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SoIC積層が2025年に量産へ入り、SoIC CoWを使うCOUPEは2026年の量産を目標としている","quote_start":0,"quote_end":132,"text_sha256":"41baa6d4c0bf935f33761781379f9d86f6990424ed38dac40bf0fccdf2c4e51d","block_sha256":"41baa6d4c0bf935f33761781379f9d86f6990424ed38dac40bf0fccdf2c4e51d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_0688057a-2aae-4f36-a0fe-30688b717e09"},{"id":"occ_5385edf0e5e36d4c4a87b9c1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_0f3cf4bc-a1c4-420d-aea0-066fca3327ea","section_id":"sec_ade70e95-1d52-4e80-9416-5c87d66f1849","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"UCIe 2.0で3Dパッケージ対応が追加され、Hybrid Bonding向けに、10～25µm級から1µm以下までの接続ピッチへ対応する拡張性が示された。([UCIe Consortium](https://www.uciexpress.org/specification","quote_start":0,"quote_end":138,"text_sha256":"e197d9bc81895179eb698b6f0f645cd98dac8a401d332a8307cb643f404e2feb","block_sha256":"e197d9bc81895179eb698b6f0f645cd98dac8a401d332a8307cb643f404e2feb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_0f3cf4bc-a1c4-420d-aea0-066fca3327ea"},{"id":"occ_44b918d10fd0b708b5b2fe09","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_1768d77e-b91f-422f-9f10-6f2c082286a6","section_id":"sec_5ac7466c-f5f7-4285-a595-f56612c10fe5","layer":"code","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":64,"end":68,"exact":"2.5D","quote":"D SRAM\n    │\nCompute Stack\n    │\nActive Base Die\n    │\n2.5D Interposer\n ┌──┼──────┐\nHBM HBM  Optical I/O\n    │\nPackage Substrate\n```","quote_start":9,"quote_end":141,"text_sha256":"1e29d08d475390bb6bdb48151b41af43b21f958935fe6a80f1c70c4c8b87768c","block_sha256":"1e29d08d475390bb6bdb48151b41af43b21f958935fe6a80f1c70c4c8b87768c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_1768d77e-b91f-422f-9f10-6f2c082286a6"},{"id":"occ_b9f487cb20f99b146a24e29c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_1d908b25-7f2d-4c11-adc1-b987f60cd127","section_id":"sec_00346202-9526-48d9-9422-789ee0a85dd8","layer":"body","character_id":null,"count":4,"matched_aliases":["2.5D","CoWoS","Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":61,"end":65,"exact":"SoIC","quote":"acheでは、CPUの近くへ大容量SRAMを置くためにキャッシュダイを積層する。Foveros DirectとSoICでは、異なるアクティブダイをHybrid Bondingで接合する。CoWoSでは、ロジックダイとHBMを巨大な2.5Dパッケージへ統合する。","quote_start":6,"quote_end":136,"text_sha256":"6ec3081b4d35fc4a5ced0c07c1d450ea161030abca769dbeaa670818d2eb6ab8","block_sha256":"6ec3081b4d35fc4a5ced0c07c1d450ea161030abca769dbeaa670818d2eb6ab8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_1d908b25-7f2d-4c11-adc1-b987f60cd127"},{"id":"occ_23f51fdfebdf763def3da0bb","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_21fbd938-f3c2-4560-9208-0206d7488a85","section_id":"sec_f866ac7e-7754-4fe8-ba66-930c2ccd2f38","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"**レチクル限界、Die-to-Die PHY、Hybrid Bonding、TSVから、3D V-Cache、Foveros Direct、SoIC**","quote_start":0,"quote_end":77,"text_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","block_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_21fbd938-f3c2-4560-9208-0206d7488a85"},{"id":"occ_b3d461921a42994320017df1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_23844f43-7368-4179-b8e6-ad41fffa6bc8","section_id":"sec_2d7c9862-dc8c-44b7-9018-861bbf60712f","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":21,"end":26,"exact":"CoWoS","quote":"しかしAIロジックとの関係では、現在は主にCoWoSなどを使い、ロジックの横へ配置される。","quote_start":0,"quote_end":45,"text_sha256":"a52240dfe5b73fc5fdfc7449acc645bd1b6cbf372a53934c642d68e3e54b6e6f","block_sha256":"a52240dfe5b73fc5fdfc7449acc645bd1b6cbf372a53934c642d68e3e54b6e6f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_23844f43-7368-4179-b8e6-ad41fffa6bc8"},{"id":"occ_00b6379d71db5d01d93ce659","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_24beeffe-ff42-4bf2-8678-702c3d5b6274","section_id":"sec_f22e7b7a-adc9-4b35-8fe3-3d21f2d31b04","layer":"code","character_id":null,"count":4,"matched_aliases":["2.5D","CoWoS","Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":59,"end":63,"exact":"2.5D","quote":"微細化\n  ↓\n巨大モノリシックSoC\n  ↓\nレチクル・歩留まり・コストの壁\n  ↓\nチップレット\n  ↓\n2.5Dパッケージ\n  ↓\nマイクロバンプ\n  ↓\nHybrid Bonding\n  ↓\nTSV\n  ↓\nDie-to-Die PHY\n  ↓\nUCIe\n  ↓\nSoIC・Foveros Direct・CoW","quote_start":4,"quote_end":163,"text_sha256":"42948f4d625577e51e5a4596891a81bab5a9542cbeb4f7484fae0097e1bdde2b","block_sha256":"42948f4d625577e51e5a4596891a81bab5a9542cbeb4f7484fae0097e1bdde2b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_24beeffe-ff42-4bf2-8678-702c3d5b6274"},{"id":"occ_d9db54bf578f01ec733b5b7e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_2cf1af12-225c-4c1c-a116-e590d36b7b97","section_id":"sec_bb25127e-bbc2-4188-8541-7d6659070eb4","layer":"body","character_id":null,"count":4,"matched_aliases":["2.5D","CoWoS","Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":66,"end":80,"exact":"Hybrid Bonding","quote":"層\n- イメージセンサーの積層\n- SRAM／Cache-on-Logic\n- マイクロバンプ型3D積層\n- Hybrid Bonding型の一部3D製品\n- SoIC、Foveros系プラットフォーム\n- CoWoSなどの2.5D＋3D統合","quote_start":11,"quote_end":132,"text_sha256":"b238c90fad420ab8adf59f0a67ef048705cdcde2daf656272b3ba71d18fb12d2","block_sha256":"b238c90fad420ab8adf59f0a67ef048705cdcde2daf656272b3ba71d18fb12d2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_2cf1af12-225c-4c1c-a116-e590d36b7b97"},{"id":"occ_de680d52195be92fa7751c06","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_2d10f6bc-29a5-462a-9684-3122c83a918e","section_id":"sec_37cb14d1-63fb-4edd-81ac-99e343cbfb38","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":14,"end":28,"exact":"Hybrid Bonding","quote":"```\n上層セル\n   ↓\nHybrid Bonding\n   ↓\n下層セル\n   ↓\n別の層\n```","quote_start":0,"quote_end":51,"text_sha256":"6df4fb6b83aa934f63af51d38cc3cd25e7e18b5093794c04a44908829bf69419","block_sha256":"6df4fb6b83aa934f63af51d38cc3cd25e7e18b5093794c04a44908829bf69419","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_2d10f6bc-29a5-462a-9684-3122c83a918e"},{"id":"occ_f6638b92f36e08291f9d4f06","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_30511cc8-2d14-4397-907c-e72f15ad1fd2","section_id":"sec_93f5b857-521c-4796-b78d-c0b07833e6dd","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"SoIC","quote":"## SoICとFoveros Directは何を可能にするのか","quote_start":0,"quote_end":32,"text_sha256":"cde601b9d578e4905751b12b9c183f6c268540648f233310017796b12fb9c204","block_sha256":"cde601b9d578e4905751b12b9c183f6c268540648f233310017796b12fb9c204","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_30511cc8-2d14-4397-907c-e72f15ad1fd2"},{"id":"occ_61b6d07468d37f032b95f534","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_36c331c4-5cda-4596-bb50-fd3d11be1259","section_id":"sec_c5607d03-f325-47f6-8f5e-4d3c2bbb0958","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"SoIC","quote":"## SoIC＋CoWoSで「縦と横」を組み合わせる","quote_start":0,"quote_end":26,"text_sha256":"a35cb5e973d7c6616db45ba1bbf70ae393ccc4ab38490239a067370a18b88141","block_sha256":"a35cb5e973d7c6616db45ba1bbf70ae393ccc4ab38490239a067370a18b88141","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_36c331c4-5cda-4596-bb50-fd3d11be1259"},{"id":"occ_2857b67bc298f83cfbf3f10c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_3828a2de-e472-4923-a908-c696fe0e6b81","section_id":"sec_00346202-9526-48d9-9422-789ee0a85dd8","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":45,"end":49,"exact":"SoIC","quote":"前回は、AMD 3D V-Cache、Intel Foveros Direct、TSMC SoIC、CoWoSを通して、現在の3D積層技術がどのように製品へ使われているのかを見てきた。","quote_start":0,"quote_end":92,"text_sha256":"9772fc293755d0a51520d5af6c695551cabd466026c62fd9a49afed010ff25e2","block_sha256":"9772fc293755d0a51520d5af6c695551cabd466026c62fd9a49afed010ff25e2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_3828a2de-e472-4923-a908-c696fe0e6b81"},{"id":"occ_6d19b9b448dfe16e8359d171","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_3a6e7510-3bf4-4ac4-a1b6-09f514c89c2e","section_id":"sec_d603b7c4-00cd-4a14-9c58-1e909e9d40e0","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":17,"end":21,"exact":"2.5D","quote":"- 同一ダイ内に残す\n- 横方向の2.5Dへ置く\n- 別のチップレットへ分ける","quote_start":0,"quote_end":39,"text_sha256":"fd4ed9f22526fc001bf35c8198ea5295db4ef1503bcbdf063f409fb87854815d","block_sha256":"fd4ed9f22526fc001bf35c8198ea5295db4ef1503bcbdf063f409fb87854815d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_3a6e7510-3bf4-4ac4-a1b6-09f514c89c2e"},{"id":"occ_b525496284b4575927675315","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_3b47c9f7-77fc-49eb-b2c6-f946a26f8aee","section_id":"sec_ba612fd1-a1ec-4434-8498-c1550558c518","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":9,"end":13,"exact":"SoIC","quote":"TSMCは3nm SoIC積層を2025年に量産へ移行したと報告しており、imecは200nmピッチのWafer-to-Wafer Hybrid BondingをLogic-to-Logic研究へ展開している。現在の量産製品と","quote_start":0,"quote_end":113,"text_sha256":"a6cdc24c8563699831294edc81ac22aa57b035147bb6442aa8b79773702f3564","block_sha256":"a6cdc24c8563699831294edc81ac22aa57b035147bb6442aa8b79773702f3564","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_3b47c9f7-77fc-49eb-b2c6-f946a26f8aee"},{"id":"occ_b4f6481221ef2fad4321a4a1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_46dd27bd-5900-4eb8-9a96-8c1d2719c732","section_id":"sec_2d7c9862-dc8c-44b7-9018-861bbf60712f","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":28,"end":32,"exact":"2.5D","quote":"> **局所SRAMは垂直積層、巨大容量HBMは横方向の2.5D接続**","quote_start":0,"quote_end":36,"text_sha256":"ecbc3b9ad86d08f3212d5a7fefc5655d1fdbbccd7dc3a676e8335dc8d526d5f0","block_sha256":"ecbc3b9ad86d08f3212d5a7fefc5655d1fdbbccd7dc3a676e8335dc8d526d5f0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_46dd27bd-5900-4eb8-9a96-8c1d2719c732"},{"id":"occ_d3eac2b9d5d2d8535878f783","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_55e2c87c-be77-47e0-8084-624cefbcd833","section_id":"sec_c5607d03-f325-47f6-8f5e-4d3c2bbb0958","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICは縦方向の極短距離接続を担当する。","quote_start":0,"quote_end":21,"text_sha256":"3f99a1680804d6985c42906350a27c48a99f75c08df2a5f3412b558efae1dc67","block_sha256":"3f99a1680804d6985c42906350a27c48a99f75c08df2a5f3412b558efae1dc67","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_55e2c87c-be77-47e0-8084-624cefbcd833"},{"id":"occ_cb48a31dad93213364597168","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_575333d2-8512-4ac6-ae95-f544e7427d4b","section_id":"sec_75ca0a37-2cfb-48f0-b0ad-50522f80cafb","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":29,"end":43,"exact":"Hybrid Bonding","quote":"- 極めて細かな位置合わせ\n- 高い処理能力\n- 細ピッチHybrid Bonding\n- 同一サイズ・同一配置に向く","quote_start":0,"quote_end":59,"text_sha256":"b3f3c43fac81965ff7bc41063e7689740ba56bda46e1e2460d5ae32374117e78","block_sha256":"b3f3c43fac81965ff7bc41063e7689740ba56bda46e1e2460d5ae32374117e78","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_575333d2-8512-4ac6-ae95-f544e7427d4b"},{"id":"occ_31bda6dde74ca248b02c1dc1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_59ff89b7-b629-496b-8b69-871f930109a8","section_id":"sec_cd4f5d3e-e325-46bc-bdd4-e1922742e443","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":25,"end":39,"exact":"Hybrid Bonding","quote":"Foveros Directは、Cu-to-Cu Hybrid Bondingを使ってアクティブダイを直接積層する。","quote_start":0,"quote_end":58,"text_sha256":"b0a21a643e21a2ce300e431d596460ced8893a20f34f36660bc4bdba7d83db3e","block_sha256":"b0a21a643e21a2ce300e431d596460ced8893a20f34f36660bc4bdba7d83db3e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_59ff89b7-b629-496b-8b69-871f930109a8"},{"id":"occ_5804c07152667ab5095a264e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_5db73659-bda1-4d94-9ed4-c6ebc27eab18","section_id":"sec_d189e7e6-dbe2-46ae-a11a-e84080f85c69","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingが細かくなっても、上下のダイは別々に製造される。","quote_start":0,"quote_end":38,"text_sha256":"8ed8496cbd044ce2b3196937de048586e344c0280ee6b25962dbd21b619ba1fc","block_sha256":"8ed8496cbd044ce2b3196937de048586e344c0280ee6b25962dbd21b619ba1fc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_5db73659-bda1-4d94-9ed4-c6ebc27eab18"},{"id":"occ_65938b040ef798ae07dae638","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_6528509d-68a8-413d-aafe-a9e07c4e9ca6","section_id":"sec_77d45d65-2bb3-4c42-9d42-e61db539ee77","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":78,"end":92,"exact":"Hybrid Bonding","quote":"個または複数のチップレットをアクティブ・ベースタイルへ直接積層する技術として位置付けている。Cu-to-Cu Hybrid Bondingによって、高密度・低抵抗・低電力な垂直接続を狙う。([Intel](https://www.intel.com/content/www/us/en/foundry/library/advanced-p","quote_start":23,"quote_end":192,"text_sha256":"470b8ae62b890b492fdb657b06470c7f3eea65819073f5106ca77721c067cf0a","block_sha256":"470b8ae62b890b492fdb657b06470c7f3eea65819073f5106ca77721c067cf0a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_6528509d-68a8-413d-aafe-a9e07c4e9ca6"},{"id":"occ_cbd1eae6449f5d436a08b8a7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_69d773b4-8c03-4f4c-8574-ef013b43d310","section_id":"sec_cd4f5d3e-e325-46bc-bdd4-e1922742e443","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":28,"end":32,"exact":"EMIB","quote":"- 上下方向：Foveros Direct\n- 横方向：EMIB\n- 周辺：HBM、I/Oダイ","quote_start":0,"quote_end":47,"text_sha256":"e43fd2e8342f12aabe0bd8d05096716b1a46d2bcdd050ceab92677964ce06eb4","block_sha256":"e43fd2e8342f12aabe0bd8d05096716b1a46d2bcdd050ceab92677964ce06eb4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_69d773b4-8c03-4f4c-8574-ef013b43d310"},{"id":"occ_a5eb836047e90a16f1cb3eb4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_7629070c-a9d7-48ff-86f4-5ae3375463b0","section_id":"sec_1ba5a3b8-606a-40b9-9692-32b9b4ad54a8","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"SoIC","quote":"## TSMC SoIC","quote_start":0,"quote_end":12,"text_sha256":"0e470d11dfc50f3609d9b38cdf897f2ccd2e4cf2687ec8e84752ffeab6c9aa56","block_sha256":"0e470d11dfc50f3609d9b38cdf897f2ccd2e4cf2687ec8e84752ffeab6c9aa56","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_7629070c-a9d7-48ff-86f4-5ae3375463b0"},{"id":"occ_c15b0fdeb599594892c1b0d8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_7695edc0-49c1-4371-abc7-d49c48000d2f","section_id":"sec_c5607d03-f325-47f6-8f5e-4d3c2bbb0958","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":17,"end":21,"exact":"SoIC","quote":"という階層構造を作れる。TSMCはSoICをCoWoSやInFOと組み合わせる3Dx3D構成を公式に提示している。([3DFabric](https://3dfabric.tsmc.com/english/dedicatedFoundry/t","quote_start":0,"quote_end":121,"text_sha256":"a3ec3b180c6f1a48d2854b8d3f64689d32cd8a76f5e53b7b9279701b79b3feda","block_sha256":"a3ec3b180c6f1a48d2854b8d3f64689d32cd8a76f5e53b7b9279701b79b3feda","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_7695edc0-49c1-4371-abc7-d49c48000d2f"},{"id":"occ_90f2149b2c79ad87e4819811","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_7d68b1df-45f2-4d66-a14f-9aa80fa569e3","section_id":"sec_1ba5a3b8-606a-40b9-9692-32b9b4ad54a8","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICは、異なる機能、サイズ、ノードのダイを垂直統合するTSMCの3Dシリコン積層プラットフォームである。","quote_start":0,"quote_end":54,"text_sha256":"8cb3c6b98a5c24985927e03faa78cecb7a473d22d844a5c5812cb6c80a2bef6e","block_sha256":"8cb3c6b98a5c24985927e03faa78cecb7a473d22d844a5c5812cb6c80a2bef6e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_7d68b1df-45f2-4d66-a14f-9aa80fa569e3"},{"id":"occ_45c9e80ad73649530e2cd454","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_84531005-c4c3-4d02-8bdf-208bddbf5cc1","section_id":"sec_2d7c9862-dc8c-44b7-9018-861bbf60712f","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoSは、ロジックチップレットとHBMを高密度インターポーザー上へ統合するAI・HPC向け基盤として位置付けられている。([3DFabric](https://3dfabric.tsmc.com/engli","quote_start":0,"quote_end":105,"text_sha256":"85fa37930ed396b12edffd2a9bf022d8d711e944887bfd428ddf159e8e561c26","block_sha256":"85fa37930ed396b12edffd2a9bf022d8d711e944887bfd428ddf159e8e561c26","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_84531005-c4c3-4d02-8bdf-208bddbf5cc1"},{"id":"occ_227e08373346019f27ed3b16","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_87b2540a-cad2-46b5-be87-db703b051be4","section_id":"sec_c5607d03-f325-47f6-8f5e-4d3c2bbb0958","layer":"code","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":26,"end":30,"exact":"SoIC","quote":"```\n上：SRAM／Logic\n       │ SoIC\n下：Compute\n       │\nCoWoS Interposer\n  │             │\nHBM           HBM\n```","quote_start":0,"quote_end":106,"text_sha256":"85ca35f2574e8923d22bbfc62675b91229ff887a5302fb25d211afc9ef7e0f8e","block_sha256":"85ca35f2574e8923d22bbfc62675b91229ff887a5302fb25d211afc9ef7e0f8e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_87b2540a-cad2-46b5-be87-db703b051be4"},{"id":"occ_140ff915f27984008325ef8c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_8b0d07fa-3a6b-472c-8a92-b72ad087c80b","section_id":"sec_cf2d9471-8f4d-4441-adb9-bdfaf8e98b63","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":61,"end":75,"exact":"Hybrid Bonding","quote":"プロセッサーとメモリーの経路を短縮してメモリーウォールを緩和することを、3D統合の主要な利点の一つとしている。Hybrid Bondingの微細化も、SRAM-on-LogicやMemory-on-Logicを主要な用途として進められている。([imec](https://www.imec-int.com/en/expertise/cm","quote_start":6,"quote_end":175,"text_sha256":"33d5ee26acd2a69b48d35503ef6f221dc2c266f9eec60ecd658946d43f7cb385","block_sha256":"33d5ee26acd2a69b48d35503ef6f221dc2c266f9eec60ecd658946d43f7cb385","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_8b0d07fa-3a6b-472c-8a92-b72ad087c80b"},{"id":"occ_3fe935c4621b94bf1721a681","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_938c30eb-31e2-453c-b72c-2f99136b203e","section_id":"sec_96533d12-6ca9-4c99-ac1c-34693413c32e","layer":"body","character_id":null,"count":4,"matched_aliases":["CoWoS","EMIB","Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":182,"end":196,"exact":"Hybrid Bonding","quote":"、スケジューラーのような細粒度分割には、sub-µm級の高密度接続とアーキテクチャの再設計が必要になる。\n- Hybrid Bonding、SoIC、Foveros Directは、Logic Foldingを製造するための基盤になる。\n- UCIe-3Dは相互運用性に向くが、極細粒度ロジックでは専用3Dインターフェースが有利な場合があ","quote_start":127,"quote_end":296,"text_sha256":"c9ba616b5d7dd36dbeeedf18db25ff002bb69f0d572bdb213625960758f9d330","block_sha256":"c9ba616b5d7dd36dbeeedf18db25ff002bb69f0d572bdb213625960758f9d330","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_938c30eb-31e2-453c-b72c-2f99136b203e"},{"id":"occ_551d0f6a7a60669e1dee6d3b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_a53122e0-cb4e-40de-ad49-4a6536cf126d","section_id":"sec_c5607d03-f325-47f6-8f5e-4d3c2bbb0958","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoSは横方向の広いシステム接続を担当する。","quote_start":0,"quote_end":24,"text_sha256":"4a218e444618781f8421903c10b26d1509a183792afd1534cf333327e1d20172","block_sha256":"4a218e444618781f8421903c10b26d1509a183792afd1534cf333327e1d20172","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_a53122e0-cb4e-40de-ad49-4a6536cf126d"},{"id":"occ_cbd431d893af58d930065d3e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_ad62d980-03fd-496a-b711-3bdf6c98f565","section_id":"sec_f18503e9-d5c9-4719-872d-7049bf19bc6c","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":26,"end":40,"exact":"Hybrid Bonding","quote":"- Logic-on-Logic\n- sub-µm Hybrid Bonding\n- 高密度裏面接続\n- 裏面電源と3D積層の統合\n- 電気ICとフォトニクスICの積層\n- UCIe-3Dによる標準接続","quote_start":0,"quote_end":101,"text_sha256":"22ef10441c4f421c290bcd81a64725f3fe6363f8abd1f0494deffc6cf0a3d8b8","block_sha256":"22ef10441c4f421c290bcd81a64725f3fe6363f8abd1f0494deffc6cf0a3d8b8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_ad62d980-03fd-496a-b711-3bdf6c98f565"},{"id":"occ_a4e6b6e9cbd330a054a82cf8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_af557c66-b02d-4314-a8e1-b39e8b352412","section_id":"sec_cd4f5d3e-e325-46bc-bdd4-e1922742e443","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"EMIB","quote":"さらにEMIBと組み合わせれば、","quote_start":0,"quote_end":16,"text_sha256":"e1374bb1721db0c76597d2369dfb33f1bf943146fcdcac3c1df4ba1fba9c6852","block_sha256":"e1374bb1721db0c76597d2369dfb33f1bf943146fcdcac3c1df4ba1fba9c6852","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_af557c66-b02d-4314-a8e1-b39e8b352412"},{"id":"occ_e5a50f4839b4317d8bce2164","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_afcdb6a9-31b6-4a52-bd54-4bf5c4693e24","section_id":"sec_1ba5a3b8-606a-40b9-9692-32b9b4ad54a8","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":7,"end":11,"exact":"SoIC","quote":"- 上下方向：SoIC\n- 横方向：CoWoS\n- 外部メモリー：HBM","quote_start":0,"quote_end":36,"text_sha256":"7d67daca2de14119081b9c0279a2247a44bd38c5190b2e21bb9fa227f75b5c22","block_sha256":"7d67daca2de14119081b9c0279a2247a44bd38c5190b2e21bb9fa227f75b5c22","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_afcdb6a9-31b6-4a52-bd54-4bf5c4693e24"},{"id":"occ_23e46675309dfb107e5c338f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_b7ecab34-86a5-4d25-8abf-73c4d325dc6a","section_id":"sec_c61fc5cc-4a8d-4dcb-a6ef-dfe6c0867dfe","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid BondingでSRAMとLogicを積む。","quote_start":0,"quote_end":29,"text_sha256":"ad44fd070d377a3a1af01ebe83f516c96bfc4b70bfe30df151104a9d6ef77e8c","block_sha256":"ad44fd070d377a3a1af01ebe83f516c96bfc4b70bfe30df151104a9d6ef77e8c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_b7ecab34-86a5-4d25-8abf-73c4d325dc6a"},{"id":"occ_134c4d693ec2c1c4853d273f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_bc62c914-076d-4452-91f0-39d6617beae2","section_id":"sec_b0068e5a-6245-413d-9197-6f6cdd6727e3","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":6,"end":20,"exact":"Hybrid Bonding","quote":"imecは、Hybrid Bondingの接続ピッチがsub-µmへ縮小することで、回路ブロック、将来的には標準セルに近い粒度でSoCを分割する方向を示している。2026年には、研究用テスト構造で200nmピッチのWafer-to-Wafe","quote_start":0,"quote_end":120,"text_sha256":"211bd41ee8daca841d92d4abc1d03cfa19e46cbb036fb94af79013111cda2603","block_sha256":"211bd41ee8daca841d92d4abc1d03cfa19e46cbb036fb94af79013111cda2603","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_bc62c914-076d-4452-91f0-39d6617beae2"},{"id":"occ_3cf24cba6bbf521a452647fa","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_c1772154-7647-495a-9824-ab2c80b51a50","section_id":"sec_795db8eb-da43-49ba-bf97-30a6f8dbe754","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid BondingがLogic Foldingの中核になる","quote_start":0,"quote_end":37,"text_sha256":"d6445d308346d5c067a2661bbc4c4aa23bc7c91c40f8442333de97838729b29c","block_sha256":"d6445d308346d5c067a2661bbc4c4aa23bc7c91c40f8442333de97838729b29c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_c1772154-7647-495a-9824-ab2c80b51a50"},{"id":"occ_609a2a31dcfb4c51f7f89741","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_c1c22f0a-6346-4f8f-992d-97de8b3153f5","section_id":"sec_00e8949d-9524-4c72-9d68-6173dc83fd9a","layer":"code","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":58,"end":72,"exact":"Hybrid Bonding","quote":"\nCompute Package\n      │\nElectrical Control IC\n      │ Hybrid Bonding／SoIC\nPhotonic IC\n      │\nOptical Fiber\n```","quote_start":3,"quote_end":115,"text_sha256":"913c5cc6a1a66da0eb1bbb099c52eb542f0e46d61a4002f1d73cde0cea630481","block_sha256":"913c5cc6a1a66da0eb1bbb099c52eb542f0e46d61a4002f1d73cde0cea630481","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_c1c22f0a-6346-4f8f-992d-97de8b3153f5"},{"id":"occ_976f6e77e91ec0cfbb53632a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_c8e50b2e-c07f-4b7b-b18f-0b3ba4f8496f","section_id":"sec_1ba5a3b8-606a-40b9-9692-32b9b4ad54a8","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICで積層した構造をCoWoSへ載せれば、","quote_start":0,"quote_end":23,"text_sha256":"c195aa7b0d6d85f368951bd9c96b3ad0704ee85b3553cfc44e48c794ad53a5ff","block_sha256":"c195aa7b0d6d85f368951bd9c96b3ad0704ee85b3553cfc44e48c794ad53a5ff","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_c8e50b2e-c07f-4b7b-b18f-0b3ba4f8496f"},{"id":"occ_de9622bbb9fee9882be031b0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_ca5b15f5-f0a4-4200-8e11-79c3a500c727","section_id":"sec_6a770b13-f0be-4188-beeb-3756f5614c8f","layer":"code","character_id":null,"count":2,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":156,"end":161,"exact":"CoWoS","quote":"   │\nベース層\nNoC・Router・Memory Controller・I/O\n          │\nCoWoS／EMIB\n   ┌──────┴──────┐\n  HBM          HBM\n          │\n光I/O・ネットワーク\n```","quote_start":101,"quote_end":232,"text_sha256":"327a13be3f531e73a4ac8d3744c696d4e7ee10d79da24ade28291466ac00dda4","block_sha256":"327a13be3f531e73a4ac8d3744c696d4e7ee10d79da24ade28291466ac00dda4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_ca5b15f5-f0a4-4200-8e11-79c3a500c727"},{"id":"occ_972c5565ca5b5e4c0b496e31","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_d8c3ccf3-c49f-4e4d-8fe1-d07276f9651d","section_id":"sec_cd4f5d3e-e325-46bc-bdd4-e1922742e443","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":22,"end":26,"exact":"EMIB","quote":"という大規模構成を作れる。IntelはこれをEMIB 3.5Dソリューションとして展開している。([Intel](https://www.intel.co.jp/content/www/jp/ja/foundry/packaging.html?utm_","quote_start":0,"quote_end":126,"text_sha256":"2383e6f89df7f0e9e5f37b2ce4a3f60c39bb9fa1bc0c6eb322da6b867015107c","block_sha256":"2383e6f89df7f0e9e5f37b2ce4a3f60c39bb9fa1bc0c6eb322da6b867015107c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_d8c3ccf3-c49f-4e4d-8fe1-d07276f9651d"},{"id":"occ_856a9c257b4fcefc08a457f4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_d9ed9001-63b6-4b5e-94ce-a7fb5f4a3f0c","section_id":"sec_ade70e95-1d52-4e80-9416-5c87d66f1849","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":53,"end":67,"exact":"Hybrid Bonding","quote":"```\nProtocol\n   ↓\nUCIe Adapter\n   ↓\nUCIe-3D PHY\n   ↓\nHybrid Bonding\n   ↓\n相手側ダイ\n```","quote_start":0,"quote_end":82,"text_sha256":"2eeb8d5857e47b0884a8ab7f3740305331a9aef7136d561d01e4c0bac6dcc4cc","block_sha256":"2eeb8d5857e47b0884a8ab7f3740305331a9aef7136d561d01e4c0bac6dcc4cc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_d9ed9001-63b6-4b5e-94ce-a7fb5f4a3f0c"},{"id":"occ_fac985a31935477c21d2f3ee","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_dae28387-9b50-48d2-b4e9-0ec53726770b","section_id":"sec_d189e7e6-dbe2-46ae-a11a-e84080f85c69","layer":"code","character_id":null,"count":2,"matched_aliases":["2.5D","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":25,"end":39,"exact":"Hybrid Bonding","quote":"```\nモノリシックSoC\n最短・最密\n\n\n細粒度Hybrid Bonding\n非常に近い\n\n\nマイクロバンプ3D\n中程度\n\n\n2.5Dインターポーザー\nより長い\n\n\n有機基板\n最も長い\n```","quote_start":0,"quote_end":97,"text_sha256":"527ebcd9784e2fecf9900efb9b63a370f8fcfc899ed12662c50dc6dacff91b11","block_sha256":"527ebcd9784e2fecf9900efb9b63a370f8fcfc899ed12662c50dc6dacff91b11","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_dae28387-9b50-48d2-b4e9-0ec53726770b"},{"id":"occ_4b25edd89b32af555443515d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_de5bca38-e14d-4bc8-93d4-ead4409101d8","section_id":"sec_795db8eb-da43-49ba-bf97-30a6f8dbe754","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":65,"end":79,"exact":"Hybrid Bonding","quote":"ry-on-LogicやLogic-on-Logicに必要な接続密度を得るには、Wafer-to-Wafer Hybrid Bondingが有力だとしている。2024年には400nm、2026年には200nmピッチの研究実証が公表されたが、これらは量産製品の一般仕様ではなく、次世代研究の到達点である。([imec](https://ww","quote_start":10,"quote_end":179,"text_sha256":"1f88d4f06dfe2237afc51180fc8f5612a420127dcc48f10055eece9ad1d4607f","block_sha256":"1f88d4f06dfe2237afc51180fc8f5612a420127dcc48f10055eece9ad1d4607f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_de5bca38-e14d-4bc8-93d4-ead4409101d8"},{"id":"occ_717ccb696ed9c98daa910d01","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_e11605c3-5769-49af-8c0f-3005ce2bd3aa","section_id":"sec_795db8eb-da43-49ba-bf97-30a6f8dbe754","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingでは、","quote_start":0,"quote_end":17,"text_sha256":"6d5151cec53fb0c89e572b90a329b49902c70bf5252c58841b52398b860a7e8e","block_sha256":"6d5151cec53fb0c89e572b90a329b49902c70bf5252c58841b52398b860a7e8e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_e11605c3-5769-49af-8c0f-3005ce2bd3aa"},{"id":"occ_70ec6c810df9218746229f60","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_04caab49-911d-4fa8-9f6d-3786d6161ca6","work_id":"wrk_0d59b917-4500-410a-8f04-11e61ecb4938","block_id":"blk_f185ae76-8aab-4392-b6a3-c6d7b90fcf98","section_id":"sec_bcc78d26-8f0a-456b-ab15-2014427f2f0b","layer":"code","character_id":null,"count":5,"matched_aliases":["CoWoS","EMIB","Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":82,"end":96,"exact":"Hybrid Bonding","quote":"─\n\n上層\n大容量SRAM\nWeight Cache\nActivation Buffer\n\n       │ Hybrid Bonding\n\n中層\nTensor Core\nMatrix Engine\nVector Processor\n\n       │ Hybrid Bonding\n\n下層\nVertical NoC\nMemory Con","quote_start":27,"quote_end":196,"text_sha256":"eddc9a4122b36c3cefcf9946c1df14d35231bbda9bc92013c3055d7a3f9ab165","block_sha256":"eddc9a4122b36c3cefcf9946c1df14d35231bbda9bc92013c3055d7a3f9ab165","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_04caab49-911d-4fa8-9f6d-3786d6161ca6/#blk_f185ae76-8aab-4392-b6a3-c6d7b90fcf98"},{"id":"occ_081be65b5bbc818f5ca3d449","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_1d971701-45c7-4f08-bd61-8b48869e046d","section_id":"sec_f0a94295-2ee4-41f2-ac2d-2e5b784d9cde","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":328,"end":332,"exact":"2.5D","quote":"・低コストな2D接続向けである。\n- **UCIe-A**は、インターポーザーやブリッジを使う短距離・高密度な2.5D接続向けである。\n- **UCIe-3D**は、Hybrid Bondingを使う垂直方向の超高密度接続向けである。