee","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_53d6c4fb-de1d-4c72-922b-b9a76720adb5","section_id":"sec_b4ad4f5d-283f-4303-abcd-1ecc7ed5b30e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":43,"end":45,"exact":"基板","quote":"- シリコンインターポーザー\n- HBMベースダイ\n- 2.5Dパッケージ\n- 高密度基板\n- HBMとASICの実装\n- Known Good Dieの選別\n- 完成後のテスト\n- パッケージ歩留まり","quote_start":0,"quote_end":101,"text_sha256":"c21ecaefd9a6ad2a9392b4b3b52eefbbf87ea8d2409c584ef7174ccd3cf6a4e8","block_sha256":"c21ecaefd9a6ad2a9392b4b3b52eefbbf87ea8d2409c584ef7174ccd3cf6a4e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_53d6c4fb-de1d-4c72-922b-b9a76720adb5"},{"id":"occ_e6dd2fcfe8cce060a79b97da","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_9e0a84c6-f121-425f-8ff6-866312cabdd8","section_id":"sec_0badf3fc-e4d1-4d91-92af-f039cf2e2e5f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":28,"end":30,"exact":"基板","quote":"その場合、SRAMセル以外にもパッケージ、接合、テスト、基板、ネットワークの費用が増える。","quote_start":0,"quote_end":45,"text_sha256":"cbeaa2cde93da5353a327619658be41c38eb157ee46256d5d4e76a6ce50176e1","block_sha256":"cbeaa2cde93da5353a327619658be41c38eb157ee46256d5d4e76a6ce50176e1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_9e0a84c6-f121-425f-8ff6-866312cabdd8"},{"id":"occ_2caa29fa873bf5a6521888ac","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_c3536916-4f1f-4327-a7ff-daafef67a6f8","section_id":"sec_100de779-ada2-41ab-8d3a-32e40cec2aef","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":22,"end":24,"exact":"基板","quote":"- チップ数\n- チップ間ネットワーク\n- 基板\n- 電源\n- 通信回路\n- ソフトウェア","quote_start":0,"quote_end":45,"text_sha256":"b782213c4913923d41d695ee86b0f92ac44986e2d28b195d3c90eb0626a143a2","block_sha256":"b782213c4913923d41d695ee86b0f92ac44986e2d28b195d3c90eb0626a143a2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_c3536916-4f1f-4327-a7ff-daafef67a6f8"},{"id":"occ_495e44ee321ea9ad0421eeb5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_015de213-2e0c-4dff-af82-82d98e267914","section_id":"sec_699be11c-0f23-4ca9-9184-41a4f579cd77","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":27,"end":29,"exact":"基板","quote":"EMIBでは局所的なブリッジだけを使うため、パッケージ基板を通じた電源供給の自由度を残しやすい。","quote_start":0,"quote_end":48,"text_sha256":"b530372c15d17e99106660bfc2adbf716777536722444916815aa694d9dd3057","block_sha256":"b530372c15d17e99106660bfc2adbf716777536722444916815aa694d9dd3057","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_015de213-2e0c-4dff-af82-82d98e267914"},{"id":"occ_0f964540cf523679fe38858a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_01e6491f-6dcb-4f09-8505-091b2b7c0861","section_id":"sec_fd386fe8-85a4-4486-b9da-f7c400af6a1f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"パッケージ基板より細かな配線を形成できるため、ダイ間を多数の短い配線で接続できる。","quote_start":0,"quote_end":41,"text_sha256":"d0856da6ccf7a4a8581e96ee232cea71d1ec29840f75c5808fb380f6c50b0ebb","block_sha256":"d0856da6ccf7a4a8581e96ee232cea71d1ec29840f75c5808fb380f6c50b0ebb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_01e6491f-6dcb-4f09-8505-091b2b7c0861"},{"id":"occ_5efa85648023dfbc43277fa1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_1859c64d-ccc8-4963-96e9-875214569687","section_id":"sec_7941d944-9425-4464-a66b-70a87d66eb98","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"有機基板型のStandard Packageは、最高密度が不要な製品で有力である。","quote_start":0,"quote_end":41,"text_sha256":"3ea5b7adfc8aa0c01375225232931573ce67cce67a069686e91a94d692e15a54","block_sha256":"3ea5b7adfc8aa0c01375225232931573ce67cce67a069686e91a94d692e15a54","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_1859c64d-ccc8-4963-96e9-875214569687"},{"id":"occ_83afbd6fb6d7f27550b92c40","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_18854f25-1aa3-4739-bb1e-65819beecd26","section_id":"sec_c4e61b44-c574-4d33-81c2-8336aab38e40","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":24,"end":26,"exact":"基板","quote":"一般的な半導体製品では、シリコンダイをパッケージ基板へ搭載し、そのパッケージをマザーボードへ取り付ける。","quote_start":0,"quote_end":52,"text_sha256":"576bd74bb59deb8a142d6698ca1b76a7708cae68814ca6692ec66dbb8ff9c359","block_sha256":"576bd74bb59deb8a142d6698ca1b76a7708cae68814ca6692ec66dbb8ff9c359","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_18854f25-1aa3-4739-bb1e-65819beecd26"},{"id":"occ_ec18742802e9d11984f2385e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_1ad4fea0-a81e-4c83-9bfc-8ab5a67e7111","section_id":"sec_91a3862c-e1c4-427c-8866-885c8b4c8918","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":149,"end":151,"exact":"基板","quote":"──●────┘\n════════════════════════════\n          有機パッケージ基板\n```","quote_start":94,"quote_end":155,"text_sha256":"15030c0bd62d48170a5beb4a3f6e134772d7a3d4eb870faf45e436a82f615aed","block_sha256":"15030c0bd62d48170a5beb4a3f6e134772d7a3d4eb870faf45e436a82f615aed","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_1ad4fea0-a81e-4c83-9bfc-8ab5a67e7111"},{"id":"occ_47b7640976b63dbb9e0803e8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_2a85764b-4502-4c7d-9c5b-3cf577cfa6cd","section_id":"sec_91a3862c-e1c4-427c-8866-885c8b4c8918","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"## 有機基板の上にダイを並べる","quote_start":0,"quote_end":16,"text_sha256":"9c7d11e9ee37b2b0f006989ea9d5c01400fd31ace525895c1861ef53ad2300fb","block_sha256":"9c7d11e9ee37b2b0f006989ea9d5c01400fd31ace525895c1861ef53ad2300fb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_2a85764b-4502-4c7d-9c5b-3cf577cfa6cd"},{"id":"occ_6806dcf58743100ea82a50c0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_394ab9f5-31ac-43e6-ba00-21405ec1098f","section_id":"sec_2d1f9016-5169-4dbf-90f6-02b90d7d5d6d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"しかし、通常の平面的なパッケージ基板に加え、半導体製造に近い微細配線層を使うため、慣例的に**2.5D**と呼ばれる。","quote_start":0,"quote_end":59,"text_sha256":"6a6abd53ed31ada3b8eb30198b3a8a7c6f4090bb2ac6e556f47b4dc30a47e401","block_sha256":"6a6abd53ed31ada3b8eb30198b3a8a7c6f4090bb2ac6e556f47b4dc30a47e401","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_394ab9f5-31ac-43e6-ba00-21405ec1098f"},{"id":"occ_d73970c85d76af88767cb5a5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_3e1b8633-f299-4236-a2fb-3dee8be92770","section_id":"sec_60a97ef1-0282-4f2e-9ddc-6a0f4415ba26","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":198,"end":200,"exact":"基板","quote":"   シリコンブリッジ\n────────────────────────────\n            有機基板\n```","quote_start":143,"quote_end":204,"text_sha256":"42558cc0edf2187346b11f7f9125e9faa7eadec5e508c92d5cfb8fdb83d42a4d","block_sha256":"42558cc0edf2187346b11f7f9125e9faa7eadec5e508c92d5cfb8fdb83d42a4d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_3e1b8633-f299-4236-a2fb-3dee8be92770"},{"id":"occ_efa5c3027c4c027572af2a2d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_417706c6-dd8a-48f6-83a6-d75be5a4aa0b","section_id":"sec_8b381af7-9bad-4757-ada3-30c27b0d9ce4","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":23,"end":25,"exact":"基板","quote":"```\nStandard Package\n有機基板中心\n長い配線・粗いピッチ\n\nAdvanced Package\nインターポーザー／ブリッジ／RDL\n短い配線・細かなピッチ\n```","quote_start":0,"quote_end":90,"text_sha256":"5fc5a9730fa1108bd281460b6889ffe97ee21df59d60238db545a3a1b723ad59","block_sha256":"5fc5a9730fa1108bd281460b6889ffe97ee21df59d60238db545a3a1b723ad59","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_417706c6-dd8a-48f6-83a6-d75be5a4aa0b"},{"id":"occ_55fcee5048508f57f0978ad9","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_4d72bcbc-217d-428c-8689-5440a698653a","section_id":"sec_91a3862c-e1c4-427c-8866-885c8b4c8918","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":13,"end":15,"exact":"基板","quote":"ダイ間の信号は、パッケージ基板内の銅配線を通る。","quote_start":0,"quote_end":24,"text_sha256":"a9705607842339c8d7c103942f480b3fdbb15c651ead2f31d73d196c26cf9e15","block_sha256":"a9705607842339c8d7c103942f480b3fdbb15c651ead2f31d73d196c26cf9e15","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_4d72bcbc-217d-428c-8689-5440a698653a"},{"id":"occ_19419e5022ce94e0720c61e5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_5daa6cbb-55d0-4ee3-a679-3e7659ed617a","section_id":"sec_699be11c-0f23-4ca9-9184-41a4f579cd77","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":5,"end":7,"exact":"基板","quote":"パッケージ基板へ小型シリコンブリッジを埋め込み、隣接するダイ同士を高密度に接続する2.5D技術である。","quote_start":0,"quote_end":51,"text_sha256":"b345d0f3eab88e991f2832354e614325acf9f7a0e39ace758c63ec60a1064cfe","block_sha256":"b345d0f3eab88e991f2832354e614325acf9f7a0e39ace758c63ec60a1064cfe","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_5daa6cbb-55d0-4ee3-a679-3e7659ed617a"},{"id":"occ_0fa1cf000d8cf0c70b546bfd","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_633051cd-cab0-49f8-b710-d01a7af259d4","section_id":"sec_37fe3199-34f2-4aa4-8a93-957a790be687","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":29,"end":31,"exact":"基板","quote":"方式ダイの配置主な接続基盤2D横方向に並べる有機パッケージ基板2.5D横方向に並べるインターポーザーやシリコンブリッジ3D上下方向に積むベースダイ、Hybrid Bondingなど","quote_start":0,"quote_end":90,"text_sha256":"4aa274d629a902901999a3622524bca9208b8d23f1bcdbe02e9a6c970b93afc8","block_sha256":"4aa274d629a902901999a3622524bca9208b8d23f1bcdbe02e9a6c970b93afc8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_633051cd-cab0-49f8-b710-d01a7af259d4"},{"id":"occ_686ea7df6f0a98e16fb26ddc","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_6c098a90-f0a7-4039-a8a4-9b474236848b","section_id":"sec_33347473-e60a-4dd5-96e6-0066dd7238b1","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":21,"end":23,"exact":"基板","quote":"従来のパッケージは、シリコンダイを保護し、基板へ接続する役割が中心だった。","quote_start":0,"quote_end":37,"text_sha256":"65189295ae3a7f9125e394691102360df97fb0fc08f3738697fda3c69b905791","block_sha256":"65189295ae3a7f9125e394691102360df97fb0fc08f3738697fda3c69b905791","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_6c098a90-f0a7-4039-a8a4-9b474236848b"},{"id":"occ_5870ccf759c9f21b6b4b04c9","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_7191fb94-460a-4efb-b4de-4139811b3967","section_id":"sec_20a55312-563f-47a8-aadb-007c4329d60e","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":59,"end":61,"exact":"基板","quote":"ロジックダイ\n      ↓ マイクロバンプ\nシリコンインターポーザー\n      ↓ TSVなど\nパッケージ基板\n```","quote_start":4,"quote_end":65,"text_sha256":"5325771097fca761556c94ed53bb736a104af20d532fa3456e45ddb7f6eaadcb","block_sha256":"5325771097fca761556c94ed53bb736a104af20d532fa3456e45ddb7f6eaadcb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_7191fb94-460a-4efb-b4de-4139811b3967"},{"id":"occ_a99d599d2f09a31c8c8ccfc5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_74c5eb3d-7531-4b6e-b981-555ee0404246","section_id":"sec_fd386fe8-85a4-4486-b9da-f7c400af6a1f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"複数のダイとパッケージ基板の間に置く、中間配線層である。","quote_start":0,"quote_end":28,"text_sha256":"157907bbe3d26d1021701ef94b1055528a965b655d5b4e94760d37f9a08d1fc5","block_sha256":"157907bbe3d26d1021701ef94b1055528a965b655d5b4e94760d37f9a08d1fc5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_74c5eb3d-7531-4b6e-b981-555ee0404246"},{"id":"occ_32e41264bfd8269a3a3bb5f4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_7f724eb5-de36-4fd4-936d-99de60068f1b","section_id":"sec_c4e61b44-c574-4d33-81c2-8336aab38e40","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":63,"end":65,"exact":"基板","quote":"ダイ\n      ↓\nバンプ・接続端子\n      ↓\nインターポーザー／ブリッジ\n      ↓\nパッケージ基板\n      ↓\nBGAはんだボール\n      ↓\nマザーボード\n```","quote_start":8,"quote_end":102,"text_sha256":"68b11689ebd4bdced7ee5ab8b4a461f3a4fe0d1b5ba3325599def2fdfaf972ce","block_sha256":"68b11689ebd4bdced7ee5ab8b4a461f3a4fe0d1b5ba3325599def2fdfaf972ce","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_7f724eb5-de36-4fd4-936d-99de60068f1b"},{"id":"occ_1201a124d4efe893d4e1b683","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_809bbc6a-c030-4db9-9c0e-a0e37b2f4cd4","section_id":"sec_a7ec5843-4e1c-49a4-8633-1be56653242d","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":78,"end":80,"exact":"基板","quote":"要な場所だけ高密度配線を使える\n- シリコン面積を抑えやすい\n- パッケージを拡張しやすい\n- 電源配線を有機基板側へ配置しやすい","quote_start":23,"quote_end":88,"text_sha256":"a7e006bf144ba1ce8f7ae06750f04fa60c374f91a5b6f0ee03017e24ec6a3fbb","block_sha256":"a7e006bf144ba1ce8f7ae06750f04fa60c374f91a5b6f0ee03017e24ec6a3fbb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_809bbc6a-c030-4db9-9c0e-a0e37b2f4cd4"},{"id":"occ_ce83d675cc9a1876ee389daf","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_8f53c23f-af36-4999-9389-eb9e75b69a07","section_id":"sec_02e9970b-0d93-49bb-b314-41af8517e2d4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"ダイとマザーボードの間にある多層基板である。","quote_start":0,"quote_end":22,"text_sha256":"af5e6cff688a6ee133f51ed31e44dafb74db3fee7940401e84b75940dbaefd16","block_sha256":"af5e6cff688a6ee133f51ed31e44dafb74db3fee7940401e84b75940dbaefd16","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_8f53c23f-af36-4999-9389-eb9e75b69a07"},{"id":"occ_212652d7f4fc9eb020f642da","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_9636e8fb-d8e9-4e16-a105-616768df5b86","section_id":"sec_7941d944-9425-4464-a66b-70a87d66eb98","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":23,"end":25,"exact":"基板","quote":"比較的独立した機能ブロックを分割するなら、有機基板の通信性能で十分な場合もある。","quote_start":0,"quote_end":40,"text_sha256":"4453ebdaf2c8b9b34a0f310b857875c73cc8991794a0622b5f3663b4c34af791","block_sha256":"4453ebdaf2c8b9b34a0f310b857875c73cc8991794a0622b5f3663b4c34af791","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_9636e8fb-d8e9-4e16-a105-616768df5b86"},{"id":"occ_887231ba0a0b20bfd56a82f0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_ad4b946f-0cdc-44b7-9fca-0a03b1911e8c","section_id":"sec_1f9eeccc-c48e-4b6d-8930-9bd81923f78e","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":36,"end":38,"exact":"基板","quote":"```\nダイ間の細かな接続\n→ マイクロバンプなど\n\nインターポーザーと基板\n→ C4など\n\nパッケージとマザーボード\n→ BGA\n```","quote_start":0,"quote_end":69,"text_sha256":"f2c80131ae125055a104a4eb29bceb4470c5830bdf341e9ae9b248d132c4a4cc","block_sha256":"f2c80131ae125055a104a4eb29bceb4470c5830bdf341e9ae9b248d132c4a4cc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_ad4b946f-0cdc-44b7-9fca-0a03b1911e8c"},{"id":"occ_0663f581f27146ad382c9686","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_ca535737-9162-400f-a4b6-d4a9fd3034d3","section_id":"sec_07e717ba-09cc-4563-89f2-b2417c24d4cd","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":13,"end":15,"exact":"基板","quote":"```\n| 項目 | 有機基板型2D | シリコンインターポーザー | シリコンブリッジ | RDL／ファンアウト | 3D積層 |\n| ダイ配置 | 横 | 横 | 横 | 横 | 上下 |\n| 配線密度 | 低～中 | 高い ","quote_start":0,"quote_end":115,"text_sha256":"e37d6a7d533a41ee878765edce8fa313da4a95580f56123babed22d75cb5f49c","block_sha256":"e37d6a7d533a41ee878765edce8fa313da4a95580f56123babed22d75cb5f49c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_ca535737-9162-400f-a4b6-d4a9fd3034d3"},{"id":"occ_09ed01ed1ff647087f4dbdb8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_ccc59b74-6b98-455b-b1d6-a1170e255c08","section_id":"sec_731486c1-3751-4f27-8582-1e61aa4a446c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":20,"end":22,"exact":"基板","quote":"ファンアウト型パッケージでは、従来の有機基板や大型シリコンインターポーザーを使わずに、比較的細かな配線と薄いパッケージを実現できる場合がある。","quote_start":0,"quote_end":71,"text_sha256":"1bbcc7032094e6ebeb79734785487cdabdfbeb5152c98cb1b654917deb8f210d","block_sha256":"1bbcc7032094e6ebeb79734785487cdabdfbeb5152c98cb1b654917deb8f210d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_ccc59b74-6b98-455b-b1d6-a1170e255c08"},{"id":"occ_7110bbdf625280c566a5b12e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_cde95c51-279a-4ea8-8fbd-319d73d3bae9","section_id":"sec_7941d944-9425-4464-a66b-70a87d66eb98","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":22,"end":24,"exact":"基板","quote":"```\n通信量が少ない\n      ↓\n有機基板でも実用的\n      ↓\n先端インターポーザーを省略\n      ↓\nパッケージコストを抑える\n```","quote_start":0,"quote_end":76,"text_sha256":"617de979dc55ca9a25ef9cdeec7bffa978a042f3c999e90fbdb5e5f4f34e0dca","block_sha256":"617de979dc55ca9a25ef9cdeec7bffa978a042f3c999e90fbdb5e5f4f34e0dca","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_cde95c51-279a-4ea8-8fbd-319d73d3bae9"},{"id":"occ_5f8dc24e45332956beff062f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_d054d73b-a080-4c4e-ab79-1e861c695935","section_id":"sec_20a55312-563f-47a8-aadb-007c4329d60e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":34,"end":36,"exact":"基板","quote":"シリコンインターポーザーは、シリコン上に細かな金属配線を形成した中間基板である。","quote_start":0,"quote_end":40,"text_sha256":"06713727a99924720c2abab234b073c720f93599039fd68c672b340838d6b8c4","block_sha256":"06713727a99924720c2abab234b073c720f93599039fd68c672b340838d6b8c4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_d054d73b-a080-4c4e-ab79-1e861c695935"},{"id":"occ_30434604a16ba7bce524a845","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_d1bcd6a4-f0a1-41a3-8f2b-daed387082ec","section_id":"sec_1b226022-dfb3-4f18-81d9-889c23cc376c","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":51,"end":53,"exact":"基板","quote":"```\nロジック・HBM\n      ↓\nインターポーザーウェハー上で統合\n      ↓\nパッケージ基板へ搭載\n```","quote_start":0,"quote_end":60,"text_sha256":"05e6c219e5422b9cdf789c69d25d30b0c5ac03f469d907b44573dc89fedad05e","block_sha256":"05e6c219e5422b9cdf789c69d25d30b0c5ac03f469d907b44573dc89fedad05e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_d1bcd6a4-f0a1-41a3-8f2b-daed387082ec"},{"id":"occ_0d5f93711d341011ec3b74ec","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_d7697315-f4be-43f5-b14c-8f4f8409d892","section_id":"sec_60a97ef1-0282-4f2e-9ddc-6a0f4415ba26","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":41,"end":43,"exact":"基板","quote":"ダイ間の境界部分だけはシリコン上の微細配線で接続し、それ以外の電源や低速信号は有機基板へ流す。","quote_start":0,"quote_end":47,"text_sha256":"a3a3872f83bbe36eeda267631b405fdb246c739254f4959bca0e5fd668f7efe1","block_sha256":"a3a3872f83bbe36eeda267631b405fdb246c739254f4959bca0e5fd668f7efe1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_d7697315-f4be-43f5-b14c-8f4f8409d892"},{"id":"occ_131c19910ee884b4bd039300","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_d8ac7381-623d-4e90-aebe-51ca269c9314","section_id":"sec_37fe3199-34f2-4aa4-8a93-957a790be687","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":4,"end":6,"exact":"基板","quote":"- 有機基板上にダイを横並びにする構造\n- 微細配線層を介して横並びにする構造\n- ダイを上下へ積層する構造","quote_start":0,"quote_end":54,"text_sha256":"73ca8a8001fd12afd44d1d063eba2baedc1ae1ffff252bd4828da45e64632804","block_sha256":"73ca8a8001fd12afd44d1d063eba2baedc1ae1ffff252bd4828da45e64632804","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_d8ac7381-623d-4e90-aebe-51ca269c9314"},{"id":"occ_1bd881369b7e2f980cb5a744","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_da746b67-7643-475a-a4bf-dbb1366671b3","section_id":"sec_2d1f9016-5169-4dbf-90f6-02b90d7d5d6d","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":197,"end":199,"exact":"基板","quote":"コンインターポーザー\n────────────────────────────\n          パッケージ基板\n```","quote_start":142,"quote_end":203,"text_sha256":"074f9d0ae69a83179f9dfeb1935f0ea4ac69040dad67aaa6a34f7ae85e0e27ca","block_sha256":"074f9d0ae69a83179f9dfeb1935f0ea4ac69040dad67aaa6a34f7ae85e0e27ca","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_da746b67-7643-475a-a4bf-dbb1366671b3"},{"id":"occ_fbc08cd11ab91d70a93174b0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_e1b72924-170f-447c-9d47-38dca65ee321","section_id":"sec_9c390a36-b88b-4ba5-9db5-cce18b424879","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"有機基板を使ったStandard Packageが有力になる。","quote_start":0,"quote_end":31,"text_sha256":"278bbad470543ca5a704e23d94a407e7afc0244365169a21ea10eec2ee79e9a0","block_sha256":"278bbad470543ca5a704e23d94a407e7afc0244365169a21ea10eec2ee79e9a0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_e1b72924-170f-447c-9d47-38dca65ee321"},{"id":"occ_cea1cbb4d4022b0dbf4e2640","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_e82f9051-bb43-4305-9d95-6b18a6666af2","section_id":"sec_5365b45d-cf90-4529-bd52-b7bdd7dfca19","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":81,"end":83,"exact":"基板","quote":"複数ダイを1つのシステムへ統合する基盤である。\n- **2D／Standard Package**は、主に有機基板でダイを横方向へ接続する。低コストだが、配線密度と距離に制約がある。\n- **2.5D**では、シリコンインターポーザー、シリコンブリッジ、RDLなどを使い、横並びのダイを高密度に接続する。\n- **","quote_start":26,"quote_end":183,"text_sha256":"5dcaa34390d7ebc62332c437507138763a0687aeb2f1cf71439c063c8b2aef15","block_sha256":"5dcaa34390d7ebc62332c437507138763a0687aeb2f1cf71439c063c8b2aef15","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_e82f9051-bb43-4305-9d95-6b18a6666af2"},{"id":"occ_568e5cda7090d55a69f3c43f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_e9cebc38-3a23-48f7-9eb6-88cc2cb60408","section_id":"sec_5eb1cd3b-713c-425d-91f4-40af8c1dedaf","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"有機基板よりも細い配線と細かな接続ピッチを形成しやすいためである。","quote_start":0,"quote_end":33,"text_sha256":"e7df8a5f965212a58b97841edefbee96ac509b864ae9d744cfb55f98ffbce874","block_sha256":"e7df8a5f965212a58b97841edefbee96ac509b864ae9d744cfb55f98ffbce874","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_e9cebc38-3a23-48f7-9eb6-88cc2cb60408"},{"id":"occ_6da04313992bafee28d87e49","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_f3f2a70d-d4f8-4da5-8b5a-2c828502b3c9","section_id":"sec_91a3862c-e1c4-427c-8866-885c8b4c8918","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":33,"end":35,"exact":"基板","quote":"最も基本的なチップレット構成では、複数のダイを1枚の有機パッケージ基板へ搭載する。","quote_start":0,"quote_end":41,"text_sha256":"33456035132061bb86cb7892d760f926f2e83b26c25cd15b1c22a81ec46bb6ac","block_sha256":"33456035132061bb86cb7892d760f926f2e83b26c25cd15b1c22a81ec46bb6ac","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_f3f2a70d-d4f8-4da5-8b5a-2c828502b3c9"},{"id":"occ_f3443fd765a88f4185a65fd0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_f5aff034-19fa-4755-8a13-57c33f70eda2","section_id":"sec_02e9970b-0d93-49bb-b314-41af8517e2d4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":8,"end":10,"exact":"基板","quote":"## パッケージ基板","quote_start":0,"quote_end":10,"text_sha256":"3cb1da5613758d47e320bb8da3d961c93e50a8c5c6c38901f0cc0b51f5e403f3","block_sha256":"3cb1da5613758d47e320bb8da3d961c93e50a8c5c6c38901f0cc0b51f5e403f3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_f5aff034-19fa-4755-8a13-57c33f70eda2"},{"id":"occ_858a8ad3a4f6fa6d67c48b97","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_f8bc464f-396a-4d18-bf06-5b2c5cc22f03","section_id":"sec_02e9970b-0d93-49bb-b314-41af8517e2d4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":29,"end":31,"exact":"基板","quote":"高性能CPUやGPUでは、細かな銅配線を形成した有機材料の基板が広く使われる。","quote_start":0,"quote_end":39,"text_sha256":"9be18461653070ac3eb87ea90d432df68256821cfa76e12d3f01faee304895ba","block_sha256":"9be18461653070ac3eb87ea90d432df68256821cfa76e12d3f01faee304895ba","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_f8bc464f-396a-4d18-bf06-5b2c5cc22f03"},{"id":"occ_44785a06173ea0e8279fd226","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_a8af9681-d20e-4553-871e-1d7168015faf","work_id":"wrk_0a52ed54-a7c0-47ca-8fe2-45b791455a54","block_id":"blk_08d0aeb0-f01a-4595-b47d-eaf88d55c7d9","section_id":"sec_110f7643-1f90-4885-8b1c-192ed981a324","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":0,"end":3,"exact":"PCB","quote":"PCB/Substrate","quote_start":0,"quote_end":13,"text_sha256":"46b910fd3c2e6370240ee5cddaa31d372625fcb1b0c0ae3ce549342e4552bda3","block_sha256":"46b910fd3c2e6370240ee5cddaa31d372625fcb1b0c0ae3ce549342e4552bda3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a8af9681-d20e-4553-871e-1d7168015faf/#blk_08d0aeb0-f01a-4595-b47d-eaf88d55c7d9"},{"id":"occ_f3c71717beeaeff6cfd1a69d","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_6a031a49-0694-4b12-8699-11306ef940aa","section_id":"sec_a520ab4e-5949-44bb-8a45-30a0fd5e6309","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":44,"end":46,"exact":"基板","quote":"MarvellはXPU CPOで、XPUパッケージから銅配線をできるだけ外へ出さず、同一基板上で光へ変換する。これにより、XPU間接続の距離を銅より大幅に伸ばし、複数ラックにまたがるscale-up domainを作ろうとしている。","quote_start":0,"quote_end":116,"text_sha256":"5319457097a61a9de8a5ba77f65515f1a125787bb8ef341750cf2fb756764c5c","block_sha256":"5319457097a61a9de8a5ba77f65515f1a125787bb8ef341750cf2fb756764c5c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_6a031a49-0694-4b12-8699-11306ef940aa"},{"id":"occ_0e2afb4d7b7dddff8aa57a20","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_9d1b430f-9ba6-4a46-abee-5fa248d94e32","section_id":"sec_5b7d0ad4-5a76-48ae-94d7-7db2810bd2f1","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":82,"end":84,"exact":"基板","quote":"pute silicon、HBM、その他chipletと、Marvellの3D SiPho Engineを同じ基板上に配置する。6.4T 3D SiPho Engineは、32チャネル×200Gの電気・光インターフェースを持ち、XPU間接続を銅より長く、低電力にすることを狙う。","quote_start":27,"quote_end":166,"text_sha256":"705833b0826e83a413d5417a91d6c3d779600c0c6cb771cf1854b0e7f7618928","block_sha256":"705833b0826e83a413d5417a91d6c3d779600c0c6cb771cf1854b0e7f7618928","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_9d1b430f-9ba6-4a46-abee-5fa248d94e32"},{"id":"occ_76325581afdf673a95444676","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_afc88027-978f-428a-a597-dd5d129dc441","work_id":"wrk_9fae1367-ebbb-47c5-ad7b-3700deb207cd","block_id":"blk_1d5a15d5-654e-4714-9b0b-cb886420fd91","section_id":"sec_d105a956-b8c3-460f-b7e3-738d9d8fba12","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":29,"end":31,"exact":"基板","quote":"深圳、東莞、蘇州、常州、無錫、上海周辺などには、電子部品、基板、センサー、モーター、金型、筐体、ケーブル、電池、電源、光学部品、カメラモジュール、組立工場が密集しています。","quote_start":0,"quote_end":86,"text_sha256":"f3622875c4ae6008a7638bbc59eb7d5ea5b6d58b2b2b26952539058cb50d212d","block_sha256":"f3622875c4ae6008a7638bbc59eb7d5ea5b6d58b2b2b26952539058cb50d212d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_afc88027-978f-428a-a597-dd5d129dc441/#blk_1d5a15d5-654e-4714-9b0b-cb886420fd91"},{"id":"occ_fa66b6aca1446bc4aab66fcc","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_afc88027-978f-428a-a597-dd5d129dc441","work_id":"wrk_9fae1367-ebbb-47c5-ad7b-3700deb207cd","block_id":"blk_8c0478d3-721a-464f-b7fd-1c3f93044552","section_id":"sec_630f0dd2-ed94-4b8c-832d-5bfcd420c22f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":50,"end":52,"exact":"基板","quote":"たとえば、ロボットを作るにはモデルだけでは足りません。モーター、減速機、センサー、バッテリー、筐体、基板、カメラ、通信モジュール、電源、工場、組立、検査、保守網が必要です。","quote_start":0,"quote_end":86,"text_sha256":"a3f1abb3fac562f7d76bcf88920e12cbf43adc23bb0e7c9b398ea0a6acc9eb85","block_sha256":"a3f1abb3fac562f7d76bcf88920e12cbf43adc23bb0e7c9b398ea0a6acc9eb85","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_afc88027-978f-428a-a597-dd5d129dc441/#blk_8c0478d3-721a-464f-b7fd-1c3f93044552"},{"id":"occ_d440109d4d63fe4874467035","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ba807781-44a3-4752-b057-ee36fa97b60c","work_id":"wrk_2624cbb6-ebd3-4127-a538-84567d7087a4","block_id":"blk_06334e5d-a49b-42c0-9cdc-53df84d17867","section_id":"sec_6cb6c728-6787-4a1b-b3fb-44c4f5df10b6","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":87,"end":89,"exact":"基板","quote":"−−−−−−−−−  ┌──┐\n──┘  └──────────────┘  └──\n          p型基板","quote_start":32,"quote_end":89,"text_sha256":"7cd84c207b3194ec923527e766a4fb2a5bdda3a8498435a1d6a4e4066974de7e","block_sha256":"7cd84c207b3194ec923527e766a4fb2a5bdda3a8498435a1d6a4e4066974de7e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ba807781-44a3-4752-b057-ee36fa97b60c/#blk_06334e5d-a49b-42c0-9cdc-53df84d17867"},{"id":"occ_2804e330aef0b3b374a9dd36","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ba807781-44a3-4752-b057-ee36fa97b60c","work_id":"wrk_2624cbb6-ebd3-4127-a538-84567d7087a4","block_id":"blk_5adae4b4-0967-4f0d-ba04-87b8d38078f3","section_id":"sec_0eed4d3b-6eed-4cfa-b41f-c8610a7cc1e2","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"また、同じシリコン上の素子が基板を通じてつながらないよう、深い拡散層や接合分離を作らなければならなかった。","quote_start":0,"quote_end":53,"text_sha256":"7793dbf92322d87393391f119849461682d4012bdb8bd680fde478848c153657","block_sha256":"7793dbf92322d87393391f119849461682d4012bdb8bd680fde478848c153657","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ba807781-44a3-4752-b057-ee36fa97b60c/#blk_5adae4b4-0967-4f0d-ba04-87b8d38078f3"},{"id":"occ_2a2cef8006d3fe05a1de9146","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ba807781-44a3-4752-b057-ee36fa97b60c","work_id":"wrk_2624cbb6-ebd3-4127-a538-84567d7087a4","block_id":"blk_7f45f554-35a4-404f-b33f-fc0d0f4b89d4","section_id":"sec_85141e74-5602-4b7d-a715-2850a46e2025","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":6,"end":8,"exact":"基板","quote":"p型シリコン基板\n        ↓\nソース・ドレイン領域を形成\n        ↓\n表面へ薄い酸化膜を作る\n        ↓\n酸化膜上へゲートを形成\n        ↓\n接触窓と金属配線を形成","quote_start":0,"quote_end":98,"text_sha256":"69676f9d8299e86de83c6d05827f4cddf997954564b4708dd5a0035280134d68","block_sha256":"69676f9d8299e86de83c6d05827f4cddf997954564b4708dd5a0035280134d68","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ba807781-44a3-4752-b057-ee36fa97b60c/#blk_7f45f554-35a4-404f-b33f-fc0d0f4b89d4"},{"id":"occ_01a02bee688cdff642693140","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ba807781-44a3-4752-b057-ee36fa97b60c","work_id":"wrk_2624cbb6-ebd3-4127-a538-84567d7087a4","block_id":"blk_b2867ff4-a1e0-4822-a448-45bdc9aed640","section_id":"sec_4e3ecebd-6d28-48c9-88ab-97afb72812cc","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":0,"end":2,"exact":"基板","quote":"基板のドーピング濃度","quote_start":0,"quote_end":10,"text_sha256":"cf2c2fddbe649083ed53060b8e4a468a0d06fa80f366bcc7cf749ce17900da57","block_sha256":"cf2c2fddbe649083ed53060b8e4a468a0d06fa80f366bcc7cf749ce17900da57","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ba807781-44a3-4752-b057-ee36fa97b60c/#blk_b2867ff4-a1e0-4822-a448-45bdc9aed640"},{"id":"occ_9891179b680b400ae8f30ea4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ba807781-44a3-4752-b057-ee36fa97b60c","work_id":"wrk_2624cbb6-ebd3-4127-a538-84567d7087a4","block_id":"blk_c0bf1f87-195b-419e-bafb-e4810c58e8ac","section_id":"sec_76f9e8f6-4bfc-498b-92c5-9f7c72bc2ac2","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":47,"end":49,"exact":"基板","quote":"ゲート\n══════════\n酸化膜\n██████████\n空乏層\n──────────\np型基板\n○ ○ ○ ○ ○","quote_start":0,"quote_end":59,"text_sha256":"9fa7290a4cf964ed7fb1269a719b1d02fe3cb330709a10a7c3fa60a13b692d17","block_sha256":"9fa7290a4cf964ed7fb1269a719b1d02fe3cb330709a10a7c3fa60a13b692d17","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ba807781-44a3-4752-b057-ee36fa97b60c/#blk_c0bf1f87-195b-419e-bafb-e4810c58e8ac"},{"id":"occ_c476bd64533724a0fcfd272b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ba807781-44a3-4752-b057-ee36fa97b60c","work_id":"wrk_2624cbb6-ebd3-4127-a538-84567d7087a4","block_id":"blk_f390aa70-81b4-480d-b1b7-aa6cb4bfbf93","section_id":"sec_76f9e8f6-4bfc-498b-92c5-9f7c72bc2ac2","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"p型シリコンを基板として使うnチャネルMOSFETを考える。","quote_start":0,"quote_end":30,"text_sha256":"2e1a09936391a17cb330182f51ea56557371f29bf6b23b047417b4713b05117b","block_sha256":"2e1a09936391a17cb330182f51ea56557371f29bf6b23b047417b4713b05117b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ba807781-44a3-4752-b057-ee36fa97b60c/#blk_f390aa70-81b4-480d-b1b7-aa6cb4bfbf93"},{"id":"occ_7b446b23bac5c3369fffb72a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bbd7c7cc-2c2f-4ae5-b5ff-2c79a2e13e88","work_id":"wrk_0a43d7eb-6a36-444f-977f-73ef3a3f671a","block_id":"blk_2b8cbee4-c979-4304-a183-bfea745b6778","section_id":"sec_66ab2b23-8648-4967-b7c1-ca789c2fe587","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":72,"end":74,"exact":"基板","quote":"内蔵し、1フェーズあたり100Aピーク電流に対応するSPSを発表している。