\n- UCIe 2.0で3DとSiP管理・DFxが追加され、UCIe 3.0ではUC","quote_start":273,"quote_end":432,"text_sha256":"7863c77a7789b5af9b7017b121dda2ad5da39128807ddce4299ed82e0ca42ebf","block_sha256":"7863c77a7789b5af9b7017b121dda2ad5da39128807ddce4299ed82e0ca42ebf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_1d971701-45c7-4f08-bd61-8b48869e046d"},{"id":"occ_0625d051caa5f889bced1d77","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_246db4cb-3ece-47da-9f66-5d8780aefd66","section_id":"sec_796efa44-8e92-406e-ae57-76beaf5444f3","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":45,"end":49,"exact":"2.5D","quote":"- シリコンインターポーザー\n- シリコンブリッジ\n- 微細RDL\n- ファンアウト\n- 2.5Dパッケージ","quote_start":0,"quote_end":54,"text_sha256":"181940bf0da8937e03a6d1883b84ea6c172b492f81a8577d0c9774121a557d48","block_sha256":"181940bf0da8937e03a6d1883b84ea6c172b492f81a8577d0c9774121a557d48","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_246db4cb-3ece-47da-9f66-5d8780aefd66"},{"id":"occ_fc7a4aaa0fcf2eec67a27043","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_3bbc7d3f-7e50-4969-9eae-3b3751233103","section_id":"sec_f07593eb-9436-4573-b762-27823e382a74","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingは接合技術である。","quote_start":0,"quote_end":23,"text_sha256":"25a38b51e9348f0cb3efaf692b98d9bee7cdd923b05fb1ce2cc0952e9b0009c2","block_sha256":"25a38b51e9348f0cb3efaf692b98d9bee7cdd923b05fb1ce2cc0952e9b0009c2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_3bbc7d3f-7e50-4969-9eae-3b3751233103"},{"id":"occ_b46b9986e74c4ef4091de607","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_78c75ab0-20ef-40b3-94dc-0d2e393bebab","section_id":"sec_f0a94295-2ee4-41f2-ac2d-2e5b784d9cde","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":9,"end":23,"exact":"Hybrid Bonding","quote":"次回は、UCIeやHybrid Bondingが実際の製品と製造技術でどのように使われているのかを、**AMD 3D V-Cache、Intel Foveros Direct、TSMC SoIC**を比較しながら解説する。","quote_start":0,"quote_end":111,"text_sha256":"1f132930936a86c5055d4c58c69f5e2eee246567972e40ca95ed58c726fc032a","block_sha256":"1f132930936a86c5055d4c58c69f5e2eee246567972e40ca95ed58c726fc032a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_78c75ab0-20ef-40b3-94dc-0d2e393bebab"},{"id":"occ_a126ebe6bc1cdee377004ef9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_8ffbd554-b7ed-4ea1-9b2d-c45b464a3ca6","section_id":"sec_5621094b-61cc-4ce7-b49a-6a55860494b5","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"**レチクル限界、Die-to-Die PHY、Hybrid Bonding、TSVから、3D V-Cache、Foveros Direct、SoIC**","quote_start":0,"quote_end":77,"text_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","block_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_8ffbd554-b7ed-4ea1-9b2d-c45b464a3ca6"},{"id":"occ_1ba6a34c166ff168f5478bff","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_96b10e1e-fceb-4c07-8ed8-4cf95f7c1f1b","section_id":"sec_bc01db18-7b44-44d6-acfd-c3ed11b2f5ce","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":157,"end":171,"exact":"Hybrid Bonding","quote":"d Package | 3D積層 |\n| 主な配線 | 有機基板 | インターポーザー、ブリッジ、RDL | Hybrid Bonding |\n| 接続距離 | 比較的長い | 短い | 極めて短い |\n| 接続密度 | 低～中 | 高い | 非常に高い |\n| PHY方式 | 少数・高速寄り | 多数・並列寄り | 超多数・広並列寄り","quote_start":102,"quote_end":271,"text_sha256":"acffd8784ec9f98ec286b2dd7e46956491ab1071c49494ec79504c2ba775e4c6","block_sha256":"acffd8784ec9f98ec286b2dd7e46956491ab1071c49494ec79504c2ba775e4c6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_96b10e1e-fceb-4c07-8ed8-4cf95f7c1f1b"},{"id":"occ_4587396a4cace819a79b5511","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_a0c891a8-daa4-4d12-bde9-19fb3d9b5a26","section_id":"sec_f07593eb-9436-4573-b762-27823e382a74","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingを使っても、通信方法が企業独自ならUCIe-3Dではない。","quote_start":0,"quote_end":43,"text_sha256":"b386f811ddd0ddb05acb0e542227352271e144e25d5a069eea139494d1f81a84","block_sha256":"b386f811ddd0ddb05acb0e542227352271e144e25d5a069eea139494d1f81a84","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_a0c891a8-daa4-4d12-bde9-19fb3d9b5a26"},{"id":"occ_3c9773c7713bad431b4c4895","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_a3ca40cb-b971-4c56-8e85-72fa8b1ac811","section_id":"sec_0b7529f7-d68d-4e06-8325-f8486dfab410","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":7,"end":11,"exact":"2.5D","quote":"UCIe-Aは2.5Dパッケージの短距離・高密度接続を可能にする。","quote_start":0,"quote_end":33,"text_sha256":"9b1e83ebca8ace37065d804be86da1f1f5926152e3e7ec91822020f797242e3a","block_sha256":"9b1e83ebca8ace37065d804be86da1f1f5926152e3e7ec91822020f797242e3a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_a3ca40cb-b971-4c56-8e85-72fa8b1ac811"},{"id":"occ_12962a45d1d4e4c1b3295dd8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_aedac2a6-2ae2-4a49-af94-09fa05d6afce","section_id":"sec_1987cecb-071f-4ac5-9170-135a49c17749","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":59,"end":73,"exact":"Hybrid Bonding","quote":"上側チップレット\n┌────────────┐\n│  Logic／SRAM  │\n└●●●●●●●●●●┘\n Hybrid Bonding\n┌●●●●●●●●●●┐\n│ Logic／Base  │\n└────────────┘\n下側チップレット\n```","quote_start":4,"quote_end":130,"text_sha256":"5d8cce252a738dc8994a7175cb59d06dfd84b50f9cbcdc7cec63283e03c1b973","block_sha256":"5d8cce252a738dc8994a7175cb59d06dfd84b50f9cbcdc7cec63283e03c1b973","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_aedac2a6-2ae2-4a49-af94-09fa05d6afce"},{"id":"occ_97fbc6fd4a07e1258b8e2e54","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_b6968f80-1765-4d4e-992b-2da407e8d0cb","section_id":"sec_1030812a-049e-4b14-b764-b3c8ef241090","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":8,"end":22,"exact":"Hybrid Bonding","quote":"マイクロバンプ、Hybrid Bonding、TSV、シリコンインターポーザー、Die-to-Die PHYがあれば、2つのダイの間に物理的な通信経路を作れる。","quote_start":0,"quote_end":80,"text_sha256":"f806a7df218dc6f8e9145e8f59f2ba5a40cef8ff760b8c0a591dbe5f305573c5","block_sha256":"f806a7df218dc6f8e9145e8f59f2ba5a40cef8ff760b8c0a591dbe5f305573c5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_b6968f80-1765-4d4e-992b-2da407e8d0cb"},{"id":"occ_a17d16bf7530e94a29d9e229","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_ba4e552a-7c39-4935-b480-bcf6094fcaf4","section_id":"sec_f07593eb-9436-4573-b762-27823e382a74","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"```\nHybrid Bonding\n\nCu-to-Cu接合\n＋\n誘電体接合\n＝物理的な接合面\n\n\nUCIe-3D\n\n信号\nレーン\nクロック\nリンク管理\n通信形式\n＝接合面を使う通信規格\n```","quote_start":0,"quote_end":97,"text_sha256":"b1f3ac3a57a28dc1ca4d958c01530dcdbf41a6511edf139569b3e8718b1e28d7","block_sha256":"b1f3ac3a57a28dc1ca4d958c01530dcdbf41a6511edf139569b3e8718b1e28d7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_ba4e552a-7c39-4935-b480-bcf6094fcaf4"},{"id":"occ_fb51445d6fd95d997bc912c3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_bd8bd6fe-fd37-40dd-a435-7efd49bd28bb","section_id":"sec_1987cecb-071f-4ac5-9170-135a49c17749","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":11,"end":25,"exact":"Hybrid Bonding","quote":"UCIe-3Dは、特にHybrid Bondingを想定して最適化されており、10～25µm級のピッチから、1µm以下の接続ピッチまでを視野に入れた拡張性を持つ。([UCIe Consortium](https://www.uciexpress.or","quote_start":0,"quote_end":125,"text_sha256":"a6e052341cf197d0d34eec09494df4fc9c119b96596feefe1e41e70cdee0a76a","block_sha256":"a6e052341cf197d0d34eec09494df4fc9c119b96596feefe1e41e70cdee0a76a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_bd8bd6fe-fd37-40dd-a435-7efd49bd28bb"},{"id":"occ_d46711550acc12e98b1efa85","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_cb4e5819-8f55-4c20-b977-662a938a58c5","section_id":"sec_f07593eb-9436-4573-b762-27823e382a74","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":11,"end":25,"exact":"Hybrid Bonding","quote":"## UCIe-3DとHybrid Bondingの違い","quote_start":0,"quote_end":28,"text_sha256":"ce8b66bfffe3d2d8f53717435a77a39b59a26adc3a6aff2e9919c9b851fe6854","block_sha256":"ce8b66bfffe3d2d8f53717435a77a39b59a26adc3a6aff2e9919c9b851fe6854","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_cb4e5819-8f55-4c20-b977-662a938a58c5"},{"id":"occ_53b7336b1d8f6036472839c6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_f7a11ab3-7e5a-4f84-87ec-4e8afc63c440","section_id":"sec_0b42367d-dad5-4f8d-b0e3-173912bf2618","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"2.5D","quote":"2Dと2.5Dでは、PHYを主にダイ外周へ配置する。","quote_start":0,"quote_end":26,"text_sha256":"7f9a19da72428eb620b85cfdf7b6d7f0ca88986c3093f81258c52a32eab644db","block_sha256":"7f9a19da72428eb620b85cfdf7b6d7f0ca88986c3093f81258c52a32eab644db","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_f7a11ab3-7e5a-4f84-87ec-4e8afc63c440"},{"id":"occ_9884d538b6f4745cad0896ac","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_f919ef99-4bd4-4c1b-a232-95e9dfbf10ce","section_id":"sec_0b7529f7-d68d-4e06-8325-f8486dfab410","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":8,"end":22,"exact":"Hybrid Bonding","quote":"UCIe-3DはHybrid Bondingによる垂直方向の超高密度接続へ対応する。","quote_start":0,"quote_end":42,"text_sha256":"14840a1f2416cee1aa5541c01bb667b7d08c4e68bdecd5f840c4ff3a4a9eb430","block_sha256":"14840a1f2416cee1aa5541c01bb667b7d08c4e68bdecd5f840c4ff3a4a9eb430","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_f919ef99-4bd4-4c1b-a232-95e9dfbf10ce"},{"id":"occ_710ea8a007a47357b384899d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_f9cd1911-33a6-44de-a444-550313001d9b","section_id":"sec_6af4ded1-2626-4215-9bed-4a92cef1f9c2","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":12,"end":26,"exact":"Hybrid Bonding","quote":"- UCIe-3D\n- Hybrid Bonding対応\n- UCIe DFx Architecture\n- テスト\n- テレメトリー\n- デバッグ\n- SiP全体の管理","quote_start":0,"quote_end":85,"text_sha256":"4d72766a565a80b34a9e73072145131690f2168a47d8fc25bf198e2b46e6d374","block_sha256":"4d72766a565a80b34a9e73072145131690f2168a47d8fc25bf198e2b46e6d374","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_f9cd1911-33a6-44de-a444-550313001d9b"},{"id":"occ_df345ca203d7513d85345803","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4","work_id":"wrk_401fbe80-56cf-48d2-8341-cfc86b46941f","block_id":"blk_feaf4cf4-5f64-46f3-a20a-1b60638a2666","section_id":"sec_376d42ac-0fdc-46fc-b8d0-324f3da293fb","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":131,"end":145,"exact":"Hybrid Bonding","quote":"\nProtocol\n    ↓\nDie-to-Die Adapter\n    ↓\nPHY\n    ↓\nバンプ／Hybrid Bonding\n    ↓\nパッケージ配線\n    ↓\n相手側チップレット\n```","quote_start":76,"quote_end":179,"text_sha256":"83827523b514d8db0ae5a8975671056a7060a988c3a3586fbd420cdfcd334458","block_sha256":"83827523b514d8db0ae5a8975671056a7060a988c3a3586fbd420cdfcd334458","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_069f7cc4-0ca9-44ca-b711-fdfd84413ec4/#blk_feaf4cf4-5f64-46f3-a20a-1b60638a2666"},{"id":"occ_f488ce8b44688e73aa4a9141","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0b72e772-70fd-4fc3-94b4-3beabdd8120c","work_id":"wrk_832924ba-8222-43e8-9f82-7a35ff151e1b","block_id":"blk_1ba0c6ca-899a-4242-bbad-020d8419a2a7","section_id":"sec_dacd34d8-a85c-405d-ac68-65929c26a1d5","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":16,"end":23,"exact":"先端パッケージ","quote":"ここで注意すべきなのは、HBMや先端パッケージは「AIラック/GPU/XPU/サーバー」の内数であることだ。","quote_start":0,"quote_end":54,"text_sha256":"72e4d7d206bdad4d9507c66b12bd179b535af117c0e89061100230cb6b62503a","block_sha256":"72e4d7d206bdad4d9507c66b12bd179b535af117c0e89061100230cb6b62503a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0b72e772-70fd-4fc3-94b4-3beabdd8120c/#blk_1ba0c6ca-899a-4242-bbad-020d8419a2a7"},{"id":"occ_dd7e78aec401c47d7bb6fca6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0b72e772-70fd-4fc3-94b4-3beabdd8120c","work_id":"wrk_832924ba-8222-43e8-9f82-7a35ff151e1b","block_id":"blk_224d508a-d378-486d-84b2-1141ba0b5e74","section_id":"sec_0100c655-6710-48b5-b84b-d710bf4d17c2","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":50,"end":57,"exact":"先端パッケージ","quote":"特にHBMは、普通のDRAMより増産が難しい。DRAMウェハだけではなく、TSV、積層、ベースダイ、先端パッケージ、テスト、歩留まり、顧客認証が必要になる。HBM3EからHBM4、HBM4Eへ進むほど、ベースダイやパッケージ連携、熱設計も難しくなる。","quote_start":0,"quote_end":125,"text_sha256":"1834b7fb0d895879a0dc75fd6949f30ce003bbef785e19e7e8883c4f2e9f8fea","block_sha256":"1834b7fb0d895879a0dc75fd6949f30ce003bbef785e19e7e8883c4f2e9f8fea","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0b72e772-70fd-4fc3-94b4-3beabdd8120c/#blk_224d508a-d378-486d-84b2-1141ba0b5e74"},{"id":"occ_500f470734db98d9b96a93c5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0b72e772-70fd-4fc3-94b4-3beabdd8120c","work_id":"wrk_832924ba-8222-43e8-9f82-7a35ff151e1b","block_id":"blk_29301c7b-edd0-4007-9651-0d8ce04a7b2b","section_id":"sec_dcc5746a-4a23-453f-b320-41b08311d5c2","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":16,"end":21,"exact":"CoWoS","quote":"2026〜2028年は、HBM、CoWoS、先端パッケージ、基板、テスト、光部品が制約になりやすい。特にAI XPV PlatformのようなXPUベースの計算容量が増えると、NVIDIA GPUだけでなく、Broadcom系ASICやGoo","quote_start":0,"quote_end":121,"text_sha256":"51df5ee76773cac15535a8c6679242d4a65f7787685d02a376491c5ee756be16","block_sha256":"51df5ee76773cac15535a8c6679242d4a65f7787685d02a376491c5ee756be16","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0b72e772-70fd-4fc3-94b4-3beabdd8120c/#blk_29301c7b-edd0-4007-9651-0d8ce04a7b2b"},{"id":"occ_95f1420791c52f9a13527a69","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0b72e772-70fd-4fc3-94b4-3beabdd8120c","work_id":"wrk_832924ba-8222-43e8-9f82-7a35ff151e1b","block_id":"blk_75d09511-fdb9-4bcd-9a66-653546421601","section_id":"sec_26ba8cdf-2810-4f14-b615-2a81876bbf2f","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":62,"end":69,"exact":"先端パッケージ","quote":"ンフラの制約は、主にGPU不足として語られてきた。NVIDIA GPUが足りない。HBMが足りない。TSMCの先端パッケージが足りない。CoWoSが足りない。光通信が足りない。AIブームの裏側には、半導体供給網の物理的な限界があった。","quote_start":7,"quote_end":124,"text_sha256":"118960c4532adab7d86125307b501bb8842a26129ed0690b5a6173f0d6f90912","block_sha256":"118960c4532adab7d86125307b501bb8842a26129ed0690b5a6173f0d6f90912","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0b72e772-70fd-4fc3-94b4-3beabdd8120c/#blk_75d09511-fdb9-4bcd-9a66-653546421601"},{"id":"occ_e0b89a6798173b29e4e787cf","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":null,"section_id":null,"layer":"title","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"title","start":6,"end":10,"exact":"EMIB","quote":"Intel EMIB-T解説","quote_start":0,"quote_end":14,"text_sha256":"cdf8c511242ede9ab27fde8622026ef1faf1ba4234eccb1b870b21e53606ae6e","block_sha256":null,"offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/"},{"id":"occ_54471c9dd319d4e957c60acd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_0025cbe2-8b3f-4e94-90b1-08ade4295548","section_id":"sec_fd1024ff-a296-4446-ac4a-1fe16d56ca29","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":7,"end":12,"exact":"CoWoS","quote":"## 第5章　CoWoSとの違い","quote_start":0,"quote_end":16,"text_sha256":"6874ceb4a32ecedd049eb46461a50a9a60fde9d15c4099a0221a344e19602877","block_sha256":"6874ceb4a32ecedd049eb46461a50a9a60fde9d15c4099a0221a344e19602877","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_0025cbe2-8b3f-4e94-90b1-08ade4295548"},{"id":"occ_1589a3ceceb617c5ca9608db","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_0177e89d-3e58-4528-8b7b-e339f2052b2b","section_id":"sec_fd1024ff-a296-4446-ac4a-1fe16d56ca29","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"EMIB","quote":"**「EMIB-T vs 巨大Si Interposer」だけではなく、「EMIB-T vs CoWoS-L」**","quote_start":0,"quote_end":57,"text_sha256":"1a983e30b0b1a02dca2827f47e3300ce0e260f52138f85320cc4103e8bd86279","block_sha256":"1a983e30b0b1a02dca2827f47e3300ce0e260f52138f85320cc4103e8bd86279","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_0177e89d-3e58-4528-8b7b-e339f2052b2b"},{"id":"occ_a95d72ee0a93d17c7cb6dd7c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_01df2dfa-f20b-4875-99a7-e3ac40de350b","section_id":"sec_0156b33c-cbf0-43a5-a0cf-a7abe865741c","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tでは、","quote_start":0,"quote_end":9,"text_sha256":"5153f030f2340003882fb5afaa8248c2f1cb1e7c53b28747dc95096713ea5b5a","block_sha256":"5153f030f2340003882fb5afaa8248c2f1cb1e7c53b28747dc95096713ea5b5a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_01df2dfa-f20b-4875-99a7-e3ac40de350b"},{"id":"occ_89b9396cd558cb94f4e586be","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_036d27c3-c18c-433f-bb42-138b43d3918d","section_id":"sec_387c382c-c84c-431a-93e4-5c144d0552e4","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tでは単純な生産能力より、","quote_start":0,"quote_end":18,"text_sha256":"c0711559a8386ff8e47c5fc60ac453af3a76e4d2995f15498621fc87184fb6d0","block_sha256":"c0711559a8386ff8e47c5fc60ac453af3a76e4d2995f15498621fc87184fb6d0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_036d27c3-c18c-433f-bb42-138b43d3918d"},{"id":"occ_f3769f5548458214d9cd093f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_04420991-dac1-41fe-b3d5-63f6a49543d6","section_id":"sec_4d645e38-d961-46ef-8cd7-aac891b07362","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":7,"end":11,"exact":"EMIB","quote":"## 第2章　EMIBの基本原理","quote_start":0,"quote_end":16,"text_sha256":"29bf8b4978520a6585fa9e62ba6fffe9c542aefb6d389b92ec9c98b15b317113","block_sha256":"29bf8b4978520a6585fa9e62ba6fffe9c542aefb6d389b92ec9c98b15b317113","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_04420991-dac1-41fe-b3d5-63f6a49543d6"},{"id":"occ_f07aca2991aadfd2afbd655a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_04a2818b-a7b0-40cb-a542-72e9acefb0ed","section_id":"sec_cc1acfc1-4478-45ef-af5d-07672d586ec8","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIBでは、高密度配線が必要な場所にしかシリコンを使わない。","quote_start":0,"quote_end":31,"text_sha256":"c72af168eef042cfc2a5cf2620fee32d5cfc4eef15e1b6d6105943111552dd05","block_sha256":"c72af168eef042cfc2a5cf2620fee32d5cfc4eef15e1b6d6105943111552dd05","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_04a2818b-a7b0-40cb-a542-72e9acefb0ed"},{"id":"occ_7bf746f4f33392c469e3067e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_04a2c28c-3277-42ae-8cb2-8c2269b63c33","section_id":"sec_0156b33c-cbf0-43a5-a0cf-a7abe865741c","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":6,"end":10,"exact":"EMIB","quote":"IntelはEMIB-Tについて、TSVを使って基板から上のダイへ直接給電することで電源経路を短縮し、さらに銅製のpower/ground meshや高密度capacitorを組み合わせて電源ノイズを抑える構造として説明","quote_start":0,"quote_end":110,"text_sha256":"789a9b6c74813bcb54863376fbc9dc6650e2267e8203cd761489fecf54e04373","block_sha256":"789a9b6c74813bcb54863376fbc9dc6650e2267e8203cd761489fecf54e04373","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_04a2c28c-3277-42ae-8cb2-8c2269b63c33"},{"id":"occ_d6671205d3830af4bae6c423","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_08f960a8-21c5-4017-aeb3-aa1e1f3dcdbc","section_id":"sec_4d645e38-d961-46ef-8cd7-aac891b07362","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":14,"end":18,"exact":"EMIB","quote":"- 有機基板＝一般道路\n- EMIB＝チップ間だけを結ぶ高速道路の橋","quote_start":0,"quote_end":34,"text_sha256":"a135a9fe9817566c7eac902fa3eb3454842f0075c6766b5211da30493b3fe2bc","block_sha256":"a135a9fe9817566c7eac902fa3eb3454842f0075c6766b5211da30493b3fe2bc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_08f960a8-21c5-4017-aeb3-aa1e1f3dcdbc"},{"id":"occ_7ac86c4dbfddc88b1c5467a2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_0b8c772d-69af-43a2-ab76-c56e83c994de","section_id":"sec_aef86a99-2e73-4fec-917b-3aed44081e53","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":7,"end":11,"exact":"EMIB","quote":"したがって今後EMIB-Tを見る場合、","quote_start":0,"quote_end":19,"text_sha256":"6cf34629aa1d6f66a8287bebf63f30804aae45e8599f6e0f912e52ac4cc91071","block_sha256":"6cf34629aa1d6f66a8287bebf63f30804aae45e8599f6e0f912e52ac4cc91071","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_0b8c772d-69af-43a2-ab76-c56e83c994de"},{"id":"occ_30a0302f01d6f629b86ff300","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_0e2998ae-7b89-43cd-8b1b-64ccc97035de","section_id":"sec_4d645e38-d961-46ef-8cd7-aac891b07362","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","EMIB"],"evidence":{"text_basis":"markdown","start":6,"end":10,"exact":"EMIB","quote":"IntelはEMIBについて、パッケージ基板内部へ小型のSilicon Bridgeを埋め込み、Logic-to-LogicやLogic-to-HBMを高密度接続する2.5D方式と定義している。","quote_start":0,"quote_end":97,"text_sha256":"1b32c3dfd7b1a811e91f9a9d3ef4b52e6e61541cee52113449b948dac9e02fd4","block_sha256":"1b32c3dfd7b1a811e91f9a9d3ef4b52e6e61541cee52113449b948dac9e02fd4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_0e2998ae-7b89-43cd-8b1b-64ccc97035de"},{"id":"occ_2aae949fa3138d7034cc0023","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_0e8a0e5c-bc1d-4d43-8dce-aa34d2ee5ebc","section_id":"sec_9117ad31-ad62-4559-b292-d67e9d25976e","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":2,"end":6,"exact":"EMIB","quote":"B＝EMIB-T Bridge","quote_start":0,"quote_end":15,"text_sha256":"f0d893f58f5ad33311c84e642f9380585931de99a0f5395e8da001f3cb10480b","block_sha256":"f0d893f58f5ad33311c84e642f9380585931de99a0f5395e8da001f3cb10480b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_0e8a0e5c-bc1d-4d43-8dce-aa34d2ee5ebc"},{"id":"occ_f01efa7eebe061b32ffe7ec1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_11bc5a67-1db5-4ce9-b975-0a83a9060b01","section_id":"sec_16a3eaba-7e3f-4d90-bc78-6627b2fbe80c","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tが伸びてもT-glassが足りなければ基板を作れない。","quote_start":0,"quote_end":33,"text_sha256":"ecb36f87573bc34c8fb25402f3ef378df8effb8d5274bdf6ffa3880196191993","block_sha256":"ecb36f87573bc34c8fb25402f3ef378df8effb8d5274bdf6ffa3880196191993","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_11bc5a67-1db5-4ce9-b975-0a83a9060b01"},{"id":"occ_6381386ba927d81fd5217604","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_138f73f4-9614-4d1b-b732-1c2990519755","section_id":"sec_0f8e2d83-0496-4dcd-b551-446a472f4cbd","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tの最初の大きな役割は、","quote_start":0,"quote_end":17,"text_sha256":"e472930bdab8a14fadcfe69ea3b95f77d24042cda0ca6cce818ef4d92f0b9747","block_sha256":"e472930bdab8a14fadcfe69ea3b95f77d24042cda0ca6cce818ef4d92f0b9747","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_138f73f4-9614-4d1b-b732-1c2990519755"},{"id":"occ_24e53d9d4dbbcb7f4c268669","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_1427b11e-827d-4e82-9c38-d27d0d8846b1","section_id":"sec_581dc030-9034-47d6-b4db-dafc6a4559c5","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":11,"end":15,"exact":"EMIB","quote":"したがって「TSMC版EMIBが完成した」という段階ではない。","quote_start":0,"quote_end":31,"text_sha256":"69d66b858740b95b46af466e1bc1c8cac847dac02a632e9b1716ab1a67240f0e","block_sha256":"69d66b858740b95b46af466e1bc1c8cac847dac02a632e9b1716ab1a67240f0e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_1427b11e-827d-4e82-9c38-d27d0d8846b1"},{"id":"occ_9ec9bf4fa0c3c09af0ab5cc5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_1535610b-16fe-4a42-b50e-224936a89a2e","section_id":"sec_6cfe0fb4-a41b-4823-8d54-dbd0caaa63cc","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":2,"end":6,"exact":"EMIB","quote":"**EMIB-T対応substrateの初期歩留まりが50〜60%程度**","quote_start":0,"quote_end":37,"text_sha256":"c639da26c46e766cc9ffd888527393e3daae5d695b35fa107ab8b91684a73944","block_sha256":"c639da26c46e766cc9ffd888527393e3daae5d695b35fa107ab8b91684a73944","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_1535610b-16fe-4a42-b50e-224936a89a2e"},{"id":"occ_812f354379ef553b200b5843","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_161e3b94-7309-454a-b1ed-28f71b934155","section_id":"sec_581dc030-9034-47d6-b4db-dafc6a4559c5","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"EMIB","quote":"**「EMIB-like」**","quote_start":0,"quote_end":15,"text_sha256":"934bdc06e38c89317cd415d9bfd235512eb44df1898e29dde458718bb0125e55","block_sha256":"934bdc06e38c89317cd415d9bfd235512eb44df1898e29dde45871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substrate\n\n═══════╗      ╔═══════\n       ║ EMIB ║\n═══════╝      ╚═══════\n```","quote_start":0,"quote_end":84,"text_sha256":"528ae54e132c381f4b62757648b28583b3e845cbed8377faa79933cc0c9123d1","block_sha256":"528ae54e132c381f4b62757648b28583b3e845cbed8377faa79933cc0c9123d1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_16962f4a-48ce-41f9-955f-a5db3aa67002"},{"id":"occ_778ec80384cc42b9f149276b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_16c15e25-4295-4d9f-b647-7fa3f6bc82d2","section_id":"sec_e132e87c-eb28-4341-9142-2d151c2acc08","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":8,"end":13,"exact":"CoWoS","quote":"そこでTSMCはCoWoSを、IntelはEMIBを発展させてきた。","quote_start":0,"quote_end":34,"text_sha256":"cc014f2a3f44ce4035007c47f4fd734ba279d9ed8c5fd5736a35069f7dfc2e89","block_sha256":"cc014f2a3f44ce4035007c47f4fd734ba279d9ed8c5fd5736a35069f7dfc2e89","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_16c15e25-4295-4d9f-b647-7fa3f6bc82d2"},{"id":"occ_2a74a275e684d734198c40f9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_1826eb69-356d-4282-b2f3-fdba792755c9","section_id":"sec_0f8e2d83-0496-4dcd-b551-446a472f4cbd","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":2,"end":7,"exact":"CoWoS","quote":"**CoWoSの代替というよりCoWoSのsecond source**","quote_start":0,"quote_end":36,"text_sha256":"bbd83c169e8ac30de7582b27410baf5c14e626e1628ad815d52fbca6428e6bc3","block_sha256":"bbd83c169e8ac30de7582b27410baf5c14e626e1628ad815d52fbca6428e6bc3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_1826eb69-356d-4282-b2f3-fdba792755c9"},{"id":"occ_5483372152fcecaa01b9bb92","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_18687876-5bf7-4a74-914b-7ca798d37880","section_id":"sec_6cfe0fb4-a41b-4823-8d54-dbd0caaa63cc","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"EMIB","quote":"**「EMIB-Tそのものが50%しか取れない」**","quote_start":0,"quote_end":26,"text_sha256":"275df72a6583d0b3f5f451b2683d57fc2fd9d94ddfde488f50e38fc15b5e9b80","block_sha256":"275df72a6583d0b3f5f451b2683d57fc2fd9d94ddfde488f50e38fc15b5e9b80","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_18687876-5bf7-4a74-914b-7ca798d37880"},{"id":"occ_e58a50c22735ccd39dc1fc89","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_18ad99ab-c43c-45bf-a3fb-32419a050223","section_id":"sec_45c2d533-98b5-40eb-8e4f-592073536988","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":19,"end":23,"exact":"EMIB","quote":"TSMC自身も2026年7月の決算で、EMIB-Tについて問われたC.C. Wei CEOが、TSMCのpackaging capacityが顧客成長を制限するほど逼迫しているため「追加の選択肢を歓迎する」と述べている。([The Motley ","quote_start":0,"quote_end":123,"text_sha256":"117119f9e2135b8da02b7c144c9784d046bf13a3f7a67a4ae632478c21d90f57","block_sha256":"117119f9e2135b8da02b7c144c9784d046bf13a3f7a67a4ae632478c21d90f57","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_18ad99ab-c43c-45bf-a3fb-32419a050223"},{"id":"occ_45ddca146ecdd0676ec5121c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_1b1b424f-a7aa-4e9f-9199-d97c53a3c435","section_id":"sec_cc1acfc1-4478-45ef-af5d-07672d586ec8","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":11,"end":15,"exact":"EMIB","quote":"## 第6章　それでもEMIB-Tが安くなりやすい理由","quote_start":0,"quote_end":27,"text_sha256":"ac4016ff4c4bd917c17365b5a0413a4c22c132fcd455aec669f5e6a44724f2d7","block_sha256":"ac4016ff4c4bd917c17365b5a0413a4c22c132fcd455aec669f5e6a44724f2d7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_1b1b424f-a7aa-4e9f-9199-d97c53a3c435"},{"id":"occ_5861ce7806757446300a6ee7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_1b4146ef-871e-4ce3-b1e9-31660ab5d368","section_id":"sec_1393f467-b453-4cef-a1bb-32168e82755b","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"EMIB","quote":"そしてEMIB-TではTSVが**電源経路**なので、単なる信号不良では済まない。","quote_start":0,"quote_end":41,"text_sha256":"f11ba47cedb3088b2b460ba4129dd9ed1d973705c5029049f254065c8a4e4704","block_sha256":"f11ba47cedb3088b2b460ba4129dd9ed1d973705c5029049f254065c8a4e4704","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_1b4146ef-871e-4ce3-b1e9-31660ab5d368"},{"id":"occ_4d9a2a736a5ba1158d64b4ec","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_1dc10d74-2255-41c9-a9a2-ff093c587c83","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tは、","quote_start":0,"quote_end":8,"text_sha256":"cc78bb82488a21bb3f197df2b34ce5f656153f4ab4fb87dac2e7559118bb79b9","block_sha256":"cc78bb82488a21bb3f197df2b34ce5f656153f4ab4fb87dac2e7559118bb79b9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_1dc10d74-2255-41c9-a9a2-ff093c587c83"},{"id":"occ_7ad61782e0c750116d7bdf9a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_1dfc610a-0154-4472-88f9-4c276d359aa2","section_id":"sec_0156b33c-cbf0-43a5-a0cf-a7abe865741c","layer":"code","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":126,"end":130,"exact":"EMIB","quote":"       TSV\n             ↑\n      ┌───────────┐\n      │  EMIB-T   │\n      └───────────┘\n             ↑\n        Substrate\n```","quote_start":71,"quote_end":193,"text_sha256":"0c5816f2989fa25d8d4035a31ec5eba9d2354ad21fa11a68d314cc2362de0eb0","block_sha256":"0c5816f2989fa25d8d4035a31ec5eba9d2354ad21fa11a68d314cc2362de0eb0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_1dfc610a-0154-4472-88f9-4c276d359aa2"},{"id":"occ_82695efd251cbf286a7a9d44","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_1fc281b7-5251-4439-85f0-97ebc9d45c66","section_id":"sec_ecb98d56-7b9f-4c2e-b07d-287378ab16c3","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":15,"end":19,"exact":"EMIB","quote":"## KPI 12　TSMC EMIB-likeの正式発表","quote_start":0,"quote_end":29,"text_sha256":"5965b3625ef498e13c21877c3fddbe7f884aaba85385b393c8183b876533f91f","block_sha256":"5965b3625ef498e13c21877c3fddbe7f884aaba85385b393c8183b876533f91f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_1fc281b7-5251-4439-85f0-97ebc9d45c66"},{"id":"occ_05e15eda7de00421ed313fc9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_20011bd8-bfb2-4965-960b-e98d3edea248","section_id":"sec_947ad809-8c71-45af-b418-0e623591c243","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":1,"end":5,"exact":"EMIB","quote":"「EMIB-Tに興味があります」","quote_start":0,"quote_end":16,"text_sha256":"8a8276d54080b1b380f9ef88ac0c3fc80dbbebf7adb0e5503a7b10c19fe2fee4","block_sha256":"8a8276d54080b1b380f9ef88ac0c3fc80dbbebf7adb0e5503a7b10c19fe2fee4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_20011bd8-bfb2-4965-960b-e98d3edea248"},{"id":"occ_618d5e0ba0bfab5faffc292d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_21a77793-dd2f-425f-9a3d-ea0291b2ebc0","section_id":"sec_fd1024ff-a296-4446-ac4a-1fe16d56ca29","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":8,"end":13,"exact":"CoWoS","quote":"しかしTSMCのCoWoS-Lはすでに、","quote_start":0,"quote_end":20,"text_sha256":"32df1fe6ff169dee2e9e87054dd1eed33e5dac9d1f82d9379e7689970a0521db","block_sha256":"32df1fe6ff169dee2e9e87054dd1eed33e5dac9d1f82d9379e7689970a0521db","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_21a77793-dd2f-425f-9a3d-ea0291b2ebc0"},{"id":"occ_1f917a8b09b028e07ed04f93","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_243cc2cf-7361-4d59-8dea-7a7711f739bb","section_id":"sec_866f7f66-a4f3-4faa-884c-623b5ecd2677","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":6,"end":10,"exact":"EMIB","quote":"IntelがEMIB-Tという優れた技術を持っていても、","quote_start":0,"quote_end":28,"text_sha256":"e8a4a97b5539062fbc40597ebedc4fd6144d46844bca0e7317d2d3352285391f","block_sha256":"e8a4a97b5539062fbc40597ebedc4fd6144d46844bca0e7317d2d3352285391f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_243cc2cf-7361-4d59-8dea-7a7711f739bb"},{"id":"occ_f00e8cb76852b001bdad5387","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_2498bf4e-aa67-4af9-a93e-e62c83423bf0","section_id":"sec_4d645e38-d961-46ef-8cd7-aac891b07362","layer":"code","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":221,"end":225,"exact":"EMIB","quote":"         │\n     └──── Silicon Bridge ───┘\n             EMIB\n\n══════════════════════════════\n        Organic Substrate\n══════════════════════════════\n```","quote_start":166,"quote_end":318,"text_sha256":"32babbe9c43cde0e089df0f466e87ea9f19eae25753b68142f00092279548f0b","block_sha256":"32babbe9c43cde0e089df0f466e87ea9f19eae25753b68142f00092279548f0b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_2498bf4e-aa67-4af9-a93e-e62c83423bf0"},{"id":"occ_0dcc12f1152957ccbb852821","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_25aefe5f-bd62-4044-bde2-ffb6a6b28377","section_id":"sec_45c2d533-98b5-40eb-8e4f-592073536988","layer":"code","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":101,"end":105,"exact":"EMIB","quote":"       ↓\nSK hynix / Micron / Samsung\n\n        ↓\n\nIntel\nEMIB-T packaging\n```","quote_start":46,"quote_end":121,"text_sha256":"be55462fc510d1bed940791fb2ec0d0c110b65f1f0bbecc7659075c6503ade48","block_sha256":"be55462fc510d1bed940791fb2ec0d0c110b65f1f0bbecc7659075c6503ade48","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_25aefe5f-bd62-4044-bde2-ffb6a6b28377"},{"id":"occ_09d545b4def1a3eb16865c0f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_270e69d8-74e2-464c-b841-8cbdffef3847","section_id":"sec_dac93ec6-a5d5-421b-8e7f-1bac8012f7ba","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":4,"end":8,"exact":"EMIB","quote":"そのためEMIB-Tでは、","quote_start":0,"quote_end":13,"text_sha256":"a5493d18b62595e6990053ae4b932f74adc5fcef55c842f87349282e0c2bf858","block_sha256":"a5493d18b62595e6990053ae4b932f74adc5fcef55c842f87349282e0c2bf858","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_270e69d8-74e2-464c-b841-8cbdffef3847"},{"id":"occ_68c0d136aab4a274b0b8c5ee","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_2c988668-e635-4455-b673-6cc1cf6385a4","section_id":"sec_1393f467-b453-4cef-a1bb-32168e82755b","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-TではTSVの歩留まりとPower Integrityが一体化する。","quote_start":0,"quote_end":39,"text_sha256":"7bfe91e7138f14a62b6367bf87a9402b99bfe2aa580cb14427d4affd70bc8a2f","block_sha256":"7bfe91e7138f14a62b6367bf87a9402b99bfe2aa580cb14427d4affd70bc8a2f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_2c988668-e635-4455-b673-6cc1cf6385a4"},{"id":"occ_71f4c6eee5ee69712bd5d465","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_2cb5a00d-3ee3-49d5-9f44-ff3aa881be84","section_id":"sec_e9742a16-c1ff-4593-85a5-463c28fb306f","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":18,"end":23,"exact":"CoWoS","quote":"## 第30章　なぜTSMCが自分でCoWoSをカニバライズするのか","quote_start":0,"quote_end":34,"text_sha256":"bdbc4ff78a2e428442e930eddc07bac695b4eb906149f607a21ff22b2020bbdc","block_sha256":"bdbc4ff78a2e428442e930eddc07bac695b4eb906149f607a21ff22b2020bbdc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_2cb5a00d-3ee3-49d5-9f44-ff3aa881be84"},{"id":"occ_7d555c51bee92f8df40e7aac","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_2cb5a419-23ed-4253-8720-2616d3c48bba","section_id":"sec_228ecaee-6bc2-4675-a0fc-6d7093bc6a87","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":16,"end":20,"exact":"EMIB","quote":"この案件が予定通り立ち上がれば、EMIB-Tにとって最大級の量産validationになる。","quote_start":0,"quote_end":46,"text_sha256":"523579f9e5e026801a8ee0398407b277a0d27de6cfaa020ac8edaa77a8c778e8","block_sha256":"523579f9e5e026801a8ee0398407b277a0d27de6cfaa020ac8edaa77a8c778e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_2cb5a419-23ed-4253-8720-2616d3c48bba"},{"id":"occ_89ae69be289d0a39b9935025","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_2ff2a744-7bb9-4e53-9c4a-fcca0cc68fe7","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-TのSilicon Bridgeそのものはかなり成熟し始めている。","quote_start":0,"quote_end":38,"text_sha256":"daf45b3fe6c9c9be2642fa9433fa244107b4be1a88d20690069abb0c14ad4565","block_sha256":"daf45b3fe6c9c9be2642fa9433fa244107b4be1a88d20690069abb0c14ad4565","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_2ff2a744-7bb9-4e53-9c4a-fcca0cc68fe7"},{"id":"occ_6f6c854ea813d1c11b83c802","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_30b9f8ef-6fc3-4565-81f8-daf86d455772","section_id":"sec_53bb81fe-ab50-4ba6-8d73-dd939830856a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIBではABF基板内部へcavityを作り、そこへSilicon Bridgeを埋め込む。","quote_start":0,"quote_end":47,"text_sha256":"4db4c22e17bf2bc8a4e26ee25f7b2a340d9839724de19d9da5c3ffda3e1411b6","block_sha256":"4db4c22e17bf2bc8a4e26ee25f7b2a340d9839724de19d9da5c3ffda3e1411b6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_30b9f8ef-6fc3-4565-81f8-daf86d455772"},{"id":"occ_775cbcd5fa3f2f3784c11124","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_30df79af-c07a-4c19-81af-1bfd468fd202","section_id":"sec_117f6fec-51b8-48ed-9961-07d39ee93f16","layer":"code","character_id":null,"count":2,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"EMIB","quote":"```\n現在\n\nEMIB-T\n+\nOrganic ABF\n\n\n将来\n\nEMIB-T\n+\nGlass Core / Glass Substrate\n```","quote_start":0,"quote_end":76,"text_sha256":"00b5bcca999d102500eeedbeb4dd32792bbe34a62410404aec52b08b6cb9e283","block_sha256":"00b5bcca999d102500eeedbeb4dd32792bbe34a62410404aec52b08b6cb9e283","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_30df79af-c07a-4c19-81af-1bfd468fd202"},{"id":"occ_3ffe15d00830eca341d5cea4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_320e1b97-ed38-43c0-9d14-ff796b54c797","section_id":"sec_52f833de-8786-4ba6-befb-6b3402bf2499","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"EMIB","quote":"現在のEMIB-T立ち上げで特に名前が挙がるのが、","quote_start":0,"quote_end":25,"text_sha256":"7e6e583d9ac23f7dfea240df460b683136a0e069f43b59d61a75178be7a300f3","block_sha256":"7e6e583d9ac23f7dfea240df460b683136a0e069f43b59d61a75178be7a300f3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_320e1b97-ed38-43c0-9d14-ff796b54c797"},{"id":"occ_f9d34d9fca61e2a29fa5ed7e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_3457faf5-00f0-4cbb-aaf5-e853118d6962","section_id":"sec_fd1024ff-a296-4446-ac4a-1fe16d56ca29","layer":"code","character_id":null,"count":4,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":22,"end":27,"exact":"CoWoS","quote":"```\n| 方式 | 主な中間配線 |\n| CoWoS-S | 全面 Silicon Interposer |\n| CoWoS-R | RDL Interposer |\n| CoWoS-L | Mold/RDL Interposer ＋ Local Si","quote_start":0,"quote_end":127,"text_sha256":"cdfb0d088a9eb8569a2b3c3640fa1bc605c5012ddaebe6479d4663302d941cf1","block_sha256":"cdfb0d088a9eb8569a2b3c3640fa1bc605c5012ddaebe6479d4663302d941cf1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_3457faf5-00f0-4cbb-aaf5-e853118d6962"},{"id":"occ_c48fce7c147f3a8addd8ad3e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_3be5cbd6-3bb3-4dcd-a223-16a0e0ede7c8","section_id":"sec_cc1acfc1-4478-45ef-af5d-07672d586ec8","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"EMIB","quote":"Intel自身もEMIB-Tについて、巨大で製造コストの高いinterposerを使わず、必要な箇所だけ高密度Silicon Bridgeを置くことをコスト面の主要な利点としている。([Intel Community](ht","quote_start":0,"quote_end":112,"text_sha256":"4ae37d1ab6065d0214d654af3d7c202595618c5980bc089fdfcf3380ffa0fd77","block_sha256":"4ae37d1ab6065d0214d654af3d7c202595618c5980bc089fdfcf3380ffa0fd77","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_3be5cbd6-3bb3-4dcd-a223-16a0e0ede7c8"},{"id":"occ_3cd146633ad66f67e3afac94","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_40f4107a-6645-4804-8b6c-44d965b4eca4","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":3,"end":8,"exact":"CoWoS","quote":"**「CoWoSが足りないから仕方なく使う技術」**","quote_start":0,"quote_end":26,"text_sha256":"008af362a4cd0943108432af030a62dfc02bb13f997ace5fa616faee8fd49595","block_sha256":"008af362a4cd0943108432af030a62dfc02bb13f997ace5fa616faee8fd49595","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_40f4107a-6645-4804-8b6c-44d965b4eca4"},{"id":"occ_38234f5b8a724a49abfde3d8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_431c3c29-afb7-41d4-92b1-6ffdc9aecd09","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":6,"end":10,"exact":"EMIB","quote":"TSMCが「EMIB-like」と呼ばれる方式を開発しているとの報道は、この変化を象徴している。","quote_start":0,"quote_end":48,"text_sha256":"9c19ab355a90191c05863c33b2f33f4e62e31c48394209d43a2372f9318378eb","block_sha256":"9c19ab355a90191c05863c33b2f33f4e62e31c48394209d43a2372f9318378eb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_431c3c29-afb7-41d4-92b1-6ffdc9aecd09"},{"id":"occ_c055d3773c691dfdf06ddc68","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_46c1e006-7f13-4563-8baa-224e2db9baed","section_id":"sec_0f8e2d83-0496-4dcd-b551-446a472f4cbd","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":11,"end":15,"exact":"EMIB","quote":"## 第26章　なぜ今EMIB-Tが突然注目されているのか","quote_start":0,"quote_end":29,"text_sha256":"ee9973d164ad599bab2d5e558805e69e66fb918c1daf6307c815dfb5866bca7a","block_sha256":"ee9973d164ad599bab2d5e558805e69e66fb918c1daf6307c815dfb5866bca7a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_46c1e006-7f13-4563-8baa-224e2db9baed"},{"id":"occ_55c1046cb16e4fb5a40dbc19","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_46efa14f-3564-4744-8a17-e1a867df42c4","section_id":"sec_f121e96c-06c1-49b1-b69e-da0c2c637531","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":21,"end":25,"exact":"EMIB","quote":"一部報道では、次世代MediaTek案件でEMIB-Tを使用し2027年Q4量産とする情報もある。([IT之家](https://www.ithome.com/0/958/954.htm?utm_source=chatgpt.com))","quote_start":0,"quote_end":118,"text_sha256":"fa3062772d7d08e0cf5eac91c09828839a112c9b859da9cde9441352c939acad","block_sha256":"fa3062772d7d08e0cf5eac91c09828839a112c9b859da9cde9441352c939acad","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_46efa14f-3564-4744-8a17-e1a867df42c4"},{"id":"occ_bdd2a3bf2edb6e3eb44a164c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_474e598f-0e86-4c80-be21-87380d76e6d2","section_id":"sec_f74807d6-83dd-4a54-82d3-61bae564e8d8","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":3,"end":8,"exact":"CoWoS","quote":"1. CoWoSより安い\n2. packageをさらに巨大化できる\n3. HBM4/HBM5へ対応\n4. power deliveryも改善\n5. yieldも十分高い","quote_start":0,"quote_end":84,"text_sha256":"0ed9319436b57e3f43c0089572d60b2c3b6c387f73fcaa394897ddf7e0af4550","block_sha256":"0ed9319436b57e3f43c0089572d60b2c3b6c387f73fcaa394897ddf7e0af4550","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_474e598f-0e86-4c80-be21-87380d76e6d2"},{"id":"occ_c0a141fc19a10f5dee71835a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_479a98dd-cf17-49cd-8ad5-14621d6e673c","section_id":"sec_62ffcbaa-e884-444b-b8a5-dbd3c227e3e7","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":7,"end":11,"exact":"EMIB","quote":"各社のHBMがEMIB-T上で認定されるかを見る。","quote_start":0,"quote_end":25,"text_sha256":"d50f7c3622239e0a50b73ce6a3115672a212ab3127ff9565bd3be01aceac2346","block_sha256":"d50f7c3622239e0a50b73ce6a3115672a212ab3127ff9565bd3be01aceac2346","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_479a98dd-cf17-49cd-8ad5-14621d6e673c"},{"id":"occ_8e6cfdaf5dcfa201f4ee92ba","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_482378fc-6240-462a-ba0c-c329209a598c","section_id":"sec_2aa1105d-14dc-458e-9c6b-79ddcee63834","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tに最も適している顧客層は、","quote_start":0,"quote_end":19,"text_sha256":"14c624e33c2113010a563154ede35119f4e85e2ae568707edcd174de1e0ee50b","block_sha256":"14c624e33c2113010a563154ede35119f4e85e2ae568707edcd174de1e0ee50b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_482378fc-6240-462a-ba0c-c329209a598c"},{"id":"occ_c693c360f908bb3a8654555b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_496af9ee-5e83-4d3e-8502-c924473f388d","section_id":"sec_fd1024ff-a296-4446-ac4a-1fe16d56ca29","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":1,"end":6,"exact":"CoWoS","quote":"「CoWoS＝巨大シリコンインターポーザ」と説明されることが多いが、現在ではこれは半分しか正しくない。","quote_start":0,"quote_end":51,"text_sha256":"057f3ab371948bd09b429787f85c1ec52216f38f912aca9d4059c354e6d38178","block_sha256":"057f3ab371948bd09b429787f85c1ec52216f38f912aca9d4059c354e6d38178","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_496af9ee-5e83-4d3e-8502-c924473f388d"},{"id":"occ_85405850eddaeefa524e0fd4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_49e676aa-848a-4dfa-b08b-2aeecfd11e7e","section_id":"sec_f53c84c7-20b2-48e3-ab4e-d9f32454bdd7","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"EMIB","quote":"## 第34章　EMIB-Tの成功で次のボトルネックはどこへ移るか","quote_start":0,"quote_end":33,"text_sha256":"506e4b8fa22a2fc9cb5787bff250a98b41337bea3fbf556c08bf3651157cab39","block_sha256":"506e4b8fa22a2fc9cb5787bff250a98b41337bea3fbf556c08bf3651157cab39","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_49e676aa-848a-4dfa-b08b-2aeecfd11e7e"},{"id":"occ_66ece6e0056a22565c12c75d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_4e9ebbc2-da76-42ab-8f4d-70d2c26e608a","section_id":"sec_d2d63a71-f4f5-4204-9c80-2a5f11f27d27","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":9,"end":13,"exact":"EMIB","quote":"## KPI 1　EMIB-T substrate yield","quote_start":0,"quote_end":31,"text_sha256":"54b2b6d16af867aae0f55104292eb27b4d0f1ee61a974804781d80d8ad95a131","block_sha256":"54b2b6d16af867aae0f55104292eb27b4d0f1ee61a974804781d80d8ad95a131","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_4e9ebbc2-da76-42ab-8f4d-70d2c26e608a"},{"id":"occ_e670cf8333fab6b763582d20","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_500d7a3c-994f-4738-8705-d57dd8896914","section_id":"sec_dc98f462-320c-4ace-a88e-614ba36b6daa","layer":"body","character_id":null,"count":3,"matched_aliases":["EMIB","先端パッケージ"],"evidence":{"text_basis":"markdown","start":18,"end":22,"exact":"EMIB","quote":"2026年7月末、TSMCが社内で「EMIB-like」と呼ばれる、Intel EMIBに近い先端パッケージング技術を開発しているとの報道が出た。([Yahoo Finance](https://finance.yahoo.com/market","quote_start":0,"quote_end":122,"text_sha256":"6c27bf01a2e2183ed531d7c8243c8d8f821c91a8d471f71b5a234a122b947f35","block_sha256":"6c27bf01a2e2183ed531d7c8243c8d8f821c91a8d471f71b5a234a122b947f35","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_500d7a3c-994f-4738-8705-d57dd8896914"},{"id":"occ_9867f834dd379f56335f61b0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_5066037f-2fbd-4ffb-9f89-3ce2dc8500a6","section_id":"sec_c0a79059-024c-4a79-84c9-2b4ef6710abf","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":10,"end":14,"exact":"EMIB","quote":"その意味では新しい「EMIB-like」が目指す可能性があるのは、","quote_start":0,"quote_end":33,"text_sha256":"811b97dbbb6a20114f1ff56b02d2a5db18445cf2c13ebb183a005c7bd61970ae","block_sha256":"811b97dbbb6a20114f1ff56b02d2a5db18445cf2c13ebb183a005c7bd61970ae","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_5066037f-2fbd-4ffb-9f89-3ce2dc8500a6"},{"id":"occ_723c6cc3d6ef6e6c7c35fddd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_52c5e2c2-2971-4229-aa59-bb24558d6ead","section_id":"sec_9117ad31-ad62-4559-b292-d67e9d25976e","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":15,"end":19,"exact":"EMIB","quote":"## 第4章　2026年時点でEMIB-Tはどこまで来たのか","quote_start":0,"quote_end":30,"text_sha256":"5b0fae640e3f1839e9c359eadba6b868a8ac35ae6dff94140096de045d19ea63","block_sha256":"5b0fae640e3f1839e9c359eadba6b868a8ac35ae6dff94140096de045d19ea63","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_52c5e2c2-2971-4229-aa59-bb24558d6ead"},{"id":"occ_396feb286412ad3f08ebdc3c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_52f7d61e-f275-41a3-bd5f-51303f957445","section_id":"sec_0f8e2d83-0496-4dcd-b551-446a472f4cbd","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":22,"end":27,"exact":"CoWoS","quote":"```\nTSMC Wafer\n+\nTSMC CoWoS\n```","quote_start":0,"quote_end":31,"text_sha256":"80b20c513cfc0e1ab94c26bace5d4e9b566e5e2a60a16eeaa24a8ff35cd59bad","block_sha256":"80b20c513cfc0e1ab94c26bace5d4e9b566e5e2a60a16eeaa24a8ff35cd59bad","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_52f7d61e-f275-41a3-bd5f-51303f957445"},{"id":"occ_235f13d2df571d623f635fbd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_566d46bd-1dc0-492b-adb8-3b4f7bd17321","section_id":"sec_0156b33c-cbf0-43a5-a0cf-a7abe865741c","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":2,"end":6,"exact":"EMIB","quote":"通常EMIBには一つ大きな問題があった。","quote_start":0,"quote_end":20,"text_sha256":"88f45ee30962104fabd18ef3a523a17a7262bf52cebf8165c1f96c1be5aa0ddf","block_sha256":"88f45ee30962104fabd18ef3a523a17a7262bf52cebf8165c1f96c1be5aa0ddf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_566d46bd-1dc0-492b-adb8-3b4f7bd17321"},{"id":"occ_218669f6a3f7a5bcd5b14d28","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_618fae72-2a1a-4d01-9fce-baf88438f7aa","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":7,"end":11,"exact":"EMIB","quote":"## 結論――EMIB-Tの本当の意味","quote_start":0,"quote_end":19,"text_sha256":"45401c6b4f3d28b1bf3e8fba22ab347f731638fb45810f03a09684fee45add49","block_sha256":"45401c6b4f3d28b1bf3e8fba22ab347f731638fb45810f03a09684fee45add49","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_618fae72-2a1a-4d01-9fce-baf88438f7aa"},{"id":"occ_215d4f975df5d6afe47fd357","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_619a8bce-aba8-4200-81cc-e5d25d9ed910","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":25,"end":29,"exact":"EMIB","quote":"ここを80〜90%近くまで引き上げられるかどうかがEMIB-Tの経済性を大きく左右する。","quote_start":0,"quote_end":44,"text_sha256":"63d3821c3b5222359eb9e946b2fdb46cc455a232bde798be9fed6b86b593f096","block_sha256":"63d3821c3b5222359eb9e946b2fdb46cc455a232bde798be9fed6b86b593f096","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_619a8bce-aba8-4200-81cc-e5d25d9ed910"},{"id":"occ_5c23fe7e0b29f4886b7f32fc","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_62640bdf-fc4a-42a9-a794-a86e8b279737","section_id":"sec_9117ad31-ad62-4559-b292-d67e9d25976e","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":20,"end":24,"exact":"EMIB","quote":"IntelがECTC 2026で公表したEMIB-Tの仕様はかなり攻めている。","quote_start":0,"quote_end":39,"text_sha256":"1c2cc838740eff2ff624c572d0ca216fd02f92350639060d36578e3e25f2d446","block_sha256":"1c2cc838740eff2ff624c572d0ca216fd02f92350639060d36578e3e25f2d446","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_62640bdf-fc4a-42a9-a794-a86e8b279737"},{"id":"occ_69bdc56e2d1a53004cf4a7ce","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_64e87b68-a8f6-46bd-bf34-878524ec176d","section_id":"sec_cc1acfc1-4478-45ef-af5d-07672d586ec8","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":2,"end":7,"exact":"CoWoS","quote":"- CoWoS-S\n- CoWoS-L\n- パッケージサイズ\n- HBM数\n- Bridge数\n- yield","quote_start":0,"quote_end":55,"text_sha256":"e2a1f61112fad8df6c0a616a9deb15ba3aa5e775af181bd8a057b558b30c8b81","block_sha256":"e2a1f61112fad8df6c0a616a9deb15ba3aa5e775af181bd8a057b558b30c8b81","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_64e87b68-a8f6-46bd-bf34-878524ec176d"},{"id":"occ_c5b4115b30144cbc1c1268e3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_6644c65f-d748-45f8-8cb6-120e2dbb0e1b","section_id":"sec_6cfe0fb4-a41b-4823-8d54-dbd0caaa63cc","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":2,"end":6,"exact":"EMIB","quote":"**EMIB-T全体のyieldとreliabilityが目標に達しつつある**","quote_start":0,"quote_end":40,"text_sha256":"b9528c8a5306ed1c48e3be7ee4a2619f4a15d802806e005a8ced6db99b5c2d97","block_sha256":"b9528c8a5306ed1c48e3be7ee4a2619f4a15d802806e005a8ced6db99b5c2d97","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_6644c65f-d748-45f8-8cb6-120e2dbb0e1b"},{"id":"occ_ff1e2ab48f5a0c519b2921c3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_667eed97-4acd-4948-abf2-392bda37780b","section_id":"sec_0156b33c-cbf0-43a5-a0cf-a7abe865741c","layer":"body","character_id":null,"count":2,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIBは基板内へ埋め込まれているため、従来構造では電源配線がEMIBを迂回しなければならない。","quote_start":0,"quote_end":48,"text_sha256":"7b2746481b6f9af38adcf8af266a0a7976fb847b25c8d03437bc7785e304af31","block_sha256":"7b2746481b6f9af38adcf8af266a0a7976fb847b25c8d03437bc7785e304af31","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_667eed97-4acd-4948-abf2-392bda37780b"},{"id":"occ_eb558c8fd2264e2a5dac9368","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_696f2584-e5bd-4053-8ca0-1536e96a138d","section_id":"sec_f53c84c7-20b2-48e3-ab4e-d9f32454bdd7","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tはその典型である。","quote_start":0,"quote_end":15,"text_sha256":"2456093dca5485a084faf0ed91d69083b86dd6a3ca5272725136914db659712c","block_sha256":"2456093dca5485a084faf0ed91d69083b86dd6a3ca5272725136914db659712c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_696f2584-e5bd-4053-8ca0-1536e96a138d"},{"id":"occ_d6f59214241912af7f733f52","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_6e655465-cad9-4a05-b6b6-c71a1d9e5712","section_id":"sec_dc98f462-320c-4ace-a88e-614ba36b6daa","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":41,"end":45,"exact":"2.5D","quote":"**AI半導体の巨大化によって、「巨大なシリコンインターポーザを敷く」という従来の2.5Dパッケージ思想そのものが再検討され始めた可能性がある。**","quote_start":0,"quote_end":74,"text_sha256":"2e340da888fc25c7c35994e6acbde6eac6a54ea004e17769ac4c3e5b74810d5b","block_sha256":"2e340da888fc25c7c35994e6acbde6eac6a54ea004e17769ac4c3e5b74810d5b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_6e655465-cad9-4a05-b6b6-c71a1d9e5712"},{"id":"occ_609deda84974866cfe9248e5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_7083ebc0-f0b2-4bcb-88bc-b44b714eac9d","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tを単純に、","quote_start":0,"quote_end":11,"text_sha256":"140f8af2a1711f9f034fcd6d2dc1bb37214609448d8608500e4a2b2788338334","block_sha256":"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第3章　EMIB-Tとは何が違うのか","quote_start":0,"quote_end":21,"text_sha256":"07f255f97b443c8fbf31546ab412ba1ea5ca13b2c194934a75a79a334812492c","block_sha256":"07f255f97b443c8fbf31546ab412ba1ea5ca13b2c194934a75a79a334812492c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_76fd3297-8059-4f24-9f57-5c9f451c902e"},{"id":"occ_5a603381f7367a8f29b9a8dc","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_7a0c5068-9977-4b24-a780-e3b7bfbba6e5","section_id":"sec_cc1acfc1-4478-45ef-af5d-07672d586ec8","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":24,"end":29,"exact":"CoWoS","quote":"別の2026年の分析では、Rubin級を想定したCoWoSのパッケージングコストが約900〜1,000ドルに対し、EMIB系では数百ドル台になる可能性があるとの推計も出ているが、これも同一仕様を完全に比較した公式BOMではない。([Tom's 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capacity不足を背景に、EMIB-Tを顧客へ提供する第二のadvanced packaging routeとして評価しており、EMIB-T対応の設備投資も進めている。([TechNews 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substrate 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第32章　EMIB-Tで今後見るべきKPI","quote_start":0,"quote_end":24,"text_sha256":"2db9bf735b63461e8f4b9f6f301f85691d1addcdad86d55616777db5b7b3ed79","block_sha256":"2db9bf735b63461e8f4b9f6f301f85691d1addcdad86d55616777db5b7b3ed79","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_8f1c2696-5b0a-4dac-91b5-3d6fb2659d1b"},{"id":"occ_e01655d1b88c8ff1aa1901ed","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_91a3442a-ffa6-45b9-a152-b4c72a835ff4","section_id":"sec_1393f467-b453-4cef-a1bb-32168e82755b","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-T最大の特徴であるTSVも、同時に製造上のリスクになる。","quote_start":0,"quote_end":33,"text_sha256":"7a9c4e706957362b38f4a9615adcb1e535ed39ec7eb34a2cc8382a8649040d12","block_sha256":"7a9c4e706957362b38f4a9615adcb1e535ed39ec7eb34a2cc8382a8649040d12","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_91a3442a-ffa6-45b9-a152-b4c72a835ff4"},{"id":"occ_94bf6324c6aee9ddabbd7dbc","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_947399d1-158a-4ae3-9a7c-de38a0752801","section_id":"sec_52f833de-8786-4ba6-befb-6b3402bf2499","layer":"body","character_id":null,"count":2,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":13,"end":17,"exact":"EMIB","quote":"ただしIntelのより広いEMIB 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chainにはAT&Sなども含まれるため、「EMIB-T基板は世界でこの3社しか作れない」と理解するのは適切ではない。","quote_start":0,"quote_end":84,"text_sha256":"b9af81426a45b3d346d40944bd225b4ea24819310d7cd11046ee6243db3771f2","block_sha256":"b9af81426a45b3d346d40944bd225b4ea24819310d7cd11046ee6243db3771f2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_947399d1-158a-4ae3-9a7c-de38a0752801"},{"id":"occ_042f41c05f78aad4f3a5a51b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_9be2640e-7d9d-4d65-b32d-6c31d5e769a0","section_id":"sec_866f7f66-a4f3-4faa-884c-623b5ecd2677","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tが優れているからCoWoSが消える、という考え方も極端である。","quote_start":0,"quote_end":37,"text_sha256":"dd1bf8fe2dbe8f5ee99cf0572f2d8edaec6585b14c4b717ac45a4b1394f9bba2","block_sha256":"dd1bf8fe2dbe8f5ee99cf0572f2d8edaec6585b14c4b717ac45a4b1394f9bba2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_9be2640e-7d9d-4d65-b32d-6c31d5e769a0"},{"id":"occ_e090c30a99cfd04b7d2801c0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_9c6326c3-038e-418e-9fea-01e9ca331202","section_id":"sec_581dc030-9034-47d6-b4db-dafc6a4559c5","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":15,"end":19,"exact":"EMIB","quote":"## 第28章　TSMCの「準EMIB」","quote_start":0,"quote_end":20,"text_sha256":"e7dd26c1135e34ec69e82cf63a274477eeabf735f09f5613a0054bde610ddce8","block_sha256":"e7dd26c1135e34ec69e82cf63a274477eeabf735f09f5613a0054bde610ddce8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_9c6326c3-038e-418e-9fea-01e9ca331202"},{"id":"occ_417e2dcd220210456fa559cd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_9de9543e-4829-4e58-a89b-f6844b652f94","section_id":"sec_4089da87-979b-4861-a813-3b6114738a98","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tの技術的な難所は、","quote_start":0,"quote_end":15,"text_sha256":"81d37aa1ffd0a49acdebad2e7d994fba9d706d81977a03896e20c04f7e319016","block_sha256":"81d37aa1ffd0a49acdebad2e7d994fba9d706d81977a03896e20c04f7e319016","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_9de9543e-4829-4e58-a89b-f6844b652f94"},{"id":"occ_237a9432bd89b98a606170f4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_9e096172-6246-46b9-a84d-b196be80aa1d","section_id":"sec_62ffcbaa-e884-444b-b8a5-dbd3c227e3e7","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":21,"end":25,"exact":"EMIB","quote":"HBM 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Silicon Interconnect）を埋め込み、SoC-to-SoC、SoC-to-chiplet、SoC-to-HBMなどを高密","quote_start":0,"quote_end":113,"text_sha256":"8469592f4f527a1cbc9504b4c982a0c17953d8e112f039e7948bb35fcf667e34","block_sha256":"8469592f4f527a1cbc9504b4c982a0c17953d8e112f039e7948bb35fcf667e34","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_9eee5a78-4a98-44d4-94ad-be8c98aeb03b"},{"id":"occ_8d145e4229853e9498e9567a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_9fa4c85d-22d8-4c3a-a62e-183781a8acff","section_id":"sec_866f7f66-a4f3-4faa-884c-623b5ecd2677","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":25,"end":29,"exact":"EMIB","quote":"TrendForceも2026年初頭、Intel EMIBの課題としてyieldとcapacity establishmentを挙げ、TSMCがturnkey solutionと量産歩留まりで優位にあると分析している。([TrendForce](https:","quote_start":0,"quote_end":129,"text_sha256":"02a42fa8a1edf2ec2ff41d9dff9b6fea58c8d4553b3c4f7e66422d120ceda7ec","block_sha256":"02a42fa8a1edf2ec2ff41d9dff9b6fea58c8d4553b3c4f7e66422d120ceda7ec","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_9fa4c85d-22d8-4c3a-a62e-183781a8acff"},{"id":"occ_16d3291b7f6805ff10190991","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_9fdaedd7-a48a-443f-bb10-5e9790dbd324","section_id":"sec_e132e87c-eb28-4341-9142-2d151c2acc08","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":14,"end":18,"exact":"EMIB","quote":"## 第1章　なぜAI時代にEMIB-Tが必要なのか","quote_start":0,"quote_end":26,"text_sha256":"11083fa120034abcbeda02c93056d6d2bf2613176b110747158146db98a463a4","block_sha256":"11083fa120034abcbeda02c93056d6d2bf2613176b110747158146db98a463a4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_9fdaedd7-a48a-443f-bb10-5e9790dbd324"},{"id":"occ_50a5dd975ff49a72e5122908","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_a0d4802d-3bc2-419d-9e7c-fb0b4b592ad4","section_id":"sec_5d552ee0-2c4b-4de8-bfcf-c9fe28156f4d","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":11,"end":15,"exact":"EMIB","quote":"2026年8月時点で、EMIB-Tはまだ外部顧客向けの本格HVMが大量に流れている段階ではない。","quote_start":0,"quote_end":48,"text_sha256":"89ea15a457110b8892375d34c9c5196fc6523bd2d5732f7fd244730819482166","block_sha256":"89ea15a457110b8892375d34c9c5196fc6523bd2d5732f7fd244730819482166","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_a0d4802d-3bc2-419d-9e7c-fb0b4b592ad4"},{"id":"occ_f4e921ae97452637c7a2ff07","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_a1a81fab-3635-4586-8477-6a5439e0e315","section_id":"sec_5454b249-7e0e-4290-8dbf-62bd278d9880","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":15,"end":19,"exact":"EMIB","quote":"## KPI 9　Intel EMIB-T backlog","quote_start":0,"quote_end":29,"text_sha256":"8f7b3b7b5c653dda528f75530aaaeab83d294c2030797280e09f26362b3b2021","block_sha256":"8f7b3b7b5c653dda528f75530aaaeab83d294c2030797280e09f26362b3b2021","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_a1a81fab-3635-4586-8477-6a5439e0e315"},{"id":"occ_2c4cd1e4749abaafbbb3587b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_a597f133-f5c6-4bf2-ad65-4fe87c27879d","section_id":"sec_c0a79059-024c-4a79-84c9-2b4ef6710abf","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS-Lそのものが、","quote_start":0,"quote_end":13,"text_sha256":"d14b451ed932f0099f96d2a6bf92a7df18628a9276512af26adf7c70943ee910","block_sha256":"d14b451ed932f0099f96d2a6bf92a7df18628a9276512af26adf7c70943ee910","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_a597f133-f5c6-4bf2-ad65-4fe87c27879d"},{"id":"occ_3f5b78dcd4579d52119f826d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_a5b5c1d1-63c4-429c-ac4d-88445732e9fd","section_id":"sec_0156b33c-cbf0-43a5-a0cf-a7abe865741c","layer":"code","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":103,"end":107,"exact":"EMIB","quote":"outing\n       ↗          ↖\n\n     ┌──────────┐\n     │   EMIB   │\n     └──────────┘\n```","quote_start":48,"quote_end":133,"text_sha256":"370dcf2c459a69608ddf8f4e09f3cbb154c7c31e76ecf5184842a6c053e1d528","block_sha256":"370dcf2c459a69608ddf8f4e09f3cbb154c7c31e76ecf5184842a6c053e1d528","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_a5b5c1d1-63c4-429c-ac4d-88445732e9fd"},{"id":"occ_7ec8b64a6eb4b4d5ddd50a25","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_a75ecce2-a178-40a1-8b3a-d3146614fd1f","section_id":"sec_f121e96c-06c1-49b1-b69e-da0c2c637531","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":43,"end":47,"exact":"EMIB","quote":"MediaTekは現在custom AI 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Multi-die Interconnect Bridge-T）\\*\\*である。","quote_start":0,"quote_end":129,"text_sha256":"a750b738ed021f91c7cb2b1a2d31d4c70cde7a2e140d569445ea573b62093e2d","block_sha256":"a750b738ed021f91c7cb2b1a2d31d4c70cde7a2e140d569445ea573b62093e2d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_aa1eca80-291b-41f5-bb5d-e760784a30eb"},{"id":"occ_c89a36cb687169cb906750fe","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_ae741f34-639c-42cb-8a26-404fc5d4c204","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":18,"end":22,"exact":"EMIB","quote":"**「巨大AI 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──┘\n\n════════════════\n ABF substrate\n════════════════\n```","quote_start":0,"quote_end":106,"text_sha256":"54b1ed1f01c2d894cd52a5470324e82f3115c0e23b5cc02bc21be3dca1f56e0f","block_sha256":"54b1ed1f01c2d894cd52a5470324e82f3115c0e23b5cc02bc21be3dca1f56e0f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_b07248f1-df0b-4808-8c11-86333c7ad9b5"},{"id":"occ_0f0d8d2746fc605f7cb785af","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_b77177bc-4cf4-4bc6-a02f-7ee632467a76","section_id":"sec_5d552ee0-2c4b-4de8-bfcf-c9fe28156f4d","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"EMIB","quote":"## 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Substrateを長年研究している理由もEMIB-Tとつながる。","quote_start":0,"quote_end":45,"text_sha256":"b2a4ae23aa43b132d0c9977a4058edbb5998c92f5aa2e681c37d01d8fe18dd09","block_sha256":"b2a4ae23aa43b132d0c9977a4058edbb5998c92f5aa2e681c37d01d8fe18dd09","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_c6e0a268-03ef-44b3-8a4b-9ca44181ea29"},{"id":"occ_253651821af22814e53de7c0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_c9cfdd4e-e71a-4989-8b17-bbce30661a40","section_id":"sec_dc98f462-320c-4ace-a88e-614ba36b6daa","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":21,"end":26,"exact":"CoWoS","quote":"## AI半導体の「後工程」が主戦場へ――CoWoSとの違い、コスト、技術ボトルネック、顧客、TSMC「準EMIB」まで","quote_start":0,"quote_end":60,"text_sha256":"1ef357f60f7cd6c4de18c18d1448e434c6833389f54eaae9aa3193688eef1c6c","block_sha256":"1ef357f60f7cd6c4de18c18d1448e434c6833389f54eaae9aa3193688eef1c6c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_c9cfdd4e-e71a-4989-8b17-bbce30661a40"},{"id":"occ_d2b478cb8a68745e3b013aa2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_ca7bc5ca-368e-47ec-9bed-b93149060632","section_id":"sec_c0a79059-024c-4a79-84c9-2b4ef6710abf","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":20,"end":24,"exact":"EMIB","quote":"## 第29章　実はTSMCはすでに半分EMIB化している","quote_start":0,"quote_end":29,"text_sha256":"60dcb70745f053b0e570cb8279a57540f7c4c999265337fcbc201f366398615b","block_sha256":"60dcb70745f053b0e570cb8279a57540f7c4c999265337fcbc201f366398615b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_ca7bc5ca-368e-47ec-9bed-b93149060632"},{"id":"occ_8e16680da5453b2261da123b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_cd3925c2-db61-4d04-91b0-d7dc98cd784e","section_id":"sec_4d645e38-d961-46ef-8cd7-aac891b07362","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":2,"end":6,"exact":"EMIB","quote":"通常EMIBはすでに2017年から量産されており、FPGA、Xeon、GPUなど多数のIntel製品で実績を持つ。