[2] これは、GPU近傍の限られた基板面積に、より多くのフェーズを詰め込むための方向性を示している。","quote_start":17,"quote_end":105,"text_sha256":"78a149765246e47245bbb8bf91d048d075e6d0f0dc0817d937ba56b0684c4058","block_sha256":"78a149765246e47245bbb8bf91d048d075e6d0f0dc0817d937ba56b0684c4058","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bbd7c7cc-2c2f-4ae5-b5ff-2c79a2e13e88/#blk_2b8cbee4-c979-4304-a183-bfea745b6778"},{"id":"occ_2c8ebae955a93e9110238912","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bbd7c7cc-2c2f-4ae5-b5ff-2c79a2e13e88","work_id":"wrk_0a43d7eb-6a36-444f-977f-73ef3a3f671a","block_id":"blk_4dce22ee-f7bf-4934-8bc2-0dda165cd314","section_id":"sec_60d98a5e-f540-45fd-aaf1-a9e61ff5238b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":24,"end":26,"exact":"基板","quote":"ただし、中国勢がすべての領域で勝つわけではない。基板・GaN単体・汎用MOSFETは価格競争が激しくなりやすい。一方で、車載主機インバータ、AIDC向けSST、SiCモジュール、液冷・熱設計、絶縁、ゲートドライバ、GPU向けSPS/MPC、長期信頼性で","quote_start":0,"quote_end":126,"text_sha256":"8839703a1db964a9b367b0b1d94f3aa5b66783bff3a518b6e43dabc005b256e8","block_sha256":"8839703a1db964a9b367b0b1d94f3aa5b66783bff3a518b6e43dabc005b256e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bbd7c7cc-2c2f-4ae5-b5ff-2c79a2e13e88/#blk_4dce22ee-f7bf-4934-8bc2-0dda165cd314"},{"id":"occ_74fe370c851804b0139b8625","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bbd7c7cc-2c2f-4ae5-b5ff-2c79a2e13e88","work_id":"wrk_0a43d7eb-6a36-444f-977f-73ef3a3f671a","block_id":"blk_7261f707-4ddc-458a-b73c-2261d7a3508e","section_id":"sec_60d98a5e-f540-45fd-aaf1-a9e61ff5238b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":3,"end":5,"exact":"基板","quote":"SiC基板では、2024年にWolfspeedが首位を維持した一方、中国のTanKeBlueとSICCがそれぞれ17％台の世界シェアを取り、中国勢の存在感が急上昇している。[12] 8インチSiCも、中国勢が量","quote_start":0,"quote_end":105,"text_sha256":"ba688418db142a4ef342b95e3023516c6ad2af8734784935b711c60b2ab6fe50","block_sha256":"ba688418db142a4ef342b95e3023516c6ad2af8734784935b711c60b2ab6fe50","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bbd7c7cc-2c2f-4ae5-b5ff-2c79a2e13e88/#blk_7261f707-4ddc-458a-b73c-2261d7a3508e"},{"id":"occ_4e66b5897d14751bfb797906","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bbd7c7cc-2c2f-4ae5-b5ff-2c79a2e13e88","work_id":"wrk_0a43d7eb-6a36-444f-977f-73ef3a3f671a","block_id":"blk_8fabf4d3-e59d-473d-9ade-7fa99ae04c73","section_id":"sec_f1d43a69-28c8-468d-bdd8-4b5df7bce4e7","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":29,"end":31,"exact":"基板","quote":"[12] TrendForceによると、2024年のSiC基板市場でWolfspeedは33.7％、中国のTanKeBlueとSICCはそれぞれ17％台へ伸びています。([TrendForce][12])","quote_start":0,"quote_end":102,"text_sha256":"d93313b19e4b61e0541fd5190a1213904737eb44134f44ac4bdc171254f72053","block_sha256":"d93313b19e4b61e0541fd5190a1213904737eb44134f44ac4bdc171254f72053","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bbd7c7cc-2c2f-4ae5-b5ff-2c79a2e13e88/#blk_8fabf4d3-e59d-473d-9ade-7fa99ae04c73"},{"id":"occ_d077f036f68d0f472b93ca67","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bbd7c7cc-2c2f-4ae5-b5ff-2c79a2e13e88","work_id":"wrk_0a43d7eb-6a36-444f-977f-73ef3a3f671a","block_id":"blk_c530d862-8a7d-497c-8a5f-5a0e76825b82","section_id":"sec_9079cfd8-9ea4-4889-9846-9680f82ca0a3","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":238,"end":240,"exact":"基板","quote":"はPSU・中間DC-DCで先に伸び、SiCは800VDC/SST/UPS/BBUで伸びる\n6. 中国勢はSiC基板・GaN単体で価格競争を強める\n7. 高信頼モジュール、MPC/SPS、熱設計、AIDC電源システムでは欧米・日本勢の堀が残る","quote_start":183,"quote_end":303,"text_sha256":"37edd44d608c3a481d6b1432e8d53d6bbaa461cb1f32ccf596492712d8fa71ea","block_sha256":"37edd44d608c3a481d6b1432e8d53d6bbaa461cb1f32ccf596492712d8fa71ea","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bbd7c7cc-2c2f-4ae5-b5ff-2c79a2e13e88/#blk_c530d862-8a7d-497c-8a5f-5a0e76825b82"},{"id":"occ_8fc6ab2f4c88802a9bc8e6fc","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_0abf18d7-f8cb-4b07-876f-8d9ef121a29e","section_id":"sec_6043300b-8e37-4fde-830f-8d6c8498112b","layer":"character","character_id":"sil_kathna","count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":3,"end":5,"exact":"基板","quote":"私は「基板」「Device」「System」を、計算する文明へ続く三つの門として石板に刻む。","quote_start":0,"quote_end":46,"text_sha256":"d7226e06bf1f50a61138fd560a6c40fe547937bcb7189a2f6f93f79b311d5140","block_sha256":"d7226e06bf1f50a61138fd560a6c40fe547937bcb7189a2f6f93f79b311d5140","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_0abf18d7-f8cb-4b07-876f-8d9ef121a29e"},{"id":"occ_cd86929a14607f9633a17fde","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_42cfe0e8-f3c2-42bc-a69a-df1db1951076","section_id":"sec_62601599-e7d0-42b1-a71b-a882f4c8c1f3","layer":"character","character_id":"zetu_noia","count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":3,"end":5,"exact":"基板","quote":"私は「基板」「Device」「System」を別々の話題にせず、一つのAIインフラが通過する連続した設計課題として観測します。","quote_start":0,"quote_end":63,"text_sha256":"f5b019b98ea30f4aec432925ba192d277e7fec05583b8562fd8689c5da230944","block_sha256":"f5b019b98ea30f4aec432925ba192d277e7fec05583b8562fd8689c5da230944","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_42cfe0e8-f3c2-42bc-a69a-df1db1951076"},{"id":"occ_59cd4fbe45e9f8419c3e17e4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_485f7f60-ba5a-4f19-ac57-82b86120e3d7","section_id":"sec_091c1c2d-da33-4e7f-94ee-654cd1cbe5d6","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":21,"end":23,"exact":"基板","quote":"## 12．住友電工の最大の強みは「InP基板からCWまで」","quote_start":0,"quote_end":30,"text_sha256":"707ec09f7b9ab56afc33d18af84a41d1479e26cb2fae44f4dbadbb74e8511978","block_sha256":"707ec09f7b9ab56afc33d18af84a41d1479e26cb2fae44f4dbadbb74e8511978","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_485f7f60-ba5a-4f19-ac57-82b86120e3d7"},{"id":"occ_c6ab0f998fec87988e7cf2f9","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_48e5918f-8353-4e25-ae8b-03467e9a76b0","section_id":"sec_85d689e4-1044-4812-afea-bf35dbbc5ca7","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"ここで、InP基板とInP fabを区別する必要がある。","quote_start":0,"quote_end":28,"text_sha256":"1dfd64d96cb76f5f36419b6b3ea7b3bd2f78efdc7a8bf5f53d13b0cb1e266b6f","block_sha256":"1dfd64d96cb76f5f36419b6b3ea7b3bd2f78efdc7a8bf5f53d13b0cb1e266b6f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_48e5918f-8353-4e25-ae8b-03467e9a76b0"},{"id":"occ_a0f8e8015cdd9bf49909162e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_492fbb66-d5e6-4b86-b0b9-8bfd4ca12331","section_id":"sec_091c1c2d-da33-4e7f-94ee-654cd1cbe5d6","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"InP単結晶/基板→ InP device fab→ EML→ 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shortageを読む時は、基板枚数、Epitaxy、Laser Die、Packagingを一つの供給量にまとめない。用途ごとの出力・寿命・波長・顧客認定がCapacityを分断する。","quote_start":0,"quote_end":97,"text_sha256":"ad746944528c81ca94705cc875b9776ff519a2accad4c8781e4ccb53a1029158","block_sha256":"ad746944528c81ca94705cc875b9776ff519a2accad4c8781e4ccb53a1029158","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_6a602b65-bffb-4a49-bbb9-f6391029a3d4"},{"id":"occ_62ecaa40586e9681fb080358","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_9f8aa061-5171-475e-82ed-b501d2dc297f","section_id":"sec_a82e8280-310d-4e76-aad7-a6adbd7ac072","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":12,"end":14,"exact":"基板","quote":"## 3．ただし6インチ基板そのものは外部から買っている","quote_start":0,"quote_end":28,"text_sha256":"3a8a610fd763888a4a2cd95c95cd31e88776a0a8d1b3c379f038484668bb1929","block_sha256":"3a8a610fd763888a4a2cd95c95cd31e88776a0a8d1b3c379f038484668bb1929","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_9f8aa061-5171-475e-82ed-b501d2dc297f"},{"id":"occ_399af3443ad1f7ed0f251ac4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_a0fee356-f367-452f-a592-d5b5c305b1eb","section_id":"sec_4d94ee7c-1c0b-4c5a-84a1-30b7350a8189","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":22,"end":24,"exact":"基板","quote":"「そのInPレーザーを作るための高品質InP基板まで確保しなければならない」","quote_start":0,"quote_end":38,"text_sha256":"7eeb92f784c2e0bee54160a488d96b2879b679d38517e8587ca4fe10a4191a0c","block_sha256":"7eeb92f784c2e0bee54160a488d96b2879b679d38517e8587ca4fe10a4191a0c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_a0fee356-f367-452f-a592-d5b5c305b1eb"},{"id":"occ_63e972d6d13450a41e8f68d1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_ba106a7f-5d45-4075-8145-39db55e4b820","section_id":"sec_6043300b-8e37-4fde-830f-8d6c8498112b","layer":"character","character_id":"sil_kathna","count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":6,"end":8,"exact":"基板","quote":"ゆえに私は、基板・Epi・Fab・後工程の能力を別々に追う。その結果が一時の輝きではなく、繰り返し作り、直し、動かせる秩序になったかを見届ける。","quote_start":0,"quote_end":72,"text_sha256":"da5eb290b439d612578c6487fc75ff99738fc00b898260fa2707e09a84cb19ae","block_sha256":"da5eb290b439d612578c6487fc75ff99738fc00b898260fa2707e09a84cb19ae","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_ba106a7f-5d45-4075-8145-39db55e4b820"},{"id":"occ_71857d58f3caaddc0a760c35","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_bdf13570-2246-4395-921a-712fddc0fe9e","section_id":"sec_4d94ee7c-1c0b-4c5a-84a1-30b7350a8189","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":25,"end":27,"exact":"基板","quote":"という、EML・CW-LD・DFBレーザー・InP基板・CPO ELSを長年積み上げてきた企業群が存在する。","quote_start":0,"quote_end":54,"text_sha256":"e71a1f07d0e368bccd310842911af58184eb60ba293124ceca43e6fb12cf4ca3","block_sha256":"e71a1f07d0e368bccd310842911af58184eb60ba293124ceca43e6fb12cf4ca3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_bdf13570-2246-4395-921a-712fddc0fe9e"},{"id":"occ_421a133ac13fe718143009b3","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_bdff21ef-9f38-4698-be45-e39455f48fc1","section_id":"sec_14aead06-a57d-4581-9157-33c02ec03f51","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":41,"end":43,"exact":"基板","quote":"だからCoherentは6インチを急拡大し、Lumentumは2031年までInP基板を予約し、三菱電機はEML capacityを3倍超へ増やし、住友電工はInP基板とoptical deviceを同時増産し、古河電工はDFBを500%以上へ増強するのである。","quote_start":0,"quote_end":131,"text_sha256":"92a58a3ba759a26d7f8d750f1f84c739447da99033df65455f50eae7e089879a","block_sha256":"92a58a3ba759a26d7f8d750f1f84c739447da99033df65455f50eae7e089879a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_bdff21ef-9f38-4698-be45-e39455f48fc1"},{"id":"occ_acfcb212260aca507d77f1ba","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_da813149-17ba-4a5e-a253-6ec76c63f8c2","section_id":"sec_85d689e4-1044-4812-afea-bf35dbbc5ca7","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":18,"end":20,"exact":"基板","quote":"InP原料→ InP単結晶→ InP基板→ 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CPO","quote_start":0,"quote_end":100,"text_sha256":"56697109def45af5786a0021487ad8de80a57e9d02f9ede6e40c50825ccef277","block_sha256":"56697109def45af5786a0021487ad8de80a57e9d02f9ede6e40c50825ccef277","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_da813149-17ba-4a5e-a253-6ec76c63f8c2"},{"id":"occ_98d0c9f74b63b610f1bd6bda","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_dc363db6-074c-4aa4-8aca-098a9719bd97","section_id":"sec_b00578a9-699a-4786-b90d-4c1550c3ae18","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":44,"end":46,"exact":"基板","quote":"| 層 | 観測対象 | 問うべきこと |\n| --- | --- | --- |\n| 基板 | 3/4/6インチInP | 径、結晶品質、外部調達比率 |\n| Device | EML・CW・UHP-CW | 出力、波長、信頼性、歩留まり |\n| System | Pluggable・EL","quote_start":0,"quote_end":146,"text_sha256":"a7b2710e0f322144a2daae0cf2200df7cd93d7c6bc5e913f80aeab5962562d7a","block_sha256":"a7b2710e0f322144a2daae0cf2200df7cd93d7c6bc5e913f80aeab5962562d7a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_dc363db6-074c-4aa4-8aca-098a9719bd97"},{"id":"occ_164b932189d3b733f2c66faa","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_df6439ba-76c0-4bd3-9c70-aa90f1b8c6bf","section_id":"sec_2c77788f-40bc-4c3e-ba90-4e445335a433","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"## 8．Lumentumも基板確保を急いでいる","quote_start":0,"quote_end":24,"text_sha256":"d62f6f524b045308729570322f63394f8f52d6e290ac482d5412e822f7154985","block_sha256":"d62f6f524b045308729570322f63394f8f52d6e290ac482d5412e822f7154985","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_df6439ba-76c0-4bd3-9c70-aa90f1b8c6bf"},{"id":"occ_1f5661651f3800a53cff2de5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_e84dafff-f8af-459b-bf60-9c826306afa0","section_id":"sec_a82e8280-310d-4e76-aad7-a6adbd7ac072","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"Coherentの強みは「InP基板を全部自作すること」ではなく、確保した基板を6インチfabで非常に効率よく高付加価値deviceへ変換することにある。","quote_start":0,"quote_end":77,"text_sha256":"d46b2d07ff31624ff9df9ba7a412c91ae542e0f09341761b1e97358f7336dfca","block_sha256":"d46b2d07ff31624ff9df9ba7a412c91ae542e0f09341761b1e97358f7336dfca","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_e84dafff-f8af-459b-bf60-9c826306afa0"},{"id":"occ_cb14b84571aded2e8f74e65b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bc9f6006-9722-468f-9c61-028e4f328422","work_id":"wrk_b22b0f52-0a33-42ed-a179-52043d274369","block_id":"blk_f298c29f-2916-43e7-900c-479a675f1539","section_id":"sec_0f7b19b3-2f61-48e0-90ba-71140d62de37","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":2,"end":4,"exact":"基板","quote":"- 基板・Epi・Fab・後工程の能力を別々に追う\n- EML、CW、UHP-CW、ELS/CPOの用途mixを見る\n- 増産発表と顧客Qualification完了を分ける","quote_start":0,"quote_end":87,"text_sha256":"7f9028ba6468a339f32f1df74433181dcef07269026db484653daaf3e9b793f9","block_sha256":"7f9028ba6468a339f32f1df74433181dcef07269026db484653daaf3e9b793f9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bc9f6006-9722-468f-9c61-028e4f328422/#blk_f298c29f-2916-43e7-900c-479a675f1539"},{"id":"occ_a0da8dcf7dfe79744c7d0a96","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_bf97dda8-b55b-4e4d-b1cf-b775474af9b2","work_id":"wrk_72fede57-1e40-4a22-81c2-67b2328ba457","block_id":"blk_a01fad96-cc2c-4b1c-a50d-519dc5a2fca3","section_id":"sec_922975d7-1018-4cbe-b508-9420516b8811","layer":"body","character_id":null,"count":1,"matched_aliases":["T-glass"],"evidence":{"text_basis":"markdown","start":8,"end":15,"exact":"T-glass","quote":"glass / T-glass","quote_start":0,"quote_end":15,"text_sha256":"84bb65a3a1bbe86bbb1e665eeb61d7d9906fb228b6424e8b658edeead0489fd6","block_sha256":"84bb65a3a1bbe86bbb1e665eeb61d7d9906fb228b6424e8b658edeead0489fd6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bf97dda8-b55b-4e4d-b1cf-b775474af9b2/#blk_a01fad96-cc2c-4b1c-a50d-519dc5a2fca3"},{"id":"occ_8cb7cbff556bd7737c764687","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c0f60d6c-f786-4c21-bf93-b517ab98e464","work_id":"wrk_6f052560-2a04-4f53-b80d-4f1c5a329637","block_id":"blk_0accbba7-b722-4b96-9dc9-b75e94a17319","section_id":"sec_87d8e3ca-7e9a-4f93-aa9f-fc10522d519f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":71,"end":73,"exact":"基板","quote":"圧・高負荷で動かし、初期不良を出荷前に炙り出す工程である。SLT、System Level Testは、実際の基板やシステムに近い環境で、OS、ファームウェア、ドライバ、メモリ、I/O、熱、電力を含めて試験する。","quote_start":16,"quote_end":122,"text_sha256":"3540238005c3d3d549313b3a5cfbd964477bb12e08ba1a93d6577d13b282d32b","block_sha256":"3540238005c3d3d549313b3a5cfbd964477bb12e08ba1a93d6577d13b282d32b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c0f60d6c-f786-4c21-bf93-b517ab98e464/#blk_0accbba7-b722-4b96-9dc9-b75e94a17319"},{"id":"occ_09fff5cc21769fe79972e256","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c1c597d3-818f-4d4d-898d-56a2070b189f","work_id":"wrk_4830a588-ef6a-4229-857e-c5b4eff6f7e3","block_id":"blk_16842864-d83e-4270-a3ea-a923ad3dc891","section_id":"sec_28e93903-5da7-4d18-b283-79db7711a61a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":117,"end":119,"exact":"基板","quote":"抵抗率、長いキャリア寿命を重視する用途ではFZが選ばれる。表面に特別な抵抗率や結晶層が必要なら、CZまたはFZ基板へエピタキシャル層を追加する。([sumcosi.com](https://www.sumcosi.com/english/products/process/))","quote_start":62,"quote_end":200,"text_sha256":"d026b8dc70e6858429dc35d16364db399da02d3d5f299c0a029da0a3329eaafc","block_sha256":"d026b8dc70e6858429dc35d16364db399da02d3d5f299c0a029da0a3329eaafc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c1c597d3-818f-4d4d-898d-56a2070b189f/#blk_16842864-d83e-4270-a3ea-a923ad3dc891"},{"id":"occ_ec727ee4f5eded48dca6b9d9","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c1c597d3-818f-4d4d-898d-56a2070b189f","work_id":"wrk_4830a588-ef6a-4229-857e-c5b4eff6f7e3","block_id":"blk_acb7b83e-0838-4a62-a305-2f81b48e054c","section_id":"sec_0495a598-bff2-49c9-b311-175727e93be3","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":30,"end":32,"exact":"基板","quote":"1951年、ゴードン・ティールとハワード・クリステンセンは、基板の原子配列を引き継ぐ薄い結晶層の成長法を開発した。1960年には、イアン・ロスの推進を受けたヘンリー・シューラーらのチームが、化学気相成長によってシリコン・トランジスタへ薄いエピタキシャル層を形成し、","quote_start":0,"quote_end":132,"text_sha256":"fdb7f54a96d5ac84065241cdffdec71809b5fcfac1f88575c84433aed798664f","block_sha256":"fdb7f54a96d5ac84065241cdffdec71809b5fcfac1f88575c84433aed798664f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c1c597d3-818f-4d4d-898d-56a2070b189f/#blk_acb7b83e-0838-4a62-a305-2f81b48e054c"},{"id":"occ_b4c5867de6beb306d8be4669","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c1c597d3-818f-4d4d-898d-56a2070b189f","work_id":"wrk_4830a588-ef6a-4229-857e-c5b4eff6f7e3","block_id":"blk_b23d55b6-a024-4227-b145-5be1482e608f","section_id":"sec_deaa5262-1e91-4d0c-bca7-3f62090a667c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":80,"end":82,"exact":"基板","quote":"ずつ切り出し、一個ずつ電極を付ける個別部品だった。増幅器、抵抗、コンデンサーを一つの回路にするには、それぞれを基板上で配線しなければならない。","quote_start":25,"quote_end":96,"text_sha256":"09d47b568b1216e74c05c70081dab1ba48fbeb24feb9537db5143a0a50eeb7a9","block_sha256":"09d47b568b1216e74c05c70081dab1ba48fbeb24feb9537db5143a0a50eeb7a9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c1c597d3-818f-4d4d-898d-56a2070b189f/#blk_b23d55b6-a024-4227-b145-5be1482e608f"},{"id":"occ_11d789b841dde86307801022","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c1c597d3-818f-4d4d-898d-56a2070b189f","work_id":"wrk_4830a588-ef6a-4229-857e-c5b4eff6f7e3","block_id":"blk_b34b9086-7ed0-4b28-b0a9-28ba00523599","section_id":"sec_0495a598-bff2-49c9-b311-175727e93be3","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":23,"end":25,"exact":"基板","quote":"現在では、完成したポリッシュト・ウェハー上へ、基板と異なる抵抗率を持つ単結晶膜を成長させるエピタキシャル・ウェハーが製造されている。さらに先端トランジスタでは、シリコン、シリコンゲルマニウム、リン添加シリコンなどを特定領域だけへ選択成長させ、チャネル","quote_start":0,"quote_end":125,"text_sha256":"4998fb0d971545961341f4768e3d10f870145b759c6ed2a4f93a4ae465d02069","block_sha256":"4998fb0d971545961341f4768e3d10f870145b759c6ed2a4f93a4ae465d02069","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c1c597d3-818f-4d4d-898d-56a2070b189f/#blk_b34b9086-7ed0-4b28-b0a9-28ba00523599"},{"id":"occ_d6c22afcce876cad80e697ef","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_0af04069-605e-42d9-89ba-addaa8f19055","sec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   │\nマイクロバンプ\n      │\nインターポーザー\n      │\nC4\n      │\nパッケージ基板\n      │\nBGAボール\n      │\nマザーボード\n```","quote_start":13,"quote_end":104,"text_sha256":"f1af404678291063cef92600136f70b84efa21bbfc47dbdc1df96c9ea3b29ed5","block_sha256":"f1af404678291063cef92600136f70b84efa21bbfc47dbdc1df96c9ea3b29ed5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_0af04069-605e-42d9-89ba-addaa8f19055"},{"id":"occ_3e2b8ebcf37b577289925ae2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_0cf5f409-7de4-439d-adbe-04d2ba6fc79e","section_id":"sec_31824d08-46b8-493e-aefa-078055eec84b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":65,"end":67,"exact":"基板","quote":"olled Collapse Chip Connection**の略で、ダイまたはインターポーザーをパッケージ基板へ接続する比較的大きなフリップチップ端子である。","quote_start":10,"quote_end":91,"text_sha256":"fa0ac9fb5b965608a6dc91ddd437dc7468a6f8449898888b7236e90b9d58faa3","block_sha256":"fa0ac9fb5b965608a6dc91ddd437dc7468a6f8449898888b7236e90b9d58faa3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_0cf5f409-7de4-439d-adbe-04d2ba6fc79e"},{"id":"occ_da761ee6ed77a6632ac36d11","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_1816c8b9-0090-4e28-ba7b-ce0b293def3d","section_id":"sec_195d44c7-13cf-42e6-a641-099bf36be0cc","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"シリコン、インターポーザー、有機基板、樹脂、銅、はんだでは、熱膨張率が異なる。","quote_start":0,"quote_end":39,"text_sha256":"b15d96a3b190c0326f1189d7a76dac538e6f16de76c5ac35f77118356cae17cd","block_sha256":"b15d96a3b190c0326f1189d7a76dac538e6f16de76c5ac35f77118356cae17cd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_1816c8b9-0090-4e28-ba7b-ce0b293def3d"},{"id":"occ_de4f9d217578c1a6bbc199aa","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_1ccc7c8f-e216-4575-ba8d-6ef8dae16b5e","section_id":"sec_95533c05-fa6e-4b18-9b7c-1357a54efa0b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":71,"end":73,"exact":"基板","quote":"は、ロジックダイとシリコンインターポーザーの間に45µmピッチのマイクロバンプを使用し、インターポーザーと有機基板の間には180µmピッチのC4バンプを使用していた。これは一つの試作例であり、実際の寸法は製品世代や設計によって異なる。([3DFabric](https://3dfabric.tsmc.com/sc","quote_start":16,"quote_end":173,"text_sha256":"a76cf0991b77f04590c9a99ebc4158f58b4c2b5146a0f0085c0790cc8baa4641","block_sha256":"a76cf0991b77f04590c9a99ebc4158f58b4c2b5146a0f0085c0790cc8baa4641","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_1ccc7c8f-e216-4575-ba8d-6ef8dae16b5e"},{"id":"occ_e4aaa6b5691249630da86099","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_1f84d86b-600d-44ce-bdf2-4bc2f70bc31a","section_id":"sec_76e76a54-2615-4700-97b9-827d6da4c826","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":49,"end":51,"exact":"基板","quote":"これらの構造では、Compute Die、I/O Die、HBM、キャッシュダイなどを、パッケージ基板やインターポーザーへ配置する。","quote_start":0,"quote_end":66,"text_sha256":"b3afd6734bd685aec82a53c380beb55ab3d6c8b58e9bcc1de593311a42af7b45","block_sha256":"b3afd6734bd685aec82a53c380beb55ab3d6c8b58e9bcc1de593311a42af7b45","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_1f84d86b-600d-44ce-bdf2-4bc2f70bc31a"},{"id":"occ_a73dd570237b6165e1d9f388","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_32741bd6-7c60-4afa-85fb-2e98dd441f07","section_id":"sec_8aa36013-4294-45ee-900e-a3a4350aa049","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":26,"end":28,"exact":"基板","quote":"- バンプに集中する機械的応力を分散する\n- ダイと基板の熱膨張差を吸収する\n- 温度サイクルによる疲労を抑える\n- 湿気や衝撃から接続部を守る\n- ダイを機械的に固定する","quote_start":0,"quote_end":86,"text_sha256":"b62933ed2ab59210a5976c4cd2e2a548123fd7932c9aa6975c44d045852f9818","block_sha256":"b62933ed2ab59210a5976c4cd2e2a548123fd7932c9aa6975c44d045852f9818","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_32741bd6-7c60-4afa-85fb-2e98dd441f07"},{"id":"occ_b8dcbba8a47803431aa55903","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_42c337d0-b76d-4f47-a226-5cfe1e6a31b3","section_id":"sec_52c67cfe-7fd3-4f0c-b83c-e10224724efd","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":42,"end":44,"exact":"基板","quote":"マイクロバンプはパッケージ内部の高密度接続に使われ、BGAはパッケージ全体をプリント基板へ接続する。","quote_start":0,"quote_end":50,"text_sha256":"abdc34f361af19404b4086820355973245ebefc971f057dabb0697163185343f","block_sha256":"abdc34f361af19404b4086820355973245ebefc971f057dabb0697163185343f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_42c337d0-b76d-4f47-a226-5cfe1e6a31b3"},{"id":"occ_dc0fb5ce2a9b36e7628e8a62","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_7054cc19-530e-4fc6-a099-66daf34d4b3b","section_id":"sec_31824d08-46b8-493e-aefa-078055eec84b","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":67,"end":69,"exact":"基板","quote":"    │\nマイクロバンプ\n     │\nインターポーザー\n     │\nC4バンプ\n     │\nパッケージ基板\n```","quote_start":12,"quote_end":73,"text_sha256":"0895f233e7110d1afa4df00288d0a1a27d9737b60a745da87836bac9c6c7c399","block_sha256":"0895f233e7110d1afa4df00288d0a1a27d9737b60a745da87836bac9c6c7c399","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_7054cc19-530e-4fc6-a099-66daf34d4b3b"},{"id":"occ_93ee33182faa61eada7f1956","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_797cf16a-3b13-4b4c-a886-64da596ad452","section_id":"sec_84b1a7f5-3c23-4603-aaea-05eff84c5175","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":70,"end":72,"exact":"基板","quote":"接続\n→ Hybrid Bonding\n\n一般的な2.5D・3D接続\n→ マイクロバンプ\n\nインターポーザーと基板\n→ C4\n\nパッケージとマザーボード\n→ BGA\n```","quote_start":15,"quote_end":101,"text_sha256":"6dba1583e62a4d0cfe5c18457c0852f6b341ebc2ed4c091a1d1849fa8aa8e395","block_sha256":"6dba1583e62a4d0cfe5c18457c0852f6b341ebc2ed4c091a1d1849fa8aa8e395","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_797cf16a-3b13-4b4c-a886-64da596ad452"},{"id":"occ_9b0da4fd8ef50a26ee991736","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_856bf1cd-fc0d-4408-bc35-758b1ce97df8","section_id":"sec_76e76a54-2615-4700-97b9-827d6da4c826","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":6,"end":8,"exact":"基板","quote":"前回は、有機基板を使う2Dパッケージ、シリコンインターポーザーを使う2.5Dパッケージ、そしてダイを上下に重ねる3D積層について解説した。","quote_start":0,"quote_end":69,"text_sha256":"41fbe2f67e5f29d1cd145a7e687bb22b0782689e54e603e357fab45693325f23","block_sha256":"41fbe2f67e5f29d1cd145a7e687bb22b0782689e54e603e357fab45693325f23","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_856bf1cd-fc0d-4408-bc35-758b1ce97df8"},{"id":"occ_04f8531bd8ebcf36c246d978","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_92ce438a-e54c-4310-b594-70891bd43fce","section_id":"sec_d29eed28-781a-4d6b-92d0-13e097eaa653","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":64,"end":66,"exact":"基板","quote":"絡\n- 接合位置のずれ\n- はんだ量のばらつき\n- アンダーフィルが入りにくい\n- 接合部の検査が難しい\n- 基板やダイの反りの影響が大きくなる","quote_start":9,"quote_end":81,"text_sha256":"ae220a7d8f4f965544faea603f60a43799c0611bf6b4d899e483c671bfc3c0d9","block_sha256":"ae220a7d8f4f965544faea603f60a43799c0611bf6b4d899e483c671bfc3c0d9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_92ce438a-e54c-4310-b594-70891bd43fce"},{"id":"occ_6fe1f4f2724b217c4d286a4c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_99e0eaa6-54b1-4bc3-82e3-b1da33294170","section_id":"sec_8aa36013-4294-45ee-900e-a3a4350aa049","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":13,"end":15,"exact":"基板","quote":"シリコン、銅、はんだ、有機基板は、それぞれ温度による膨張率が異なる。","quote_start":0,"quote_end":34,"text_sha256":"2c8c71a7136487c7f5471f725d36ca34149b70245431de15626ea20b026e8f06","block_sha256":"2c8c71a7136487c7f5471f725d36ca34149b70245431de15626ea20b026e8f06","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_99e0eaa6-54b1-4bc3-82e3-b1da33294170"},{"id":"occ_7e13927e306e223e32e3d66f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_99ebf878-8677-44ad-a702-4522421591d7","section_id":"sec_0d53439e-1015-44b0-a15d-324f352c68ef","layer":"body","character_id":null,"count":2,"matched_aliases":["低誘電","基板"],"evidence":{"text_basis":"markdown","start":28,"end":31,"exact":"低誘電","quote":"ただし銅ピラー自体は硬いため、温度変化による応力がダイや低誘電率配線層へ伝わりやすくなる場合がある。そのため、バンプ形状、パッド、アンダーフィル、基板材料を一体として設計する必要がある。","quote_start":0,"quote_end":93,"text_sha256":"a893dd638b1789522e2876d27419cbc127467576a161bc1b7c0c3e2888d7b359","block_sha256":"a893dd638b1789522e2876d27419cbc127467576a161bc1b7c0c3e2888d7b359","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_99ebf878-8677-44ad-a702-4522421591d7"},{"id":"occ_9f91c6a074e178014f942616","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_9e4abc6d-c08b-41e1-a53d-062c28090709","section_id":"sec_519ce49d-c0fb-4e2d-9f06-c7ecb2874791","layer":"code","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":32,"end":34,"exact":"基板","quote":"```\nワイヤーボンディング\n\nダイ上面 ─ 金属ワイヤー ─ 基板\n\n\nフリップチップ\n\nダイ下面\n● ● ● ● ●  バンプ\n────────\n基板\n```","quote_start":0,"quote_end":81,"text_sha256":"163b390c3e3c330f5f922ea887585b13c5a33db38e9e0722fced05c61a9422c4","block_sha256":"163b390c3e3c330f5f922ea887585b13c5a33db38e9e0722fced05c61a9422c4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_9e4abc6d-c08b-41e1-a53d-062c28090709"},{"id":"occ_59f4d81c77a97f849ac8419f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_b1d0c868-04d5-405f-ad66-4ea1ba9cb55c","section_id":"sec_abe8b268-524d-4dd6-a766-f3051d11558c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":70,"end":72,"exact":"基板","quote":"ダイ内部ダイの上面と下面を接続マイクロバンプダイ境界面別のダイやインターポーザーと接続インターポーザー配線中間基板内部横方向に信号を伝送Die-to-Die PHYダイ内部電気信号を送受信","quote_start":15,"quote_end":109,"text_sha256":"b45ab30d449cdb7c8899587d456e1a498ec739264cc21826167f8e3ff073ead8","block_sha256":"b45ab30d449cdb7c8899587d456e1a498ec739264cc21826167f8e3ff073ead8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_b1d0c868-04d5-405f-ad66-4ea1ba9cb55c"},{"id":"occ_dde456dc13798678ef5e5e66","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_d2ce2a32-847c-469f-9ffe-fd14281a8ad0","section_id":"sec_38f2999f-e027-41d7-83b4-b795308256df","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":20,"end":22,"exact":"基板","quote":"マイクロバンプは、外部SerDesが通る基板配線やコネクタと比べれば、非常に短い接続である。","quote_start":0,"quote_end":46,"text_sha256":"89360ffa046bccf5ceef1ba1bdc67f7a2a5ee00826ad02d359938d8187a4e3c7","block_sha256":"89360ffa046bccf5ceef1ba1bdc67f7a2a5ee00826ad02d359938d8187a4e3c7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_d2ce2a32-847c-469f-9ffe-fd14281a8ad0"},{"id":"occ_75554cb0da39c0d6d77933e4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_d407418b-523f-49a8-82f4-a14dcfe3a332","section_id":"sec_95533c05-fa6e-4b18-9b7c-1357a54efa0b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":13,"end":15,"exact":"基板","quote":"インターポーザー上には有機基板より細かな配線を形成できるため、ダイの下へ多数のマイクロバンプを配置できる。","quote_start":0,"quote_end":53,"text_sha256":"17b4f6478f6b6ff8077cc9f68eb79192ba193c98c2f57b56235baaba80b90b52","block_sha256":"17b4f6478f6b6ff8077cc9f68eb79192ba193c98c2f57b56235baaba80b90b52","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_d407418b-523f-49a8-82f4-a14dcfe3a332"},{"id":"occ_5d573d878c7518146b1c3894","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_ed219407-2c40-43b3-a80d-49f817a13658","section_id":"sec_c757215d-46ec-4999-9c58-5cc4bf096503","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":13,"end":15,"exact":"基板","quote":"一方で、温度差によるダイや基板の膨張、反り、接合時間が課題になる。","quote_start":0,"quote_end":33,"text_sha256":"7dfd54e156e62d2640620695900112a58992bca10e57ebc91d6520573a7b9eaa","block_sha256":"7dfd54e156e62d2640620695900112a58992bca10e57ebc91d6520573a7b9eaa","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_ed219407-2c40-43b3-a80d-49f817a13658"},{"id":"occ_df4ab5447e9da4b818c49c9a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_f718ae83-3885-4e13-8805-0dc3377e22d8","section_id":"sec_519ce49d-c0fb-4e2d-9f06-c7ecb2874791","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":83,"end":85,"exact":"基板","quote":"    