([Intel](https://www.intel.com/content/www/us/en/","quote_start":0,"quote_end":106,"text_sha256":"e2a3980e725dd2e6b3f5d5dc41359a5b18b63f046088c80b13cc091b58ba8fbf","block_sha256":"e2a3980e725dd2e6b3f5d5dc41359a5b18b63f046088c80b13cc091b58ba8fbf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_cd3925c2-db61-4d04-91b0-d7dc98cd784e"},{"id":"occ_98d02d3c7307143539cf4a01","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_ce2542a7-e05d-4a89-bf0e-345e026b898c","section_id":"sec_6cfe0fb4-a41b-4823-8d54-dbd0caaa63cc","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"EMIB","quote":"## 第14章　EMIB-T基板歩留まり50%問題","quote_start":0,"quote_end":25,"text_sha256":"a333ef10344953ed0cbfd1f648c1c678ade5c8b9f0db3896ad1916a4d21550ac","block_sha256":"a333ef10344953ed0cbfd1f648c1c678ade5c8b9f0db3896ad1916a4d21550ac","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_ce2542a7-e05d-4a89-bf0e-345e026b898c"},{"id":"occ_27ee16a7102ae5137d48ac39","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_cea2257b-dd88-480c-b7b0-98480e1ce3fa","section_id":"sec_dac93ec6-a5d5-421b-8e7f-1bac8012f7ba","layer":"code","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":58,"end":62,"exact":"EMIB","quote":"\nCompute Die\n↓\nKnown Good Die\n\nHBM\n↓\nKnown Good Stack\n\nEMIB-T substrate\n↓\nKnown Good Substrate\n\nIntermediate Assembly\n↓\nTest\n\nFinal Assembly\n↓\nTest\n```","quote_start":3,"quote_end":154,"text_sha256":"2119c9c7afcae68182e766808d48f9a92fb91c05d3c9c1f579e52f211c0e1a32","block_sha256":"2119c9c7afcae68182e766808d48f9a92fb91c05d3c9c1f579e52f211c0e1a32","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_cea2257b-dd88-480c-b7b0-98480e1ce3fa"},{"id":"occ_60dbe9f778c2775a21cade2e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_d03ae55c-b601-4555-9643-c8f45eb58034","section_id":"sec_fd1024ff-a296-4446-ac4a-1fe16d56ca29","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":9,"end":14,"exact":"CoWoS","quote":"TSMCには複数のCoWoS方式がある。","quote_start":0,"quote_end":20,"text_sha256":"7e741d24c16b06fbea1909ddfab0e22e73c022c54d167f382035eadc01df84e8","block_sha256":"7e741d24c16b06fbea1909ddfab0e22e73c022c54d167f382035eadc01df84e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_d03ae55c-b601-4555-9643-c8f45eb58034"},{"id":"occ_b3571c987856353c811c52bc","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_d0f7a7d0-796a-4d29-91d8-6bda7a36f369","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":9,"end":14,"exact":"CoWoS","quote":"**「Intel版CoWoS」**","quote_start":0,"quote_end":17,"text_sha256":"e77dc9e02533119606b75dc4cde7c379fb49effe367ba405e493ec63d538447b","block_sha256":"e77dc9e02533119606b75dc4cde7c379fb49effe367ba405e493ec63d538447b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_d0f7a7d0-796a-4d29-91d8-6bda7a36f369"},{"id":"occ_828cd72098331e091f8195aa","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_d10d46a7-2ae2-4f14-88e3-b08d9b865890","section_id":"sec_866f7f66-a4f3-4faa-884c-623b5ecd2677","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":11,"end":16,"exact":"CoWoS","quote":"## 第31章　ただしCoWoSは消えない","quote_start":0,"quote_end":21,"text_sha256":"9f237a136a482d0f5172e3885bbce7b8f53d6bf570f317d793d3b018c8f06064","block_sha256":"9f237a136a482d0f5172e3885bbce7b8f53d6bf570f317d793d3b018c8f06064","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_d10d46a7-2ae2-4f14-88e3-b08d9b865890"},{"id":"occ_1b46eab6966365c0debd5591","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_d6504f0d-68e1-46e1-872a-63899d587bd5","section_id":"sec_ecb98d56-7b9f-4c2e-b07d-287378ab16c3","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":11,"end":15,"exact":"EMIB","quote":"これによってTSMCがEMIB-Tをどの程度本気で競合と見ているかが分かる。","quote_start":0,"quote_end":38,"text_sha256":"52482e4dbd615cadb679f49273ab2e84d253a7cef19b192a4faeadd050789aa4","block_sha256":"52482e4dbd615cadb679f49273ab2e84d253a7cef19b192a4faeadd050789aa4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_d6504f0d-68e1-46e1-872a-63899d587bd5"},{"id":"occ_23c5f93c4b9eca9b954f24cf","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_d9acfb07-db9b-48c4-8e64-f8f0c131b403","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":1,"end":5,"exact":"EMIB","quote":"「EMIB-Tを採用した」というニュースだけではない。","quote_start":0,"quote_end":27,"text_sha256":"31d3ba014dec97e9aa9d089b6f1445f41a4ac97fc5e51d6b83235680975d9c2a","block_sha256":"31d3ba014dec97e9aa9d089b6f1445f41a4ac97fc5e51d6b83235680975d9c2a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_d9acfb07-db9b-48c4-8e64-f8f0c131b403"},{"id":"occ_cbf0b04b22d057d25ce9c90a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_dc5fc3b2-aafc-4574-837f-0565ea7a2bfe","section_id":"sec_0156b33c-cbf0-43a5-a0cf-a7abe865741c","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"EMIB","quote":"つまりEMIB-Tは単なる高速信号用の橋ではない。","quote_start":0,"quote_end":25,"text_sha256":"d0b27194c997f634ecd10c9ece771fb6b67a5ce8d518686c5b30fecaee327912","block_sha256":"d0b27194c997f634ecd10c9ece771fb6b67a5ce8d518686c5b30fecaee327912","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_dc5fc3b2-aafc-4574-837f-0565ea7a2bfe"},{"id":"occ_aaee4557f6bbf9ddda3ae797","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_de1c789e-ab70-4eb1-818f-b3be45a40a10","section_id":"sec_dfa37d81-a3e3-420a-aefd-2b3845e3a98a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":39,"end":43,"exact":"EMIB","quote":"そして2027〜2028年は、その主導権をTSMCが維持するのか、IntelがEMIB-Tによって一角を奪うのかを判断する重要な期間になる。","quote_start":0,"quote_end":70,"text_sha256":"5f633080d2e8a6cf3228cb4cf3a0bbd2b6f053aab1c906d10c9f9c57b12014a1","block_sha256":"5f633080d2e8a6cf3228cb4cf3a0bbd2b6f053aab1c906d10c9f9c57b12014a1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_de1c789e-ab70-4eb1-818f-b3be45a40a10"},{"id":"occ_1735cd74d604bda9a4fe8bd3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_dfa150eb-7c5f-4764-8d02-364bc27befc0","section_id":"sec_117f6fec-51b8-48ed-9961-07d39ee93f16","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"EMIB","quote":"つまりEMIB-Tは単独技術というより、","quote_start":0,"quote_end":20,"text_sha256":"37a5041f5385d2cd0203178309270066a7a122ddaa3be764b9c093bb22b64e42","block_sh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backlog continues to grow**","quote_start":0,"quote_end":36,"text_sha256":"60e640b8a27521f7eda6361a2cc1a8a17c40310e6db5e0de5587e98c6feccc42","block_sha256":"60e640b8a27521f7eda6361a2cc1a8a17c40310e6db5e0de5587e98c6feccc42","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_e109b975-f992-4253-9f3b-877379a4b896"},{"id":"occ_4673564246c763acbadbacc3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_e6dc8787-537d-4d35-afa7-dfad84e68fe7","section_id":"sec_e33e0471-7975-44f8-bafe-438bbc9ed9f3","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":9,"end":13,"exact":"EMIB","quote":"## Intel EMIB-T徹底解説","quote_start":0,"quote_end":19,"text_sha256":"17e47167b50cc88210a2146be079b7ebb93b24ea3bf99c2a391b1a830fba55bd","block_sha256":"17e47167b50cc88210a2146be079b7ebb93b24ea3bf99c2a391b1a830fba55bd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_e6dc8787-537d-4d35-afa7-dfad84e68fe7"},{"id":"occ_49b1822f35541ca352fc3503","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_ea38370f-1dc3-4c3c-9ee4-d44d568e9f5f","section_id":"sec_53bb81fe-ab50-4ba6-8d73-dd939830856a","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tが巨大化すると、Bridge数自体も30個以上へ増える。","quote_start":0,"quote_end":34,"text_sha256":"f37c9e8150828927d04b56afbbcd9183337e8efd52f8714f3d706fbf11f324c3","block_sha256":"f37c9e8150828927d04b56afbbcd9183337e8efd52f8714f3d706fbf11f324c3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_ea38370f-1dc3-4c3c-9ee4-d44d568e9f5f"},{"id":"occ_bcb634f6ad5f7260d3f56191","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_eac38612-2927-4289-8edc-7baae5e12f08","section_id":"sec_f121e96c-06c1-49b1-b69e-da0c2c637531","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":7,"end":12,"exact":"CoWoS","quote":"**TSMC CoWoSとIntel 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第7章　EMIB-T最大の問題――実はSilicon Bridgeではない","quote_start":0,"quote_end":40,"text_sha256":"1d3bd12868287bb251f3e837f766317fa11317647371471c58fbbb84b18bc74d","block_sha256":"1d3bd12868287bb251f3e837f766317fa11317647371471c58fbbb84b18bc74d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_edb7e726-a220-4076-b345-8b8532b8234f"},{"id":"occ_650d921c07411b6c993a1d19","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_eee012ba-899b-4ba0-82cd-25afb58a43ef","section_id":"sec_dc98f462-320c-4ace-a88e-614ba36b6daa","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":60,"end":65,"exact":"CoWoS","quote":"ogleが2028年向けに300万個を超えるTPUについてIntelを確保したとの報道、MediaTekによるCoWoSとEMIB双方への公式対応、NVIDIAによる評価、HBMメーカーによる検証が伝えられている。([Reuters](https://www.reuters.com/business/google-nv","quote_start":5,"quote_end":165,"text_sha256":"0923b22084c58727a3b7525d3ddbdceec3c897a0525a4e4ae76aa79ea5442bc8","block_sha256":"0923b22084c58727a3b7525d3ddbdceec3c897a0525a4e4ae76aa79ea5442bc8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_eee012ba-899b-4ba0-82cd-25afb58a43ef"},{"id":"occ_95ffbae6d30e8ca0e87f0bbb","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_ef669faa-1562-4bfd-8ca4-700cf8fbde3a","section_id":"sec_f53c84c7-20b2-48e3-ab4e-d9f32454bdd7","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS不足が消えるわけではない。","quote_start":0,"quote_end":18,"text_sha256":"3d14a4424467b524f8c2f4bf4f6a32b56ac560dabf96d502a80144576ff467de","block_sha256":"3d14a4424467b524f8c2f4bf4f6a32b56ac560dabf96d502a80144576ff467de","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_ef669faa-1562-4bfd-8ca4-700cf8fbde3a"},{"id":"occ_9fc516981d3a4f3789b47fd6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_f0488889-f52b-48b7-9eff-9fb537eb0e03","section_id":"sec_6cfe0fb4-a41b-4823-8d54-dbd0caaa63cc","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"EMIB","quote":"**巨大なEMIB-T対応package 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Bridge\n","quote_start":21,"quote_end":181,"text_sha256":"0bab9b29f75a2e085d3e75a87fa7278b6a970ee4f5aaac76b92bb49e38b593c3","block_sha256":"0bab9b29f75a2e085d3e75a87fa7278b6a970ee4f5aaac76b92bb49e38b593c3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_f441971e-730b-444f-a00c-75166b4c57d2"},{"id":"occ_d7a0365e53a8959df4172152","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_f9d46801-9d81-495e-9ae5-3caad4e728e1","section_id":"sec_4d645e38-d961-46ef-8cd7-aac891b07362","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIBは非常に明快な発想から生まれている。","quote_start":0,"quote_end":22,"text_sha256":"388a8e8b7840388267a8546c0163a3636d5a76ab0bc1d3a99eda9186db241b39","block_sha256":"388a8e8b7840388267a8546c0163a3636d5a76ab0bc1d3a99eda9186db241b39","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_f9d46801-9d81-495e-9ae5-3caad4e728e1"},{"id":"occ_b6ab422bbd37ffa06a3724a9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_fa8f9f29-3516-4d52-a05a-042e675cb892","section_id":"sec_c268fc4d-161c-4e84-8919-d88ca87f1c0c","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":18,"end":22,"exact":"EMIB","quote":"**HBM3E/HBM4/HBM5がEMIB-T上で十分にqualificationされていること**","quote_start":0,"quote_end":51,"text_sha256":"848441722dadd8b9faab4065e485395802ac91c7851986648462a5e6734b7054","block_sha256":"848441722dadd8b9faab4065e485395802ac91c7851986648462a5e6734b7054","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_fa8f9f29-3516-4d52-a05a-042e675cb892"},{"id":"occ_c8389a5a9e2e3c01ef7ebfd2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_faf94a98-740e-4bd0-bee3-7c66dad6baa3","section_id":"sec_f121e96c-06c1-49b1-b69e-da0c2c637531","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":18,"end":23,"exact":"CoWoS","quote":"ただしMediaTekの公式発言は「CoWoSとEMIB双方をサポート」であるため、特定案件の独占採用についてはサプライチェーン情報と公式情報を分けて見る必要がある。","quote_start":0,"quote_end":83,"text_sha256":"801006ace8e750c39283e67bed2ca426b04d94ccbffaa4a35850993adebb274d","block_sha256":"801006ace8e750c39283e67bed2ca426b04d94ccbffaa4a35850993adebb274d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_faf94a98-740e-4bd0-bee3-7c66dad6baa3"},{"id":"occ_f7f4cc73949fc046590ef9db","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_fd0ab9df-1c35-4507-9f13-fbaef51aae3d","section_id":"sec_d8bc6bd6-4c64-49d9-b063-2f6375f195cc","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tは、","quote_start":0,"quote_end":8,"text_sha256":"cc78bb82488a21bb3f197df2b34ce5f656153f4ab4fb87dac2e7559118bb79b9","block_sha256":"cc78bb82488a21bb3f197df2b34ce5f656153f4ab4fb87dac2e7559118bb79b9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce/#blk_fd0ab9df-1c35-4507-9f13-fbaef51aae3d"},{"id":"occ_7728ead14d86870e82f701de","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_0c1ca0be-030b-470f-a556-2d79b9d3ddce","work_id":"wrk_a09f39eb-1b73-4666-a271-64dbd9638093","block_id":"blk_fe85faf3-1057-40e7-bb39-bdbb6568d0e2","section_id":"sec_387c382c-c84c-431a-93e4-5c144d0552e4","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":4,"end":8,"exact":"EMIB","quote":"そのためEMIB-Tでは、","quote_start":0,"quote_end":13,"text_sha256":"a5493d18b62595e6990053ae4b932f74adc5fcef55c842f87349282e0c2bf858","block_sha25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**横**（スタック数）  \n   → **8 → 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|","quote_start":82,"quote_end":217,"text_sha256":"e0bfc08c7334d651377af4abaf5bf7ffba402b8cb8bff31fee651974f5ee1766","block_sha256":"e0bfc08c7334d651377af4abaf5bf7ffba402b8cb8bff31fee651974f5ee1766","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_2f5cc921-59ef-4e07-ba11-82e4656c1db7/#blk_b193f436-b420-4e37-9aa2-b9a280f4e7a7"},{"id":"occ_b0751f10f8cb11d558a76f1d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_355a11d8-4fec-4b80-a649-e98f432ab2b2","work_id":"wrk_88ec36ab-4756-4367-9133-1ec996d49f09","block_id":"blk_0985261c-0a7c-411f-a6da-87462850cec8","section_id":"sec_453ff63b-362b-477b-b9cb-8444584de297","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS不足。","quote_start":0,"quote_end":8,"text_sha256":"0e3ada7cc5e07bcbe9cbf0b4f4fbd32040b7102fa22f4b1f8abe140149689d62","block_sha256":"0e3ada7cc5e07bcbe9cbf0b4f4fbd32040b7102fa22f4b1f8abe140149689d62","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_355a11d8-4fec-4b80-a649-e98f432ab2b2/#blk_0985261c-0a7c-411f-a6da-87462850cec8"},{"id":"occ_0d06ee052aa15f54f6b4507a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_355a11d8-4fec-4b80-a649-e98f432ab2b2","work_id":"wrk_88ec36ab-4756-4367-9133-1ec996d49f09","block_id":"blk_32189a04-d6a6-4e1a-bb73-d921b5142d34","section_id":"sec_453dd87d-5668-4061-bb85-a99e8e4f8a57","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":29,"end":36,"exact":"先端パッケージ","quote":"TELもAIサーバー向け先端Logic、DRAM、HBM、先端パッケージ投資を中長期の成長ドライバーとしている。([Tel](https://www.tel.com/ir/irta3a00000006g5-att/fy26q3presentations-e.pdf?utm","quote_start":0,"quote_end":136,"text_sha256":"2d7a1780ad720852e813845df3915cdb47fa202be191f374c46ac469f22de09d","block_sha256":"2d7a1780ad720852e813845df3915cdb47fa202be191f374c46ac469f22de09d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_355a11d8-4fec-4b80-a649-e98f432ab2b2/#blk_32189a04-d6a6-4e1a-bb73-d921b5142d34"},{"id":"occ_34ebb8e21e1868cb267eb687","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_355a11d8-4fec-4b80-a649-e98f432ab2b2","work_id":"wrk_88ec36ab-4756-4367-9133-1ec996d49f09","block_id":"blk_a6b9fa1e-d09e-4283-b200-9fa5e16a082f","section_id":"sec_5e89a8b0-b847-43f9-91ea-c360faaf182c","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":10,"end":17,"exact":"先端パッケージ","quote":"AI半導体、HBM、先端パッケージ、データセンター。","quote_start":0,"quote_end":26,"text_sha256":"6e72f825f1acba0d8c40e6d0f10341eb725feda8e3a822c4ed4bc783d417dc8b","block_sha256":"6e72f825f1acba0d8c40e6d0f10341eb725feda8e3a822c4ed4bc783d417dc8b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_355a11d8-4fec-4b80-a649-e98f432ab2b2/#blk_a6b9fa1e-d09e-4283-b200-9fa5e16a082f"},{"id":"occ_b0e1ba56a50119f29814d369","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_355a11d8-4fec-4b80-a649-e98f432ab2b2","work_id":"wrk_88ec36ab-4756-4367-9133-1ec996d49f09","block_id":"blk_e11d0a2b-d7c9-492a-9864-e77893e839d9","section_id":"sec_3bdc0720-6512-4aa2-8fa0-93da93198d76","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoSを確保できる。","quote_start":0,"quote_end":12,"text_sha256":"adf4169b321973521cfd5936baf7b9ee1e85735e04d15c99b129f7c34a67b978","block_sha256":"adf4169b321973521cfd5936baf7b9ee1e85735e04d15c99b129f7c34a67b978","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_355a11d8-4fec-4b80-a649-e98f432ab2b2/#blk_e11d0a2b-d7c9-492a-9864-e77893e839d9"},{"id":"occ_646dc9cbc692cef7f2f420ea","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_070abce2-4ba5-40a4-9c94-c0925065b6d1","section_id":"sec_23217fdf-6265-47d7-8627-0bac05728567","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":12,"end":16,"exact":"SoIC","quote":"## \\6. 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Bondingを使ってSRAMをCPUコアダイ上に積む量産例として紹介されている。([darpa.mil](https://www.darpa.mil/sites","quote_start":0,"quote_end":136,"text_sha256":"57f37624096117cdfb93ffa714bfdfa82fce739df0032ed2ff033480fea55803","block_sha256":"57f37624096117cdfb93ffa714bfdfa82fce739df0032ed2ff033480fea55803","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_0d58f202-1931-4d7f-8bc5-162c99ef999a"},{"id":"occ_6ebe7d7132310c2163ab6d7f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_0efc44e1-515d-430d-b7d3-eab90b04d5d7","section_id":"sec_23217fdf-6265-47d7-8627-0bac05728567","layer":"body","character_id":null,"count":3,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMC SoICは、TSMCの3D集積技術である。SoICは **System on Integrated Chips** の略であり、TSMC 3DFabricの中核的な3D統合技術の一つである。TSMCはSoIC","quote_start":0,"quote_end":109,"text_sha256":"1d1610e278544cffc23caae9d2d6e2223d985dea639b5cefde4a13d66745c239","block_sha256":"1d1610e278544cffc23caae9d2d6e2223d985dea639b5cefde4a13d66745c239","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_0efc44e1-515d-430d-b7d3-eab90b04d5d7"},{"id":"occ_6817b160ec4ad8eb4104509a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_0f4c1d4c-c262-4a1f-a93b-d68d00c2f4b2","section_id":"sec_de56745a-202f-4bdb-a84a-a16fd00cd2e3","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid 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Hybr","quote_start":50,"quote_end":209,"text_sha256":"edf9359807ee16f7736a7c98851cbc224f0bc63a2b23f701e60023592f037184","block_sha256":"edf9359807ee16f7736a7c98851cbc224f0bc63a2b23f701e60023592f037184","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_0f4c1d4c-c262-4a1f-a93b-d68d00c2f4b2"},{"id":"occ_e56fb2c66cab6d8c4117f2f3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_110543b8-fce8-4397-b120-2f548f19c79a","section_id":"sec_9fdb29d1-6f7d-4372-80e2-111a0d9434de","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingの難しさ","quote_start":0,"quote_end":21,"text_sha256":"814b05ea3cc2f4920de1ee4a8ba8d4d328f270e935219abdc04163a64abdc19a","block_sha256":"814b05ea3cc2f4920de1ee4a8ba8d4d328f270e935219abdc04163a64abdc19a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_110543b8-fce8-4397-b120-2f548f19c79a"},{"id":"occ_e912a601af0f78bd0caead93","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_123ba210-6e60-4344-b38a-c6790539bf9f","section_id":"sec_4d7fbb1d-2fdb-469d-bc95-528ce1eae672","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":2,"end":16,"exact":"Hybrid Bonding","quote":"**Hybrid Bondingが“縦方向の道”を作り、Logic Foldingがその道を使った新しい都市設計を行う**","quote_start":0,"quote_end":61,"text_sha256":"58462a6f7b48098a783b9039fa8f4dfa63e6368b739bd35dafa7de82f3f7f5db","block_sha256":"58462a6f7b48098a783b9039fa8f4dfa63e6368b739bd35dafa7de82f3f7f5db","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_123ba210-6e60-4344-b38a-c6790539bf9f"},{"id":"occ_c27596c3ddaa78a5f5be1397","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_12a9e0d5-e0cd-4dca-bc7f-0176a0e2542b","section_id":"sec_4eddd243-12bb-4bf6-96bd-12fd6d342a04","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":60,"end":74,"exact":"Hybrid Bonding","quote":"verosはマイクロバンプを使った3D積層技術として始まり、Foveros DirectではCu-to-Cu Hybrid Bondingによるより高密度な接続を狙う。IntelのFoveros Direct 3D資料では、直接銅—銅ハイブリッドボンディングによりsub-10µmピッチを実現し、従来のマイクロバンプと比べて接続密度を大き","quote_start":5,"quote_end":174,"text_sha256":"b040d158bd005bd05aa318b401881c3187deec7010e9079ff9a70c7e379b154b","block_sha256":"b040d158bd005bd05aa318b401881c3187deec7010e9079ff9a70c7e379b154b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_12a9e0d5-e0cd-4dca-bc7f-0176a0e2542b"},{"id":"occ_4bc917af14bd36abde0c1584","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_14380921-8198-430d-9e2f-44941b869995","section_id":"sec_e4e0a0ba-0654-4c2d-b61d-e574d1f34395","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"ここでのHybrid Bondingの役割は、**SRAMをCPUに極めて近い距離で接続すること**である。これは「メモリをロジックに近づける」技術の代表例と言える。","quote_start":0,"quote_end":83,"text_sha256":"1873fbec7facd4b2de926f459b4b4aa37de39327db6901bb8d8e82794d2c738b","block_sha256":"1873fbec7facd4b2de926f459b4b4aa37de39327db6901bb8d8e82794d2c738b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_14380921-8198-430d-9e2f-44941b869995"},{"id":"occ_3c8336ea9d54e9325b94b5ec","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_14a44d2e-18a7-4747-8a8a-9e2da80d705d","section_id":"sec_67797b87-fa32-4a4b-b6ac-c0bec83769bc","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMC SoICは3D積層の製造基盤であり、Intel Foveros Directはタイル統合の高密度基盤であり、AMD 3D V-CacheはSRAMをCPUに近づける実用例であり、YMTC XtackingはN","quote_start":0,"quote_end":109,"text_sha256":"f04a56a0dad8d100d183a35302083800894a3aa87a3af3a3cc162f79497709cf","block_sha256":"f04a56a0dad8d100d183a35302083800894a3aa87a3af3a3cc162f79497709cf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_14a44d2e-18a7-4747-8a8a-9e2da80d705d"},{"id":"occ_449c5472453a544b02bf7630","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_1c24d4b3-e6c4-4ac5-801b-234013ff826d","section_id":"sec_687fdcdd-e7fe-4c32-ad11-d5fd2b7fb5cf","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":19,"end":23,"exact":"SoIC","quote":"Logic FoldingやTSMC SoIC、Intel Foveros Direct、AMD 3D V-Cacheを理解するうえで欠かせない基礎技術が、**Hybrid Bonding**である。","quote_start":0,"quote_end":100,"text_sha256":"5b032fde5cb5fc3f7785e6abaf09de02603c90a65069e14e3e0852f4d510762e","block_sha256":"5b032fde5cb5fc3f7785e6abaf09de02603c90a65069e14e3e0852f4d510762e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_1c24d4b3-e6c4-4ac5-801b-234013ff826d"},{"id":"occ_ac90b528a44195bd036563e3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_1c9f5513-ae0a-4e44-afbf-b228210809b4","section_id":"sec_23217fdf-6265-47d7-8627-0bac05728567","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":2,"end":16,"exact":"Hybrid Bonding","quote":"- Hybrid Bonding\n- 低抵抗・低容量接続\n- 高密度インターコネクト\n- logic-on-logic\n- memory-on-logic\n- chiplet-on-chiplet\n- wafer-on-wafer","quote_start":0,"quote_end":115,"text_sha256":"3921c1754bf9f15dfc5bc6f1f47560b723596483c5e945667749332569f3b286","block_sha256":"3921c1754bf9f15dfc5bc6f1f47560b723596483c5e945667749332569f3b286","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_1c9f5513-ae0a-4e44-afbf-b228210809b4"},{"id":"occ_1c7391e6f6117847f993835b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_275f6ebf-3331-47d1-b70b-a54ba9e8b51d","section_id":"sec_ef41c544-5c77-4182-9b82-ad00fe9576f1","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"```\nHybrid Bonding\n= 縦方向に高密度でつなぐ技術\n\nLogic Folding\n= その縦方向接続を使って、\n  ロジック回路の配置・配線・クロック・タイミングを再設計する考え方\n```","quote_start":0,"quote_end":103,"text_sha256":"d2625eeaeb32c4cda68232824e503e404190487a0ae7254562f39e99ef5f7725","block_sha256":"d2625eeaeb32c4cda68232824e503e404190487a0ae7254562f39e99ef5f7725","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_275f6ebf-3331-47d1-b70b-a54ba9e8b51d"},{"id":"occ_4b750a4da0e51b0387933f82","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_3be2ad21-4d70-4fc1-a835-50a7e298b787","section_id":"sec_9fdb29d1-6f7d-4372-80e2-111a0d9434de","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":39,"end":53,"exact":"Hybrid Bonding","quote":"また、接続密度が上がるほど、テストや修復も難しくなる。ロジック内部に近い粒度でHybrid Bondingを使う場合、接続不良をどう検出し、どう迂回するかが重要になる。","quote_start":0,"quote_end":84,"text_sha256":"7a871d55dd9b3318a913eaedd6800c1098bb0d4da926d74d4ecb25a691480605","block_sha256":"7a871d55dd9b3318a913eaedd6800c1098bb0d4da926d74d4ecb25a691480605","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_3be2ad21-4d70-4fc1-a835-50a7e298b787"},{"id":"occ_b7b7f1f859e6d799b2a1150d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_3f595965-9ad3-449c-8cfe-d8f13dba4580","section_id":"sec_687fdcdd-e7fe-4c32-ad11-d5fd2b7fb5cf","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":51,"end":65,"exact":"Hybrid Bonding","quote":"```\n従来のマイクロバンプ接続\n\n上側ダイ\n  ● ● ● ●   ← はんだバンプ\n下側ダイ\n\n\nHybrid Bonding\n\n上側ダイ\nCu | 絶縁膜 | Cu | 絶縁膜\n│              │\nCu | 絶縁膜 | Cu | 絶縁膜\n下側ダイ\n```","quote_start":0,"quote_end":137,"text_sha256":"996ef86b8b49208ad71d4423d92652421bf270fb76ae3d9bb63e0ced5c7c3035","block_sha256":"996ef86b8b49208ad71d4423d92652421bf270fb76ae3d9bb63e0ced5c7c3035","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_3f595965-9ad3-449c-8cfe-d8f13dba4580"},{"id":"occ_68dad4f0ccf00edbf35e7031","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_4490cb81-8273-4957-b4d8-1b52f918aa17","section_id":"sec_ef41c544-5c77-4182-9b82-ad00fe9576f1","layer":"body","character_id":null,"count":3,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingは、あくまで「どう接続するか」という製造・接合技術である。  \n一方、Logic Foldingは「どのロジックを上下に分け、どの経路を短くするか」という物理設計手法であり、おそらくHybrid Bo","quote_start":0,"quote_end":114,"text_sha256":"2ccefa01f82fa47a23b640df72b64b0626b7dbcd8e93305909baafca87523bb6","block_sha256":"2ccefa01f82fa47a23b640df72b64b0626b7dbcd8e93305909baafca87523bb6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_4490cb81-8273-4957-b4d8-1b52f918aa17"},{"id":"occ_42d638263cfc90098a9b0ffe","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_468db5f0-1eea-4ee7-8431-063c7a7b0efc","section_id":"sec_e4e0a0ba-0654-4c2d-b61d-e574d1f34395","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":33,"end":47,"exact":"Hybrid Bonding","quote":"```\n上層: SRAM Cache Die\n        │ Hybrid Bonding\n下層: CPU Core Die\n```","quote_start":0,"quote_end":68,"text_sha256":"55d2d29cc2a2dbf5570105eabeb3fbe98fab66a46b86f56fb11a578d7bdb31de","block_sha256":"55d2d29cc2a2dbf5570105eabeb3fbe98fab66a46b86f56fb11a578d7bdb31de","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_468db5f0-1eea-4ee7-8431-063c7a7b0efc"},{"id":"occ_555b5843ef5d417f61974d71","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_4b2b7857-4545-4f19-8530-c12468dfa516","section_id":"sec_b2e26e64-cc90-4796-9511-e904733e07c5","layer":"body","character_id":null,"count":1,"matched_aliases":["ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":0,"end":12,"exact":"ハイブリッドボンディング","quote":"ハイブリッドボンディングでは、微小な接合不良、ボイド、ミスアライメント、表面平坦性の問題が歩留まりに影響する。","quote_start":0,"quote_end":55,"text_sha256":"8e66bb0fa22646c711e3dc15f8f67f1f50adeeb5dd1b4dbdfcde17699d7ff141","block_sha256":"8e66bb0fa22646c711e3dc15f8f67f1f50adeeb5dd1b4dbdfcde17699d7ff141","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_4b2b7857-4545-4f19-8530-c12468dfa516"},{"id":"occ_76c0bbcafcfe8636bcb341b8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_4c8b09b3-8a63-4ffc-b38d-caf65212da58","section_id":"sec_23217fdf-6265-47d7-8627-0bac05728567","layer":"code","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":4,"end":8,"exact":"SoIC","quote":"```\nSoIC = 積むための製造基盤\nLogic Folding = 積んだ空間でロジックをどう折りたたむか\n```","quote_start":0,"quote_end":60,"text_sha256":"ac0e1c2e530b2f2d61d056951fc726544da0350b354f3e0f88e6705471f8b649","block_sha256":"ac0e1c2e530b2f2d61d056951fc726544da0350b354f3e0f88e6705471f8b649","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_4c8b09b3-8a63-4ffc-b38d-caf65212da58"},{"id":"occ_a4cbed9d1e9bc9ffecfc89ff","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_5de152b1-4100-4e25-8216-5e54ed8564aa","section_id":"sec_d0b3c2ac-3d07-458f-b089-fcb2777a8532","layer":"body","character_id":null,"count":1,"matched_aliases":["ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":36,"end":48,"exact":"ハイブリッドボンディング","quote":"Logic Foldingの本質は、単なる「チップを積むこと」ではない。ハイブリッドボンディングによる垂直接続を、パッケージ接続ではなく、**ロジック内部の配線資源に近いものとして扱う**点にある。","quote_start":0,"quote_end":99,"text_sha256":"6e0a38cc9d4cebdd45ea4b4b5294a1d8fe0eefd7479242110677603d0f05e6bf","block_sha256":"6e0a38cc9d4cebdd45ea4b4b5294a1d8fe0eefd7479242110677603d0f05e6bf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_5de152b1-4100-4e25-8216-5e54ed8564aa"},{"id":"occ_b81c66b689ebd16b8d6172ba","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_72ea7920-82ec-46aa-9962-24da0076656a","section_id":"sec_49208312-f9db-4d5e-9c9a-4b77a9e8c4d4","layer":"code","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":9,"end":13,"exact":"SoIC","quote":"```\nTSMC SoIC\n= 3D集積を実現する製造・接合基盤\n\nIntel Foveros Direct\n= タイル/チップレットを高密度に積む接合基盤\n\nAMD 3D V-Cache\n= SRAMをCPUの上に積む実用例","quote_start":0,"quote_end":113,"text_sha256":"56f87081ea0b84624f6801d818db0b034d4752aa08115272ac9871fd963aab5d","block_sha256":"56f87081ea0b84624f6801d818db0b034d4752aa08115272ac9871fd963aab5d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_72ea7920-82ec-46aa-9962-24da0076656a"},{"id":"occ_d84d96b33bbee4b27cf0db9d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_793f1c03-aee7-4eee-ae84-fc697133115b","section_id":"sec_e4e0a0ba-0654-4c2d-b61d-e574d1f34395","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingの実用例として分かりやすいのが、AMDの**3D V-Cache**である。","quote_start":0,"quote_end":52,"text_sha256":"72f635500eb5d1d0c9d17d5183c925cba7bc68b065437523e916b8686562f91b","block_sha256":"72f635500eb5d1d0c9d17d5183c925cba7bc68b065437523e916b8686562f91b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_793f1c03-aee7-4eee-ae84-fc697133115b"},{"id":"occ_8cb902921b401cd6513ad14b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_79dcd6ef-2256-487d-b894-452a99ab6849","section_id":"sec_9fdb29d1-6f7d-4372-80e2-111a0d9434de","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingは非常に強力だが、簡単な技術ではない。","quote_start":0,"quote_end":33,"text_sha256":"1b2d4ea6144f100940eb42362586ebd3dff2b75b5aa73aafb3c7922f89620677","block_sha256":"1b2d4ea6144f100940eb42362586ebd3dff2b75b5aa73aafb3c7922f89620677","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_79dcd6ef-2256-487d-b894-452a99ab6849"},{"id":"occ_53cc27887208e89e4da44837","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_7bbe1f7c-6111-469d-8cb0-e76e1a2bdce0","section_id":"sec_88e467bb-8fb4-4d79-8dcf-8770942775d6","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":80,"end":94,"exact":"Hybrid Bonding","quote":"算器にデータを供給し続ける必要がある。そのため、1bitをどれだけ低エネルギーで動かせるかが非常に重要になる。