金属パッド\n          │\n        バンプ\n          │\nインターポーザー／基板\n```","quote_start":28,"quote_end":89,"text_sha256":"9e433c8c45765b9dee4f4f3f0e980bbfdde7cf6f2b88967a4e5781e9f5d2516c","block_sha256":"9e433c8c45765b9dee4f4f3f0e980bbfdde7cf6f2b88967a4e5781e9f5d2516c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_f718ae83-3885-4e13-8805-0dc3377e22d8"},{"id":"occ_fa8e39ddab522e8c384b5e56","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_fdce2016-07e9-447a-94cb-62f09cd96ae6","section_id":"sec_8aa36013-4294-45ee-900e-a3a4350aa049","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"```\n加熱\n  ↓\n基板は大きく膨張\nシリコンは比較的小さく膨張\n  ↓\nマイクロバンプに横方向の力\n```","quote_start":0,"quote_end":55,"text_sha256":"8c03d93667ce2ca3f6a9b7e4bdf9b8be691a5ed9560fcbf3157a80eb383843e5","block_sha256":"8c03d93667ce2ca3f6a9b7e4bdf9b8be691a5ed9560fcbf3157a80eb383843e5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_fdce2016-07e9-447a-94cb-62f09cd96ae6"},{"id":"occ_9507c53e329c0f53010f8de0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c49d360e-2b3c-4311-82ad-b78a89fde3e0","work_id":"wrk_d0398aa0-3c6b-4407-995a-ef79e6153754","block_id":"blk_345b4e2c-f634-4958-809f-5b1507a756ae","section_id":"sec_76ac794c-63f3-4982-963b-19d823a5e7d0","layer":"code","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":258,"end":260,"exact":"基板","quote":"          | PA、LNA、スイッチ、フィルタなどを小型パッケージ化        |\n| 樹脂多層基板/LCP基板         | 高周波信号配線・アンテナ周辺                     |\n| Connectivity Modules | Wi-Fi、Bluetooth、LPWA、","quote_start":203,"quote_end":360,"text_sha256":"66837fad2a2f4e23aaf89b060853ef2820e0efefb6dbbd7a011fcdfad224a7a3","block_sha256":"66837fad2a2f4e23aaf89b060853ef2820e0efefb6dbbd7a011fcdfad224a7a3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c49d360e-2b3c-4311-82ad-b78a89fde3e0/#blk_345b4e2c-f634-4958-809f-5b1507a756ae"},{"id":"occ_6431536cf6e9a2162f3b3863","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c49d360e-2b3c-4311-82ad-b78a89fde3e0","work_id":"wrk_d0398aa0-3c6b-4407-995a-ef79e6153754","block_id":"blk_beb29729-6a67-4558-90a1-62c5c0c0f7e4","section_id":"sec_4cef8f7b-fe8f-47d7-b1c3-381fbd169b9a","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":559,"end":561,"exact":"基板","quote":"近に配置   | ループインダクタンス低減        |\n| 埋め込みMLCC       | パッケージ基板内に内蔵     | 超近接デカップリング          |\n| 高耐圧MLCC        | 48V/54V電源系      | AIサーバー電源アーキテクチャで重要  |\n| C0G/NP","quote_start":504,"quote_end":661,"text_sha256":"ce79c7142d8be2e0512c5f13c33fe2f933243de523e2202520e970ae3c1e1a57","block_sha256":"ce79c7142d8be2e0512c5f13c33fe2f933243de523e2202520e970ae3c1e1a57","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c49d360e-2b3c-4311-82ad-b78a89fde3e0/#blk_beb29729-6a67-4558-90a1-62c5c0c0f7e4"},{"id":"occ_00d507a7b607964b79053775","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c49d360e-2b3c-4311-82ad-b78a89fde3e0","work_id":"wrk_d0398aa0-3c6b-4407-995a-ef79e6153754","block_id":"blk_f4cbe265-0d13-46aa-822b-2714107cdefd","section_id":"sec_76ac794c-63f3-4982-963b-19d823a5e7d0","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":80,"end":82,"exact":"基板","quote":"社売上の35.7%です。最大用途ですが、前年比では減少しています。村田は、スマホ向け高周波モジュールや多層樹脂基板が減少した一方、サーバー向けMLCCやEMIフィルタが増えたと説明しています。([Murata Manufacturing Co., Ltd.](https://corporate.murata.co","quote_start":25,"quote_end":182,"text_sha256":"949eac216390e673d60ed7dfd2606655c103e48e2079ebadcacaff6d39f361e2","block_sha256":"949eac216390e673d60ed7dfd2606655c103e48e2079ebadcacaff6d39f361e2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c49d360e-2b3c-4311-82ad-b78a89fde3e0/#blk_f4cbe265-0d13-46aa-822b-2714107cdefd"},{"id":"occ_e25f5645a44960e1ccd2ec7b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_308ae37a-ae03-4b78-91f9-0d0231be75de","section_id":"sec_570d2448-bc8a-4810-96cd-0a5d8915bbf1","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":101,"end":103,"exact":"基板","quote":"  ↓\n金属パッド\n        ↓\nマイクロバンプ／Hybrid Bonding\n        ↓\n有機基板／インターポーザー／ブリッジ\n        ↓\n相手側の接続端子\n        ↓\n相手側Die-to-Die PHY\n```","quote_start":46,"quote_end":168,"text_sha256":"1a96816b7b7f71f7a4ccd137d54d53e7412dab8aef40eebd8bc74d7e9a94c490","block_sha256":"1a96816b7b7f71f7a4ccd137d54d53e7412dab8aef40eebd8bc74d7e9a94c490","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_308ae37a-ae03-4b78-91f9-0d0231be75de"},{"id":"occ_6e9135ab7d8b5e4a6a2f23b3","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_5d391570-4718-4aae-939a-5ae1bcf35fa2","section_id":"sec_ff79c093-e2b7-457c-bf88-74c39be40c9c","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"- 微細な有機基板\n- シリコンインターポーザー\n- シリコンブリッジ\n- 高密度RDL\n- マイクロバンプ\n- Hybrid Bonding\n- TSV","quote_start":0,"quote_end":77,"text_sha256":"80e5c4c86b2f4ace868f13aef0fdaad84a33062fe3f172463dee445f58b311ae","block_sha256":"80e5c4c86b2f4ace868f13aef0fdaad84a33062fe3f172463dee445f58b311ae","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_5d391570-4718-4aae-939a-5ae1bcf35fa2"},{"id":"occ_f310b36feefdc50f06891d28","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c720ff79-9532-414c-ab0c-c6caec3e9331","work_id":"wrk_8d913e5f-cd3d-4488-9ff4-07fe3dd89c98","block_id":"blk_4abe40ee-7465-4168-9782-e9711b92ca82","section_id":"sec_a545c1b3-fe0f-4314-b011-bfea5e435be6","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":196,"end":198,"exact":"基板","quote":"EOL：トランジスタ・素子分離        │\n├─────────────────────┤\n│ シリコン基板                       │\n└─────────────────────┘\nダイ裏面\n```","quote_start":141,"quote_end":255,"text_sha256":"1d7be10c13d87ea96f97c083aa15ca3172b633d1b7ee4659f7f0ff48761b72a1","block_sha256":"1d7be10c13d87ea96f97c083aa15ca3172b633d1b7ee4659f7f0ff48761b72a1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c720ff79-9532-414c-ab0c-c6caec3e9331/#blk_4abe40ee-7465-4168-9782-e9711b92ca82"},{"id":"occ_63af0120ba3af7a7161c3f09","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c720ff79-9532-414c-ab0c-c6caec3e9331","work_id":"wrk_8d913e5f-cd3d-4488-9ff4-07fe3dd89c98","block_id":"blk_5ec56e5f-89d3-4437-b692-ca692ccb694f","section_id":"sec_95df2425-e22b-4cdc-9318-7fb08566c1b8","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":421,"end":423,"exact":"基板","quote":"│ ワード線・チャネル・ソース／ドレイン │\n├────────────────────┤\n│ 単結晶シリコン基板                 │\n└────────────────────┘\nダイ裏面\n```","quote_start":366,"quote_end":473,"text_sha256":"7e5440bec13aab6a202ab42543fba5e181f563fe8df68fd54858c0bf037fb044","block_sha256":"7e5440bec13aab6a202ab42543fba5e181f563fe8df68fd54858c0bf037fb044","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c720ff79-9532-414c-ab0c-c6caec3e9331/#blk_5ec56e5f-89d3-4437-b692-ca692ccb694f"},{"id":"occ_9048337fba57aeff44cea202","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c720ff79-9532-414c-ab0c-c6caec3e9331","work_id":"wrk_8d913e5f-cd3d-4488-9ff4-07fe3dd89c98","block_id":"blk_71acc5c2-f9bf-4112-9d69-ab926d71c872","section_id":"sec_980c9e0f-e17e-4a73-8f73-a64ca9e7f144","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":136,"end":138,"exact":"基板","quote":"ロ\n    ↓\n機能ブロック\n    ↓\nダイ\n    ↓\nチップレット\n    ↓\nパッケージ\n    ↓\n基板・ラック・システム\n```","quote_start":81,"quote_end":151,"text_sha256":"fc993a499adcd0f7f78a778de45f899bbb1b7ae3c068f4b31c56e3747602ff45","block_sha256":"fc993a499adcd0f7f78a778de45f899bbb1b7ae3c068f4b31c56e3747602ff45","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c720ff79-9532-414c-ab0c-c6caec3e9331/#blk_71acc5c2-f9bf-4112-9d69-ab926d71c872"},{"id":"occ_760b13346edb9fc69dc76521","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c720ff79-9532-414c-ab0c-c6caec3e9331","work_id":"wrk_8d913e5f-cd3d-4488-9ff4-07fe3dd89c98","block_id":"blk_7e815d79-51ea-46fb-866d-33cb019ada67","section_id":"sec_5c81e13b-7817-4477-b944-35dbb002e019","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":32,"end":34,"exact":"基板","quote":"従来型DRAMのアクセス・トランジスタは、基本的に単結晶シリコン基板を使うFEOL側へ形成される。","quote_start":0,"quote_end":49,"text_sha256":"df0ce0a9e205717a3558c5ac6614279592562ceb3bd66474d4b5154f081d207e","block_sha256":"df0ce0a9e205717a3558c5ac6614279592562ceb3bd66474d4b5154f081d207e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c720ff79-9532-414c-ab0c-c6caec3e9331/#blk_7e815d79-51ea-46fb-866d-33cb019ada67"},{"id":"occ_bd9c3ac5f64ca0f55283dea4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c720ff79-9532-414c-ab0c-c6caec3e9331","work_id":"wrk_8d913e5f-cd3d-4488-9ff4-07fe3dd89c98","block_id":"blk_91317346-f518-45cc-aeea-b09260ba8bd9","section_id":"sec_67dbfa7a-c471-4ec0-b3db-f09eb5c59b3b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"一つの方向は、シリコン基板を深く掘ることだった。","quote_start":0,"quote_end":24,"text_sha256":"922b164aa02ff587eb5b1c471cf0463e7e9dd35d8ab6151afadf95f747435ee9","block_sha256":"922b164aa02ff587eb5b1c471cf0463e7e9dd35d8ab6151afadf95f747435ee9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c720ff79-9532-414c-ab0c-c6caec3e9331/#blk_91317346-f518-45cc-aeea-b09260ba8bd9"},{"id":"occ_f6faec3b92f1f805e7091e61","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c720ff79-9532-414c-ab0c-c6caec3e9331","work_id":"wrk_8d913e5f-cd3d-4488-9ff4-07fe3dd89c98","block_id":"blk_d28db3d1-d4ae-4a51-820c-0cdd7d85e871","section_id":"sec_7df815f3-3f28-4108-829e-c9d139e000ec","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":19,"end":21,"exact":"基板","quote":"- シリコン：トランジスタのチャネルや基板\n- SiO₂、High-k材料：絶縁膜\n- 銅、コバルト、ルテニウム、タングステン：配線やコンタクト\n- シリコン窒化膜：絶縁、保護、エッチング制御\n- 酸化物半導体：将来の低温トランジスタ候補\n-","quote_start":0,"quote_end":121,"text_sha256":"6a17c3e84703c65b3abfdf5c4a103393fe712a9f6e659fcfe3dcc22836636898","block_sha256":"6a17c3e84703c65b3abfdf5c4a103393fe712a9f6e659fcfe3dcc22836636898","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c720ff79-9532-414c-ab0c-c6caec3e9331/#blk_d28db3d1-d4ae-4a51-820c-0cdd7d85e871"},{"id":"occ_7f3c4008098c351ecf9893ff","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c720ff79-9532-414c-ab0c-c6caec3e9331","work_id":"wrk_8d913e5f-cd3d-4488-9ff4-07fe3dd89c98","block_id":"blk_f81d0ed4-d798-467b-8144-c49087dc9fc1","section_id":"sec_db41a0df-aa1a-4ef6-b2db-7f044a1b728b","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":141,"end":143,"exact":"基板","quote":"───────\nFEOL\n単結晶シリコンの\nアクセス・トランジスタ\n────────────────\nシリコン基板\n```","quote_start":86,"quote_end":147,"text_sha256":"3d7ae5428e1d1786bcb558f587a929e11ea0f28233635ba7f27a25f3f58efe59","block_sha256":"3d7ae5428e1d1786bcb558f587a929e11ea0f28233635ba7f27a25f3f58efe59","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c720ff79-9532-414c-ab0c-c6caec3e9331/#blk_f81d0ed4-d798-467b-8144-c49087dc9fc1"},{"id":"occ_67f171a137576862c074aa1f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_10d56c1a-f2c4-475e-942b-12827d0bb4e7","section_id":"sec_81198421-741f-4d21-a685-c76896f3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":18,"end":20,"exact":"基板","quote":"ABF（味の素ビルドアップフィルム）基板:","quote_start":0,"quote_end":21,"text_sha256":"703f6725b04a0f73179d203d8416d48276e52148e2179f07b023e5b86d77d070","block_sha256":"703f6725b04a0f73179d203d8416d48276e52148e2179f07b023e5b86d77d070","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_10d56c1a-f2c4-475e-942b-12827d0bb4e7"},{"id":"occ_3de9d7bd49075d0f3a7409f2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_51d37dca-2efa-459f-972a-4e79a2c77ddf","section_id":"sec_ceac4b2f-644b-4c78-b1c2-a6b754f4fa21","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"先端パッケージ基板材料である**ABF（Ajinomoto Build-up Film）は、現在世界で事実上 Ajinomoto（味の素）社が独占供給する素材**です。ABFはCPUやGPUをプリント基板上に実装する際","quote_start":0,"quote_end":109,"text_sha256":"8f584a41ba19e4aaf66f21be15f81d44b4c8b2aeb3c5cfcebf850221afeff7e8","block_sha256":"8f584a41ba19e4aaf66f21be15f81d44b4c8b2aeb3c5cfcebf850221afeff7e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_51d37dca-2efa-459f-972a-4e79a2c77ddf"},{"id":"occ_3602c082f75b31980d11e4e6","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_57ec3932-567b-413c-ab30-9c780c23fe1f","section_id":"sec_4521cebd-4654-4690-8f24-0417b44da034","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":25,"end":27,"exact":"基板","quote":"全ての半導体は、シリコンウェーハと呼ばれる円盤状の基板の上に作られる。これは半導体製造のまさに「礎」であり、この供給が止まれば、世界のいかなる半導体工場も稼働できない。この foundational material（基礎材料）において、日本企業は絶対的","quote_start":0,"quote_end":127,"text_sha256":"3c8f4f257497cd8bb222676fcd8cec54e2df28775ca4d95b61aa7c31e65e2067","block_sha256":"3c8f4f257497cd8bb222676fcd8cec54e2df28775ca4d95b61aa7c31e65e2067","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_57ec3932-567b-413c-ab30-9c780c23fe1f"},{"id":"occ_a06027acdb88dff3d1a2174e","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_6bf75832-1ed4-4f3b-8f8b-c983a44e241d","section_id":"sec_ceac4b2f-644b-4c78-b1c2-a6b754f4fa21","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":7,"end":9,"exact":"基板","quote":"### ABF基板（Ajinomoto Build-up Film）の供給停止リスク","quote_start":0,"quote_end":42,"text_sha256":"55d6d9f822c821140b2793745f3efcd74ed78d934dce686fa1468a89066347cf","block_sha256":"55d6d9f822c821140b2793745f3efcd74ed78d934dce686fa1468a89066347cf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_6bf75832-1ed4-4f3b-8f8b-c983a44e241d"},{"id":"occ_c44881a29e966459d929048b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_76a27899-cd06-4258-9beb-55c389c63d2d","section_id":"sec_ceac4b2f-644b-4c78-b1c2-a6b754f4fa21","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":39,"end":41,"exact":"基板","quote":"ABF供給が止まれば、TSMCで製造された最先端GPUやCPUも**パッケージ基板が作れず出荷不能**になります。生成AI向けの**H100などNVIDIAのGPU**は多数のチップレットを高密度実装するためABF基板に強く依存しています。またデータセンター向けCPU（Intel ","quote_start":0,"quote_end":141,"text_sha256":"3f475219f93ee22fcecdf466752c25b9eebd7969e2efc869effa91f64c93206c","block_sha256":"3f475219f93ee22fcecdf466752c25b9eebd7969e2efc869effa91f64c93206c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_76a27899-cd06-4258-9beb-55c389c63d2d"},{"id":"occ_ad58c93f64fd88daaeaf8671","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_7e97071a-d050-4950-b052-11de23a8cb25","section_id":"sec_ceac4b2f-644b-4c78-b1c2-a6b754f4fa21","layer":"body","character_id":null,"count":4,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":27,"end":29,"exact":"基板","quote":"ABFは極薄フィルム状の樹脂で、台湾や日本のパッケージ基板メーカー（Ibiden、日月光など）が購入し、CPU/GPU用の基板に積層して使用します。**ほぼ単一源依存**のため、その供給が止まれば**世界中の先端チップのパッケージング工程が直ちにストップ**","quote_start":0,"quote_end":129,"text_sha256":"aa9ebb959b6f6cc40657c43d4dd5121b98ccccc7d4a842583dfaf4ba9a66e35b","block_sha256":"aa9ebb959b6f6cc40657c43d4dd5121b98ccccc7d4a842583dfaf4ba9a66e35b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_7e97071a-d050-4950-b052-11de23a8cb25"},{"id":"occ_45e9fbbb9e80e2e93d26c461","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_9113fa74-c539-4ad1-90e3-f22fe80c4b9d","section_id":"sec_ed6278b3-4269-4bbe-a6ed-52af4846f416","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":150,"end":152,"exact":"基板","quote":"SUMCO**は21.9%と、**両社で世界シェアの半分超**を担います。300mm径ウェーハ（最新鋭チップの基板）の供給において日本企業は最大の地位にあり、中国を含む他国は品質・量ともに日本に大きく依存しています。