Hybrid Bondingは、この「データ移動の電力」を下げるための中核技術になりつつある。","quote_start":25,"quote_end":127,"text_sha256":"8c05b0cdeec74f3da8b03313ac4f1d1da5580b29f3dc70eadb8f51ff1feccaad","block_sha256":"8c05b0cdeec74f3da8b03313ac4f1d1da5580b29f3dc70eadb8f51ff1feccaad","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_7bbe1f7c-6111-469d-8cb0-e76e1a2bdce0"},{"id":"occ_d27d82590fd2e37f68b4e795","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_7ddbbf75-336c-49fa-8d3b-8ab9b3691b8a","section_id":"sec_788d6e81-79d6-41aa-8d39-eb3b36b4e047","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":6,"end":20,"exact":"Hybrid Bonding","quote":"## 追記：Hybrid Bondingとは何か","quote_start":0,"quote_end":24,"text_sha256":"d723b5b18b8b2b3d1ac9a71b5bad212a7a31e3f14ddb81b40141c2d8dacde14f","block_sha256":"d723b5b18b8b2b3d1ac9a71b5bad212a7a31e3f14ddb81b40141c2d8dacde14f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_7ddbbf75-336c-49fa-8d3b-8ab9b3691b8a"},{"id":"occ_cfb33b658b9092905911b6f0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_9a5f8869-042a-46fe-b8fe-c67851dbd275","section_id":"sec_4d7fbb1d-2fdb-469d-bc95-528ce1eae672","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingは、3D半導体時代の基礎インフラである。  \n従来のマイクロバンプよりも高密度・低RLC・低遅延な接続を可能にし、メモリとロジック、ロジックとロジック、タイルとタイルをより近づける。","quote_start":0,"quote_end":105,"text_sha256":"ac2e84588b7e5c66b34baf449bd7f57a864b11bf3193d40b6ab6e880b918d307","block_sha256":"ac2e84588b7e5c66b34baf449bd7f57a864b11bf3193d40b6ab6e880b918d307","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_9a5f8869-042a-46fe-b8fe-c67851dbd275"},{"id":"occ_a1a4834909dfc1fe40350041","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_a1fc43b3-3540-4e18-82ba-1f56a4f9d67d","section_id":"sec_d0b3c2ac-3d07-458f-b089-fcb2777a8532","layer":"body","character_id":null,"count":4,"matched_aliases":["Hybrid Bonding","SoIC","ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":23,"end":37,"exact":"Hybrid Bonding","quote":"このとき重要なのが、**Fine-Pitch Hybrid Bonding**である。ハイブリッドボンディングは、銅パッド同士と絶縁膜同士を直接接合する技術であり、従来のマイクロバンプよりも細かいピッチで高密度接続できる。TSMCはSoICを3DFabricの一部として位置","quote_start":0,"quote_end":137,"text_sha256":"4819b74d8559d583efc303da1d6b476005608969309505fb3bc61b88794e6656","block_sha256":"4819b74d8559d583efc303da1d6b476005608969309505fb3bc61b88794e6656","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_a1fc43b3-3540-4e18-82ba-1f56a4f9d67d"},{"id":"occ_181c03790788536489992cac","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_a4d7676d-7477-4ec4-b59b-e74c9a44da4e","section_id":"sec_6758bab6-6257-46cb-91cd-bbb1bdb72a2a","layer":"body","character_id":null,"count":1,"matched_aliases":["ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":37,"end":49,"exact":"ハイブリッドボンディング","quote":"KnowMadeは、YMTCが2018〜2019年にXtackingとしてハイブリッドボンディングを3D NANDに適用し、その後関連特許ポートフォリオを拡大してきたと説明している。([KnowMade](https://www.knowmade.com/technology-news/semic","quote_start":0,"quote_end":149,"text_sha256":"f99a14a73e7c53072c1a47c8addeb6caea3405c4ccb9cd6b2bb8bc9868290ec6","block_sha256":"f99a14a73e7c53072c1a47c8addeb6caea3405c4ccb9cd6b2bb8bc9868290ec6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_a4d7676d-7477-4ec4-b59b-e74c9a44da4e"},{"id":"occ_ca349a040d7d7f4aaeb046ed","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_aa8a1b90-3189-4c1e-9e09-0d31baff779c","section_id":"sec_ef41c544-5c77-4182-9b82-ad00fe9576f1","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":17,"end":31,"exact":"Hybrid Bonding","quote":"**Logic Foldingは、Hybrid Bondingを単なるダイ間接続ではなく、ロジック内部の3D配線資源として使う設計思想である。**","quote_start":0,"quote_end":73,"text_sha256":"aa6e3dfd964b99d71fc8dfe379e23c37f7b8508e89649db262379c6f6cb5817b","block_sha256":"aa6e3dfd964b99d71fc8dfe379e23c37f7b8508e89649db262379c6f6cb5817b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_aa8a1b90-3189-4c1e-9e09-0d31baff779c"},{"id":"occ_f1b9eb14d46e3b755d5ffbfa","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_ab11ef17-5ab2-4b79-8431-c57998d6caa9","section_id":"sec_49208312-f9db-4d5e-9c9a-4b77a9e8c4d4","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"SoIC","quote":"## TSMC SoIC、Intel Foveros Directとの関係","quote_start":0,"quote_end":37,"text_sha256":"af690f8c76ddf32e50378dece6f9e651d2c4f84714326ee8a29c252fed1d12c3","block_sha256":"af690f8c76ddf32e50378dece6f9e651d2c4f84714326ee8a29c252fed1d12c3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_ab11ef17-5ab2-4b79-8431-c57998d6caa9"},{"id":"occ_b2f35d0fd64e9d5478e9c239","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_bac348e9-36bc-4322-ae0d-a2660d021915","section_id":"sec_23217fdf-6265-47d7-8627-0bac05728567","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICは「3D積層を可能にする製造・接合基盤」であり、Logic Foldingは「そのような3D接続を使って、ロジック内部の配置・配線をどう再設計するか」という設計方法論である。","quote_start":0,"quote_end":91,"text_sha256":"6de38717105388ada2b13ddf3083e43fc867a93f85860b6569b7c65648f7d6d1","block_sha256":"6de38717105388ada2b13ddf3083e43fc867a93f85860b6569b7c65648f7d6d1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_bac348e9-36bc-4322-ae0d-a2660d021915"},{"id":"occ_d66c16ecb28ff311d063b6b8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_cadba494-51dc-494e-be4a-11cdf3c4cff6","section_id":"sec_88e467bb-8fb4-4d79-8dcf-8770942775d6","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid 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3D配置\n- ハイブリッドボンディング\n- メモリ近接\n- クロック最適化\n- NoC最適化\n- 熱設計\n- 電源供給\n- 歩留まり修復\n- 3D EDA\n- AIによる設計探索","quote_start":0,"quote_end":91,"text_sha256":"e9b6a0bf0804c3d58a2df7a9f0c07587f2c1014d5f1d50f8f7051d226ddbd38d","block_sha256":"e9b6a0bf0804c3d58a2df7a9f0c07587f2c1014d5f1d50f8f7051d226ddbd38d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_e5b619c6-d345-4c59-bd7a-f8d0146c8b66"},{"id":"occ_fc7cf883a977a7e0b0ca9fab","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3","work_id":"wrk_68ec8173-3ea7-4526-bfea-020e82eae4c6","block_id":"blk_ed6335d8-db54-49cd-9a1e-195e350ef4c5","section_id":"sec_88e467bb-8fb4-4d79-8dcf-8770942775d6","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bondingをさらに設計内部へ取り込み、長い横配線を短い縦接続へ変","quote_start":0,"quote_end":124,"text_sha256":"0e030113e0be88422f26d2d91bec77f19dbeeefee654af776511cb260f786062","block_sha256":"0e030113e0be88422f26d2d91bec77f19dbeeefee654af776511cb260f786062","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_3621f98d-f1b9-4e97-9c8a-8b259cfd31c3/#blk_fc0d9961-10c4-44c5-8671-852df1a0cf66"},{"id":"occ_435c15e2b08e3edd6ee10017","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_434ed8d3-8167-4144-9b6e-d003da6dda05","work_id":"wrk_3a0c5c0e-1aa0-4c0a-919b-6fdb8f3ded2d","block_id":"blk_bdc00d83-868c-47a8-bde8-c377ec2382a0","section_id":"sec_e0f6bbf3-4f33-4b74-897a-3ce9b68220b9","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":18,"end":25,"exact":"先端パッケージ","quote":"AI半導体というと、GPU、HBM、先端パッケージング、光通信に目が向きやすい。","quote_start":0,"quote_end":40,"text_sha256":"61f619ff267ccfdc4f67a1a25f91c70e17fe4472ed96e0dea209f395a506bf62","block_sha256":"61f619ff267ccfdc4f67a1a25f91c70e17fe4472ed96e0dea209f395a506bf62","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_434ed8d3-8167-4144-9b6e-d003da6dda05/#blk_bdc00d83-868c-47a8-bde8-c377ec2382a0"},{"id":"occ_8d96abe9acd9dd80bcfe0f43","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_44c73f5c-647d-467e-8aa2-527eb6352a8a","work_id":"wrk_45578dda-8dcf-452e-909d-3f4c17ea166c","block_id":"blk_0b6f00b1-10fe-4252-96cb-90c16ee1c8e9","section_id":"sec_1d17a9bd-cd6a-4506-879b-fbc657caf459","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMCのSoICは、CPU上にSRAMをL3キャッシュとして積層した実用例を持つ。SamsungのX-Cubeも、ロジックダイ上にSRAMを積層し、配線距離の短縮と電力効率向上を狙う技術である。([台灣積體電路製造公","quote_start":0,"quote_end":109,"text_sha256":"01b73b6842395d903921f854d433c5089148e564ceb7212fae15b8aed4e1542c","block_sha256":"01b73b6842395d903921f854d433c5089148e564ceb7212fae15b8aed4e1542c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_44c73f5c-647d-467e-8aa2-527eb6352a8a/#blk_0b6f00b1-10fe-4252-96cb-90c16ee1c8e9"},{"id":"occ_0c527210cfea99cc5f9d0201","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_44c73f5c-647d-467e-8aa2-527eb6352a8a","work_id":"wrk_45578dda-8dcf-452e-909d-3f4c17ea166c","block_id":"blk_196af91e-8d95-4703-b17c-ff5a7cd830bc","section_id":"sec_9ed55c6a-7fec-40c3-9223-028a429e29da","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":22,"end":29,"exact":"先端パッケージ","quote":"対象はSRAM、積層SRAM、先端ロジック、先端パッケージ。","quote_start":0,"quote_end":30,"text_sha256":"c8fa91667821275ccb0e860790920c3db906d1eb2ad56021eaa5559e0c5dfa77","block_sha256":"c8fa91667821275ccb0e860790920c3db906d1eb2ad56021eaa5559e0c5dfa77","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_44c73f5c-647d-467e-8aa2-527eb6352a8a/#blk_196af91e-8d95-4703-b17c-ff5a7cd830bc"},{"id":"occ_b148c321dbf8faf711f37191","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_44c73f5c-647d-467e-8aa2-527eb6352a8a","work_id":"wrk_45578dda-8dcf-452e-909d-3f4c17ea166c","block_id":"blk_7b078abb-e3d0-4db4-bf78-969df01582c8","section_id":"sec_07e25edc-7a88-498a-90d8-24c1e67ec925","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":60,"end":65,"exact":"CoWoS","quote":"DRAMダイ\n- TSVによる垂直接続\n- ロジックベースダイ\n- 積層・接合工程\n- インターポーザー\n- CoWoSなどの先端パッケージ\n- GPUとの電気的接続","quote_start":5,"quote_end":88,"text_sha256":"7c1cd0c91ac660263376339e251dbd8f711116d4c2d8421e812794eb1689c5b5","block_sha256":"7c1cd0c91ac660263376339e251dbd8f711116d4c2d8421e812794eb1689c5b5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_44c73f5c-647d-467e-8aa2-527eb6352a8a/#blk_7b078abb-e3d0-4db4-bf78-969df01582c8"},{"id":"occ_cb163613e82c996280058386","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_44c73f5c-647d-467e-8aa2-527eb6352a8a","work_id":"wrk_45578dda-8dcf-452e-909d-3f4c17ea166c","block_id":"blk_c1a0703b-8905-4da8-bec9-ab5dbd1bb8c7","section_id":"sec_1d17a9bd-cd6a-4506-879b-fbc657caf459","layer":"body","character_id":null,"count":2,"matched_aliases":["SoIC","ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":30,"end":34,"exact":"SoIC","quote":"- TSMCやSamsung Foundryの先端工程\n- SoICやX-Cubeなどの3D積層\n- ハイブリッドボンディング\n- SRAM設計IP\n- MBISTや半導体テスター","quote_start":0,"quote_end":90,"text_sha256":"dff063f76d210e185ab433746efa3947e107ede5f648f136dd5087f29097c86f","block_sha256":"dff063f76d210e185ab433746efa3947e107ede5f648f136dd5087f29097c86f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_44c73f5c-647d-467e-8aa2-527eb6352a8a/#blk_c1a0703b-8905-4da8-bec9-ab5dbd1bb8c7"},{"id":"occ_fbf538e22dec33aa87bd19ee","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_44c73f5c-647d-467e-8aa2-527eb6352a8a","work_id":"wrk_45578dda-8dcf-452e-909d-3f4c17ea166c","block_id":"blk_cc40735c-c2ef-4188-82e0-ac28adfc4330","section_id":"sec_07e25edc-7a88-498a-90d8-24c1e67ec925","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":70,"end":74,"exact":"2.5D","quote":"と、HBM3EではAIアクセラレーターとHBMの間に1000本以上の信号線が必要となり、一般的な基板ではなく、2.5Dパッケージが必要になる。([SemiAnalysis](https://newsletter.semianalysis.com/p/scaling-the-memory-wall-the-rise-a","quote_start":15,"quote_end":174,"text_sha256":"a19948f649642587a84193527163d18b48543bcaee319506452862a660e826fe","block_sha256":"a19948f649642587a84193527163d18b48543bcaee319506452862a660e826fe","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_44c73f5c-647d-467e-8aa2-527eb6352a8a/#blk_cc40735c-c2ef-4188-82e0-ac28adfc4330"},{"id":"occ_11957e6d216400ddfe9aaf00","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_2ecfb62b-f9c0-44ee-a537-a0ba28dc8bd9","section_id":"sec_b1e51e98-9f17-4a07-a857-bed833ac1cf9","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":16,"end":30,"exact":"Hybrid Bonding","quote":"次回は、TSV、マイクロバンプ、Hybrid Bondingなどの物理接続を通して、実際にデータを送受信する**Die-to-Die PHY**を解説する。","quote_start":0,"quote_end":78,"text_sha256":"a0eca158a2327957508367479e1e72177cdb33dd5af20a520f3ca5bd67a22727","block_sha256":"a0eca158a2327957508367479e1e72177cdb33dd5af20a520f3ca5bd67a22727","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_2ecfb62b-f9c0-44ee-a537-a0ba28dc8bd9"},{"id":"occ_bb45e61f5cd37ff0c73eeb94","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_35925231-8aeb-4ac2-b27e-ddd2f48d6727","section_id":"sec_01382f6c-9016-418b-9374-a2e2687a6df3","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":2,"end":16,"exact":"Hybrid Bonding","quote":"> Hybrid Bondingは接合面をつなぎ、TSVはダイの厚みを貫通する","quote_start":0,"quote_end":39,"text_sha256":"645f5cf6d2826cb192f988b5ff4de8b7606b16ef0191351d61f9db7318c3f8f9","block_sha256":"645f5cf6d2826cb192f988b5ff4de8b7606b16ef0191351d61f9db7318c3f8f9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_35925231-8aeb-4ac2-b27e-ddd2f48d6727"},{"id":"occ_5120731ae4e4dc7d743065f8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_3c63980f-4af7-44e6-80da-3a6560e5c81c","section_id":"sec_ffff5754-45d1-46ca-8c8b-170679fda206","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":44,"end":58,"exact":"Hybrid Bonding","quote":"```\nダイ内部回路\n      ↓\nTSV\n      ↓\n銅パッド\n      ↓\nHybrid Bonding\n      ↓\n相手側ダイ\n```","quote_start":0,"quote_end":76,"text_sha256":"c62b87c5029c641132110bade899b2d72a269e779d1eaf065e37a78d0febaa6d","block_sha256":"c62b87c5029c641132110bade899b2d72a269e779d1eaf065e37a78d0febaa6d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_3c63980f-4af7-44e6-80da-3a6560e5c81c"},{"id":"occ_a7160d6ff90831ec36a6d08d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_56256943-fb88-49e6-b17b-b21a884f442b","section_id":"sec_2baa4eaa-bfa8-4d89-86e4-4a24ef76eab0","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":54,"end":68,"exact":"Hybrid Bonding","quote":"```\n演算回路\n   ↓\nDie-to-Die PHY\n   ↓\n接続パッド\n   ↓\nTSV\n   ↓\nHybrid Bonding／マイクロバンプ\n   ↓\n相手側PHY\n```","quote_start":0,"quote_end":92,"text_sha256":"55f4fa7ce4e5b39fb0ae46564890543f7d038fe70db626a1f7b419619ef67374","block_sha256":"55f4fa7ce4e5b39fb0ae46564890543f7d038fe70db626a1f7b419619ef67374","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_56256943-fb88-49e6-b17b-b21a884f442b"},{"id":"occ_9d1afb79cebe0f753fff1f8e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_5bb6839b-84c3-4d89-b8d1-8c57bfd14eb4","section_id":"sec_d4a4c19e-faf9-4efd-8d07-eede4c714206","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":71,"end":85,"exact":"Hybrid Bonding","quote":"    ↓\n      TSV\n        ↓\nダイ下面の接続パッド\n        ↓\nマイクロバンプ／Hybrid Bonding\n        ↓\n下側ダイの回路\n```","quote_start":16,"quote_end":107,"text_sha256":"1ae7311cb76f27f9d3f27ab004d7b9ee8ccc2e57eb56c50b30bb63f1cad75b59","block_sha256":"1ae7311cb76f27f9d3f27ab004d7b9ee8ccc2e57eb56c50b30bb63f1cad75b59","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_5bb6839b-84c3-4d89-b8d1-8c57bfd14eb4"},{"id":"occ_91026e1f41c98d51e338fb4a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_5fdf6c70-da49-478b-9a43-841ca3d2645c","section_id":"sec_da1aa9cd-0844-4dc9-b768-6b4568e8be61","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid 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↑\n下側ダイ回路面\n```","quote_start":0,"quote_end":58,"text_sha256":"e04264a2c1c77a1859d1f2c671e645b4ecf1de3394ceafad078c1519a83abf3c","block_sha256":"e04264a2c1c77a1859d1f2c671e645b4ecf1de3394ceafad078c1519a83abf3c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_5fdf6c70-da49-478b-9a43-841ca3d2645c"},{"id":"occ_1cf43f9e8fb521c4ea570873","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_6a0cf99d-55cb-4a81-a501-25b3aaaded9a","section_id":"sec_d4a4c19e-faf9-4efd-8d07-eede4c714206","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":21,"end":35,"exact":"Hybrid Bonding","quote":"前回は、銅パッドと誘電体を直接接合する**Hybrid Bonding**について解説した。","quote_start":0,"quote_end":46,"text_sha256":"e98a69f98e5edbc022afe6dc575035f4b56ef08df3cb1f466eb4ef5eb492c5c7","block_sha256":"e98a69f98e5edbc022afe6dc575035f4b56ef08df3cb1f466eb4ef5eb492c5c7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_6a0cf99d-55cb-4a81-a501-25b3aaaded9a"},{"id":"occ_9e468c28cbff490ca7cd3c99","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_71a57cc4-0f28-483e-a6e5-c13e154bb575","section_id":"sec_ffff5754-45d1-46ca-8c8b-170679fda206","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":104,"end":118,"exact":"Hybrid Bonding","quote":"を接続 |\n| マイクロバンプ | 2つの部品の境界面 | ダイとダイ、ダイとインターポーザーを接続 |\n| Hybrid Bonding | 2つの部品の境界面 | 銅と誘電体を直接接合 |\n| RDL | ダイ・ウェハー表面 | 接続位置を横方向へ再配置 |\n```","quote_start":49,"quote_end":184,"text_sha256":"e5d870716cae6e048bf257543e213c2935a8653d0897d4f3c6b3177e2e81227c","block_sha256":"e5d870716cae6e048bf257543e213c2935a8653d0897d4f3c6b3177e2e81227c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_71a57cc4-0f28-483e-a6e5-c13e154bb575"},{"id":"occ_bdc3119a4856ae6c595a8852","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_727d6853-bed5-4933-9ecd-05942ef3cf94","section_id":"sec_a8214f17-9f1e-439a-adf5-8379d855bd7a","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingでは必ずTSVが必要なのか","quote_start":0,"quote_end":30,"text_sha256":"e068c98b3599637064b63b05c1271eb449b36406c8f739cb93aa08f254f52a52","block_sha256":"e068c98b3599637064b63b05c1271eb449b36406c8f739cb93aa08f254f52a52","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_727d6853-bed5-4933-9ecd-05942ef3cf94"},{"id":"occ_7d4ab799e3f329c3ec200f23","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_7cb68312-9246-4f54-bbe2-f5b17f1ac4dc","section_id":"sec_2baa4eaa-bfa8-4d89-86e4-4a24ef76eab0","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":18,"end":32,"exact":"Hybrid Bonding","quote":"- TSV：ダイ内部の垂直配線\n- Hybrid Bonding：ダイ境界面の直接接合\n- マイクロバンプ：ダイ境界面の突起接続\n- Die-to-Die PHY：電気信号を送受信する回路\n- UCIe：通信方法を定める規格","quote_start":0,"quote_end":112,"text_sha256":"2040d46f5d9639aa413df237ad95c8882e0f134122c7c418606372f61cf5e6a9","block_sha256":"2040d46f5d9639aa413df237ad95c8882e0f134122c7c418606372f61cf5e6a9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_7cb68312-9246-4f54-bbe2-f5b17f1ac4dc"},{"id":"occ_38f6047151fa089e4a3c2b79","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_ae8cd336-afcd-4a1f-ad7d-592277ed5c64","section_id":"sec_75281026-e867-4724-8859-d47410451135","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":5,"end":19,"exact":"Hybrid Bonding","quote":"前回扱ったHybrid Bondingと同様、TSVでもCMPは配線の平坦性と接続信頼性を左右する工程である。","quote_start":0,"quote_end":55,"text_sha256":"60832ee7de7899502a4a5e4b3bf965e5bedc1f0b96d7b9c7e7617a3ac5b3da30","block_sha256":"60832ee7de7899502a4a5e4b3bf965e5bedc1f0b96d7b9c7e7617a3ac5b3da30","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_ae8cd336-afcd-4a1f-ad7d-592277ed5c64"},{"id":"occ_2e7ee84799cda73f8d258932","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_b5e07b5a-fae6-4ff5-a42a-d2c70b3ec2b4","section_id":"sec_ffff5754-45d1-46ca-8c8b-170679fda206","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":13,"end":27,"exact":"Hybrid Bonding","quote":"TSVは、マイクロバンプやHybrid Bondingの代替技術ではない。","quote_start":0,"quote_end":37,"text_sha256":"58ef322d50712c3ead26735f3f41cc1f15084263f6330ca22c5e5a6eb05afe9f","block_sha256":"58ef322d50712c3ead26735f3f41cc1f15084263f6330ca22c5e5a6eb05afe9f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_b5e07b5a-fae6-4ff5-a42a-d2c70b3ec2b4"},{"id":"occ_973ffcaef07fcc8cc0501e05","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_bc7fede6-febb-4dfa-a97c-1e153908b9c7","section_id":"sec_b1e51e98-9f17-4a07-a857-bed833ac1cf9","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":356,"end":370,"exact":"Hybrid Bonding","quote":"tは、製造工程のどの段階でTSVを形成するかの違いである。\n- TSVはダイ内部の配線であり、マイクロバンプやHybrid Bondingはダイ境界面の接続技術である。\n- HBMでは、TSVとマイクロバンプを組み合わせて複数のDRAMダイを接続する。\n- 銅とシリコンの熱膨張差による応力のため、TSV周辺にKeep-Out Zoneを","quote_start":301,"quote_end":470,"text_sha256":"3a5487509f8506a8bcb5d2989c26124ed5e20113537d484be6d9849f4ecb3eaa","block_sha256":"3a5487509f8506a8bcb5d2989c26124ed5e20113537d484be6d9849f4ecb3eaa","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_bc7fede6-febb-4dfa-a97c-1e153908b9c7"},{"id":"occ_3f0a49d28a3a81e46f6d104a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_ca42fa25-1b91-4547-9b42-3ed4c6939250","section_id":"sec_fa6cd1a5-1fed-4c55-a44a-122213f4ad34","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":34,"end":48,"exact":"Hybrid Bonding","quote":"- 裏面絶縁膜\n- 再配線層\n- 銅パッド\n- マイクロバンプ\n- Hybrid Bonding用パッド","quote_start":0,"quote_end":52,"text_sha256":"d4c7d117e9652aa372a62218792f86926cb9e468210b69006ef421338b44a119","block_sha256":"d4c7d117e9652aa372a62218792f86926cb9e468210b69006ef421338b44a119","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_ca42fa25-1b91-4547-9b42-3ed4c6939250"},{"id":"occ_c070069711a343b38224d9ca","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_d4d69cd4-e31b-4e7d-ba0c-2a9bce57abd9","section_id":"sec_170af824-89fa-4d6c-b024-bfa9c293ba25","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"**レチクル限界、Die-to-Die PHY、Hybrid Bonding、TSVから、3D V-Cache、Foveros Direct、SoIC**","quote_start":0,"quote_end":77,"text_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","block_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_d4d69cd4-e31b-4e7d-ba0c-2a9bce57abd9"},{"id":"occ_5cb862ca398c8ef732ed2069","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4802c0fb-3eae-453b-96d2-1237f0009713","work_id":"wrk_02b6e758-a5fe-4b66-a620-6c322b16db7e","block_id":"blk_eca084d0-6f6e-4cb2-8db1-668a191bc76a","section_id":"sec_d4a4c19e-faf9-4efd-8d07-eede4c714206","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingを使えば、上下のダイを非常に細かなピッチで接続できる。しかし、接合面へ到達した信号を、ダイの反対側へ運ぶには別の配線が必要になることがある。","quote_start":0,"quote_end":84,"text_sha256":"4af3df8c9bb4364f414dc3a1faa4e9783da2217e820067ac96a9ff0f2ea45be1","block_sha256":"4af3df8c9bb4364f414dc3a1faa4e9783da2217e820067ac96a9ff0f2ea45be1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4802c0fb-3eae-453b-96d2-1237f0009713/#blk_eca084d0-6f6e-4cb2-8db1-668a191bc76a"},{"id":"occ_aadffde05a35d11737662774","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_037e5ac4-1f20-4565-b8b5-60978d558ab7","section_id":"sec_3238d8bf-1b25-43f5-b51f-d5c09df28207","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":144,"end":149,"exact":"CoWoS","quote":"L Memory / AI SSD\n────────────────\nシリコンインターポーザ / RDL / CoWoS\n────────────────\n光I/O層\n  ├─ EIC\n  ├─ PIC\n  ├─ レーザー\n  └─ ファイバーアタッチ\n────────────────\nABF / ガラスコア / 低損","quote_start":89,"quote_end":249,"text_sha256":"2093fd68f17b5e3586ea66e1a987a025fd86d38f51d5e0b283fd9b09d57836d9","block_sha256":"2093fd68f17b5e3586ea66e1a987a025fd86d38f51d5e0b283fd9b09d57836d9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_037e5ac4-1f20-4565-b8b5-60978d558ab7"},{"id":"occ_8460b7c7813c2d4ad27c1cad","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_2c7ff5ec-6766-4fac-9d93-c25ec419fb60","section_id":"sec_9dd8cd28-26e8-4757-814f-cc7bd673fc71","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":193,"end":200,"exact":"先端パッケージ","quote":"して、演算器のすぐ横で働く。  \nPICは光の配線を作り、EICはそれを電気信号とつなぎ、COUPEはそれらを先端パッケージとして統合する。","quote_start":138,"quote_end":208,"text_sha256":"2813576e0fc934781a50a725b9e9fa29fa6eb03e07e930f6c29fadadd59f03d4","block_sha256":"2813576e0fc934781a50a725b9e9fa29fa6eb03e07e930f6c29fadadd59f03d4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_2c7ff5ec-6766-4fac-9d93-c25ec419fb60"},{"id":"occ_12ff846341bf12450297c5de","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_2d7cd1b5-dca5-4c5b-956f-5261b83ea815","section_id":"sec_e1e4cc90-c2f6-4a25-a650-c8c9e057cabf","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":39,"end":46,"exact":"先端パッケージ","quote":"COUPEの役割は、光I/Oを「個別企業の特殊実装」から「標準化・共通化された先端パッケージ部品」に近づけることだと見られる。","quote_start":0,"quote_end":63,"text_sha256":"81b355d70af7d57f2e161c7d6410e90a5f090e7104d7f5974602caef1d1e6110","block_sha256":"81b355d70af7d57f2e161c7d6410e90a5f090e7104d7f5974602caef1d1e6110","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_2d7cd1b5-dca5-4c5b-956f-5261b83ea815"},{"id":"occ_58c0b68649159ee3cb80d1af","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_34be6ce2-dd4b-4897-bda4-d76bf27f9b46","section_id":"sec_c4fe696c-3cab-4c2f-91d6-2e95af5c2563","layer":"body","character_id":null,"count":1,"matched_aliases":["ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":49,"end":61,"exact":"ハイブリッドボンディング","quote":"高性能CPUやGPUでは、ワイヤボンディングではなく、フリップチップ、Cuピラー、マイクロバンプ、ハイブリッドボンディングへ向かう。ここから先は、前工程と後工程の境界領域である。","quote_start":0,"quote_end":89,"text_sha256":"4ae79804af587b819d1d2aaca1777e160fbac4678abd84a336a1223f2585fe02","block_sha256":"4ae79804af587b819d1d2aaca1777e160fbac4678abd84a336a1223f2585fe02","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_34be6ce2-dd4b-4897-bda4-d76bf27f9b46"},{"id":"occ_95cae07cd8a88195366fe139","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_69018c5d-c844-48e6-91b9-4503eeefd713","section_id":"sec_a064f138-129b-4086-9a1e-17c520d4f9d4","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":44,"end":48,"exact":"2.5D","quote":"TSMCはCOUPEについて、業界のフォトニックエンジン構造、つまりモノリシック、2D、2.5D、3Dの強みと弱みを整理した上で、異なる要求を同一統合プラットフォームへまとめるCompact Universal Photonic Engineとして提案している。また、COUPEはEIC-PIC統","quote_start":0,"quote_end":148,"text_sha256":"72162ee32c888741cc3593f04dcdf0fcc4d58cf24b1660a1414c761cbefd4216","block_sha256":"72162ee32c888741cc3593f04dcdf0fcc4d58cf24b1660a1414c761cbefd4216","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_69018c5d-c844-48e6-91b9-4503eeefd713"},{"id":"occ_df28c74e5bdb3ce8cd4ba0a2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_78ca8698-b8e8-4c16-9897-620245865c14","section_id":"sec_db109102-2a60-4efa-81f5-5f380848d0d6","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":35,"end":39,"exact":"EMIB","quote":"## 4-2. シリコンインターポーザ / RDLインターポーザ / EMIB","quote_start":0,"quote_end":39,"text_sha256":"7fb26cccfaa249fa74ca97bd1e480b62b83a91f82cd38ec70b08aa0b4efc1f2d","block_sha256":"7fb26cccfaa249fa74ca97bd1e480b62b83a91f82cd38ec70b08aa0b4efc1f2d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_78ca8698-b8e8-4c16-9897-620245865c14"},{"id":"occ_dfa881f67d93abe9c475febb","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_7eb18c36-f818-4aa5-a965-4329dc8896d8","section_id":"sec_db109102-2a60-4efa-81f5-5f380848d0d6","layer":"body","character_id":null,"count":6,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":5,"end":10,"exact":"CoWoS","quote":"TSMCのCoWoS-Sはシリコンインターポーザ型、CoWoS-RはRDLインターポーザ型、CoWoS-LはRDLと局所的シリコン接続を組み合わせる方式として理解できる。TSMCはCoWoS-Sについて、最大3.3倍レチ","quote_start":0,"quote_end":110,"text_sha256":"831de3d772a31247033f1ef94b8d709438a9554c496c9558b6589bf868a0f00a","block_sha256":"831de3d772a31247033f1ef94b8d709438a9554c496c9558b6589bf868a0f00a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_7eb18c36-f818-4aa5-a965-4329dc8896d8"},{"id":"occ_35c374590a09bc45e3947d99","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_aa5f83f2-f187-4497-9eee-8d77c9e72c48","section_id":"sec_23e41c07-8a42-46b0-a7bc-d8f2c7bb11af","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":28,"end":33,"exact":"CoWoS","quote":"RDLは、ファンアウトパッケージ、RDLインターポーザ、CoWoS-R、CoWoS-Lなどで重要になる。  \n材料は、銅配線、ポリイミド、PBO、エポキシ系絶縁膜、Ti/TiW、Ni、Auなどである。","quote_start":0,"quote_end":100,"text_sha256":"38fc94d85ef05a8344b935306c622d226df97161f9dc0f3e5c7e05c15cdcb637","block_sha256":"38fc94d85ef05a8344b935306c622d226df97161f9dc0f3e5c7e05c15cdcb637","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_aa5f83f2-f187-4497-9eee-8d77c9e72c48"},{"id":"occ_5b22e3b0f6c8decc091e621b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_bcd7a314-35df-4e50-9722-c3112f17ddb8","section_id":"sec_e1e4cc90-c2f6-4a25-a650-c8c9e057cabf","layer":"code","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":71,"end":76,"exact":"CoWoS","quote":"IC/EIC統合を共通化する\n・ASIC設計者が光I/Oを使いやすくする\n・UCIeなどD2D接続とつなぐ\n・CoWoS/SoIC/RDLと組み合わせる\n・光I/Oを“チップレット化”する\n```","quote_start":16,"quote_end":114,"text_sha256":"335c7eb280f89dbadfbb33e0549cda2aa41202e2e1704e4d527b3149dbd978fe","block_sha256":"335c7eb280f89dbadfbb33e0549cda2aa41202e2e1704e4d527b3149dbd978fe","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_bcd7a314-35df-4e50-9722-c3112f17ddb8"},{"id":"occ_739a493d97725af41df20ffd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_c063ebda-afd6-4b2f-af65-8a5c9565004f","section_id":"sec_9dd8cd28-26e8-4757-814f-cc7bd673fc71","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":43,"end":48,"exact":"CoWoS","quote":"```\n昔：\nトランジスタを微細化すれば性能が伸びた\n\n今：\nGPU + HBM + CoWoS + ABF + 冷却 + テストで性能が決まる\n\n次：\nGPU + HBM + HBF/XL-FLASH + COUPE/CPO + 光I/O + メモリプールで性能が決まる\n```","quote_start":0,"quote_end":140,"text_sha256":"a6be43732e3869f37efd8ae82e10834c8bd7fe242b271c3efe5b3ba3b8748bb8","block_sha256":"a6be43732e3869f37efd8ae82e10834c8bd7fe242b271c3efe5b3ba3b8748bb8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_c063ebda-afd6-4b2f-af65-8a5c9565004f"},{"id":"occ_60b02cd7d1c6433dbdef0e03","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_cc8d32ec-ec9c-4412-8ba3-c905070421da","section_id":"sec_2769c995-b6a1-4e12-aeae-007d98194234","layer":"code","character_id":null,"count":2,"matched_aliases":["EMIB","ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":98,"end":110,"exact":"ハイブリッドボンディング","quote":"U / CPU / AI ASIC / HBM\n────────────────────\nマイクロバンプ / ハイブリッドボンディング / RDL\n────────────────────\nシリコンインターポーザ / RDLインターポーザ / EMIB\n────────────────────\nABF / FC-BGAパッケージ基板","quote_start":43,"quote_end":210,"text_sha256":"2e2fa5628aec1ff04858f04670cf80af0017b14a0e1eac4f02b27a3edc13ed2e","block_sha256":"2e2fa5628aec1ff04858f04670cf80af0017b14a0e1eac4f02b27a3edc13ed2e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_cc8d32ec-ec9c-4412-8ba3-c905070421da"},{"id":"occ_4df0ee251b10b7c2f2ca2f96","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_cf607e78-a853-4202-8c3f-4275227ccd2f","section_id":"sec_d8c3fb19-0992-4ebb-a4ba-317e2653833d","layer":"code","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":182,"end":187,"exact":"CoWoS","quote":"-FLASH / CXL Memory / AI SSD\n────────────────\nパッケージ統合層\nCoWoS / SoIC / RDL / COUPE\n────────────────\n光I/O層\nPIC / EIC / CPO / ファイバー\n────────────────\nラック接続層\nNVLink ","quote_start":127,"quote_end":287,"text_sha256":"4304772e0479f88e67c3e75a9d0edfe7fabbad6d15569f762350fea21311c287","block_sha256":"4304772e0479f88e67c3e75a9d0edfe7fabbad6d15569f762350fea21311c287","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_cf607e78-a853-4202-8c3f-4275227ccd2f"},{"id":"occ_3598c7ddd5e2f081057743f3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_dc591e8b-5519-4506-987d-34056d4bbd5a","section_id":"sec_289022db-dc16-43ad-82a1-8dd163dcc858","layer":"body","character_id":null,"count":5,"matched_aliases":["CoWoS","ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":52,"end":57,"exact":"CoWoS","quote":"一方、後工程は、かつては「チップを包む工程」と見られていた。しかしAI時代には違う。GPUとHBMを結ぶCoWoS、シリコンインターポーザ、RDL、ABF基板、マイクロバンプ、ハイブリッドボンディング、MLCC、テストは、もはや性能そのものを決める。