\n- **半導体製造装置**：アプライドマテリアルズ等の米企業に次ぎ、日本の装置メーカー（**東京","quote_start":95,"quote_end":252,"text_sha256":"b14b1a479cc384cc69c1b646bc010ffa88441fcc4a429230d0efd9520326f4b9","block_sha256":"b14b1a479cc384cc69c1b646bc010ffa88441fcc4a429230d0efd9520326f4b9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_9113fa74-c539-4ad1-90e3-f22fe80c4b9d"},{"id":"occ_a0ccc9d14167c9b10cdb491b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_9605055b-3ebd-422f-ac91-9552a28a83cc","section_id":"sec_c7784d0f-aaae-424a-8110-502742742469","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":139,"end":141,"exact":"基板","quote":"製の**EUVフォトレジスト**を用いて行われる。\n3. チップは、**味の素**のフィルムを使った**ABF基板**上に実装（パッケージング）される。\n4. ウェーハからの切り出しは、**ディスコ**製の**ダイシングソー**がなければ不可能である。\n5. そして最終的な品質保証は、**アドバンテスト**製の*","quote_start":84,"quote_end":241,"text_sha256":"7bf15d07edc1dc529772a9dae5573bd4f694c41e10ebe68fece04c5e7d815868","block_sha256":"7bf15d07edc1dc529772a9dae5573bd4f694c41e10ebe68fece04c5e7d815868","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_9605055b-3ebd-422f-ac91-9552a28a83cc"},{"id":"occ_4960495a6790884a4ca0f118","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_9c261fd8-84c8-48a7-b563-46382ac2536d","section_id":"sec_de9552ad-5120-4073-80fe-b88f0d366162","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"**シリコンウェーハ**（半導体基板）は、前述の通り**信越化学**と**SUMCO**の2社で世界シェアの約50%を占める戦略材料です。このウェーハ供給が止まれば、世界中の半導体ファウンドリ（TSMC、サムスンなど）やメモリメーカーは","quote_start":0,"quote_end":118,"text_sha256":"b6681b1b34d3f3aab09a39b5a5e24d901cb2fb7eba9404f2f6a14c4c1048d1a9","block_sha256":"b6681b1b34d3f3aab09a39b5a5e24d901cb2fb7eba9404f2f6a14c4c1048d1a9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_9c261fd8-84c8-48a7-b563-46382ac2536d"},{"id":"occ_b7f475b00b7ecc2fea4fc820","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_a0aed16e-0a19-4e18-a821-9a178c1556e9","section_id":"sec_81198421-741f-4d21-a685-c76896f3a98a","layer":"body","character_id":null,"count":5,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":43,"end":45,"exact":"基板","quote":"AIを動かすGPUやサーバー用CPUのような高性能プロセッサは、チップ本体と外部の回路基板を接続するために、極めて複雑で多層構造のパッケージ基板を必要とする。この基板の製造に不可欠なのが、味の素が開発したABF（味の素ビルドアップフィルム）と呼ばれる絶縁フィルムである 。味の素はこの分野の","quote_start":0,"quote_end":145,"text_sha256":"3ac262c969c77bd8e2bf1af9d195426396d78678d595725c070cd51bd657a41c","block_sha256":"3ac262c969c77bd8e2bf1af9d195426396d78678d595725c070cd51bd657a41c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_a0aed16e-0a19-4e18-a821-9a178c1556e9"},{"id":"occ_ad8f43e6ff7347bab94dbdac","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_c52d3f32-6306-43f3-80ff-e2f2b2504230","section_id":"sec_beeeb578-586d-4913-b6d0-88c065ed705b","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":16,"end":18,"exact":"基板","quote":"## 半導体材料への影響（ABF基板・その他素材）","quote_start":0,"quote_end":25,"text_sha256":"b4ca544d65b2c79ab12c77b184b6a4e4a07e2e9db82d03b7b835bf31924a07cf","block_sha256":"b4ca544d65b2c79ab12c77b184b6a4e4a07e2e9db82d03b7b835bf31924a07cf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_c52d3f32-6306-43f3-80ff-e2f2b2504230"},{"id":"occ_57641744f1ae60d71dbf94ea","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_cbdd3bb6-8fa2-401b-a704-c973d840776d","section_id":"sec_8afcb381-b06e-4974-a6dd-829330a02004","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":624,"end":626,"exact":"基板","quote":"ウン）に追い込まれる。特に、生成AIの進化を支える高性能GPUのサプライチェーンは、シリコンウェーハからABF基板、EUVフォトレジスト、検査装置に至るまで、その全ての重要工程で日本製の部素材・装置に依存している。本災害は、このサプライチェーンを完全に寸断し、世界のAIインフラ増強を最低でも2年から3年にわたり「","quote_start":569,"quote_end":726,"text_sha256":"cea5001c744b1cd273a1f89de987b83256dc3d2c211ece6226db55fb5dc66eb4","block_sha256":"cea5001c744b1cd273a1f89de987b83256dc3d2c211ece6226db55fb5dc66eb4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_cbdd3bb6-8fa2-401b-a704-c973d840776d"},{"id":"occ_bd0e81cd73bf96522dc4df42","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_c8a89daf-c91d-4b06-8c19-b87b474452c0","work_id":"wrk_2738ad6a-8234-40b1-bd04-1a4039f5142d","block_id":"blk_e895a76a-a500-4024-b4e5-c01f062429e9","section_id":"sec_7733031f-412a-4cc3-a669-d0023d07160b","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":80,"end":82,"exact":"基板","quote":"）** – 世界シェア約50%。南海トラフではSUMCO九州工場等が被災する恐れ。供給喪失時は**世界の半導体基板供給が半減**し、ファウンドリ・メモリメーカーの生産計画に直撃。ウェーハ不足は1年以上尾を引き、チップ価格高騰と生産遅延を招く。\n- **味の素（ABF樹脂）** – 世界シェア95%以上。首都直下地","quote_start":25,"quote_end":182,"text_sha256":"7e1b91857097a58a7540c15323b341fbb30a2675e0b65605b92cc1a4dd145a15","block_sha256":"7e1b91857097a58a7540c15323b341fbb30a2675e0b65605b92cc1a4dd145a15","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_e895a76a-a500-4024-b4e5-c01f062429e9"},{"id":"occ_eb9ffaa4cf796db2922bdb75","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_19cc50c9-a03c-4c1b-9d61-f9238cd1a614","section_id":"sec_bfcdab04-2502-450e-bedf-89d282c9fa3f","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":118,"end":120,"exact":"基板","quote":"d Bonding\n          │\nActive Base Die\n          │\nパッケージ基板\n```","quote_start":63,"quote_end":124,"text_sha256":"b3776b5e55d78eedb0860badb5018b47008d8ea2fd0d4de69164643e8960869b","block_sha256":"b3776b5e55d78eedb0860badb5018b47008d8ea2fd0d4de69164643e8960869b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_19cc50c9-a03c-4c1b-9d61-f9238cd1a614"},{"id":"occ_be728b41f500bb718ed009af","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_95029eb9-7921-4e42-afe2-8937b436cea3","section_id":"sec_34ce463e-2408-4d36-8916-e1ba80d0a7cb","layer":"body","character_id":null,"count":1,"matched_aliases":["低誘電"],"evidence":{"text_basis":"markdown","start":20,"end":23,"exact":"低誘電","quote":"- トランジスタ\n- 微細な銅配線\n- 低誘電率材料\n- SRAM\n- DRAM\n- センサー\n- 光デバイス","quote_start":0,"quote_end":55,"text_sha256":"7929c6925785fc7fd455a000ef57a8f57ce421e270dccc04b30b7a3f308a52f8","block_sha256":"7929c6925785fc7fd455a000ef57a8f57ce421e270dccc04b30b7a3f308a52f8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_95029eb9-7921-4e42-afe2-8937b436cea3"},{"id":"occ_f07539846dd72eee3c1fcc07","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_e3cd6d02-c54c-441e-9e04-1cf1c5febed1","section_id":"sec_62fc3168-606d-4cda-96b6-6d1bf17a4c0e","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":83,"end":85,"exact":"基板","quote":"距離・3D積層\n\nマイクロバンプ\n→ 成熟量産・2.5D・比較的低コスト\n\nC4\n→ インターポーザー／ダイと基板\n\nBGA\n→ パッケージとマザーボード\n```","quote_start":28,"quote_end":109,"text_sha256":"34dd15665d33a4b12b3f958e1a7f26598e871866bc5dd69f5bb93a53eb774893","block_sha256":"34dd15665d33a4b12b3f958e1a7f26598e871866bc5dd69f5bb93a53eb774893","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_e3cd6d02-c54c-441e-9e04-1cf1c5febed1"},{"id":"occ_216a8c6692796db59befd306","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d05fdc83-690b-49be-9f59-154e0892f912","work_id":"wrk_ede099d3-0f2a-4b68-a3eb-51048a49bb31","block_id":"blk_231a3aa8-f0dc-4b93-b1b8-038acac0af4a","section_id":"sec_0ee03261-b0a0-40fd-a58d-c1c05df80a10","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":20,"end":22,"exact":"基板","quote":"## 第12章　日本の住友電工――InP基板からCWレーザーまで","quote_start":0,"quote_end":32,"text_sha256":"36972fd30f51313904cd3c6e277dbb81f2ebeaf1b9e79032a845d76f8cc30864","block_sha256":"36972fd30f51313904cd3c6e277dbb81f2ebeaf1b9e79032a845d76f8cc30864","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d05fdc83-690b-49be-9f59-154e0892f912/#blk_231a3aa8-f0dc-4b93-b1b8-038acac0af4a"},{"id":"occ_cbd9743b444b1d698ba2a094","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d05fdc83-690b-49be-9f59-154e0892f912","work_id":"wrk_ede099d3-0f2a-4b68-a3eb-51048a49bb31","block_id":"blk_31d13645-4fa2-48ba-a0ad-8900d9fd117c","section_id":"sec_26c184ee-309e-4e2e-9fee-0d3bf8b345b2","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":0,"end":3,"exact":"PCB","quote":"PCB、OSFP housing、connector、heat sinkまで組み上げて完成する。","quote_start":0,"quote_end":48,"text_sha256":"bd6157827d855fc27ad697edd31bbfe943f25e2daf493b71ff67c4a5271aa2c2","block_sha256":"bd6157827d855fc27ad697edd31bbfe943f25e2daf493b71ff67c4a5271aa2c2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d05fdc83-690b-49be-9f59-154e0892f912/#blk_31d13645-4fa2-48ba-a0ad-8900d9fd117c"},{"id":"occ_9675e52bdace3d7206e814dc","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d05fdc83-690b-49be-9f59-154e0892f912","work_id":"wrk_ede099d3-0f2a-4b68-a3eb-51048a49bb31","block_id":"blk_3395619f-839f-4373-b5f9-73fc4e0fb6e8","section_id":"sec_047ec6d3-2ca1-4d0c-9f5b-00bba0d9f06d","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":350,"end":353,"exact":"PCB","quote":"イバーを接続 | 8Tx＋8Rx等 |\n| PMIC/MCU/EEPROM | 電源・制御 | 複数 |\n| PCB | ICと光エンジンを接続 | 1 |\n| OSFP筐体 | 機械・熱インターフェース | 1 |\n| Heat Sink | DSP/レーザー等の放熱 | 1式 |","quote_start":295,"quote_end":437,"text_sha256":"04f27de0ba580d0e8bc76042761f892fe4a413de6ae10fa4e8f1facfbb9a80ea","block_sha256":"04f27de0ba580d0e8bc76042761f892fe4a413de6ae10fa4e8f1facfbb9a80ea","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d05fdc83-690b-49be-9f59-154e0892f912/#blk_3395619f-839f-4373-b5f9-73fc4e0fb6e8"},{"id":"occ_e88646394de27f7ba38be093","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d05fdc83-690b-49be-9f59-154e0892f912","work_id":"wrk_ede099d3-0f2a-4b68-a3eb-51048a49bb31","block_id":"blk_58c747ac-ff42-4a2b-840e-fc2095468533","section_id":"sec_badee867-0d68-4713-9593-4e4950bf76b1","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":21,"end":24,"exact":"PCB","quote":"Switch ASIC\n    │\n   PCB\n    │\nOSFP Transceiver","quote_start":0,"quote_end":47,"text_sha256":"1b124e82bee17b89a92f7b0b272bda3c54ac1ca837c90632d84a070b6d6809a6","block_sha256":"1b124e82bee17b89a92f7b0b272bda3c54ac1ca837c90632d84a070b6d6809a6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d05fdc83-690b-49be-9f59-154e0892f912/#blk_58c747ac-ff42-4a2b-840e-fc2095468533"},{"id":"occ_3d6b5079c359e30659c5c2eb","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d05fdc83-690b-49be-9f59-154e0892f912","work_id":"wrk_ede099d3-0f2a-4b68-a3eb-51048a49bb31","block_id":"blk_94ab8d31-2d2c-48bf-9bb1-18c2e09596ef","section_id":"sec_a0efa779-706c-4ce7-af7b-d40cd8cf655c","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":125,"end":128,"exact":"PCB","quote":"tive alignment\nThermal management\nOptical test\nBurn-in\nPCB assembly\nOSFP assembly\n          │\n          ▼","quote_start":70,"quote_end":175,"text_sha256":"221be9b5b3566a71a349805bea5c88258ce2eb6291c51450c5994fb30544531c","block_sha256":"221be9b5b3566a71a349805bea5c88258ce2eb6291c51450c5994fb30544531c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d05fdc83-690b-49be-9f59-154e0892f912/#blk_94ab8d31-2d2c-48bf-9bb1-18c2e09596ef"},{"id":"occ_fb7c44a0f1d9b3769ae65b59","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d05fdc83-690b-49be-9f59-154e0892f912","work_id":"wrk_ede099d3-0f2a-4b68-a3eb-51048a49bb31","block_id":"blk_ce759fea-6883-4480-b3b3-6d947d2b203b","section_id":"sec_bc95bb4f-d842-4d84-831a-6874e70c2129","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":35,"end":38,"exact":"PCB","quote":"Die\n ↓\nBump / Wire\n ↓\nSubstrate\n ↓\nPCB","quote_start":0,"quote_end":38,"text_sha256":"21f47098508076fb18377f610ca6696dc86ed9a76ff9539319ce5992adcc2264","block_sha256":"21f47098508076fb18377f610ca6696dc86ed9a76ff9539319ce5992adcc2264","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d05fdc83-690b-49be-9f59-154e0892f912/#blk_ce759fea-6883-4480-b3b3-6d947d2b203b"},{"id":"occ_07deb9919d71c9dc39d54383","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d4189e74-ba90-4c4f-8495-9a2fccea5a2a","work_id":"wrk_ba0d2481-72cf-412b-92be-570c7d9c07e4","block_id":"blk_1c13cc83-c0e8-4a2b-b7d1-e74a4b55fa33","section_id":"sec_2ed0e0d0-fb11-4e8a-a324-e4bcb2c9a836","layer":"body","character_id":null,"count":2,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":35,"end":37,"exact":"基板","quote":"- TSMCの先端ウェハー\n- HBM\n- 先端パッケージ\n- ABF基板\n- 高多層PCB\n- 光レーザー\n- トランシーバー\n- 液冷\n- 変圧器\n- 発電・送電設備","quote_start":0,"quote_end":85,"text_sha256":"9e5e9d148993f79d5b33b429a13b350a3b19053dd81f6e1d1d9c54ea07ecfe94","block_sha256":"9e5e9d148993f79d5b33b429a13b350a3b19053dd81f6e1d1d9c54ea07ecfe94","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d4189e74-ba90-4c4f-8495-9a2fccea5a2a/#blk_1c13cc83-c0e8-4a2b-b7d1-e74a4b55fa33"},{"id":"occ_42806a5439f5153fb55ee767","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d4189e74-ba90-4c4f-8495-9a2fccea5a2a","work_id":"wrk_ba0d2481-72cf-412b-92be-570c7d9c07e4","block_id":"blk_47c6caca-1d7f-4ba7-8e32-d5fccfeeb7ae","section_id":"sec_48f88bf1-e701-4251-aab4-da9e3eb503b6","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":29,"end":31,"exact":"基板","quote":"しかし味の素ビルドアップフィルム、ABFが高性能パッケージ基板の重要材料であり、現在の基板工場、設計、製造工程がその特性を前提として最適化されていることは事実である。","quote_start":0,"quote_end":83,"text_sha256":"9c5e8142fcc15ceb87560d13730c7b269d9e032c42a6c45318890e86fa66887c","block_sha256":"9c5e8142fcc15ceb87560d13730c7b269d9e032c42a6c45318890e86fa66887c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d4189e74-ba90-4c4f-8495-9a2fccea5a2a/#blk_47c6caca-1d7f-4ba7-8e32-d5fccfeeb7ae"},{"id":"occ_c798507db6d43eee074a1717","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d4189e74-ba90-4c4f-8495-9a2fccea5a2a","work_id":"wrk_ba0d2481-72cf-412b-92be-570c7d9c07e4","block_id":"blk_9610a45a-6290-4033-8c58-697fe5ac62b2","section_id":"sec_2ed0e0d0-fb11-4e8a-a324-e4bcb2c9a836","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":75,"end":77,"exact":"基板","quote":"ASIC、AMD GPU、NVIDIA GPUは競合製品だが、物理供給網では同じTSMC、HBM、パッケージ、基板へ依存する。","quote_start":20,"quote_end":83,"text_sha256":"1aba1be387e27012afbc4ee25fc4f40ebb7ff78f5307e35b97c4b493cef560f0","block_sha256":"1aba1be387e27012afbc4ee25fc4f40ebb7ff78f5307e35b97c4b493cef560f0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d4189e74-ba90-4c4f-8495-9a2fccea5a2a/#blk_9610a45a-6290-4033-8c58-697fe5ac62b2"},{"id":"occ_6b55db0fde87229a5080a331","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d6eb7e13-0508-4773-9eb4-6d508aae435f","work_id":"wrk_5797fd32-9908-4af9-833c-afd4b5ede120","block_id":"blk_6575a5e1-5b78-4375-b5a8-44e2c2b9b1f7","section_id":"sec_d8f3244d-ce88-46bc-85e3-180ce726474e","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":59,"end":61,"exact":"基板","quote":"制御ゲート (Control Gate)**: 電位を **0V** にします（接地、グラウンド）。\n- **基板 (Substrate)**: **非常に高い正電圧**（例: +20V）を印 加します。","quote_start":4,"quote_end":106,"text_sha256":"aef6a62dcd46d54eb601ac5281690e2519cedee43f62f9fb10fd189fa1b7aeb6","block_sha256":"aef6a62dcd46d54eb601ac5281690e2519cedee43f62f9fb10fd189fa1b7aeb6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d6eb7e13-0508-4773-9eb4-6d508aae435f/#blk_6575a5e1-5b78-4375-b5a8-44e2c2b9b1f7"},{"id":"occ_fe7855263c91fd71fef9d16b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d6eb7e13-0508-4773-9eb4-6d508aae435f","work_id":"wrk_5797fd32-9908-4af9-833c-afd4b5ede120","block_id":"blk_75f1da76-178d-458d-a0bf-506a96a30ab0","section_id":"sec_bfcdd739-c10a-4cbc-85cd-e5acd2db7115","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":94,"end":96,"exact":"基板","quote":"子 (e-)** が、再び**ファウラー・ノルドハイム・トンネリング**現象によってトンネル酸化膜を通り抜け、基板側へと引き抜かれます。","quote_start":39,"quote_end":107,"text_sha256":"fd2566a5ba42ab332ac6a41d93f2d8ad8c6a0ba8bd061f34825d012f1cec9613","block_sha256":"fd2566a5ba42ab332ac6a41d93f2d8ad8c6a0ba8bd061f34825d012f1cec9613","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d6eb7e13-0508-4773-9eb4-6d508aae435f/#blk_75f1da76-178d-458d-a0bf-506a96a30ab0"},{"id":"occ_db2ed089c2f5d5ea63d228ab","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d6eb7e13-0508-4773-9eb4-6d508aae435f","work_id":"wrk_5797fd32-9908-4af9-833c-afd4b5ede120","block_id":"blk_c36db675-5e19-4a77-8c78-f070e81f1326","section_id":"sec_8a55cc13-e189-4df9-805f-fae339f4e637","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":62,"end":64,"exact":"基板","quote":"シュメモリのデータ消去は、書き込みとは異なる電圧のかけ方をします。