TSMCのCoWoS-Sは大面積シリコンインターポーザ上でロジッ","quote_start":0,"quote_end":157,"text_sha256":"19e42ad07fc24b84be811763bb8cf89fe81824b4b93a180e3f777706c1e4237d","block_sha256":"19e42ad07fc24b84be811763bb8cf89fe81824b4b93a180e3f777706c1e4237d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_dc591e8b-5519-4506-987d-34056d4bbd5a"},{"id":"occ_18d160ec2d49613178347a16","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955","work_id":"wrk_cb25df93-468d-4abf-9350-ba1bcf0d3b49","block_id":"blk_e1ec01c9-2e60-40da-b81e-ee848e878228","section_id":"sec_e1e4cc90-c2f6-4a25-a650-c8c9e057cabf","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":16,"end":23,"exact":"先端パッケージ","quote":"COUPEは、これらをTSMCの先端パッケージエコシステムへ引き寄せる可能性がある。","quote_start":0,"quote_end":42,"text_sha256":"46d860d55c3d9e6861a616aff07f8189b9d3d3b57369e5fb74a66838c6434008","block_sha256":"46d860d55c3d9e6861a616aff07f8189b9d3d3b57369e5fb74a66838c6434008","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_49a8bdbd-8ee8-4c28-8af4-da1787c47955/#blk_e1ec01c9-2e60-40da-b81e-ee848e878228"},{"id":"occ_060d5ff13e8fe2f888d59a2d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":null,"section_id":null,"layer":"title","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"title","start":31,"end":45,"exact":"Hybrid Bonding","quote":"HBMの「30%のウェハーで13%のビット」の先にあるもの――Hybrid Bonding・3D DRAM・XBMへ","quote_start":0,"quote_end":58,"text_sha256":"f02e32bc17ad1c9229b4bdd0d76b0f789ddaccded44486efe0ba96613e55ca91","block_sha256":null,"offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/"},{"id":"occ_5e21129d3226b167aed6d3e9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_1340c314-3267-4dab-91b9-1fcba0a6f281","section_id":"sec_9c63fb87-bfbc-490f-b62a-a26ebfe8a2b7","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":14,"end":28,"exact":"Hybrid Bonding","quote":"だから16Hi時代になるほどHybrid Bondingの重要性が高まります。","quote_start":0,"quote_end":39,"text_sha256":"29afb8efc05502a3717268855a23af68272075f738d194ea528d0dfb89788c31","block_sha256":"29afb8efc05502a3717268855a23af68272075f738d194ea528d0dfb89788c31","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_1340c314-3267-4dab-91b9-1fcba0a6f281"},{"id":"occ_36e089716fab1ebe45226135","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_34faabf6-0069-413d-957c-ba325613c84e","section_id":"sec_acfbf346-6845-4c6f-a687-69804c004a96","layer":"body","character_id":null,"count":1,"matched_aliases":["hybrid bonding"],"evidence":{"text_basis":"markdown","start":77,"end":91,"exact":"hybrid 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bondingの双方に対応しています。","quote_start":22,"quote_end":103,"text_sha256":"c9b33d944407de37b8ef18c0d6989cad38bc729da1ec831fc012f803ba886f44","block_sha256":"c9b33d944407de37b8ef18c0d6989cad38bc729da1ec831fc012f803ba886f44","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_34faabf6-0069-413d-957c-ba325613c84e"},{"id":"occ_6329a35e9c4de606417e71d0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_44adb11d-5669-4844-9525-e470d1839b81","section_id":"sec_0547eb1b-868e-454b-bdc0-5fea010ca6da","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICはwafer-level 3D stacking 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27．TSMCは「CoWoSが減るからマイナス」ではない","quote_start":0,"quote_end":31,"text_sha256":"9339136842d4b504cdac325d73a91448e4a68303e5fc9e9cd5e6f0ddea368d34","block_sha256":"9339136842d4b504cdac325d73a91448e4a68303e5fc9e9cd5e6f0ddea368d34","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_6e41a43d-c5e3-484d-9e6d-14faf21a6ab3"},{"id":"occ_88ed31b9d51fbd9bcf618424","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_72dccbdc-90dd-490a-979e-c54d8e6429cc","section_id":"sec_11c69f1d-6eeb-4cb9-95f1-f256ef48cf40","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingでは表面のわずかなparticleや凹凸がbond voidにつながるので、Cleaningの価値そのものが高くなります。","quote_start":0,"quote_end":75,"text_sha256":"ee954783734dba65113697a255f3639276981d8fc90244c49621fcc155c3c77a","block_sha256":"ee954783734dba65113697a255f3639276981d8fc90244c49621fcc155c3c77a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_72dccbdc-90dd-490a-979e-c54d8e6429cc"},{"id":"occ_8a444df7ece92f435d777610","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_8d4d2fac-8d5d-4bba-adbf-032cc59992ae","section_id":"sec_40efe366-86db-4e89-8b13-ed044755c8e6","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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ZAM型multi-wafer","quote_start":0,"quote_end":67,"text_sha256":"efbcdf985821ddcd3d6664b0b058b3b426fd39283251677985bcbfa0a1e3946c","block_sha256":"efbcdf985821ddcd3d6664b0b058b3b426fd39283251677985bcbfa0a1e3946c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_8d4d2fac-8d5d-4bba-adbf-032cc59992ae"},{"id":"occ_a9d2a97099708f67b25b0f4a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_9ff776e0-972b-4eb5-862c-e6d37733d974","section_id":"sec_0547eb1b-868e-454b-bdc0-5fea010ca6da","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":6,"end":11,"exact":"CoWoS","quote":"その意味ではCoWoS-S型のsilicon interposer contentには逆風となり得ます。","quote_start":0,"quote_end":52,"text_sha256":"b22fd9fe91962330f5450ce3d5f3961e899df114ab4293b052b388c18dc83d4d","block_sha256":"b22fd9fe91962330f5450ce3d5f3961e899df114ab4293b052b388c18dc83d4d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_9ff776e0-972b-4eb5-862c-e6d37733d974"},{"id":"occ_f18713adba3d992f5ecafe6f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_a6f392e8-4826-4445-ab8c-095aa9ef160e","section_id":"sec_dc78362c-4e99-49ed-b9b6-b6f7eb3726cb","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"つまりHybrid Bondingは直接DRAMセルを増やす技術ではありません。","quote_start":0,"quote_end":40,"text_sha256":"ae564fb60e1bdbefd3098f669e826532d524d096dcd4c2f722b2e67b5a0d7dd5","block_sha256":"ae564fb60e1bdbefd3098f669e826532d524d096dcd4c2f722b2e67b5a0d7dd5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_a6f392e8-4826-4445-ab8c-095aa9ef160e"},{"id":"occ_03b82c412ebc0950a115a01b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_bd004386-6827-4e28-8058-623068052190","section_id":"sec_dc78362c-4e99-49ed-b9b6-b6f7eb3726cb","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingでは、はんだbumpを介さず、","quote_start":0,"quote_end":29,"text_sha256":"4d51c7c32dfbb75376fab589a98d0e4cdb963547726309c3f5cd418e64cd8400","block_sha256":"4d51c7c32dfbb75376fab589a98d0e4cdb963547726309c3f5cd418e64cd8400","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_bd004386-6827-4e28-8058-623068052190"},{"id":"occ_24ccbf8ce8e6d5665727701f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_c6f4c48a-0dfa-49a6-b3c3-c97751582302","section_id":"sec_1141e9b2-dfb3-45c5-a869-6c49d5149afe","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":18,"end":32,"exact":"Hybrid Bonding","quote":"Applied MaterialsはHybrid Bondingについて、W2WをCIS/NANDで利用し、DRAMにも適用可能な技術として位置付けています。さらにDie-to-WaferではBesiと共同でKinex integrated hybrid bond","quote_start":0,"quote_end":132,"text_sha256":"5a53a8021e2e4d104bc819ac62da90a48cbd66ec8f65ec3d874a72aed11ab254","block_sha256":"5a53a8021e2e4d104bc819ac62da90a48cbd66ec8f65ec3d874a72aed11ab254","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_c6f4c48a-0dfa-49a6-b3c3-c97751582302"},{"id":"occ_7e5f030bb9db921de13fd288","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_caac3d80-1cf3-4249-bca8-cb4861ba450a","section_id":"sec_dc78362c-4e99-49ed-b9b6-b6f7eb3726cb","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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(KLA)","quote_start":0,"quote_end":96,"text_sha256":"b0d6f60de917c3254bf2d344d7e60d6e1494d64e44fd07dadbc7fc51fc10ee7e","block_sha256":"b0d6f60de917c3254bf2d344d7e60d6e1494d64e44fd07dadbc7fc51fc10ee7e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_caac3d80-1cf3-4249-bca8-cb4861ba450a"},{"id":"occ_2ce2b32e6ec64f9320607e9c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_cb0ca56d-aef6-4185-8c84-97b5f8036fa0","section_id":"sec_89410003-bfd4-4499-9f3e-5fb954800b92","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":33,"end":47,"exact":"Hybrid Bonding","quote":"# HBMの「30%のウェハーで13%のビット」の先にあるもの――Hybrid Bonding・3D DRAM・XBMへ","quote_start":0,"quote_end":60,"text_sha256":"8df8e656b464ea952f7939424af60c155be44ee8c52c41c5d7ff34999cf81704","block_sha256":"8df8e656b464ea952f7939424af60c155be44ee8c52c41c5d7ff34999cf81704","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_cb0ca56d-aef6-4185-8c84-97b5f8036fa0"},{"id":"occ_89653a32f3c2024a7775f805","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_d82cec4f-524c-4b04-a772-63797221584d","section_id":"sec_0547eb1b-868e-454b-bdc0-5fea010ca6da","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS↓SoIC↓Memory-on-Logic","quote_start":0,"quote_end":26,"text_sha256":"9c6feffb643db721b95e04e923e85baab3d88f88b69f3f3a272f6719a31aeb8f","block_sha256":"9c6feffb643db721b95e04e923e85baab3d88f88b69f3f3a272f6719a31aeb8f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_d82cec4f-524c-4b04-a772-63797221584d"},{"id":"occ_7cecfca74a1db9d5c10d75c8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_d941abb4-0e8b-48c7-bbb6-652ca21c8bc8","section_id":"sec_b9633fd9-6f97-4e7d-95b7-1bc8f69368d8","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":104,"end":118,"exact":"Hybrid Bonding","quote":"| 1β/1γ、Cell縮小、Peripheral改善 | bit/waferを増やす |\n| 垂直改善 | Hybrid Bonding、W2W、3D DRAM | 接続Pitchと積層密度を上げる |\n| 構造改善 | Logic Base、XBM、PIM | MemoryとLogicの境界を再設計する |","quote_start":49,"quote_end":205,"text_sha256":"0009d503ac2d55b6e79a5222c12db5a7f29cd82d0008b4580cda21fcb0884fc3","block_sha256":"0009d503ac2d55b6e79a5222c12db5a7f29cd82d0008b4580cda21fcb0884fc3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_d941abb4-0e8b-48c7-bbb6-652ca21c8bc8"},{"id":"occ_a462270b98915615ec5c02c4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_dbfcb08b-7abc-45ff-b076-e23f9a1856b3","section_id":"sec_0547eb1b-868e-454b-bdc0-5fea010ca6da","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":9,"end":13,"exact":"SoIC","quote":"しかしTSMCにはSoICがあります。","quote_start":0,"quote_end":19,"text_sha256":"a0d8279e03b56fa08f511ff6c7b09efef3e3ca49642497cf386fe76c78271cd8","block_sha256":"a0d8279e03b56fa08f511ff6c7b09efef3e3ca49642497cf386fe76c78271cd8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_dbfcb08b-7abc-45ff-b076-e23f9a1856b3"},{"id":"occ_859f0ecaf99f71c55d81f600","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_e54c9017-6cfe-4edb-94aa-a54b229f0d13","section_id":"sec_dc78362c-4e99-49ed-b9b6-b6f7eb3726cb","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Compute","quote_start":0,"quote_end":59,"text_sha256":"42739a7512fb48696c074ed05a296478313f24a8ec219ff494aafe9b7c30190d","block_sha256":"42739a7512fb48696c074ed05a296478313f24a8ec219ff494aafe9b7c30190d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_f10d56dc-8d13-4efa-a8fd-066f9a6d4c86"},{"id":"occ_4ef1f478d310f929987596c4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4b279499-0bae-4004-81f9-2ca2bb999ac5","work_id":"wrk_d22e5e28-8b9c-42fc-8499-924270d5334f","block_id":"blk_f2e1e587-edcb-4273-aae1-145e595a13e5","section_id":"sec_cdb1340b-85f0-443d-8ba8-594501a221b2","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":36,"end":50,"exact":"Hybrid Bonding","quote":"KLAはbonded/thinned/warped wafer、TSV、Hybrid Bondingなどを対象としたinspection/metrologyを展開しています。 (KLA)","quote_start":0,"quote_end":93,"text_sha256":"31446639e6af2eb8b04874c5dae3dc4fe4a655c35fbe6a781551b7f09e6bd821","block_sha256":"31446639e6af2eb8b04874c5dae3dc4fe4a655c35fbe6a781551b7f09e6bd821","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4b279499-0bae-4004-81f9-2ca2bb999ac5/#blk_f2e1e587-edcb-4273-aae1-145e595a13e5"},{"id":"occ_c5966d19bcaf7f8b2cdffec5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4eb110b8-6300-4d37-befb-7de1200dd0be","work_id":"wrk_34d11714-0800-4643-88ea-3e7aabfd2897","block_id":"blk_a4a66a27-3f17-4196-bc81-7fa5cdd9f9a2","section_id":"sec_754e017b-fb31-47a9-b9a9-cfe3371063f7","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":112,"end":119,"exact":"先端パッケージ","quote":"上はさすがに無理だ」という上限を付けるオプション価値として効いている  \n  \nしかし、彼らも同じ HBM と先端パッケージに依存している以上、真に「安い計算」を実現するには、メモリとパッケージのサプライチェーンを含めた全体のボトルネック解消が必要になる","quote_start":57,"quote_end":184,"text_sha256":"ede677445a5db1c629d0808d3e2249acaa1cf709d8010ac815ebdbb84e25240b","block_sha256":"ede677445a5db1c629d0808d3e2249acaa1cf709d8010ac815ebdbb84e25240b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4eb110b8-6300-4d37-befb-7de1200dd0be/#blk_a4a66a27-3f17-4196-bc81-7fa5cdd9f9a2"},{"id":"occ_e3b15e659fd51a7ca135e254","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_4eb110b8-6300-4d37-befb-7de1200dd0be","work_id":"wrk_34d11714-0800-4643-88ea-3e7aabfd2897","block_id":"blk_bd96ba14-9b85-4519-836a-a3b13b09cf1d","section_id":"sec_754e017b-fb31-47a9-b9a9-cfe3371063f7","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS","EMIB","SoIC"],"evidence":{"text_basis":"markdown","start":33,"end":38,"exact":"CoWoS","quote":"特にHBMメモリは逼迫している、TSMCの製造能力にも限界がある、CoWoS/SoICのCoWo-Lは殆どNVIDIAが抑えている、Googleはintel EMIBなどの別ルートを模索している段階だ","quote_start":0,"quote_end":100,"text_sha256":"63bddf25f8262d3fcac662f96634a7ecc97560bfee9a2c6a76f3e21875fb6755","block_sha256":"63bddf25f8262d3fcac662f96634a7ecc97560bfee9a2c6a76f3e21875fb6755","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_4eb110b8-6300-4d37-befb-7de1200dd0be/#blk_bd96ba14-9b85-4519-836a-a3b13b09cf1d"},{"id":"occ_f7e7ee948e14002b6e9a4b74","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_0af81243-a1d1-4585-b5b6-32da3a93dc81","section_id":"sec_3ac4e9a2-e8ce-49e4-b594-a6ef115b2a42","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":11,"end":16,"exact":"CoWoS","quote":"```\n| 項目 | CoWoS | CoPoS |\n| 製造単位 | 300mm級ウェハ | 310×310mm、510×515mm、600×600mm級パネル |\n| 強み | 高密度・高精度・成熟 | 大面積・取り数・コスト効","quote_start":0,"quote_end":116,"text_sha256":"8328feb29ef1ebaa9b9511b6794be0609e0c71699eca2be1efe9fcb1c5a26b8b","block_sha256":"8328feb29ef1ebaa9b9511b6794be0609e0c71699eca2be1efe9fcb1c5a26b8b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_0af81243-a1d1-4585-b5b6-32da3a93dc81"},{"id":"occ_0437faf054f0ea9b6af60d14","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_1dfe7323-d8ac-4a7c-91a8-cf62de59ab7b","section_id":"sec_1d9b902c-75d7-4448-bbe3-73461573b9d5","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":20,"end":25,"exact":"CoWoS","quote":"この流れの中で重要になるのが、TSMCのCoWoS、その次の選択肢であるCoPoS、そしてそれを支えるガラスコア基板とABFです。","quote_start":0,"quote_end":65,"text_sha256":"5628e44fd4c2c39b7db6d7904825d585be2d6ee0f384bb65c95c7292853984a8","block_sha256":"5628e44fd4c2c39b7db6d7904825d585be2d6ee0f384bb65c95c7292853984a8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_1dfe7323-d8ac-4a7c-91a8-cf62de59ab7b"},{"id":"occ_edfb6e9df503ccde864775a3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_2b929a26-e7e1-410b-84a0-016b6e858e98","section_id":"sec_96629702-804b-48db-be0a-984ccc470179","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":110,"end":117,"exact":"先端パッケージ","quote":" FormFactor、日本マイクロニクス、日本電子材料のプローブカード\n- KLA、Onto、Camtekの先端パッケージ検査","quote_start":55,"quote_end":119,"text_sha256":"75efeae7a88a2fa86a99b2d843b59d6d79d3fe67a4c7f61a4e998bc5d9f60d82","block_sha256":"75efeae7a88a2fa86a99b2d843b59d6d79d3fe67a4c7f61a4e998bc5d9f60d82","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_2b929a26-e7e1-410b-84a0-016b6e858e98"},{"id":"occ_69b99206bb47185db3c7437e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_2dd892f6-a3fe-4a99-bd33-26e1b44a82d5","section_id":"sec_b06184ed-1027-4365-9f91-76da9e8254bc","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":12,"end":17,"exact":"CoWoS","quote":"そのため、CoPoSは「CoWoSの完全代替」ではなく、2030年前後に超大型AIパッケージの一部で使われる可能性のある補完技術と見るべきです。","quote_start":0,"quote_end":72,"text_sha256":"7d98b7c8cd80305d5522b75563a5e7e2ca91a5da42a76c13ae71271010a19c54","block_sha256":"7d98b7c8cd80305d5522b75563a5e7e2ca91a5da42a76c13ae71271010a19c54","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_2dd892f6-a3fe-4a99-bd33-26e1b44a82d5"},{"id":"occ_1a2b4683c73f9004e7f9bd26","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_310e90bb-8ba4-4a8e-aa75-f0bdfd72c590","section_id":"sec_3654a8b2-246d-4705-9c62-3dca7a906684","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":55,"end":60,"exact":"CoWoS","quote":"主な公開根拠として、TSMCのCoPoSは2026年パイロット、2029〜2030年頃の商用化候補と報じられ、CoWoSを直ちに置き換えるものではなく補完技術とされています。イビデンはAI向けICパッケージ基板で5000億円投資、CY30以降に130×130mm超・14-X-14・Glass Coreを示しています。味","quote_start":0,"quote_end":160,"text_sha256":"49d11a9068c4673015ed1934ef6577cf5fb9e74abbb83f450a96aafaeaa21c52","block_sha256":"49d11a9068c4673015ed1934ef6577cf5fb9e74abbb83f450a96aafaeaa21c52","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_310e90bb-8ba4-4a8e-aa75-f0bdfd72c590"},{"id":"occ_1be609f1f7e249e82969e381","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_3625decf-b2f3-4371-8c31-23b5f74241df","section_id":"sec_1d9b902c-75d7-4448-bbe3-73461573b9d5","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":16,"end":21,"exact":"CoWoS","quote":"最初に結論を言えば、CoPoSはCoWoSをすぐ置き換える技術ではありません。むしろ、CoWoSが大型化していく中で、さらに先の超大型AIパッケージを作るための補完技術です。そして、ガラスコア基板はCoPoSだけでなく、CoWoS大型化の限界","quote_start":0,"quote_end":121,"text_sha256":"958ad583bcc721c0c83c043debf721466a7f5b95525fcd66c2166e13f2a97eef","block_sha256":"958ad583bcc721c0c83c043debf721466a7f5b95525fcd66c2166e13f2a97eef","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_3625decf-b2f3-4371-8c31-23b5f74241df"},{"id":"occ_3630dcdd0600b15c25b85b1f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_3ff03c74-4df2-48d1-befd-7167a509a144","section_id":"sec_b06184ed-1027-4365-9f91-76da9e8254bc","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":8,"end":13,"exact":"CoWoS","quote":"現在の主流であるCoWoSは、**Chip-on-Wafer-on-Substrate**です。つまり、チップをウェハ上で組み立て、それを基板に載せる技術です。一方、CoPoSでは、丸いウェハではなく、四角い大型パネルを使いま","quote_start":0,"quote_end":113,"text_sha256":"3d6d41cc9f897ec428edec75cb1501b70fc1f31cc6757979cb4cf95cf06d55a3","block_sha256":"3d6d41cc9f897ec428edec75cb1501b70fc1f31cc6757979cb4cf95cf06d55a3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_3ff03c74-4df2-48d1-befd-7167a509a144"},{"id":"occ_00ae648562fc13ee346a8c3c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_41f116d2-daee-4ebc-9a62-142554371e11","section_id":"sec_670e1c23-d03c-4677-969e-dd382989ace6","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":19,"end":24,"exact":"CoWoS","quote":"CoPoS全体のインテグレーターです。CoWoS、SoIC、CoPoS、ガラスコア、RDL、顧客設計を統合し、NVIDIAや大型ASIC顧客に提供します。","quote_start":0,"quote_end":77,"text_sha256":"792b7a227ca094c9cd51ffe177a951a8eb167e40c7537a13f0bf1304cec62bca","block_sha256":"792b7a227ca094c9cd51ffe177a951a8eb167e40c7537a13f0bf1304cec62bca","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_41f116d2-daee-4ebc-9a62-142554371e11"},{"id":"occ_2fbe0e0b4a0499dd9276e03b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_57d363e8-9260-4114-9b11-4a06a0be7636","section_id":"sec_3ac4e9a2-e8ce-49e4-b594-a6ef115b2a42","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":11,"end":16,"exact":"CoWoS","quote":"CoPoSが普及するとCoWoSの一部は相殺されます。特に、超大型AIパッケージの一部は、CoWoSではなくCoPoS側に移る可能性があります。","quote_start":0,"quote_end":72,"text_sha256":"fc764076d76b7d1a02062df14d389289938cba7e7eab60e07c9b52a7cd29864a","block_sha256":"fc764076d76b7d1a02062df14d389289938cba7e7eab60e07c9b52a7cd29864a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_57d363e8-9260-4114-9b11-4a06a0be7636"},{"id":"occ_025dde4d1966a69b69a73c5b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_6493db57-a99d-469a-a539-53f8039cc1e2","section_id":"sec_8ee46d70-0976-4c9d-a162-90e7cc533414","layer":"body","character_id":null,"count":1,"matched_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\\2. CoWoSとCoPoSの違い","quote_start":0,"quote_end":21,"text_sha256":"b58f0934e94eae556daf308eee439af31f3d6c4ce14fc44bd71fa3577f38b595","block_sha256":"b58f0934e94eae556daf308eee439af31f3d6c4ce14fc44bd71fa3577f38b595","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_880c02e6-8be6-40a6-b50a-8f1705cb02a1"},{"id":"occ_76f39bfed5a4a1c39e847357","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_8f509a42-6de0-438f-b313-ec9b278518ee","section_id":"sec_8ee46d70-0976-4c9d-a162-90e7cc533414","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":14,"end":19,"exact":"CoWoS","quote":"ただし、相殺されるのは、主にCoWoSの「名称上の売上」の一部です。TSMC全体の先端パッケージ売上では、むしろネットプラスになる可能性が高いです。","quote_start":0,"quote_end":74,"text_sha256":"032fbae027d30098e71013b51ba0cc3433d88669f3e0a7bc0f3a740791818a24","block_sha256":"032fbae027d30098e71013b51ba0cc3433d88669f3e0a7bc0f3a740791818a24","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_8f509a42-6de0-438f-b313-ec9b278518ee"},{"id":"occ_64c04560e67e13a4d1976995","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_935114a4-c498-41cf-b406-c01144cc70be","section_id":"sec_1d60a8b8-8525-46d4-8c3a-6549659e04c3","layer":"body","character_id":null,"count":1,"matched_aliases":["ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":4,"end":16,"exact":"ハイブリッドボンディング","quote":"RDL、ハイブリッドボンディング、TSV/TGV、欠陥検査で強いです。","quote_start":0,"quote_end":35,"text_sha256":"89a8b143f9b0d57459820418c6f47d0a8c70c8125cb0f0ec895c0de82613b7e8","block_sha256":"89a8b143f9b0d57459820418c6f47d0a8c70c8125cb0f0ec895c0de82613b7e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_935114a4-c498-41cf-b406-c01144cc70be"},{"id":"occ_26dd3dd2f1d78f6782fd0a62","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_97321bde-ba5c-4166-8e54-890efb9217e1","section_id":"sec_b06184ed-1027-4365-9f91-76da9e8254bc","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":2,"end":7,"exact":"CoWoS","quote":"**CoWoS = 丸いウェハで高密度にAIチップを作る技術**  \n**CoPoS = 四角い大型パネルで、より大きなAIチップを効率よく作る技術**","quote_start":0,"quote_end":76,"text_sha256":"c9a823e6a906bd8f8c64b06416b838551ee5968ba178859a666dc445c4d5d81b","block_sha256":"c9a823e6a906bd8f8c64b06416b838551ee5968ba178859a666dc445c4d5d81b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_97321bde-ba5c-4166-8e54-890efb9217e1"},{"id":"occ_7d5ac4667bbae7b79557e56e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_a5923d90-09ba-4301-bbeb-cbbc1098f209","section_id":"sec_3ac4e9a2-e8ce-49e4-b594-a6ef115b2a42","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":20,"end":25,"exact":"CoWoS","quote":"しかし、2030年頃までは、CoPoSがCoWoSを食うというより、CoWoSでは効率が悪くなる超大型領域を補う形になりそうです。TSMC全体では、CoWoS売上が一部CoPoSへ分類変更されるだけでなく、AIパッケージ全体の市場を広げる効果の方が大","quote_start":0,"quote_end":125,"text_sha256":"b7278d1c6ae3a5f05fb37696def460ea0ddcfb0adf96e598a6e3e01d6629c4a3","block_sha256":"b7278d1c6ae3a5f05fb37696def460ea0ddcfb0adf96e598a6e3e01d6629c4a3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_a5923d90-09ba-4301-bbeb-cbbc1098f209"},{"id":"occ_fbd7b386160e23f5a9342948","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_a5ecf907-22ad-4a47-800e-bc8fef3a80e0","section_id":"sec_670e1c23-d03c-4677-969e-dd382989ace6","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":15,"end":20,"exact":"CoWoS","quote":"TSMCにとってCoPoSは、CoWoSを食う技術というより、IntelやSamsungに次世代パッケージの差別化余地を渡さないための防衛・拡張技術です。","quote_start":0,"quote_end":77,"text_sha256":"b9e5535ffa7257345a7a1ee2a8453ba3a84de6f107649a74e3456973884695cf","block_sha256":"b9e5535ffa7257345a7a1ee2a8453ba3a84de6f107649a74e3456973884695cf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_a5ecf907-22ad-4a47-800e-bc8fef3a80e0"},{"id":"occ_2f526ac7275977cb6461289e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_ba123b5a-0b40-4719-8b78-825d38fa46e3","section_id":"sec_3654a8b2-246d-4705-9c62-3dca7a906684","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":12,"end":17,"exact":"CoWoS","quote":"2026〜2027年は、CoWoS、ABF、HBM、ATE、プローブカードが先に伸びます。  \n2028年は、ガラスコア基板とCoPoSの初期採用が見えるかの分岐点です。  \n2030年は、CoPoSとガラスコアが本格的に事業化するか","quote_start":0,"quote_end":117,"text_sha256":"f9226c16ff0bed61c624d57f8ebd460bcc4fdcec9ae034dc9361c6b86bf3f276","block_sha256":"f9226c16ff0bed61c624d57f8ebd460bcc4fdcec9ae034dc9361c6b86bf3f276","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_ba123b5a-0b40-4719-8b78-825d38fa46e3"},{"id":"occ_9c536ceefec9ad93bd025fc3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_bc68395c-2711-4973-8628-f62feae0764a","section_id":"sec_8ee46d70-0976-4c9d-a162-90e7cc533414","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":13,"end":18,"exact":"CoWoS","quote":"領域CoPoS普及時の影響CoWoS-S一部の超大型品が移行する可能性CoWoS-L併存しやすいABF基板減りにくい。むしろ高層化ABF材料減りにくい。高性能化で増えるガラスコア新規に増えるRDL/パネル工程新規に増える検査・テスト挿入","quote_start":0,"quote_end":118,"text_sha256":"28c53930b3858b879353955f1913447b3cafd4080a624d0a4ac4f2dd8ba75f59","block_sha256":"28c53930b3858b879353955f1913447b3cafd4080a624d0a4ac4f2dd8ba75f59","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_bc68395c-2711-4973-8628-f62feae0764a"},{"id":"occ_e6994bc4caafa18f35d52967","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_c7402196-f7ee-4899-aed0-eac76d38d0d3","section_id":"sec_8ee46d70-0976-4c9d-a162-90e7cc533414","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":11,"end":16,"exact":"CoWoS","quote":"CoPoSが広がると、CoWoSの一部売上は相殺されます。","quote_start":0,"quote_end":29,"text_sha256":"14440581774cfaee669b2482997b7c752e2695f91df0368c4b628283167388c7","block_sha256":"14440581774cfaee669b2482997b7c752e2695f91df0368c4b628283167388c7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_c7402196-f7ee-4899-aed0-eac76d38d0d3"},{"id":"occ_94dd1915f3feb60ac46cfbdd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_e3d3556a-118c-41ab-b47a-e4cb113d536a","section_id":"sec_892f2d51-a2d1-42c6-a5b7-e25e50cc90cd","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":0,"end":7,"exact":"先端パッケージ","quote":"先端パッケージ、HBM、ガラス/パネル検査で上振れしやすい企業です。","quote_start":0,"quote_end":34,"text_sha256":"dc252c0e0b498b4b68160334b55d9d95d72e0d728659faf772aef0f88341568a","block_sha256":"dc252c0e0b498b4b68160334b55d9d95d72e0d728659faf772aef0f88341568a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_e3d3556a-118c-41ab-b47a-e4cb113d536a"},{"id":"occ_2e4824ec1be9ce83d2d613a5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_513457e5-9067-4419-bce8-bb6dfe3e66c5","work_id":"wrk_0b56d32a-d32d-4b74-82d1-14128c2e931f","block_id":"blk_e966dc9b-1442-4622-b654-d3f61201c0c4","section_id":"sec_1d60a8b8-8525-46d4-8c3a-6549659e04c3","layer":"code","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":10,"end":17,"exact":"先端パッケージ","quote":"```\n| 年 | 先端パッケージ関連売上 | 営業利益イメージ |\n| 2026 | 9.5〜10.5億ドル | 3.5〜4.5億ドル |\n| 2027 | 12〜15億ドル | 4.5〜6.5億ドル |\n| 2028 | 14〜1","quote_start":0,"quote_end":117,"text_sha256":"48953d5d1c58ee68482958d5ea9e7f52c12b55ecd82d407ec3beb42bc4afbe3a","block_sha256":"48953d5d1c58ee68482958d5ea9e7f52c12b55ecd82d407ec3beb42bc4afbe3a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_513457e5-9067-4419-bce8-bb6dfe3e66c5/#blk_e966dc9b-1442-4622-b654-d3f61201c0c4"},{"id":"occ_ff5c789833ba9d6a4c86ec5a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_53605de4-06cc-4e0b-9bc9-21f393408c0a","work_id":"wrk_006833f6-f225-48d3-8754-46fe28d6bd8e","block_id":"blk_f51c3693-e884-426b-a21e-23e7ee1a45e6","section_id":"sec_7c91db57-1adf-4ae2-ad6f-5ced1a9ebb9b","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":27,"end":34,"exact":"先端パッケージ","quote":"メモリ、NAND、MLCC、PMIC、PCB、CCL、先端パッケージ、ファウンドリ、電源、冷却、データセンター、送電。  \nこれらは実需が強い。  \nだから企業業績には追い風になる。","quote_start":0,"quote_end":91,"text_sha256":"1e29b02d392341078aabdb70d9b0a21870a98b1cc8b533fd922eb1006fa3a27c","block_sha256":"1e29b02d392341078aabdb70d9b0a21870a98b1cc8b533fd922eb1006fa3a27c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_53605de4-06cc-4e0b-9bc9-21f393408c0a/#blk_f51c3693-e884-426b-a21e-23e7ee1a45e6"},{"id":"occ_baf0784aca5fd076072158a1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_5387a515-478b-41ca-82a3-5b54af988fd1","work_id":"wrk_41cc4908-f3de-420c-9823-faa2e85483cd","block_id":"blk_15e35cb6-a9b4-497c-a2cd-f9ab5abb73a7","section_id":"sec_1c188503-b133-4fe5-9c99-1a23bc03e426","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":84,"end":91,"exact":"先端パッケージ","quote":"変化を小さく見積もることになる。現在のLTAが配分しているのは製品だけではない。将来のウェハー投入、工程時間、先端パッケージ、テスト能力、世代移行の優先順位である。","quote_start":29,"quote_end":111,"text_sha256":"b5f2fe8b8c9159e83f437f74c1c68945d384d75a87d941139b0ebab51bf7ab90","block_sha256":"b5f2fe8b8c9159e83f437f74c1c68945d384d75a87d941139b0ebab51bf7ab90","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5387a515-478b-41ca-82a3-5b54af988fd1/#blk_15e35cb6-a9b4-497c-a2cd-f9ab5abb73a7"},{"id":"occ_51c9e32f4ac0073ced983b20","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_5387a515-478b-41ca-82a3-5b54af988fd1","work_id":"wrk_41cc4908-f3de-420c-9823-faa2e85483cd","block_id":"blk_1fabc0cd-3a8f-415d-b4f9-e92665e0bfcb","section_id":"sec_a1f200d8-bccc-4d32-a69c-c9c4a097e705","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":61,"end":68,"exact":"先端パッケージ","quote":"設費、人件費、材料費が上がっている。さらに、HBMは通常DRAMより多くの良品ダイ、TSV、積層、接合、検査、先端パッケージを必要とする。","quote_start":6,"quote_end":75,"text_sha256":"b751b333ad16e563ccb4aed1e177ae29b38ecee5196384ff0e9076086b16b9a5","block_sha256":"b751b333ad16e563ccb4aed1e177ae29b38ecee5196384ff0e9076086b16b9a5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5387a515-478b-41ca-82a3-5b54af988fd1/#blk_1fabc0cd-3a8f-415d-b4f9-e92665e0bfcb"},{"id":"occ_b9159bffdef1637bc081eef8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_5387a515-478b-41ca-82a3-5b54af988fd1","work_id":"wrk_41cc4908-f3de-420c-9823-faa2e85483cd","block_id":"blk_7d57792d-7d8a-4c61-8b7c-564831681693","section_id":"sec_0e57d076-2e54-4017-bc0d-52c1a2b1d670","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":0,"end":7,"exact":"先端パッケージ","quote":"先端パッケージ","quote_start":0,"quote_end":7,"text_sha256":"3cc8ce32f4dde646276d738f8c8e8b8b5d21c9343adeb0623a1ceffc6bce60cc","block_sha256":"3cc8ce32f4dde646276d738f8c8e8b8b5d21c9343adeb0623a1ceffc6bce60cc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5387a515-478b-41ca-82a3-5b54af988fd1/#blk_7d57792d-7d8a-4c61-8b7c-564831681693"},{"id":"occ_d1caca20c612fcb944a68165","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_03966bda-7f92-4d60-b6a5-55c19c8c4e0a","section_id":"sec_eb6ffe60-6d7f-4da0-8ccd-b2dcfba11303","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":85,"end":90,"exact":"CoWoS","quote":"、AIサーバーの計算価値の中心そのものだからです。NVIDIA自身も、AIインフラはTSMCのウェハ、HBM、CoWoS、組立・テストを組み合わせて供給しており、最終製品の価値の中心はGPU側にあります。DGX B200でも1台の中心は8基のGPUです。 ([NVIDIA](https://www.nvidia.com","quote_start":30,"quote_end":190,"text_sha256":"a3ad93160d88e3885f607cf49ce57a2da34427be0cc818a8dd5bc4417d18a6e4","block_sha256":"a3ad93160d88e3885f607cf49ce57a2da34427be0cc818a8dd5bc4417d18a6e4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_03966bda-7f92-4d60-b6a5-55c19c8c4e0a"},{"id":"occ_288d01bc547e7fa659bfa3a9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_05a5526f-86e6-456d-87d8-d989990dedf9","section_id":"sec_793da2b4-e200-497b-abbe-a4c4270e1850","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":138,"end":143,"exact":"CoWoS","quote":"て完成形を決める工程\n- **TSMC** = 実際に大量生産できる超高精度な巨大セントラルキッチン\n- **CoWoS / パッケージ** = 出来上がった料理を、ソースや付け合わせごと最適な一皿に美しく、機能的に盛り付ける工程","quote_start":83,"quote_end":198,"text_sha256":"d910a00400b29e91b54d4e7c6844b4b1cd2a5e63821f7a98f31ddb81ca10cb60","block_sha256":"d910a00400b29e91b54d4e7c6844b4b1cd2a5e63821f7a98f31ddb81ca10cb60","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_05a5526f-86e6-456d-87d8-d989990dedf9"},{"id":"occ_1f32e21a3a9b8b2b6cd5af62","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_05dab846-86e7-456f-b111-57c0155f52ab","section_id":"sec_dda88d46-69d9-4e24-b7a0-8bc2776c9e7a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":7,"end":12,"exact":"CoWoS","quote":"## \\8. CoWoSはレストランでいうと何か","quote_start":0,"quote_end":24,"text_sha256":"668b103ff0391a248778ee0072bdc7a41dbfc1f624b08a254f40297e62f01f10","block_sha256":"668b103ff0391a248778ee0072bdc7a41dbfc1f624b08a254f40297e62f01f10","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_05dab846-86e7-456f-b111-57c0155f52ab"},{"id":"occ_29edf574042e86935cb63a65","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_0f598edd-7e80-40a3-a40d-f32678af67b2","section_id":"sec_793da2b4-e200-497b-abbe-a4c4270e1850","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":51,"end":56,"exact":"CoWoS","quote":"EDA 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に当たります。","quote_start":0,"quote_end":29,"text_sha256":"13818c54e33377832da9a455e286b59c3535b9e98fc45f5b6f31c05826f34cc1","block_sha256":"13818c54e33377832da9a455e286b59c3535b9e98fc45f5b6f31c05826f34cc1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_15d767cd-5f00-4b95-8934-dc8dd754e354"},{"id":"occ_b4be2b6f8749f9af4c149589","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_19b494b2-2083-40bf-ac02-5184505ea005","section_id":"sec_e89e6323-74a6-4d39-b6f2-94a85487af53","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","先端パッケージ"],"evidence":{"text_basis":"markdown","start":0,"end":7,"exact":"先端パッケージ","quote":"先端パッケージや 2.5D/3D-IC では、「論理的に動く」だけでは足りず、**熱で性能が落ちないか、電源ノイズで誤動作しないか、応力で壊れないか** が非常に重要です。Ansys はそこを詰める役割が強かった会","quote_start":0,"quote_end":107,"text_sha256":"5cf7a87c5cf2faf7bd9a60d0424288a64bb30b76b8e95939a77a9b14d937bd43","block_sha256":"5cf7a87c5cf2faf7bd9a60d0424288a64bb30b76b8e95939a77a9b14d937bd43","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_19b494b2-2083-40bf-ac02-5184505ea005"},{"id":"occ_7736dd20eba2798b9848c476","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_1b36909d-3687-4ace-85bb-7c487b1e11ee","section_id":"sec_935e972d-6492-4525-996e-3aa0ef30efdb","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":45,"end":52,"exact":"先端パッケージ","quote":"**HBM/DRAM**  \n→ **メモリアレイ設計 + カスタム/アナログ + 3D/先端パッケージEDA** が重いです。 ([Synopsys](https://www.synopsys.com/implementation-and-signoff/custom-design-platform.","quote_start":0,"quote_end":152,"text_sha256":"322596ec024c3ee627ff9caaafc81daeb3400bd45c9e9ef16d5a09e16f5c3b6c","block_sha256":"322596ec024c3ee627ff9caaafc81daeb3400bd45c9e9ef16d5a09e16f5c3b6c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_1b36909d-3687-4ace-85bb-7c487b1e11ee"},{"id":"occ_5b9c5782efb4e377ed4fe537","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_2c89d76a-371e-4e00-9797-a87b4ab7006b","section_id":"sec_9037dc85-459a-4cb0-bd2c-3a3ede1bf6ab","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":51,"end":56,"exact":"CoWoS","quote":"AI GPUではここが極めて重要です。  \nGPUダイだけでは製品にならず、  \nHBMと一緒に **CoWoS などの先端パッケージ** に載せて、巨大な1つの高性能製品にします。","quote_start":0,"quote_end":91,"text_sha256":"9071354b11b2b8604251ab3b0fe8c36609b75a006e230b2e6caa70666f089c4d","block_sha256":"9071354b11b2b8604251ab3b0fe8c36609b75a006e230b2e6caa70666f089c4d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_2c89d76a-371e-4e00-9797-a87b4ab7006b"},{"id":"occ_196390057817f8befdd08b47","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_3af51c27-0b05-4b9d-8747-e9b0af87a58b","section_id":"sec_62ce10b0-8ff6-450b-af10-69adc7927cd8","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":149,"end":154,"exact":"CoWoS","quote":"* を、シリコンインターポーザやRDLインターポーザを使って近接統合し、巨大な1つの高性能パッケージにします。CoWoS-S は logic chiplets と HBM cubes を統合する構造で、より大型向けには CoWoS-L や CoWoS-R の選択肢もあります。 ([3dfabric.tsmc.com](","quote_start":94,"quote_end":254,"text_sha256":"40676de808f156158c10dc4293c85d8dee027b4af92210e389e1b5c3d3e44908","block_sha256":"40676de808f156158c10dc4293c85d8dee027b4af92210e389e1b5c3d3e44908","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_3af51c27-0b05-4b9d-8747-e9b0af87a58b"},{"id":"occ_fe0771b42b2506e43bd449b4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_3b9426ef-41f4-496f-a10e-4e3fcf2d1992","section_id":"sec_0dfd6226-c983-41fb-b6cb-6168695dddec","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":199,"end":204,"exact":"CoWoS","quote":"*fabless** で、製造の全段階を外部パートナーに委ねる形を取っており、TSMC のようなファウンドリ、CoWoS パッケージ、組立・テスト外部委託先を使っています。 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の moat を深くする資産** です。AIサーバー、3D-IC、先端パッケージ、電力密度、熱設計が重くなるほど、Ansys の物理解析は「あると便利」ではなく「ないと怖い」に近づきます。つまり Ansys の価値は、今は **Synopsys 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製品化担当","quote_start":0,"quote_end":36,"text_sha256":"90c9029083528cdfe70fc1d89415f89b2bd153ef8f410a9ee0b693bc6e0f9378","block_sha256":"90c9029083528cdfe70fc1d89415f89b2bd153ef8f410a9ee0b693bc6e0f9378","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_4c191155-d934-4239-b104-7c643dba3c59"},{"id":"occ_65ea234096d8d317d939a9bf","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_4dde2124-5028-4ac3-b919-01efae432729","section_id":"sec_62ce10b0-8ff6-450b-af10-69adc7927cd8","layer":"body","character_id":null,"count":4,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":17,"end":24,"exact":"先端パッケージ","quote":"AI GPUで特に重要なのが **先端パッケージ** です。  \nTSMC の CoWoS は、公式には **Chip on Wafer on Substrate** の先端パッケージ技術で、AI やスーパーコンピューティング向けに、**logic","quote_start":0,"quote_end":124,"text_sha256":"3e23c8fed712ff4db4fe369665a76d0ee39e4ac2ca65d342ac25c0291d8f82a9","block_sha256":"3e23c8fed712ff4db4fe369665a76d0ee39e4ac2ca65d342ac25c0291d8f82a9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_4dde2124-5028-4ac3-b919-01efae432729"},{"id":"occ_a71cc18be1eb95de9448adf2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_55e3b55b-825d-46b2-93f3-f27171bf7338","section_id":"sec_653e5ab2-2c59-411a-988c-74751ea3b539","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":78,"end":85,"exact":"先端パッケージ","quote":"\\*「デジタルSoCよりも custom memory / analog 寄り」**で、HBMだけさらに**「先端パッケージEDAが必須」\\*\\*になります。 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 \n→ メインと付け合わせとソースを最適に配置し、一皿として性能を完成させる  \n= GPUとHBMの近接統合、先端パッケージ","quote_start":0,"quote_end":87,"text_sha256":"9519746660487d1bba99a6c08e18e13a61008df55b767d08b96cefe09eae09d4","block_sha256":"9519746660487d1bba99a6c08e18e13a61008df55b767d08b96cefe09eae09d4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_652c2369-a11f-4218-b9b5-55d4473bb835"},{"id":"occ_60090ea78376d8a4a003f732","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_6e45f3d9-c821-4c62-a2cd-0a8d9bafc714","section_id":"sec_a3ddb549-62eb-4d4c-bf4c-f79b19fb0bb8","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":41,"end":46,"exact":"CoWoS","quote":"です。EDA がないとまともなレシピになりにくく、TSMC がないと実物にならず、CoWoS がないと AI 向けの最高性能の一皿になりにくい、という関係です。 ([Synopsys](https://www.synopsys.com/glossary/what-is-electronic-","quote_start":0,"quote_end":146,"text_sha256":"81625489d3d21cd9ff3398ce4d98b8b8d019d0df87b8c4ebb6c3f4f583c475e8","block_sha256":"81625489d3d21cd9ff3398ce4d98b8b8d019d0df87b8c4ebb6c3f4f583c475e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_6e45f3d9-c821-4c62-a2cd-0a8d9bafc714"},{"id":"occ_e2dd00178547ace765a5f06c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_73fd74c9-d088-456a-9bc4-2ae5f794cca6","section_id":"sec_ca6628e7-36bd-4bfe-9f22-0e45a8c410e4","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":2,"end":7,"exact":"CoWoS","quote":"**CoWoS 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([3dfabric.tsmc.com](https://3dfabric.tsmc.c","quote_start":0,"quote_end":107,"text_sha256":"b19032c49ae2125e7b2df741070512a9d6d9d2b6d53164ba1be4e2f77f98e6d8","block_sha256":"b19032c49ae2125e7b2df741070512a9d6d9d2b6d53164ba1be4e2f77f98e6d8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_73fd74c9-d088-456a-9bc4-2ae5f794cca6"},{"id":"occ_7fcc973bf4c8f96d50761ba0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_7655addc-e1d7-46b7-8d2c-faeb87573fcf","section_id":"sec_66a807c2-6109-4937-8479-774b7e91dcb7","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":234,"end":238,"exact":"2.5D","quote":"ign Platform でカスタム・アナログ設計を、3DIC Compiler で multi-die / 2.5D / 3D の co-design を、Signoff で power/signal integrity や multiphysics を扱っています。HBM 側の protocol/SoC 接続では","quote_start":179,"quote_end":338,"text_sha256":"83daee68f6783e3c666ea1a645295e38e5cfae92258dd103237ec8296b653a08","block_sha256":"83daee68f6783e3c666ea1a645295e38e5cfae92258dd103237ec8296b653a08","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_7655addc-e1d7-46b7-8d2c-faeb87573fcf"},{"id":"occ_051a2613fa2b0c6166cccd71","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_7a6af168-341e-415a-a3ad-c0ae124e92bd","section_id":"sec_53c84022-b474-4011-94b8-d3848c7dae5b","layer":"body","character_id":null,"count":3,"matched_aliases":["2.5D","先端パッケージ"],"evidence":{"text_basis":"markdown","start":74,"end":81,"exact":"先端パッケージ","quote":"、I/O構成、リフレッシュやトレーニングの成立性を決めます。  \nHBMになると、**ダイ単体ではなく多ダイ/先端パッケージ込み**で成立させる必要があるので、普通のDRAMより早い段階から 2.5D/3D の co-design が入ります。Synopsys 3DIC Compiler は、2.5D/3D multi-d","quote_start":19,"quote_end":181,"text_sha256":"77464a6224703e407672eb607db1cee04d935b7b67f03538ccc16e0753f4ca2c","block_sha256":"77464a6224703e407672eb607db1cee04d935b7b67f03538ccc16e0753f4ca2c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_7a6af168-341e-415a-a3ad-c0ae124e92bd"},{"id":"occ_92de7647d56648f11fef55da","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_8171dba8-463d-4373-a8e8-6ae31ff4fb7f","section_id":"sec_dda88d46-69d9-4e24-b7a0-8bc2776c9e7a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":4,"end":9,"exact":"CoWoS","quote":"だから CoWoS は、  \n**「完成した部品をまとめる作業」ではなく、「料理として成立させる最後の重要技術」**  \nです。","quote_start":0,"quote_end":64,"text_sha256":"0c2bb028d51fbe0730fb71fa7671286881d109870fd7c682e53451019e59aff1","block_sha256":"0c2bb028d51fbe0730fb71fa7671286881d109870fd7c682e53451019e59aff1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_8171dba8-463d-4373-a8e8-6ae31ff4fb7f"},{"id":"occ_53a2a4526bb3f68a4ea1934b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_9efff6fc-94bd-4a0d-b9fe-ade0e9da0a63","section_id":"sec_62ce10b0-8ff6-450b-af10-69adc7927cd8","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":65,"end":72,"exact":"先端パッケージ","quote":" の流れは、  \n**設計 → 製造 → パッケージ**  \nではなく、  \n**設計 → 製造 → 超重要な先端パッケージ統合**  \nです。  \n今のAI時代は、パッケージングが製品性能そのものの一部になっています。 ([3dfabric.tsmc.com](https://3dfabric.tsmc.com/engl","quote_start":10,"quote_end":172,"text_sha256":"871722a65b628cdc9251dbebca04c6ccae33102fdf22bf76ac5a8607109722b6","block_sha256":"871722a65b628cdc9251dbebca04c6ccae33102fdf22bf76ac5a8607109722b6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_9efff6fc-94bd-4a0d-b9fe-ade0e9da0a63"},{"id":"occ_fcdeaf519ada59f9511133cb","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_a9627279-843e-4764-9a5d-d03b25e3c3fb","section_id":"sec_dda88d46-69d9-4e24-b7a0-8bc2776c9e7a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS は、ただの「皿に乗せる作業」ではありません。","quote_start":0,"quote_end":28,"text_sha256":"a42bac1641347b3097cbc1946ecd78978745de549443eb1803b1277d9b45fc03","block_sha256":"a42bac1641347b3097cbc1946ecd78978745de549443eb1803b1277d9b45fc03","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_a9627279-843e-4764-9a5d-d03b25e3c3fb"},{"id":"occ_99de15c3a64e976fce597f70","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_ab65feeb-40a9-42e3-aabc-8ba9e6ff5cff","section_id":"sec_a3ddb549-62eb-4d4c-bf4c-f79b19fb0bb8","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":66,"end":71,"exact":"CoWoS","quote":"敗しないように設計するための道具”**  \n**TSMCは“その料理を超高精度で実際に作る厨房”**  \n**CoWoSは“その料理を最高の一皿に仕上げる盛り付け技術”**","quote_start":11,"quote_end":97,"text_sha256":"6eeba322312108ac8cd05a03627703d3c7e7db5a7fdb6af8ccc5c34d0951e766","block_sha256":"6eeba322312108ac8cd05a03627703d3c7e7db5a7fdb6af8ccc5c34d0951e766","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_ab65feeb-40a9-42e3-aabc-8ba9e6ff5cff"},{"id":"occ_8fb59f56b276789e0b558eac","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_ae4dfb7d-3b16-4c7e-a0b2-98fe457a0f03","section_id":"sec_da353e09-7d11-4e68-a53e-d404703c5260","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":89,"end":94,"exact":"CoWoS","quote":"BMメモリをすぐ近くに置いて、超短距離でつなぎ、一体の高性能パッケージにする**ことが重要です。TSMC の CoWoS は、ロジックチップと HBM を高密度インターポーザ上で統合する先端パッケージ技術です。 ([3DFabric](https://3dfabric.tsmc.com/english/dedicate","quote_start":34,"quote_end":194,"text_sha256":"e3714ce8b6ab41e82cc721dbb080af4ba165eb84198eff6e138f314f37629be2","block_sha256":"e3714ce8b6ab41e82cc721dbb080af4ba165eb84198eff6e138f314f37629be2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_ae4dfb7d-3b16-4c7e-a0b2-98fe457a0f03"},{"id":"occ_573e862f05e0b2766e189d60","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_bd6d1aed-8928-4537-8c3f-92456dc86c87","section_id":"sec_19e5b639-214f-4105-b1a6-d9a4ac5a588b","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","先端パッケージ"],"evidence":{"text_basis":"markdown","start":91,"end":95,"exact":"2.5D","quote":"ほど、EDA + 検証 + IP + 物理解析まで一体で取りにいける会社」になった** ということです。特に 2.5D/3D、先端パッケージ、熱・電源・電磁界まで絡む AI システムでは、論理設計だけでなく物理世界の整合が重要になるので、Ansys 統合が効きやすいです。逆にリスクは、**統合が大きいぶん実行難度が高","quote_start":36,"quote_end":195,"text_sha256":"f3f60ce5d86aed5195ef00bce3b13e42ebcae4c062bae7498ee0e0d904b9c223","block_sha256":"f3f60ce5d86aed5195ef00bce3b13e42ebcae4c062bae7498ee0e0d904b9c223","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_bd6d1aed-8928-4537-8c3f-92456dc86c87"},{"id":"occ_bc1e267f6c26091378e5c352","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_c5aa69d2-8e7b-4469-9390-60283ba4da8c","section_id":"sec_653e5ab2-2c59-411a-988c-74751ea3b539","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":158,"end":162,"exact":"2.5D","quote":"mechanical stress の multiphysics を統合し、Ansys の半導体解析も 3D/2.5D chip-package co-analysis、power integrity、thermal、thermal-mechanical stress を扱います。 ([Synopsys](https","quote_start":103,"quote_end":262,"text_sha256":"b4fcecae7546b96ccc93211614231d0d83413a5d720e7c867a1ddce6196aea5c","block_sha256":"b4fcecae7546b96ccc93211614231d0d83413a5d720e7c867a1ddce6196aea5c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_c5aa69d2-8e7b-4469-9390-60283ba4da8c"},{"id":"occ_e71a4c02b7a962306b08311b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_cd8ea7af-2976-4557-aaa5-5f5f83358047","section_id":"sec_bdb4dabc-4a2a-4db2-9bb4-fe08aa433ac7","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":18,"end":23,"exact":"CoWoS","quote":"## \\14. 良品ダイが選別され、CoWoSやパッケージ工程へ進む","quote_start":0,"quote_end":34,"text_sha256":"a37b8da36be6213c1a79b8a3ca0212b8db6ba5aa28136a33fe5b5cde06c021b3","block_sha256":"a37b8da36be6213c1a79b8a3ca0212b8db6ba5aa28136a33fe5b5cde06c021b3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_cd8ea7af-2976-4557-aaa5-5f5f83358047"},{"id":"occ_09614b615cec8d497c11fbf0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_cf75f1a0-7386-4c84-8b39-ed2e3b6a69e0","section_id":"sec_56b04cf3-11fa-4a2e-9a1f-50abaf9a674a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":65,"end":70,"exact":"CoWoS","quote":"ト**  \n  まだウェハ状態のGPUダイを測り、良否や特性を確認する\n- **ファイナルテスト**  \n  CoWoSやパッケージ後の完成品を個別に測る\n- **必要に応じてSLT/バーンイン**  \n  実使用に近い条件で動かし、品質をさらに確認する ([株式会社アドバンテスト](https://www.advan","quote_start":10,"quote_end":170,"text_sha256":"f8b5d5186e3d72e188e15eda82d30197bc36c15581f5567309dc627e08c22fb6","block_sha256":"f8b5d5186e3d72e188e15eda82d30197bc36c15581f5567309dc627e08c22fb6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_cf75f1a0-7386-4c84-8b39-ed2e3b6a69e0"},{"id":"occ_e78d4c96140397c73e2a60e8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_dc398a9d-882b-4fe1-aa01-36d04191c8be","section_id":"sec_a15a81ef-6b01-4032-846d-3a1a9ae4911b","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","先端パッケージ"],"evidence":{"text_basis":"markdown","start":205,"end":209,"exact":"2.5D","quote":"m、早期寄生・信頼性・digitized memory flow で回すと説明しています。さらに HBM は 2.5D/3D multi-die と先端パッケージが前提になり、Synopsys 3DIC は high-speed die-to-die、multiphysics、signoff を統合し、Ansys も","quote_start":150,"quote_end":309,"text_sha256":"16f57e23511082f97267bc5d9452b8c3d22e8c64f3c8250f0b281a23bc818ec7","block_sha256":"16f57e23511082f97267bc5d9452b8c3d22e8c64f3c8250f0b281a23bc818ec7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_dc398a9d-882b-4fe1-aa01-36d04191c8be"},{"id":"occ_4d9ddd94a29a43b215d5ce8d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_e1466fba-5a3d-4943-a5c9-ea9549ca56d1","section_id":"sec_274f197d-f404-4bc4-8dfa-e3fa232d7743","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":326,"end":331,"exact":"CoWoS","quote":"TSMC** がウェハを作る  \n→ **Advantest系のテスト工程** でウェハーテスト  \n→ **CoWoS/パッケージ工程** でHBMと統合  \n→ **ファイナルテスト/SLT** で製品確認  \n→ **シリコン評価担当** が実機で立ち上げる  \n→ 問題があれば前の工程へ戻る","quote_start":271,"quote_end":421,"text_sha256":"152fb3759374a607323ee0ce1db539512f4ca82b82b53ee9e2ec1cf3ac074c10","block_sha256":"152fb3759374a607323ee0ce1db539512f4ca82b82b53ee9e2ec1cf3ac074c10","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_e1466fba-5a3d-4943-a5c9-ea9549ca56d1"},{"id":"occ_acf899117ceb9f0917f6b2a7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_e483146b-8a25-4b31-84c1-c535f5244bd6","section_id":"sec_e73e17af-a974-4ccc-853d-48f293c31246","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","3D実装"],"evidence":{"text_basis":"markdown","start":31,"end":35,"exact":"2.5D","quote":"- 複数チップを近くに並べる\n- HBM を近接配置する\n- 2.5D/3D実装する","quote_start":0,"quote_end":42,"text_sha256":"6452d3a4227c1448631a36f3d49c2984fa5d35e438ebe290d0be28f05a3daf51","block_sha256":"6452d3a4227c1448631a36f3d49c2984fa5d35e438ebe290d0be28f05a3daf51","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_e483146b-8a25-4b31-84c1-c535f5244bd6"},{"id":"occ_95f9fee889c4b7e6a45283a7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_ea2f8c83-11e7-47c0-9d46-cbd8bae23770","section_id":"sec_62ce10b0-8ff6-450b-af10-69adc7927cd8","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":29,"end":34,"exact":"CoWoS","quote":"## \\6. AI GPUでは、作っただけでは終わらない。CoWoSでHBMと一体化する","quote_start":0,"quote_end":44,"text_sha256":"32fe1aa03d61fc8c887d271006e8a7d89305aee2988a99a1f47cecbca8de95ac","block_sha256":"32fe1aa03d61fc8c887d271006e8a7d89305aee2988a99a1f47cecbca8de95ac","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_ea2f8c83-11e7-47c0-9d46-cbd8bae23770"},{"id":"occ_eb402aad58116781ef0924b6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_f4517b63-b64b-4dc4-9aa0-50ed8d4f27d1","section_id":"sec_56b04cf3-11fa-4a2e-9a1f-50abaf9a674a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoSや組立の前後で、チップは徹底的に測定されます。  \nAdvantest は公式に、自社の test systems は主に **ウェハ生産工程の終わりの wafer test** と、**パッケージ後","quote_start":0,"quote_end":105,"text_sha256":"0e5d0951686507b8d0a376cb0b1c36557ffad19e57e0b79276ce75916f15371f","block_sha256":"0e5d0951686507b8d0a376cb0b1c36557ffad19e57e0b79276ce75916f15371f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_f4517b63-b64b-4dc4-9aa0-50ed8d4f27d1"},{"id":"occ_d9c69e73bc404d4b33d845cd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_f713aa9a-9d8a-4de0-9eb9-4a4ae189f5fb","section_id":"sec_703da90c-28d2-4248-af42-e69a437d8992","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":142,"end":147,"exact":"CoWoS","quote":"TPGを仕込む**  \n→ **TSMCへテープアウト**  \n→ **TSMCでウェハ製造**  \n→ **CoWoSでGPUダイとHBMを一体化**  \n→ **ウェハーテスト / パッケージ後テスト / 必要に応じてSLT**  \n→ **サーバーボード/システムへ組み込み**  \n→ **量産・出荷** ([S","quote_start":87,"quote_end":247,"text_sha256":"f7b51c2d2652dfc3dfbbd1cf98cbfaa37fac2c1903d71485abe6d11082cf4a60","block_sha256":"f7b51c2d2652dfc3dfbbd1cf98cbfaa37fac2c1903d71485abe6d11082cf4a60","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_f713aa9a-9d8a-4de0-9eb9-4a4ae189f5fb"},{"id":"occ_3deb4c167ce00f51539fe211","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_f90f2e7a-1997-40fa-898e-066e03531259","section_id":"sec_93676270-b1d6-47fb-91ee-4336a528d984","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":41,"end":46,"exact":"CoWoS","quote":"**EDAは「作る前の世界」**、  \n**TSMCは「作る世界」**、  \n**CoWoSは「GPUとHBMを1つの高性能製品にする世界」**、  \n**Advantestは「作られたものを測って品質を保証する世界」**  \nです。 ([StockLight](https://stockl","quote_start":0,"quote_end":146,"text_sha256":"541e248bef8853981b6bcbbfdac74c62c01d0856f027ddede25e33426bfc6abe","block_sha256":"541e248bef8853981b6bcbbfdac74c62c01d0856f027ddede25e33426bfc6abe","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_57810a5f-315e-49a7-ac85-72cc27e35eff/#blk_f90f2e7a-1997-40fa-898e-066e03531259"},{"id":"occ_275b28237292eecea467bd0b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_57810a5f-315e-49a7-ac85-72cc27e35eff","work_id":"wrk_fc529d17-dbc8-4405-b2ca-a48accef7253","block_id":"blk_fe8300bf-9905-4662-aec9-85708b25e82c","section_id":"sec_c9350540-9751-48fa-acb8-6a13f0106833","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":45,"end":50,"exact":"CoWoS","quote":"つまり、最終的な量産の絵は、  \n**NVIDIAが設計し、TSMCがロジックダイを作り、CoWoSなどの先端パッケージでGPUとHBMを統合し、テスト工程ではAdvantestのようなATE/SLT装置が活躍し、組立・実装パートナーが完成品やシステムへ仕上げる**  \nという形です。 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リスク要因：HBM4/先端パッケージ/地政学と「カスタムAIチップ」の加速","quote_start":0,"quote_end":41,"text_sha256":"501e6f36d5333b6b4c4a503004afc53b6d66ad30c97d37de5daf4cefd8d002f8","block_sha256":"501e6f36d5333b6b4c4a503004afc53b6d66ad30c97d37de5daf4cefd8d002f8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_584d62bb-c9f7-4d1f-b637-8fac93976f1b/#blk_846d4fb2-2522-4115-9001-617e1a325d47"},{"id":"occ_152313856b2f1aea9ab170ad","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_584d62bb-c9f7-4d1f-b637-8fac93976f1b","work_id":"wrk_b4bdeaca-dc31-448c-8f47-03f9e39c14b0","block_id":"blk_9b7b4068-eb70-4264-9aa9-727cfed20d8b","section_id":"sec_7800b888-0c3d-4203-83d5-f95d6e4a3b61","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":80,"end":87,"exact":"先端パッケージ","quote":"機関から示され、たとえばは2026年の世界AI支出を**約2.52兆ドル**と予測しています。同時に、HBMや先端パッケージ能力が供給制約になりやすく、RubinについてもHBM4確保が出荷計画に影響し得るというアナリスト報道があります。","quote_start":25,"quote_end":144,"text_sha256":"e3bafc9091b8e76d7e690748bdef70bd3bd3bf9901f10315af9070fca2de2621","block_sha256":"e3bafc9091b8e76d7e690748bdef70bd3bd3bf9901f10315af9070fca2de2621","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_584d62bb-c9f7-4d1f-b637-8fac93976f1b/#blk_9b7b4068-eb70-4264-9aa9-727cfed20d8b"},{"id":"occ_e64fddb6984fe0b6f35d327d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_5bf9454f-9956-42b9-a29c-ae99782c33c0","work_id":"wrk_37743298-dcff-4252-a0d0-d94538fc2a68","block_id":"blk_40bd86c6-40e1-4ec5-96e4-a8ff60c9b004","section_id":"sec_60e77721-995a-4268-9f0f-3c596d2cc41a","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":6,"end":13,"exact":"先端パッケージ","quote":"AIチップと先端パッケージの中心は依然として台湾である。([Reuters](https://www.reuters.com/world/asia-pacific/tsmc-expects-strong-multi-year-","quote_start":0,"quote_end":113,"text_sha256":"8e77f70f31664a0f8315b8863834d031140fe31fdd941309a5c0921d2293ec3d","block_sha256":"8e77f70f31664a0f8315b8863834d031140fe31fdd941309a5c0921d2293ec3d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5bf9454f-9956-42b9-a29c-ae99782c33c0/#blk_40bd86c6-40e1-4ec5-96e4-a8ff60c9b004"},{"id":"occ_23a022ac7c447d4144f81829","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_5cb295dd-df59-4d28-9799-42065461c569","work_id":"wrk_5380fdec-35cc-4092-a93e-530c9abca5c9","block_id":"blk_2b8fa019-9e4e-4a12-a61a-f7e189acf29e","section_id":"sec_f07eb27a-ae6e-4f12-b383-76f3bc65a17b","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":30,"end":35,"exact":"CoWoS","quote":"現状、AIインフラはNVIDIA 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|\n```","quote_start":64,"quote_end":205,"text_sha256":"e82bb37aac61da800054bc17555b213f1872f1e032bf14c250b5ba1fe01e798a","block_sha256":"e82bb37aac61da800054bc17555b213f1872f1e032bf14c250b5ba1fe01e798a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_5ed1cac5-83cc-4660-89c7-643aae40960d/#blk_1664c069-1371-4fa7-b3f3-388087df88b2"},{"id":"occ_37df1bc6eb8e0bd5abf54955","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_5ed1cac5-83cc-4660-89c7-643aae40960d","work_id":"wrk_5b8f2ea4-f2a5-484d-9b6e-1ec16d2a1a3e","block_id":"blk_3745bbc4-f9dc-405a-b470-0958a6239f0d","section_id":"sec_fccc39f4-03c4-4c4a-bab7-96f9555fc8bd","layer":"code","character_id":null,"count":2,"matched_aliases":["2.5D","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":69,"end":73,"exact":"2.5D","quote":"C\n        ↓\nレチクル・歩留まり・コストの壁\n        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見るべき階層 | 代表的な論点 |\n| --- | --- |\n| HBM | GPU、AI ASIC、CoWoS、先端パッケージ |\n| Server DRAM | RDIMM、MRDIMM、CXL、CPUサーバー |\n| NAND / eSSD | RAG、KVキャッシュ、チェックポイント、動画生成 |\n| 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電力設備","quote_start":0,"quote_end":45,"text_sha256":"f99e5d7ec1bdf2dd9bc57297ceb2dc3e7589605595c9a4e272ada1953561f264","block_sha256":"f99e5d7ec1bdf2dd9bc57297ceb2dc3e7589605595c9a4e272ada1953561f264","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_716e29e3-ca33-4e0a-89d8-a4c146c91139/#blk_fcb07715-4cc0-40d8-99aa-318031c26339"},{"id":"occ_6eee59b11125d119f71340a6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_716e29e3-ca33-4e0a-89d8-a4c146c91139","work_id":"wrk_6b2d4c96-c0d4-4d57-8d9e-9077ea538a79","block_id":"blk_fd6c3ef6-b0a8-42f8-9190-80b2cababc6a","section_id":"sec_8a88aea3-46f4-46a1-99c2-2c55c6371095","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":123,"end":128,"exact":"CoWoS","quote":"nt ASP inventory days\nNAND enterprise SSD demand price\nCoWoS capacity utilization lead time\nAI server shipment ODM\nGB200 GB300 Rubin rack shipment\noptical trans","quote_start":68,"quote_end":228,"text_sha256":"1eeed3a755ac39b53a2aabd9ee71852cdad1d6edfd37f20883c968157fbf415c","block_sha256":"1eeed3a755ac39b53a2aabd9ee71852cdad1d6edfd37f20883c968157fbf415c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_716e29e3-ca33-4e0a-89d8-a4c146c91139/#blk_fd6c3ef6-b0a8-42f8-9190-80b2cababc6a"},{"id":"occ_d0d53a6444ffa9e8fc6b6de4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_73f07a40-b588-4fa6-bf2b-2880462e214c","work_id":"wrk_83edd5a9-4c70-4085-ba5b-602f9d005928","block_id":"blk_74922f2a-8516-4221-a0c7-4d26a1a6c015","section_id":"sec_a03d2b94-6aa7-4ac5-b9cf-85c69f44e3ad","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":14,"end":19,"exact":"CoWoS","quote":"Packageを大きくするとCoWoSが必要になる。","quote_start":0,"quote_end":26,"text_sha256":"94ea158b2cb67e3097a0ff62608e751f8cd35ea44d7ff9488bcf046877e0a80e","block_sha256":"94ea158b2cb67e3097a0ff62608e751f8cd35ea44d7ff9488bcf046877e0a80e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_73f07a40-b588-4fa6-bf2b-2880462e214c/#blk_74922f2a-8516-4221-a0c7-4d26a1a6c015"},{"id":"occ_9b6d9be95a7e1fec91215bb0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_78657238-b40f-4a7c-b670-325df3688f39","work_id":"wrk_70fbeeef-5587-4e6a-a017-b7e323d0b279","block_id":"blk_34674c25-2e1c-4075-89e5-18864ce442cf","section_id":"sec_3d266c17-8ba5-47e1-822b-5135b00fe58d","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":269,"end":276,"exact":"先端パッケージ","quote":"。\n- HBMはAI GPUのBOMを大きく左右する高単価部材になっている。\n- HBM供給はDRAM、積層、先端パッケージ、冷却、顧客認証が絡むため、単純な増産では解けない。\n- AIインフラの性能上限は、GPUだけでなく、記憶帯域と熱設計にも制約される。","quote_start":214,"quote_end":343,"text_sha256":"614314e48617cbaf2a56bd5310e5f1c001b17bc6ae12886f9adfaf2e142cf4fc","block_sha256":"614314e48617cbaf2a56bd5310e5f1c001b17bc6ae12886f9adfaf2e142cf4fc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_78657238-b40f-4a7c-b670-325df3688f39/#blk_34674c25-2e1c-4075-89e5-18864ce442cf"},{"id":"occ_dd92a2b1e1af22b7700c1133","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_78657238-b40f-4a7c-b670-325df3688f39","work_id":"wrk_70fbeeef-5587-4e6a-a017-b7e323d0b279","block_id":"blk_549d73c3-a095-47b9-841d-422a21706688","section_id":"sec_73c03144-c3da-4ce8-b8f7-ae5b3dc45650","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","CoWoS"],"evidence":{"text_basis":"markdown","start":33,"end":38,"exact":"CoWoS","quote":"AIサーバーの価格が上がる理由は、GPUダイだけではない。HBM、CoWoSや2.5Dパッケージング、基板、電源、冷却、ネットワーク部品が全て高付加価値化している。その中でもHBMは、供給制約と高単価が重なり、AIハードウェアの価格形成に大きく影響する。","quote_start":0,"quote_end":127,"text_sha256":"01880fbdf032853893a0f5025d3974c67bac5d245b4c53705bf04e2b033a241c","block_sha256":"01880fbdf032853893a0f5025d3974c67bac5d245b4c53705bf04e2b033a241c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_78657238-b40f-4a7c-b670-325df3688f39/#blk_549d73c3-a095-47b9-841d-422a21706688"},{"id":"occ_0252c5658feaee359e496ee9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_78657238-b40f-4a7c-b670-325df3688f39","work_id":"wrk_70fbeeef-5587-4e6a-a017-b7e323d0b279","block_id":"blk_cf4cd2e6-4c5b-414a-8195-f2904b6e2f67","section_id":"sec_791a5e3c-6f37-4cad-9675-3dca0307a4d8","layer":"body","character_id":null,"count":3,"matched_aliases":["2.5D","CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":117,"end":124,"exact":"先端パッケージ","quote":"に効く |\n| ベースダイ高度化 | HBM4以降は顧客ごとのロジック設計やGPU側最適化が重くなる |\n| 先端パッケージング | CoWoS、2.5D、SiP、インターポーザ、先端基板に依存する |\n| 冷却構造 | HBM5ではiHBM/ICEやHPBのような内蔵冷却が製造難度を上げる |\n| 顧客認証 | GPU/","quote_start":62,"quote_end":224,"text_sha256":"a4cc70cf9dbfd93d9d0597eb0d43fc79676e949317bab13fc528668ab968cb19","block_sha256":"a4cc70cf9dbfd93d9d0597eb0d43fc79676e949317bab13fc528668ab968cb19","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_78657238-b40f-4a7c-b670-325df3688f39/#blk_cf4cd2e6-4c5b-414a-8195-f2904b6e2f67"},{"id":"occ_7306d337d0e85a81babb5f48","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_78657238-b40f-4a7c-b670-325df3688f39","work_id":"wrk_70fbeeef-5587-4e6a-a017-b7e323d0b279","block_id":"blk_d2aeb046-ce24-4fac-9404-5b5e91a7b4f4","section_id":"sec_3135ef67-9996-49ac-9d1e-3b1eff74c5d1","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":68,"end":75,"exact":"先端パッケージ","quote":"ように簡単に増産できない。DRAMダイの製造だけでなく、TSV、積層、ベースダイ、MR-MUFやTC-NCF、先端パッケージング、顧客認証、GPU側との共同設計が必要になる。さらにHBM4では顧客専用ロジックダイの比重が高まり、置き換えがより難しくなると報じられている。([Reuters][5])","quote_start":13,"quote_end":162,"text_sha256":"32dd9ccf97affc20f78f7bca835124f1d1ad9be05070ce8e38fc050d27216dd6","block_sha256":"32dd9ccf97affc20f78f7bca835124f1d1ad9be05070ce8e38fc050d27216dd6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_78657238-b40f-4a7c-b670-325df3688f39/#blk_d2aeb046-ce24-4fac-9404-5b5e91a7b4f4"},{"id":"occ_5fb60690214144b4f8ba5a5f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":null,"section_id":null,"layer":"title","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"title","start":31,"end":35,"exact":"SoIC","quote":"第10回　3D V-Cache、Foveros Direct、SoIC、CoWoS―3D積層技術は何が違うのか","quote_start":0,"quote_end":55,"text_sha256":"f852ea535df999b6d54e5220e2a24943a247502d078ebbb0ee32725ecc8c9f75","block_sha256":null,"offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/"},{"id":"occ_6fefd532c5d03edd70139af8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_0186f235-7812-449c-a1cc-25d10b744e3d","section_id":"sec_82a3adcb-7423-4c77-a34b-39ce8699a149","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":7,"end":11,"exact":"EMIB","quote":"この構成が**EMIB 3.5D**である。","quote_start":0,"quote_end":22,"text_sha256":"124c444ac631867fb062f6cb3661d019635d07631495d1287af6847655634a53","block_sha256":"124c444ac631867fb062f6cb3661d019635d07631495d1287af6847655634a53","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_0186f235-7812-449c-a1cc-25d10b744e3d"},{"id":"occ_5fd8837bc162a77a75fd3db6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_04bfac0c-703d-402b-bc93-33980d0fbc86","section_id":"sec_0bb97945-76b6-4546-9d43-a0e75d54d34f","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingで接合したダイを、損傷なく剥がして交換することは極めて難しい。","quote_start":0,"quote_end":45,"text_sha256":"342a8320443c5466d717331ebb022c9832ee9ea493f00536ea25ae8fe5540cd3","block_sha256":"342a8320443c5466d717331ebb022c9832ee9ea493f00536ea25ae8fe5540cd3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_04bfac0c-703d-402b-bc93-33980d0fbc86"},{"id":"occ_ddc6df4a5f3c956ea95773a4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_0a6d3846-f8cf-426d-8108-9a2537b78a45","section_id":"sec_22e1ba4b-2678-44a4-85a0-c0dee6bbe5e1","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":45,"end":59,"exact":"Hybrid Bonding","quote":"ALU、レジスターファイル、スケジューラー、キャッシュ、NoCをどの層へ配置するのか、なぜHybrid Bondingと裏面電源が必要になるのか、そして将来のAIチップが「パッケージ全体で1台のコンピューター」になる過程を見ていく。","quote_start":0,"quote_end":116,"text_sha256":"da6f83346b48ccd2afeb41ae8f9dfe6e608022dd32a3ed90761e6bf6ed780485","block_sha256":"da6f83346b48ccd2afeb41ae8f9dfe6e608022dd32a3ed90761e6bf6ed780485","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_0a6d3846-f8cf-426d-8108-9a2537b78a45"},{"id":"occ_b9bdc49414329f384038d3b1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_0be35f03-d616-45c2-a9a5-d7fa693cbe46","section_id":"sec_5f9e5e3c-3e1f-4a85-80cc-cc2b7ef03124","layer":"code","character_id":null,"count":2,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":43,"end":47,"exact":"SoIC","quote":"```\nLogic／SRAM／Photonics\n   ＋\nCoW／WoW\n   ＋\nSoIC-X／SoIC-P\n```","quote_start":0,"quote_end":60,"text_sha256":"44d1274f8a1b6bc04b775250c400c4d90836c21c3d848500129898f7bf1dd6e5","block_sha256":"44d1274f8a1b6bc04b775250c400c4d90836c21c3d848500129898f7bf1dd6e5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_0be35f03-d616-45c2-a9a5-d7fa693cbe46"},{"id":"occ_cddceb3120ce0571704d583d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_0e5eea0b-fb7f-4845-9cf0-fd3cbda43380","section_id":"sec_82a3adcb-7423-4c77-a34b-39ce8699a149","layer":"code","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":195,"end":199,"exact":"EMIB","quote":"┘          └────●───┘\n     ╲                  ╱\n       EMIB Bridge\n────────────────────────\n       有機パッケージ基板\n```","quote_start":140,"quote_end":252,"text_sha256":"7cae856ef0573aa5cc602fe26975a6bdb8cf4ef15f7018bcc133ca155f344a49","block_sha256":"7cae856ef0573aa5cc602fe26975a6bdb8cf4ef15f7018bcc133ca155f344a49","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_0e5eea0b-fb7f-4845-9cf0-fd3cbda43380"},{"id":"occ_72005c56e954f26e4d8bf411","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_0f417409-e1fd-422b-b0d0-abf7bac8c796","section_id":"sec_1990bcd4-f2e1-4c76-8890-9753d9c46ae3","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS","Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":15,"end":29,"exact":"Hybrid Bonding","quote":"> **3D V-CacheはHybrid Bondingを使った製品であり、Foveros DirectとSoICは3D積層を作る製造基盤、CoWoSは複数のダイとHBMを横方向へ統合するパッケージ基盤である。