一般的には、制御ゲートを接地（0V）し、**基板（Substrate）側に高い正電圧**（例: +20V）を印加します。","quote_start":7,"quote_end":100,"text_sha256":"64c2df8a9a43d17d9ecdec197f45b667f76b88442cfd919b27c1eb12ade41b54","block_sha256":"64c2df8a9a43d17d9ecdec197f45b667f76b88442cfd919b27c1eb12ade41b54","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d6eb7e13-0508-4773-9eb4-6d508aae435f/#blk_c36db675-5e19-4a77-8c78-f070e81f1326"},{"id":"occ_22f19d34bc210c8bb65213cf","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d6eb7e13-0508-4773-9eb4-6d508aae435f","work_id":"wrk_5797fd32-9908-4af9-833c-afd4b5ede120","block_id":"blk_c5d45238-0f13-420f-ba2b-e2e22a0735f0","section_id":"sec_371dabe5-2e72-43f5-9fc3-f33d9813b9de","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":214,"end":216,"exact":"基板","quote":"ーティングゲートに蓄積された状態が、データを表す一つの状態となる。逆に、データを消去する「イレーズ」操作では、基板側に高い電圧を印加することで、フローティングゲートに捕獲されていた電子を引き抜き、元の状態に戻す 。","quote_start":159,"quote_end":266,"text_sha256":"a0570b5fe07a7c3686696ae7517afc0f55b72cc4e2ac6fc2d95b387b96ac7237","block_sha256":"a0570b5fe07a7c3686696ae7517afc0f55b72cc4e2ac6fc2d95b387b96ac7237","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d6eb7e13-0508-4773-9eb4-6d508aae435f/#blk_c5d45238-0f13-420f-ba2b-e2e22a0735f0"},{"id":"occ_aaae865af3e04f74786fde10","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_d6eb7e13-0508-4773-9eb4-6d508aae435f","work_id":"wrk_5797fd32-9908-4af9-833c-afd4b5ede120","block_id":"blk_e522430f-81ce-4c2d-8b5a-c2076602c6cc","section_id":"sec_99f2718a-a2ca-4fd7-9e18-91546a12cbe2","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":11,"end":13,"exact":"基板","quote":"- 制御ゲートが0V、基板が+20Vになることで、フローティングゲートは基板に対して非常に低い電位の状態になります。\n- これにより、書き込み時とは**正反対の向きに強い電場**がトンネル酸化膜にかかります。","quote_start":0,"quote_end":104,"text_sha256":"4889b8ff4e2d74a75d1e87fb1a9f22dc73288dfd1b9313f38289ced7dbd5dfbf","block_sha256":"4889b8ff4e2d74a75d1e87fb1a9f22dc73288dfd1b9313f38289ced7dbd5dfbf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_d6eb7e13-0508-4773-9eb4-6d508aae435f/#blk_e522430f-81ce-4c2d-8b5a-c2076602c6cc"},{"id":"occ_f6e01681662fd1facaca62db","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_da6063d5-59b2-4519-9c42-45d8f4f206c8","work_id":"wrk_ef613b57-c920-49a8-bb03-b7fdb149eeca","block_id":"blk_200e31db-db67-42b2-93fc-00fb4914de89","section_id":"sec_9c702843-6627-490f-a9d1-52e8c1008aa4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":145,"end":147,"exact":"基板","quote":"bstrateの生産を2026年に開始する予定としている。COUPE光エンジンをパッケージ内に統合することで、基板上のプラガブル版と比べて電力効率2倍、レイテンシ10分の1を実現すると説明されている。([TSMC](https://pr.tsmc.com/english/news/3302))","quote_start":90,"quote_end":237,"text_sha256":"27a1f798471e7a444c8eff15fa49f3afd5e2e858771ea09c9fdab47150ccf39b","block_sha256":"27a1f798471e7a444c8eff15fa49f3afd5e2e858771ea09c9fdab47150ccf39b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_da6063d5-59b2-4519-9c42-45d8f4f206c8/#blk_200e31db-db67-42b2-93fc-00fb4914de89"},{"id":"occ_8ce6c36d8e0ff43ae1f5275b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_dbe69fb8-f76d-44e6-b111-aa27e548a204","work_id":"wrk_0252d3aa-e602-4a99-abf9-0b9ec2b5796a","block_id":"blk_a07ff4f7-74e7-47ba-aca4-078d65cb93ad","section_id":"sec_0e18eb64-9933-4275-851c-0225dc9241d4","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":77,"end":79,"exact":"基板","quote":"約1.86EB、電力は6〜10GW級、HBM市場は約224億〜336億ドル、電源、電気設備、光、MLCC、先端基板まで巨大な需要が発生する。","quote_start":22,"quote_end":92,"text_sha256":"524281d46e300ad9590475d09d190d0887f60442f9eaa1234215f6473126f911","block_sha256":"524281d46e300ad9590475d09d190d0887f60442f9eaa1234215f6473126f911","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_dbe69fb8-f76d-44e6-b111-aa27e548a204/#blk_a07ff4f7-74e7-47ba-aca4-078d65cb93ad"},{"id":"occ_5fde6ed7bff55747b290e7dd","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_dbe69fb8-f76d-44e6-b111-aa27e548a204","work_id":"wrk_0252d3aa-e602-4a99-abf9-0b9ec2b5796a","block_id":"blk_d56890dc-0410-4694-9eb8-998dbd0b2089","section_id":"sec_3f89399d-01c1-48cb-a726-12941626338f","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":82,"end":84,"exact":"基板","quote":"Cメーカーにとって重要なのは、数量だけではない。AIサーバーでは、高容量、低ESL、高耐圧、高温対応、埋め込み基板対応、実効容量の大きいMLCCが必要になる。つまり、汎用品ではなく高付加価値品の比率が上がる。","quote_start":27,"quote_end":131,"text_sha256":"22ae32f84264aeeb7aadadc306b1ac6f600d2839804afcf233943df48454fe30","block_sha256":"22ae32f84264aeeb7aadadc306b1ac6f600d2839804afcf233943df48454fe30","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_dbe69fb8-f76d-44e6-b111-aa27e548a204/#blk_d56890dc-0410-4694-9eb8-998dbd0b2089"},{"id":"occ_4f18ca47226332729a92219c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_dbe69fb8-f76d-44e6-b111-aa27e548a204","work_id":"wrk_0252d3aa-e602-4a99-abf9-0b9ec2b5796a","block_id":"blk_e020c488-fb6b-4b11-8a0d-59c543026edf","section_id":"sec_51aca827-3de7-49b8-a646-accdf331ac06","layer":"body","character_id":null,"count":3,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":8,"end":10,"exact":"基板","quote":"先端パッケージや基板では、TSMC、ASE、Amkor、Ibiden、Shinko、Unimicron、Ajinomotoが重要になる。TPU/ASICはHBMを載せるため、2.5Dパッケージ、インターポーザ、ABF基板","quote_start":0,"quote_end":110,"text_sha256":"ca2323758a1ec6d06071b093c57ba4768db4af2badb0f6b0a4ca780c51b5973a","block_sha256":"ca2323758a1ec6d06071b093c57ba4768db4af2badb0f6b0a4ca780c51b5973a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_dbe69fb8-f76d-44e6-b111-aa27e548a204/#blk_e020c488-fb6b-4b11-8a0d-59c543026edf"},{"id":"occ_7ed75f508c2b73c5f272cad8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_dbe69fb8-f76d-44e6-b111-aa27e548a204","work_id":"wrk_0252d3aa-e602-4a99-abf9-0b9ec2b5796a","block_id":"blk_e4a1737f-2ab0-4de6-863d-15402f481c8a","section_id":"sec_51aca827-3de7-49b8-a646-accdf331ac06","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NVL144とNVL576のロードマップ比較: PCB、CPO、受益者銘柄群を分けて読む","quote_start":0,"quote_end":50,"text_sha256":"3f49435cf1b8500850e941c62e0913035535e6518326a4e9763aea3eccafb619","block_sha256":null,"offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/"},{"id":"occ_be02bd4e21e8a8d4fa615768","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_076eeb8f-d36e-4c68-9787-08d32d4d5888","section_id":"sec_2d69188d-ada2-47a4-a0de-7ed6542fdb51","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":127,"end":130,"exact":"PCB","quote":"め、ラック間光接続、CPO、ファイバー密度、レーザー、NVSwitch統合が難所になる。つまりKyberは銅とPCBの壁、NVL576は光と運用の壁である。","quote_start":72,"quote_end":150,"text_sha256":"5be0dcf09faeb63d4bfd241e0f6d9cd5f7fc653f648dc79e174f5794df11e44d","block_sha256":"5be0dcf09faeb63d4bfd241e0f6d9cd5f7fc653f648dc79e174f5794df11e44d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_076eeb8f-d36e-4c68-9787-08d32d4d5888"},{"id":"occ_54c377ec86b1aa72b2b845b5","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_0de1f99a-f05c-4651-ae95-3df06c67fadf","section_id":"sec_e39ce498-d90e-4fec-a6ea-6f924e89ff43","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":78,"end":81,"exact":"PCB","quote":"数・高速デジタル材料を展開する。超低損失材料、低CTE材料、多回積層対応材料を持つため、Kyber級のシステムPCBが量産される場合の有力な材料候補となる。Kyberへの直接採用は未確認である。([EMCTW][8])","quote_start":23,"quote_end":132,"text_sha256":"4ebb11ee66060acb04bc767e19515b7cc1e461c5de86e902a7e063d2227ead48","block_sha256":"4ebb11ee66060acb04bc767e19515b7cc1e461c5de86e902a7e063d2227ead48","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_0de1f99a-f05c-4651-ae95-3df06c67fadf"},{"id":"occ_c290f656977d32287d35c7f4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_0e53af67-9e2b-42f7-a127-b08ade2a0ff2","section_id":"sec_f33fddd9-7b31-4e0e-919e-a4d5788a3871","layer":"code","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":48,"end":50,"exact":"基板","quote":"```text\nGPUダイ・HBM\n　↓\nシリコンインターポーザー\n　↓\nFC-BGAパッケージ基板\n　↓\nGPUアクセラレーターボード\n```","quote_start":0,"quote_end":72,"text_sha256":"4c9c3f4d401b962ef180eeb59658245eea599d73b27895ac000f8f33eb87d356","block_sha256":"4c9c3f4d401b962ef180eeb59658245eea599d73b27895ac000f8f33eb87d356","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_0e53af67-9e2b-42f7-a127-b08ade2a0ff2"},{"id":"occ_4b7272d74349f27450664723","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_0e88aa0f-8a91-477f-b5e4-891dfa57ae9a","section_id":"sec_fb5d4657-6cdb-43bf-9732-f320c1b77a50","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":9,"end":12,"exact":"PCB","quote":"高階HDIと高多層PCBを主力とし、AI・高性能計算向けに低損失材料と信号品質技術を展開している。","quote_start":0,"quote_end":49,"text_sha256":"79253866774e26167d1e60875debbef35106b816f23500fe30d72170ad0c9ac1","block_sha256":"79253866774e26167d1e60875debbef35106b816f23500fe30d72170ad0c9ac1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_0e88aa0f-8a91-477f-b5e4-891dfa57ae9a"},{"id":"occ_94e047ef483c158315baa9ca","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_133b9e16-6d3a-4441-a13d-89b98142f1c0","section_id":"sec_f1717796-0eec-4cf7-a82b-127ae3651ffa","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":313,"end":316,"exact":"PCB","quote":"ア | 大型高多層、低損失、反り制御    |\n| 代表的企業群   | イビデン、シンコーなど | システムPCB企業         |\n| Kyber固有性 | 低い          | 非常に高い             |","quote_start":258,"quote_end":375,"text_sha256":"47cbdde22297403fc3b5af71aebbe33e97c37a3c4b96c0a01c0284d75ba86cd2","block_sha256":"47cbdde22297403fc3b5af71aebbe33e97c37a3c4b96c0a01c0284d75ba86cd2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_133b9e16-6d3a-4441-a13d-89b98142f1c0"},{"id":"occ_9bbbc987c2a08175ac317ab2","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_135c61e3-1b42-4395-8d8c-bb91dd28795c","section_id":"sec_10f607dc-4f5d-43ee-9f0a-b7bc2623dad4","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":32,"end":35,"exact":"PCB","quote":"# Kyber NVL144とNVL576のロードマップ比較: PCB、CPO、受益者銘柄群を分けて読む","quote_start":0,"quote_end":52,"text_sha256":"004e92c3b569a9b324138ddbae48b554499682d7383174acd0ef8f38fe4b8b6d","block_sha256":"004e92c3b569a9b324138ddbae48b554499682d7383174acd0ef8f38fe4b8b6d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_135c61e3-1b42-4395-8d8c-bb91dd28795c"},{"id":"occ_4880bb86e2cbfee052e801f8","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_14e1b690-9cd8-4016-ae11-0dc8d6eec551","section_id":"sec_24401d61-e9fb-4e2d-bfcf-f0bd5f75e348","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":6,"end":9,"exact":"PCB","quote":"KyberのPCB問題と、イビデンが製造するFC-BGAは別の階層にある。","quote_start":0,"quote_end":37,"text_sha256":"b8783cd13c7cc88dea9552dcc7b29049de2e583be72b6d34e4b98198909951ef","block_sha256":"b8783cd13c7cc88dea9552dcc7b29049de2e583be72b6d34e4b98198909951ef","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_14e1b690-9cd8-4016-ae11-0dc8d6eec551"},{"id":"occ_256351369760013471526836","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_18c95b8e-b0e1-4430-a929-242c650fe787","section_id":"sec_1d178d94-2813-4c76-bc9f-8fa0941041ca","layer":"body","character_id":null,"count":2,"matched_aliases":["CCL","PCB"],"evidence":{"text_basis":"markdown","start":21,"end":24,"exact":"PCB","quote":"**絶ノイア:** Kyberが遅れると、PCBやCCLには直接影響しやすいですね。","quote_start":0,"quote_end":42,"text_sha256":"5dffd566e630364a0eebb08d7e66e89b4f6a05310615d7f0013d5395335ee548","block_sha256":"5dffd566e630364a0eebb08d7e66e89b4f6a05310615d7f0013d5395335ee548","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_18c95b8e-b0e1-4430-a929-242c650fe787"},{"id":"occ_6672c24673f5082a8fed8560","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_1b769125-f2b6-4387-886e-a343b46761ec","section_id":"sec_ae16f1f3-4109-4bbd-81b4-26d78e5a5836","layer":"character","character_id":"zetu_noia","count":3,"matched_aliases":["CCL","PCB"],"evidence":{"text_basis":"markdown","start":7,"end":10,"exact":"PCB","quote":"私は、ここを「PCBの話」と「CPOの話」に分けて見ます。Kyberで見るべきは、高多層PCB、低損失CCL、コネクター、800VDC、液冷。NVL576で見るべきは、CPO、ファイバー実装、光エンジン、NVSwitch","quote_start":0,"quote_end":110,"text_sha256":"10d6e62fbb2d79c5299cdace0be95cd2b154b70bd6c342e1e2ea55676fb51fc0","block_sha256":"10d6e62fbb2d79c5299cdace0be95cd2b154b70bd6c342e1e2ea55676fb51fc0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_1b769125-f2b6-4387-886e-a343b46761ec"},{"id":"occ_29a5704178ca31631790bb47","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_1d4e49a0-a403-4982-a9fe-48513df7ecca","section_id":"sec_69f11bc3-6baf-43d8-b752-80cf5c40a488","layer":"body","character_id":null,"count":2,"matched_aliases":["CCL","低誘電"],"evidence":{"text_basis":"markdown","start":28,"end":31,"exact":"低誘電","quote":"Kyberのような大型・高多層・高速ミッドプレーンでは、低誘電率、低損失、低熱膨張率、高い寸法安定性を持つ高級CCLの使用量が増える。","quote_start":0,"quote_end":67,"text_sha256":"4c5b46ca946b8e37c655c211474d6950d0735a2b8bb0eabba689b3118ae9e18d","block_sha256":"4c5b46ca946b8e37c655c211474d6950d0735a2b8bb0eabba689b3118ae9e18d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_1d4e49a0-a403-4982-a9fe-48513df7ecca"},{"id":"occ_ea8205f51715e0267448e308","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_1e8389c2-30f8-4676-a285-e9aec7f9acd9","section_id":"sec_f1717796-0eec-4cf7-a82b-127ae3651ffa","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":72,"end":75,"exact":"PCB","quote":"たGPUパッケージを載せたコンピュートブレードと、NVLinkスイッチブレードをラック内部でつなぐ大型システムPCBである。","quote_start":17,"quote_end":79,"text_sha256":"a92e28f246a2e104064f65ad0e2d9954866fa64685120a3e9d2f3326671bb86d","block_sha256":"a92e28f246a2e104064f65ad0e2d9954866fa64685120a3e9d2f3326671bb86d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_1e8389c2-30f8-4676-a285-e9aec7f9acd9"},{"id":"occ_c51c818861f5c78bd425c907","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_1edc012c-6929-477b-8ccc-765df0e2d6d7","section_id":"sec_796d00e5-4f2e-4bd2-91c8-9716e4c4dfa6","layer":"body","character_id":null,"count":2,"matched_aliases":["CCL","PCB"],"evidence":{"text_basis":"markdown","start":74,"end":77,"exact":"PCB","quote":"、SemiAnalysisが「Kyber NVL144は12カ月以上遅れて2028年へ移る」と報告したことで、PCB、CCL、電源、冷却などの関連銘柄が大きく反応した。","quote_start":19,"quote_end":103,"text_sha256":"4dafb9d3d5d81475f44ac96e727c1e1ff906df8861576079b9d0cf495ff9d64a","block_sha256":"4dafb9d3d5d81475f44ac96e727c1e1ff906df8861576079b9d0cf495ff9d64a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_1edc012c-6929-477b-8ccc-765df0e2d6d7"},{"id":"occ_d3ca13b1f88a848e1156e10c","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_1f24f837-61e2-4d42-a252-ff2886c4605b","section_id":"sec_cb84cb6e-83a7-49e1-9a40-b8d34daceac8","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":13,"end":15,"exact":"基板","quote":"* 積層時の位置ずれ\n* 基板の反り\n* 層間剝離\n* ビアの接続不良\n* 銅と樹脂の熱膨張差","quote_start":0,"quote_end":47,"text_sha256":"d19c1c0ebf7dc85b25a896aca3f202611924b0684f0369e864b95bbf2f50dd8e","block_sha256":"d19c1c0ebf7dc85b25a896aca3f202611924b0684f0369e864b95bbf2f50dd8e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_1f24f837-61e2-4d42-a252-ff2886c4605b"},{"id":"occ_6f3a9bb3217df3043a73909a","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_2211d48a-6520-4de7-a6f0-981854800eab","section_id":"sec_cb84cb6e-83a7-49e1-9a40-b8d34daceac8","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":10,"end":12,"exact":"基板","quote":"### 大型・高多層基板の歩留まり","quote_start":0,"quote_end":17,"text_sha256":"ec4e0a4cfa867889fdf7bb145066bfa8606a09a4649c612e49f9ff827d38f9e7","block_sha256":"ec4e0a4cfa867889fdf7bb145066bfa8606a09a4649c612e49f9ff827d38f9e7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_2211d48a-6520-4de7-a6f0-981854800eab"},{"id":"occ_6002da3f266f9d8066813a31","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_28d649bc-bd4c-4eb8-a74c-473e002f4c1d","section_id":"sec_e42ceebc-f725-456c-a681-0bc3de208d73","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":15,"end":18,"exact":"PCB","quote":"NVL576で問題になるのは、PCBミッドプレーンよりも、","quote_start":0,"quote_end":29,"text_sha256":"2b754bb1f20811dc6fb6f93fa20c72a2e8837d14b3245a0de46dc05ee7eef5cf","block_sha256":"2b754bb1f20811dc6fb6f93fa20c72a2e8837d14b3245a0de46dc05ee7eef5cf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_28d649bc-bd4c-4eb8-a74c-473e002f4c1d"},{"id":"occ_cdeff830a2fc205a37dc669b","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_2a141506-d9e5-4852-8de6-a4aea2d01913","section_id":"sec_66a51ff0-e5bd-4c6a-a346-1a294a441d4a","layer":"caption","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":15,"end":18,"exact":"PCB","quote":"![Kyberを支えるシステムPCB配線](media/c56337bd48b0ce87a5bf230fd7f47f6142df1632e5b628e991942d56d147c5be.png)","quote_start":0,"quote_end":97,"text_sha256":"3e1a555318f5f2fddd5c6291bbb62b156a33b181a070bfedc6bdf02f5475236b","block_sha256":"3e1a555318f5f2fddd5c6291bbb62b156a33b181a070bfedc6bdf02f5475236b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_2a141506-d9e5-4852-8de6-a4aea2d01913"},{"id":"occ_6a23cafcb0ba901ce9d66761","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_3c37ece5-05f1-4eaa-93f3-80dba87804cc","section_id":"sec_7f2531c6-0503-4240-b80a-5c5b02c51f28","layer":"code","character_id":null,"count":3,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":41,"end":43,"exact":"基板","quote":"```text\nRubin Ultra GPU\n　↓\nコンピュートブレード\n　↓\n基板対基板コネクター\n　↓\n大型PCBミッドプレーン\n　↓\n銅フライオーバーケーブル\n　↓\nNVLinkスイッチブレード\n```","quote_start":0,"quote_end":105,"text_sha256":"c0a05bfa3745a0f05f379af9ccc07bdea491298e59f52c01f9c063ac6bdd41ab","block_sha256":"c0a05bfa3745a0f05f379af9ccc07bdea491298e59f52c01f9c063ac6bdd41ab","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_3c37ece5-05f1-4eaa-93f3-80dba87804cc"},{"id":"occ_b70086739f4b9e4da6997cce","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_4a1bc53f-b651-4534-84a3-c3e3a9609dc9","section_id":"sec_e273bd1b-01e5-4e06-a706-6b2aa731426e","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":36,"end":39,"exact":"PCB","quote":"北米・アジアで試作から量産まで対応できるため、Kyber級の大型システムPCBに技術的に近い企業の一つである。ただしKyberへの採用は未確認である。([TTM Technologies][10])","quote_start":0,"quote_end":99,"text_sha256":"5802d38a1d914d8120fe30e6d485834bf28c7c031a18a8dd0ebc176b7fd42d43","block_sha256":"5802d38a1d914d8120fe30e6d485834bf28c7c031a18a8dd0ebc176b7fd42d43","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_4a1bc53f-b651-4534-84a3-c3e3a9609dc9"},{"id":"occ_59be995a746ab1db54ab5957","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_4c2f3619-c6a5-439b-95bd-f89859a7d834","section_id":"sec_f33fddd9-7b31-4e0e-919e-a4d5788a3871","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":19,"end":21,"exact":"基板","quote":"イビデンは高性能半導体向けFC-BGA基板を製造し、AIやデータセンター向け需要に対応する増産投資を行っている。([Ibiden][7])","quote_start":0,"quote_end":69,"text_sha256":"f650490b2919cdc189db733cff6bdedca1fb37a0b1d7173a66357aff8aa20af1","block_sha256":"f650490b2919cdc189db733cff6bdedca1fb37a0b1d7173a66357aff8aa20af1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_4c2f3619-c6a5-439b-95bd-f89859a7d834"},{"id":"occ_9d6c540f887e5af4060e0dc0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_50e6c402-498c-4ab0-a11b-0383c6099cb7","section_id":"sec_5b267c8d-939f-4ef7-b3f5-36062c417e38","layer":"body","character_id":null,"count":3,"matched_aliases":["CCL","PCB"],"evidence":{"text_basis":"markdown","start":25,"end":28,"exact":"PCB","quote":"- Kyber NVL144はラック内銅接続と大型PCBミッドプレーンが主な焦点である。\n- NVL576は8台のNVL72系ラックをつなぐ構成であり、主な焦点はラック間光接続とCPOに移る。\n- CCL、システムPCB、コネクターはKyber成功時の上振","quote_start":0,"quote_end":128,"text_sha256":"bdcfbddb98b619471a8601c9786ac6de69b86066aef32d83ce6e796a3ce6d9c0","block_sha256":"bdcfbddb98b619471a8601c9786ac6de69b86066aef32d83ce6e796a3ce6d9c0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_50e6c402-498c-4ab0-a11b-0383c6099cb7"},{"id":"occ_95bf347e886155aa45d2dce4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_56959f23-7f90-4993-ba44-28baf0305b67","section_id":"sec_f33fddd9-7b31-4e0e-919e-a4d5788a3871","layer":"body","character_id":null,"count":1,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":38,"end":40,"exact":"基板","quote":"FC-BGAは、GPUやCPUの半導体パッケージ直下に置かれるICパッケージ基板である。","quote_start":0,"quote_end":44,"text_sha256":"88f7c4c02b7cef2d673ae5a9b9a7aebf6ccdb7d96391f11a63d2af577cd3d9b9","block_sha256":"88f7c4c02b7cef2d673ae5a9b9a7aebf6ccdb7d96391f11a63d2af577cd3d9b9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_56959f23-7f90-4993-ba44-28baf0305b67"},{"id":"occ_1e2b3a9b2a3035c83a9cf277","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_5cc4d148-86f4-46cf-a376-8b591147e51b","section_id":"sec_796d00e5-4f2e-4bd2-91c8-9716e4c4dfa6","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":54,"end":57,"exact":"PCB","quote":"Kyber NVL144は、1台のラックに144基のGPUを収容する高密度ラックであり、主な技術リスクは大型PCBミッドプレーンにある。","quote_start":0,"quote_end":68,"text_sha256":"fb746ee60f090ab983e3dca1ad6abce496663d34843723db8ec470df79fd7b17","block_sha256":"fb746ee60f090ab983e3dca1ad6abce496663d34843723db8ec470df79fd7b17","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_5cc4d148-86f4-46cf-a376-8b591147e51b"},{"id":"occ_526accbdda9af1dba6ca7374","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_5dbe3142-fc9b-4dbb-a949-1189225fd8dc","section_id":"sec_76a9fe1c-449b-4c18-a379-9a08c9e575cd","layer":"body","character_id":null,"count":2,"matched_aliases":["CCL","PCB"],"evidence":{"text_basis":"markdown","start":0,"end":3,"exact":"CCL","quote":"CCL・システムPCB企業は、Kyber量産が成功した場合の上振れが大きい。しかし、採用企業が確定しておらず、量産延期時の期待剝落も大きい。","quote_start":0,"quote_end":70,"text_sha256":"30d75bcf75e1a9dfde84a4ffaee8991a71d60a544590617003583d7cdaaded78","block_sha256":"30d75bcf75e1a9dfde84a4ffaee8991a71d60a544590617003583d7cdaaded78","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_5dbe3142-fc9b-4dbb-a949-1189225fd8dc"},{"id":"occ_16a0e1b887ad544d1a0ee506","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_64b0db7c-d2a9-43cf-994c-8ef3758a46c0","section_id":"sec_a875e253-2da6-472a-80d8-7542126312bb","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":17,"end":20,"exact":"PCB","quote":"GPUとNVLinkスイッチを大型PCBミッドプレーンを介してall-to-all接続する設計であり、スイッチからミッドプレーンまでの一部には銅製フライオーバーケーブルも使われると推定されている。([SemiAnalysis][3])","quote_start":0,"quote_end":117,"text_sha256":"b6fb54937baca694e47e32ca3589c791924c7e549731175c828edc6d4a8abea9","block_sha256":"b6fb54937baca694e47e32ca3589c791924c7e549731175c828edc6d4a8abea9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_64b0db7c-d2a9-43cf-994c-8ef3758a46c0"},{"id":"occ_3dd64bd3c2237835e5d4871f","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_6518864b-47df-4425-9f8f-1923b9c09d09","section_id":"sec_2d69188d-ada2-47a4-a0de-7ed6542fdb51","layer":"body","character_id":null,"count":3,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":2,"end":5,"exact":"PCB","quote":"大型PCBミッドプレーンは、半導体パッケージ基板とも、通常のサーバーボードとも違う。面積が大きく、層数が多く、信号速度が高く、差し込まれるブレード数も多い。基板の反り、熱膨張、ビア、コネクター精度のどれか一つが","quote_start":0,"quote_end":105,"text_sha256":"90fed7f81786f7277e4392a563975f7086bfb90fcadb943fab4881cfcab96139","block_sha256":"90fed7f81786f7277e4392a563975f7086bfb90fcadb943fab4881cfcab96139","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_6518864b-47df-4425-9f8f-1923b9c09d09"},{"id":"occ_34e6072d110fce3a1a03b8c1","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_6f148954-a026-49a1-b21c-0ebe09d2f0e2","section_id":"sec_93dd6ff5-5d86-44a8-952c-d929bf20f2c2","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":49,"end":51,"exact":"基板","quote":"SemiAnalysisはVera Rubin NVL72でAmphenolのPaladinHD2基板対基板コネクターが使われると分析している。Kyberでも同種の超高速・高密度接続技術が必要になるが、正式採用は未確認である。([SemiAnalysis][14])","quote_start":0,"quote_end":133,"text_sha256":"3d60712232aafbb0c552fc74db7a83738555a18a66d7cd4becb2602e0b30c1f3","block_sha256":"3d60712232aafbb0c552fc74db7a83738555a18a66d7cd4becb2602e0b30c1f3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_6f148954-a026-49a1-b21c-0ebe09d2f0e2"},{"id":"occ_c22b214c93f256e19b822cfe","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_776af87a-da96-48e8-bf1e-efd9bea9b616","section_id":"sec_a875e253-2da6-472a-80d8-7542126312bb","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":136,"end":139,"exact":"PCB","quote":"a GPU\n* 合計144GPU\n* 72基のNVLink 7スイッチ\n* 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**Kyberそのものに賭けるならCCL・システムPCB。**\n> **高密度AIラック全体に賭けるなら800VDC・液冷。**\n> **Rubin Ultraの総出荷に賭けるならFC-BGA・HBM・先端パッケージ。**","quote_start":0,"quote_end":113,"text_sha256":"2e98c971ec7cdf9191155f88615ce115d4f90dba1dd3a1c39a662628a40fe73f","block_sha256":"2e98c971ec7cdf9191155f88615ce115d4f90dba1dd3a1c39a662628a40fe73f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_867a6f51-0e8d-4935-b111-786b0d9a1999"},{"id":"occ_e5839544e8a3f678248200a4","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_ad2298f3-6157-4bc6-9278-411774386f41","section_id":"sec_335ff7ca-a148-4047-b81e-9abead80394f","layer":"body","character_id":null,"count":2,"matched_aliases":["基板"],"evidence":{"text_basis":"markdown","start":14,"end":16,"exact":"基板","quote":"ブレードとミッドプレーン間の基板対基板コネクターや、NVLinkスイッチ付近の銅フライオーバー配線が必要になる。","quote_start":0,"quote_end":56,"text_sha256":"4f46ab74ec9e3e3305065a514aeb6ba0d0ef575cb80b76c4d11215f3856035ff","block_sha256":"4f46ab74ec9e3e3305065a514aeb6ba0d0ef575cb80b76c4d11215f3856035ff","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_ad2298f3-6157-4bc6-9278-411774386f41"},{"id":"occ_5800843180d47341aaaba650","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_b2aab693-317c-4a40-b481-98d2f53210ef","section_id":"sec_e273bd1b-01e5-4e06-a706-6b2aa731426e","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":32,"end":35,"exact":"PCB","quote":"AI、ハイパースケールサーバー、クラウド、高性能計算向けの複雑なPCBを製造し、バックプレーンとシステム統合も事業領域としている。","quote_start":0,"quote_end":65,"text_sha256":"39ad527043b8c07b1095f9bfd126034b384e61bf4de9f66698e5419a9f41bd5d","block_sha256":"39ad527043b8c07b1095f9bfd126034b384e61bf4de9f66698e5419a9f41bd5d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_b2aab693-317c-4a40-b481-98d2f53210ef"},{"id":"occ_1c3f96c7944abe98cc6dbbe0","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_c1515d33-fb98-4d99-b8f8-69e5acceee38","section_id":"sec_f6fe7f16-3ed2-4dd1-8fa0-b281c859c280","layer":"body","character_id":null,"count":1,"matched_aliases":["CCL"],"evidence":{"text_basis":"markdown","start":0,"end":3,"exact":"CCL","quote":"CCL企業はKyberへの直接感応度が高い。","quote_start":0,"quote_end":22,"text_sha256":"256e75f1f0db8a41b27d204254bf92b2b3267730892a850637c6f431a2ce454f","block_sha256":"256e75f1f0db8a41b27d204254bf92b2b3267730892a850637c6f431a2ce454f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_c1515d33-fb98-4d99-b8f8-69e5acceee38"},{"id":"occ_ee20a6d23a0cad756739dcd7","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_c3fe882a-e796-4cc4-b759-5be798c2b471","section_id":"sec_ee04cb4c-f5a0-4006-840e-5d89c555337c","layer":"body","character_id":null,"count":3,"matched_aliases":["PCB","基板"],"evidence":{"text_basis":"markdown","start":23,"end":26,"exact":"PCB","quote":"AI・高性能サーバー向けの高多層HDI、低損失PCB、ネットワーク基板を展開する。高層数、信号品質、熱管理を必要とするサーバー・スイッチ基板への感応度が高い。([GCE][12])","quote_start":0,"quote_end":90,"text_sha256":"e6d462447d41a0279e736d6646086d6011e1accc666412a64a0277926bcfda1b","block_sha256":"e6d462447d41a0279e736d6646086d6011e1accc666412a64a0277926bcfda1b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_c3fe882a-e796-4cc4-b759-5be798c2b471"},{"id":"occ_b900d0a7680ccbacc33bcecf","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_c6683653-b833-4fc6-9506-15d3a59062fd","section_id":"sec_06b1cda0-2a92-44fc-85b6-ec828ca72dda","layer":"body","character_id":null,"count":1,"matched_aliases":["CCL"],"evidence":{"text_basis":"markdown","start":23,"end":26,"exact":"CCL","quote":"一方、Kyber専用の大型ミッドプレーン、高級CCL、800VDCラック内部品の需要は後ろ倒しになる。","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Kyber NVL144\n  1ラック144GPU。ラック内部は銅接続。主なリスクはPCBミッドプレーン。","quote_start":0,"quote_end":55,"text_sha256":"650c4a47db4e65d5ad1cf11d821f99d46c8bc465c47384a17c6ca428b89c4cdb","block_sha256":"650c4a47db4e65d5ad1cf11d821f99d46c8bc465c47384a17c6ca428b89c4cdb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_d24e12ab-6bc9-4384-abce-0f7ea303ecfc"},{"id":"occ_742d5c78e1080773c7b865ba","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_d4dee993-b563-446b-9a1a-ef0b3d46d9be","section_id":"sec_69f11bc3-6baf-43d8-b752-80cf5c40a488","layer":"body","character_id":null,"count":1,"matched_aliases":["CCL"],"evidence":{"text_basis":"markdown","start":8,"end":11,"exact":"CCL","quote":"## 1．低損失CCLメーカー","quote_start":0,"quote_end":15,"text_sha256":"0a90bd02ee6a33a8f3fcbd4f6cbcf376e890edb1c8415d8f14c92165a0461972","block_sha256":"0a90bd02ee6a33a8f3fcbd4f6cbcf376e890edb1c8415d8f14c92165a0461972","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_d4dee993-b563-446b-9a1a-ef0b3d46d9be"},{"id":"occ_18b568585a0acbff0ed54191","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_d8483863-c32c-47ba-834e-98aaf5ff5e0b","section_id":"sec_7f2531c6-0503-4240-b80a-5c5b02c51f28","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":64,"end":67,"exact":"PCB","quote":"erの中心的なボトルネックはレーザーや光エンジンではなく、**144GPU分の超高速信号を扱える巨大なシステムPCBを量産できるか**である。","quote_start":9,"quote_end":80,"text_sha256":"442bc974190bc3241e81bbab436c79a84af43861ab370b58a6ff899f4d4448a7","block_sha256":"442bc974190bc3241e81bbab436c79a84af43861ab370b58a6ff899f4d4448a7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_d8483863-c32c-47ba-834e-98aaf5ff5e0b"},{"id":"occ_1bc03cb8c028e9c155c77845","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_dd7f0436-3fca-40da-a49a-2208f82bd06f","section_id":"sec_ccf76790-8f77-4dbb-9d6c-3d414fea02bd","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":39,"end":42,"exact":"PCB","quote":"イビデンよりも、Kyberのコンピュートブレードやスイッチボードに近いシステムPCB企業として理解しやすい。Kyber採用そのものは確認されていない。([Meiko Electric][13])","quote_start":0,"quote_end":97,"text_sha256":"8ecfad06dad3258a67f1b102bfa057ca7585ce010870f8acbdb21a34ad4920be","block_sha256":"8ecfad06dad3258a67f1b102bfa057ca7585ce010870f8acbdb21a34ad4920be","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ddbe7777-4c06-4736-a565-b1f544e649ff/#blk_dd7f0436-3fca-40da-a49a-2208f82bd06f"},{"id":"occ_5ef2a7d180cc218cf63ee774","topic_id":"top_8f9f00d9-1afc-4ec4-a7cb-ae60567096ae","revision_id":"rev_ddbe7777-4c06-4736-a565-b1f544e649ff","work_id":"wrk_83bf9cf8-cdd1-43de-97ff-cc1a6b5bf6c6","block_id":"blk_e6bd4a8e-ce08-4536-9026-2b03e7ae825b","section_id":"sec_9ca0c4c7-3777-44c6-98c6-caf7d219b20e","layer":"body","character_id":null,"count":1,"matched_aliases":["PCB"],"evidence":{"text_basis":"markdown","start":2,"end":5,"exact":"PCB","quote":"* PCBミッドプレーンの量産性が依然として難しい\n* 12カ月以上遅れる\n* 投入時期が2028年へ移る\n* 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| 液冷、CDU、熱交換器、空調              |\n| 半導体部材  | MLCC、インダクタ、PCB、ABF、銅箔       |\n| メモリ    | HBM、DRAM、SSD                |\n| 建設・不動産 | データセンター開発、電力用地              |\n| 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