**","quote_start":0,"quote_end":108,"text_sha256":"314ac850581bbb648e0c36427ffe2c7f3bfa96753248a630668d59598b15d7e2","block_sha256":"314ac850581bbb648e0c36427ffe2c7f3bfa96753248a630668d59598b15d7e2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_0f417409-e1fd-422b-b0d0-abf7bac8c796"},{"id":"occ_39d29debab9a23833123a442","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_0f4b787b-4876-4962-9a41-dbb08dc854fa","section_id":"sec_91ceb51e-4eb6-4605-b4b2-887d3fea4676","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":10,"end":24,"exact":"Hybrid Bonding","quote":"- バンプレス\n- Hybrid Bonding\n- 高い接続密度\n- 低抵抗\n- 高性能HPC向け","quote_start":0,"quote_end":50,"text_sha256":"2eceb8c81c60e68f33e110ac16557cf45540804293d09875fd6f8aea9df71517","block_sha256":"2eceb8c81c60e68f33e110ac16557cf45540804293d09875fd6f8aea9df71517","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_0f4b787b-4876-4962-9a41-dbb08dc854fa"},{"id":"occ_95418572f860c1020ba2a02d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_12ec50c7-4313-4fb7-a4f7-80d93cb93f79","section_id":"sec_674c8637-6f19-40c9-bd12-9027f4c4cc62","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICは、CoWとWoWの両方を扱う。","quote_start":0,"quote_end":20,"text_sha256":"79c50198c4daa8e3939fa246c8f3e105239971af179e908da9f745e80520d52e","block_sha256":"79c50198c4daa8e3939fa246c8f3e105239971af179e908da9f745e80520d52e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_12ec50c7-4313-4fb7-a4f7-80d93cb93f79"},{"id":"occ_97704db81d6bdd1f7578477e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_135c3c28-e22a-4df6-9d6c-ad4b99781c2b","section_id":"sec_e792ef12-3b90-4a08-a6a1-ce5023f015f3","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"**レチクル限界、Die-to-Die PHY、Hybrid Bonding、TSVから、3D V-Cache、Foveros Direct、SoIC**","quote_start":0,"quote_end":77,"text_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","block_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_135c3c28-e22a-4df6-9d6c-ad4b99781c2b"},{"id":"occ_e646e76d697e1d26e2dca82e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_16243aa4-45e2-4e8c-b5a0-ec18955a271a","section_id":"sec_a2d0c1f6-5f73-4feb-9099-f4a44256109c","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":22,"end":36,"exact":"Hybrid Bonding","quote":"CPU CCDに加えてSRAMダイ、TSV、Hybrid Bonding、薄化、検査が必要になる。","quote_start":0,"quote_end":49,"text_sha256":"5bf1b5fe408910d0d2c1553033c1cd89ba392a750326911a148026dee710a171","block_sha256":"5bf1b5fe408910d0d2c1553033c1cd89ba392a750326911a148026dee710a171","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_16243aa4-45e2-4e8c-b5a0-ec18955a271a"},{"id":"occ_e334d40842062b12a0f1f91e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_16d23991-4cc0-4f85-970a-1d824f2ef7bb","section_id":"sec_4bb67337-c9a2-40f4-ac8d-8d8df79f20db","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingで垂直に積む場合は、接合面全体に多数の接点を配置できる。","quote_start":0,"quote_end":42,"text_sha256":"aa2ef61e71e3c564e275c31b02e81e0c51c1ccf9fedd995601b0594eda9145e0","block_sha256":"aa2ef61e71e3c564e275c31b02e81e0c51c1ccf9fedd995601b0594eda9145e0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_16d23991-4cc0-4f85-970a-1d824f2ef7bb"},{"id":"occ_ae21457d0b768a98b9ec2280","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_21b61d68-3ff3-484b-abee-6c37a842b9ca","section_id":"sec_22e1ba4b-2678-44a4-85a0-c0dee6bbe5e1","layer":"body","character_id":null,"count":17,"matched_aliases":["2.5D","CoWoS","EMIB","Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":80,"end":94,"exact":"Hybrid Bonding","quote":"RAMキャッシュを積層するAMDの製品アーキテクチャである。\n- 3D V-Cacheでは、Cu-to-Cu Hybrid BondingとTSVが組み合わされる。\n- 第2世代3D V-CacheではキャッシュをCPUの下へ移し、高発熱CPUコアを冷却面へ近づけた。\n- **Foveros Direct 3D**は、アクティブ・ベース","quote_start":25,"quote_end":194,"text_sha256":"743b39f6467c405beb68b12713cf2793b49b34ebe1b49439cab68a1dafa8fed4","block_sha256":"743b39f6467c405beb68b12713cf2793b49b34ebe1b49439cab68a1dafa8fed4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_21b61d68-3ff3-484b-abee-6c37a842b9ca"},{"id":"occ_4e1a4ec24fceac0a08102698","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_264ddb92-21a6-4b87-a68c-b8dd724fb0b8","section_id":"sec_1990bcd4-f2e1-4c76-8890-9753d9c46ae3","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":20,"end":34,"exact":"Hybrid Bonding","quote":"ここまで、チップレット、マイクロバンプ、Hybrid Bonding、TSV、Die-to-Die PHY、UCIeを順に見てきた。","quote_start":0,"quote_end":66,"text_sha256":"401bb25634f5db442b175772e9338d17c1ebb1ea3c04e53e0017d9c338945c5c","block_sha256":"401bb25634f5db442b175772e9338d17c1ebb1ea3c04e53e0017d9c338945c5c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_264ddb92-21a6-4b87-a68c-b8dd724fb0b8"},{"id":"occ_ae41b611f938d6a6aa725001","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_2a0179cd-fe63-4dfb-8af4-513e2b6d20b1","section_id":"sec_106ffe21-db87-4b0e-94af-e01e4923eba3","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS-Lは、大型RDLインターポーザーと、必要な部分だけに配置した**Local Silicon Interconnect、LSI**を組み合わせる。","quote_start":0,"quote_end":78,"text_sha256":"3ec3c3848ed4df5e2d9f52e0c3c59e4bd4ce1e24532936348cec0108427dd9db","block_sha256":"3ec3c3848ed4df5e2d9f52e0c3c59e4bd4ce1e24532936348cec0108427dd9db","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_2a0179cd-fe63-4dfb-8af4-513e2b6d20b1"},{"id":"occ_249aabdd4455f230f111bfef","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_2cc7919a-573e-42b7-9d2b-14a2b83765f7","section_id":"sec_25638db2-da4f-4932-be5c-28b5c2f5af38","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":34,"end":38,"exact":"SoIC","quote":"## 第10回　3D V-Cache、Foveros Direct、SoIC、CoWoS――3D積層技術は何が違うのか","quote_start":0,"quote_end":59,"text_sha256":"a289204b8b5c17a0b9bf6ddec5e70191a24e2a3b0deaaa64487824d8587b502b","block_sha256":"a289204b8b5c17a0b9bf6ddec5e70191a24e2a3b0deaaa64487824d8587b502b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_2cc7919a-573e-42b7-9d2b-14a2b83765f7"},{"id":"occ_9c0f6b3f7fa5c52e7957b6b5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_2dd6c1a1-b913-4a8b-8bc6-54df2d506bac","section_id":"sec_b75806f2-a812-476f-a610-2521b9a6f884","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":16,"end":20,"exact":"SoIC","quote":"などへ展開されている。TSMCはSoIC CoWを使ったシリコンフォトニクス統合技術COUPEについて、2026年の量産を目標としている。","quote_start":0,"quote_end":69,"text_sha256":"4f62fcd01fad51c62ddeb93b492060e814412c2adb6ef061dd27835f904a8e67","block_sha256":"4f62fcd01fad51c62ddeb93b492060e814412c2adb6ef061dd27835f904a8e67","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_2dd6c1a1-b913-4a8b-8bc6-54df2d506bac"},{"id":"occ_2fcc27749104c53a0b0c3678","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_3d504a30-4fde-4478-aa50-65c898e6249e","section_id":"sec_b9e8a954-9202-4827-b727-4d0eed0ce458","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":13,"end":17,"exact":"SoIC","quote":"- マイクロバンプ型\n- SoIC-Xより粗い接続\n- 比較的低コスト\n- 3D積層の適用範囲を広げる","quote_start":0,"quote_end":51,"text_sha256":"0c84aef48750605dabeb8cc4ecc099fcc77832694f37b8380911ade914bad162","block_sha256":"0c84aef48750605dabeb8cc4ecc099fcc77832694f37b8380911ade914bad162","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_3d504a30-4fde-4478-aa50-65c898e6249e"},{"id":"occ_b1d59645b7e46f1b16a611d6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_425e8bc1-ab8a-48b8-a329-e2e05c71d8e3","section_id":"sec_30f73fb5-a3bb-4de1-a558-e7ce6c31fff7","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"SoIC","quote":"## TSMC SoICとは何か","quote_start":0,"quote_end":16,"text_sha256":"6585db3f4d31643d7898360517c8f927b84a078eb1acca6b6829315e572313a7","block_sha256":"6585db3f4d31643d7898360517c8f927b84a078eb1acca6b6829315e572313a7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_425e8bc1-ab8a-48b8-a329-e2e05c71d8e3"},{"id":"occ_087254105dc5bd44f859d7b2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_4352d4d3-b574-4168-8df9-299e49fbd879","section_id":"sec_464398bd-71cb-47e6-abec-074074255ba2","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":12,"end":26,"exact":"Hybrid Bonding","quote":"3D V-CacheではHybrid BondingとTSVが組み合わされる。","quote_start":0,"quote_end":39,"text_sha256":"747e2f136cda248a1331bffe2cc824db49e221fa9aafdfee9f79c775eda619e1","block_sha256":"747e2f136cda248a1331bffe2cc824db49e221fa9aafdfee9f79c775eda619e1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_4352d4d3-b574-4168-8df9-299e49fbd879"},{"id":"occ_ddbb82142373bd0afab3a3c2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_460c6371-e729-49bf-bf45-480cf89325a0","section_id":"sec_4562cdc6-b457-45bb-be13-70dc378a8268","layer":"body","character_id":null,"count":4,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIBは有機基板へ埋め込んだ局所シリコンブリッジであり、CoWoS-Sは大型シリコンインターポーザーを使用する。CoWoS-LはRDLと局所シリコン接続を組み合わせるため、構造的にはEMIB的な思想にも近づ","quote_start":0,"quote_end":104,"text_sha256":"eda83b822187eb6398e82e07acafbca1c8f712595179b16e85b907362d1d96fd","block_sha256":"eda83b822187eb6398e82e07acafbca1c8f712595179b16e85b907362d1d96fd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_460c6371-e729-49bf-bf45-480cf89325a0"},{"id":"occ_e59c2c8b5f31fd92c7b9176f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_4642c973-28fd-470e-9e1d-88eab5243c1d","section_id":"sec_4ef54890-ff58-4716-85d7-0a2e5bfc3de6","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS-Rは、シリコン全面ではなく、ポリマーと銅配線によるRDLインターポーザーを使う。","quote_start":0,"quote_end":46,"text_sha256":"3885e0185c3968cbef527bf32fc92180dbcfff1b3d1eeba526c3f1b88b26b807","block_sha256":"3885e0185c3968cbef527bf32fc92180dbcfff1b3d1eeba526c3f1b88b26b807","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_4642c973-28fd-470e-9e1d-88eab5243c1d"},{"id":"occ_5547960483a50c341a7f3850","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_49cc30d6-cbef-419e-8dac-d0ba02affb59","section_id":"sec_240146b2-c9e3-4e27-b243-b4f9f16348f8","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMCはSoICでCoWとWoWの両方を提供し、機能、サイズ、ノードの組み合わせに応じて選択できるとしている。([3DFabric](https://3dfabric.tsmc.com/english/dedicat","quote_start":0,"quote_end":109,"text_sha256":"a1a567411eff4ec29f18f1a992664095a4066c7b946a2123d785a4ebf1691468","block_sha256":"a1a567411eff4ec29f18f1a992664095a4066c7b946a2123d785a4ebf1691468","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_49cc30d6-cbef-419e-8dac-d0ba02affb59"},{"id":"occ_08c0fbfbe8c4f1865a02a412","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_52f4078e-8c73-4f1b-bc5e-abf940a3d2d4","section_id":"sec_4a96d001-697f-4d65-9b5e-ddd403e5f740","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":3,"end":8,"exact":"CoWoS","quote":"## CoWoS-S","quote_start":0,"quote_end":10,"text_sha256":"88944b6a65e4f556a7afbaeb2e531d7f9f4175da7c7d2259d58c77a4687852cf","block_sha256":"88944b6a65e4f556a7afbaeb2e531d7f9f4175da7c7d2259d58c77a4687852cf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_52f4078e-8c73-4f1b-bc5e-abf940a3d2d4"},{"id":"occ_c59899bb96c25ffa4cb39779","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_54bde9a6-e6fc-42cc-9e94-64de59efb17c","section_id":"sec_30f73fb5-a3bb-4de1-a558-e7ce6c31fff7","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICは、SoCを複数のチップレットへ分割し、それらを高密度な垂直接続で再統合することを目的としている。","quote_start":0,"quote_end":53,"text_sha256":"4409fdd2da1b804a7465a95cb18c937032c0a0ddf6ef071e54a250fbd92fa681","block_sha256":"4409fdd2da1b804a7465a95cb18c937032c0a0ddf6ef071e54a250fbd92fa681","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_54bde9a6-e6fc-42cc-9e94-64de59efb17c"},{"id":"occ_1c7fbd9a62c30a790fb62cad","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_5faeef9f-3f07-4a28-9765-4c5b5e709926","section_id":"sec_106ffe21-db87-4b0e-94af-e01e4923eba3","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":9,"end":14,"exact":"CoWoS","quote":"2025年時点で、CoWoS-Rは量産3年目、CoWoS-Lは量産2年目に入り、より大型のCoWoS-L製品が2026年に量産開始予定とTSMCは報告している。","quote_start":0,"quote_end":80,"text_sha256":"4d94b2e979c6ccd79bd3a93e321513527cc7e85bcf45e441a4dc9387b45c1b3c","block_sha256":"4d94b2e979c6ccd79bd3a93e321513527cc7e85bcf45e441a4dc9387b45c1b3c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_5faeef9f-3f07-4a28-9765-4c5b5e709926"},{"id":"occ_af1c12be49e268c876f53845","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_5fc243be-19ef-4648-8ab3-b6823772483d","section_id":"sec_4a96d001-697f-4d65-9b5e-ddd403e5f740","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS-Sは、大型のシリコンインターポーザーを使用する。","quote_start":0,"quote_end":30,"text_sha256":"17cf522ffb342b77e1c5510bac32d38ab03f0097e003dcccdac360ec1153c115","block_sha256":"17cf522ffb342b77e1c5510bac32d38ab03f0097e003dcccdac360ec1153c115","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_5fc243be-19ef-4648-8ab3-b6823772483d"},{"id":"occ_62d66e3cb0cd152eed649d83","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_61146bc0-1516-43fa-9284-fb2357c58476","section_id":"sec_91ec2da7-4c53-44fc-b94a-1d12fa060c24","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":8,"end":13,"exact":"CoWoS","quote":"## TSMC CoWoS","quote_start":0,"quote_end":13,"text_sha256":"f4022fd0daa79f4c894ec11c97caf2a63368dff3e8d758248e7b412df5c2709a","block_sha256":"f4022fd0daa79f4c894ec11c97caf2a63368dff3e8d758248e7b412df5c2709a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_61146bc0-1516-43fa-9284-fb2357c58476"},{"id":"occ_de4181ec5047c9f18674fc5b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_6142afad-556c-415d-8949-f35bf61979ce","section_id":"sec_62edb1b9-6ba1-4bfd-883e-4e90f34d893a","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICとCoWoSは競合する技術ではない。","quote_start":0,"quote_end":22,"text_sha256":"03673a58c6581bc4ff81e7df45c665bc73fed036eea51d90fb1ffd9855172930","block_sha256":"03673a58c6581bc4ff81e7df45c665bc73fed036eea51d90fb1ffd9855172930","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_6142afad-556c-415d-8949-f35bf61979ce"},{"id":"occ_975106cabdaa2446a60a4617","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_61f6080f-0fd1-4fb1-bcd8-5d3b8662c155","section_id":"sec_82a3adcb-7423-4c77-a34b-39ce8699a149","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":18,"end":22,"exact":"EMIB","quote":"そこでIntelは、FoverosとEMIBを組み合わせる。","quote_start":0,"quote_end":30,"text_sha256":"879c310aadc73ae5f64eb78b5ead278aa5122bf441fccbccfcc5158798516f3b","block_sha256":"879c310aadc73ae5f64eb78b5ead278aa5122bf441fccbccfcc5158798516f3b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_61f6080f-0fd1-4fb1-bcd8-5d3b8662c155"},{"id":"occ_6308a8ef9282e3a7a5adea46","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_66f53bee-5210-405d-ae12-3101707935b0","section_id":"sec_62edb1b9-6ba1-4bfd-883e-4e90f34d893a","layer":"body","character_id":null,"count":3,"matched_aliases":["2.5D","CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":2,"end":6,"exact":"SoIC","quote":"- SoIC：上下方向の3D積層\n- CoWoS：横方向の2.5D統合\n- HBM：メモリー内部の3D積層","quote_start":0,"quote_end":53,"text_sha256":"b0875003feb4ab7537bcfed6ac822415c47c32b4ed9badb6b98b8a441fc841da","block_sha256":"b0875003feb4ab7537bcfed6ac822415c47c32b4ed9badb6b98b8a441fc841da","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_66f53bee-5210-405d-ae12-3101707935b0"},{"id":"occ_72b9be72adc47e0ef6a73919","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_67d1f8bc-4435-451a-8183-31bc2c034fb2","section_id":"sec_4562cdc6-b457-45bb-be13-70dc378a8268","layer":"code","character_id":null,"count":3,"matched_aliases":["CoWoS","EMIB","SoIC"],"evidence":{"text_basis":"markdown","start":39,"end":43,"exact":"EMIB","quote":"```\nIntel\n\nFoveros Direct\n上下積層\n      ＋\nEMIB\n横方向接続\n\n\nTSMC\n\nSoIC\n上下積層\n      ＋\nCoWoS\n横方向統合\n```","quote_start":0,"quote_end":91,"text_sha256":"ecb4556b703ab0b3bae7263cf0d610b699980da7e9b8230070ffea9153739591","block_sha256":"ecb4556b703ab0b3bae7263cf0d610b699980da7e9b8230070ffea9153739591","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_67d1f8bc-4435-451a-8183-31bc2c034fb2"},{"id":"occ_c14433ff8a33d50fe03024dc","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_6a84aa69-a31e-42d0-a3fc-69a259290a97","section_id":"sec_62edb1b9-6ba1-4bfd-883e-4e90f34d893a","layer":"code","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":43,"end":47,"exact":"SoIC","quote":"```\n       SRAM／Logic\n            │\n       SoIC 3D接合\n            │\n       Compute Die\n\nHBM ＝＝ CoWoS Interposer ＝＝ HBM\n```","quote_start":0,"quote_end":121,"text_sha256":"d65dbcdb62ba6a8265ebc5f4f0d7c734c0c8c477c41889ffcaf102074070acd6","block_sha256":"d65dbcdb62ba6a8265ebc5f4f0d7c734c0c8c477c41889ffcaf102074070acd6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_6a84aa69-a31e-42d0-a3fc-69a259290a97"},{"id":"occ_019c0b30a6ada332c830c466","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_6b1e1641-2b8c-4093-af5c-88efff4ee204","section_id":"sec_b9e8a954-9202-4827-b727-4d0eed0ce458","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"SoIC","quote":"## SoIC-P","quote_start":0,"quote_end":9,"text_sha256":"d14fec6bf4721bf0d71f706bdc1a51cf5ec43d52a30f64e7d56385bed660c6de","block_sha256":"d14fec6bf4721bf0d71f706bdc1a51cf5ec43d52a30f64e7d56385bed660c6de","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_6b1e1641-2b8c-4093-af5c-88efff4ee204"},{"id":"occ_e7539c6565be44b96723bd65","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_6bf2aed3-471a-4d7d-8758-31627a700bec","section_id":"sec_43ba5c3e-4b07-4574-b92e-7ba559f99412","layer":"code","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":91,"end":95,"exact":"SoIC","quote":"   ↓\nUCIe Adapter\n        ↓\nUCIe PHY\n        ↓\nFoveros／SoIC／CoWoS上の接続\n```","quote_start":36,"quote_end":109,"text_sha256":"9387ad9c60cfed3bc595ab0b1446dbf2a9e60eeb3ca01a7610a609dff08e1eb3","block_sha256":"9387ad9c60cfed3bc595ab0b1446dbf2a9e60eeb3ca01a7610a609dff08e1eb3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_6bf2aed3-471a-4d7d-8758-31627a700bec"},{"id":"occ_c8dbc7d183802dcaba2f0cc8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_6e242ba8-aad0-4e82-aa06-bee31e8a5a11","section_id":"sec_1990bcd4-f2e1-4c76-8890-9753d9c46ae3","layer":"code","character_id":null,"count":5,"matched_aliases":["2.5D","CoWoS","Hybrid Bonding","SoIC","先端パッケージ"],"evidence":{"text_basis":"markdown","start":140,"end":144,"exact":"SoIC","quote":"irect 3D | 3D製造・実装プラットフォーム | アクティブダイ同士を直接積層する |\n| TSMC SoIC | 3Dシリコン積層プラットフォーム | ロジック、SRAMなどを垂直統合する |\n| TSMC CoWoS | 2.5D先端パッケージ | ロジックとHBMを横方向に統合する |\n| Hybrid","quote_start":85,"quote_end":244,"text_sha256":"2277c09254ea54671b732ed9e35c95ba12d5159fd2f60443ba15cca0961e9a20","block_sha256":"2277c09254ea54671b732ed9e35c95ba12d5159fd2f60443ba15cca0961e9a20","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_6e242ba8-aad0-4e82-aa06-bee31e8a5a11"},{"id":"occ_2fd41ca8b4706c0ec85fd977","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_6ee1916c-1b8d-4a9b-bd84-bdc072b4d4b3","section_id":"sec_b75806f2-a812-476f-a610-2521b9a6f884","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"SoIC","quote":"## SoICの量産状況","quote_start":0,"quote_end":12,"text_sha256":"357b727b39082a922cebdb1fcabc21c06b0e7a1cfc4843a8be0a28d2f3601067","block_sha256":"357b727b39082a922cebdb1fcabc21c06b0e7a1cfc4843a8be0a28d2f3601067","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_6ee1916c-1b8d-4a9b-bd84-bdc072b4d4b3"},{"id":"occ_7823258991e175a13d41181b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_6efb0434-9ac2-4139-bac3-0f840d57409c","section_id":"sec_98e1dbcd-9234-4bc4-953c-523a1ae8ed80","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":75,"end":89,"exact":"Hybrid Bonding","quote":"キャッシュにより1 CCD当たり最大96MB、1ソケット当たり最大768MBのL3を構成し、銅同士のバンプレスHybrid Bondingを使用した。([docs.amd.com](https://docs.amd.com/api/khub/documents/H6ZxG2XaLcN9JvMbJ1Q3tQ/content?utm_sou","quote_start":20,"quote_end":189,"text_sha256":"1ac49f311fddb49beb330e7e36eb5cd01719f77f0387d2de756b02814408194a","block_sha256":"1ac49f311fddb49beb330e7e36eb5cd01719f77f0387d2de756b02814408194a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_6efb0434-9ac2-4139-bac3-0f840d57409c"},{"id":"occ_837447b3709ae3d27a3fe6d3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_6f5946c7-a930-42e3-8ae8-4c8094f21ee0","section_id":"sec_106ffe21-db87-4b0e-94af-e01e4923eba3","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":3,"end":8,"exact":"CoWoS","quote":"## CoWoS-L","quote_start":0,"quote_end":10,"text_sha256":"fb21014b5d12b2a322e557d0f69dd64a1864843af9fc33b4e9f93d3e01b1e430","block_sha256":"fb21014b5d12b2a322e557d0f69dd64a1864843af9fc33b4e9f93d3e01b1e430","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_6f5946c7-a930-42e3-8ae8-4c8094f21ee0"},{"id":"occ_3ee32fa5d761834f34de8bbe","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_70a34338-109f-4b96-b221-122752a27696","section_id":"sec_485b06a6-a1de-4a79-a1a2-e8aeaefb3a0b","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":38,"end":52,"exact":"Hybrid Bonding","quote":"```\n上側Compute Tile\n        │\nCu-to-Cu Hybrid Bonding\n        │\nActive Base Die\n NoC・Cache・I/O・制御\n        │\nパッケージ基板\n```","quote_start":0,"quote_end":118,"text_sha256":"56f6aba5dd2d1e73af1873c66a0ea83c73b605d444ceb4c6bdfa074bbe358b0f","block_sha256":"56f6aba5dd2d1e73af1873c66a0ea83c73b605d444ceb4c6bdfa074bbe358b0f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_70a34338-109f-4b96-b221-122752a27696"},{"id":"occ_c725e555e7ca6d6e228c438c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_77b873f5-a1d0-4f29-93e8-158514c5779d","section_id":"sec_f7d1119b-c08d-4c9a-856e-dd7d191c2d1d","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingで接続距離とピッチを小さくしても、ダイ境界には依然として、","quote_start":0,"quote_end":43,"text_sha256":"3b6bec9ccdbefe5adc884eabf5807f922662ac021d76579d398ce53ca3aff330","block_sha256":"3b6bec9ccdbefe5adc884eabf5807f922662ac021d76579d398ce53ca3aff330","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_77b873f5-a1d0-4f29-93e8-158514c5779d"},{"id":"occ_937a57621f882c5a426777ff","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_7993056a-925b-4e04-af3d-c40fae25fda7","section_id":"sec_106ffe21-db87-4b0e-94af-e01e4923eba3","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":5,"end":10,"exact":"CoWoS","quote":"TSMCはCoWoS-Lについて、","quote_start":0,"quote_end":17,"text_sha256":"b712b28d4469033874e403f2d730e25f5dd28dc59df686ecfb8637bd88262210","block_sha256":"b712b28d4469033874e403f2d730e25f5dd28dc59df686ecfb8637bd88262210","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_7993056a-925b-4e04-af3d-c40fae25fda7"},{"id":"occ_e502e785f9a51270ce27d634","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_80f3c404-d552-4488-938d-56095651b5ea","section_id":"sec_464398bd-71cb-47e6-abec-074074255ba2","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":67,"end":81,"exact":"Hybrid Bonding","quote":"イの回路\n        ↓\n       TSV\n        ↓\n接合用Cuパッド\n        ↓\nHybrid Bonding\n        ↓\n相手側のCuパッド\n        ↓\n相手側回路\n```","quote_start":12,"quote_end":121,"text_sha256":"d99ee5112e027eda47f35f5974a9fa54a50b976782464942ddca1906f56b8e56","block_sha256":"d99ee5112e027eda47f35f5974a9fa54a50b976782464942ddca1906f56b8e56","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_80f3c404-d552-4488-938d-56095651b5ea"},{"id":"occ_a2f0cc84d900fdb6ec6dff09","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_8176a0c7-ecff-40c4-950d-3f75be25712d","section_id":"sec_dbcfc5eb-39d9-449b-b07d-3e3d338b37d7","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":52,"end":66,"exact":"Hybrid Bonding","quote":"```\n第1世代の概念\n\nヒートスプレッダ\n       ↑\n追加L3キャッシュダイ\n       │\nHybrid Bonding\n       │\nCPU CCD\n       │\nパッケージ基板\n```","quote_start":0,"quote_end":104,"text_sha256":"07d24bee42b3b17e436d8ddcc1800df4c170e1ed3151ad90d7be885caffeb5d6","block_sha256":"07d24bee42b3b17e436d8ddcc1800df4c170e1ed3151ad90d7be885caffeb5d6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_8176a0c7-ecff-40c4-950d-3f75be25712d"},{"id":"occ_94801672ac9ff16a4e8d4165","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_81cfab6e-8d3d-4012-b25f-b452e2aedf46","section_id":"sec_62edb1b9-6ba1-4bfd-883e-4e90f34d893a","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMCはSoICをCoWoSまたはInFOへ統合できるとし、垂直積層と横方向パッケージを組み合わせる3Dx3Dをシステムレベルの構成として位置付けている。([3DFabric](https://3dfabric.ts","quote_start":0,"quote_end":109,"text_sha256":"e1adb48453b25da0694de81e10202cdfb6ad299820c4221d108c68d7be64ecd0","block_sha256":"e1adb48453b25da0694de81e10202cdfb6ad299820c4221d108c68d7be64ecd0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_81cfab6e-8d3d-4012-b25f-b452e2aedf46"},{"id":"occ_addf38069c83eababbd4f639","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_8315d281-6ccd-44fb-aa6e-0532120d8a85","section_id":"sec_485b06a6-a1de-4a79-a1a2-e8aeaefb3a0b","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":54,"end":68,"exact":"Hybrid Bonding","quote":"IntelはFoveros Directについて、従来のはんだマイクロバンプを排除し、直接Cu-to-Cu Hybrid Bondingを使うことで、sub-10µmの接続ピッチを実現すると説明している。([Intel](https://www.intel.com/content/dam/www/central-libraries/u","quote_start":0,"quote_end":168,"text_sha256":"ef61e68964d5eda75e8b8400c8a965568a2f556c5832c47c19aec789151dc1fc","block_sha256":"ef61e68964d5eda75e8b8400c8a965568a2f556c5832c47c19aec789151dc1fc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_8315d281-6ccd-44fb-aa6e-0532120d8a85"},{"id":"occ_c1c49b561d0a772f1455c592","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_83b98a8e-8f26-4a33-b708-c30e0f3593e2","section_id":"sec_4a96d001-697f-4d65-9b5e-ddd403e5f740","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":14,"end":19,"exact":"CoWoS","quote":"TSMCの現行公式情報では、CoWoS-Sは最大3.3倍レチクル、約2,700mm²のインターポーザーに対応し、それ以上のサイズにはCoWoS-LまたはCoWoS-Rが推奨されている。([3DFabric](https://3dfabri","quote_start":0,"quote_end":119,"text_sha256":"96affa401136e8495fbcf6dda3bf6af833d96bd69ed04717b68053936da7bcd8","block_sha256":"96affa401136e8495fbcf6dda3bf6af833d96bd69ed04717b68053936da7bcd8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_83b98a8e-8f26-4a33-b708-c30e0f3593e2"},{"id":"occ_854220ea6a852bf5ac3514f5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_8535ffe9-ebce-40dd-9551-f88839b157a4","section_id":"sec_62edb1b9-6ba1-4bfd-883e-4e90f34d893a","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICで作った3D積層ダイを、CoWoSの上へ載せられる。","quote_start":0,"quote_end":30,"text_sha256":"27fe77b9af07e3c0278b47c95a8841426622652ba9d703e1942026286ec11425","block_sha256":"27fe77b9af07e3c0278b47c95a8841426622652ba9d703e1942026286ec11425","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_8535ffe9-ebce-40dd-9551-f88839b157a4"},{"id":"occ_301578c0b03f4b4ea4e23e58","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_8614ce70-3b41-48af-904e-2730547ec34a","section_id":"sec_91ec2da7-4c53-44fc-b94a-1d12fa060c24","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":26,"end":30,"exact":"2.5D","quote":"大型ロジック、チップレット、HBMを横方向に統合する2.5Dパッケージである。","quote_start":0,"quote_end":39,"text_sha256":"d3e0bef5a9bc43e570e9f3963b69b9144eff11881db3cc397ed82018933f5d57","block_sha256":"d3e0bef5a9bc43e570e9f3963b69b9144eff11881db3cc397ed82018933f5d57","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_8614ce70-3b41-48af-904e-2730547ec34a"},{"id":"occ_847f6096ad8d4a8e1a68d181","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_88f19ad8-b767-4b44-a78f-19b836705727","section_id":"sec_1990bcd4-f2e1-4c76-8890-9753d9c46ae3","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingは「技術」、3D V-Cacheは「製品」、SoICとFoveros Directは「製造プラットフォーム」である","quote_start":0,"quote_end":74,"text_sha256":"60225367e6e7a912270453a684267e51d749d2eccd16c6fc21c7cd2597dd22ab","block_sha256":"60225367e6e7a912270453a684267e51d749d2eccd16c6fc21c7cd2597dd22ab","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_88f19ad8-b767-4b44-a78f-19b836705727"},{"id":"occ_bff7ecd116c10656af9c097b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_8bc8e49f-7ea7-4617-acb3-3310b38e7c0c","section_id":"sec_394c13d9-cc08-4deb-8765-123b0784d079","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":38,"end":52,"exact":"Hybrid Bonding","quote":"```\nCompute\n   ＋\nActive Base Die\n   ＋\nHybrid Bonding\n```","quote_start":0,"quote_end":56,"text_sha256":"19c9aeec3a723c4f34419e7f830359540ce2f9eebc593d8b0aeca206c05ea9d5","block_sha256":"19c9aeec3a723c4f34419e7f830359540ce2f9eebc593d8b0aeca206c05ea9d5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_8bc8e49f-7ea7-4617-acb3-3310b38e7c0c"},{"id":"occ_1845511ad6f32e8866a5fc9a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_8c9a49de-63e7-4c52-9154-eee67c29cbef","section_id":"sec_4ef54890-ff58-4716-85d7-0a2e5bfc3de6","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":5,"end":10,"exact":"CoWoS","quote":"TSMCはCoWoS-Rについて、最小4µmピッチのRDL配線、低RC配線、GSGSG配置と層間シールドによる信号・電源品質を挙げている。([3DFabric](https://3dfabric.tsmc.com/eng","quote_start":0,"quote_end":110,"text_sha256":"94e504212c5d4b87af387ba5ef45c46dea03edf52e22d178f8dd9764c451268a","block_sha256":"94e504212c5d4b87af387ba5ef45c46dea03edf52e22d178f8dd9764c451268a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_8c9a49de-63e7-4c52-9154-eee67c29cbef"},{"id":"occ_ec8e86d390f6ce8209f28f20","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_930827d9-ceca-444f-9549-68a60cd3f0cf","section_id":"sec_82a3adcb-7423-4c77-a34b-39ce8699a149","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":18,"end":22,"exact":"EMIB","quote":"## Foveros DirectとEMIB 3.5D","quote_start":0,"quote_end":27,"text_sha256":"5fe47b0d6f62d15418abe26fc4022e4ab83b4540ebcdfea6d25230306fd14d60","block_sha256":"5fe47b0d6f62d15418abe26fc4022e4ab83b4540ebcdfea6d25230306fd14d60","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_930827d9-ceca-444f-9549-68a60cd3f0cf"},{"id":"occ_958ea4f889f25fce61ada8c3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_991060b7-a91f-4049-a0d1-d93d338e29e3","section_id":"sec_30f73fb5-a3bb-4de1-a558-e7ce6c31fff7","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMCはSoICについて、","quote_start":0,"quote_end":14,"text_sha256":"14be388a88da281b0ada45a864f6ed0135c0992854b68d48ab6b28f518a09721","block_sha256":"14be388a88da281b0ada45a864f6ed0135c0992854b68d48ab6b28f518a09721","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_991060b7-a91f-4049-a0d1-d93d338e29e3"},{"id":"occ_8b126d23d310ce59559aada7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_99f6b28d-f180-48f0-9596-fe4f7cb09cd9","section_id":"sec_0312c350-16b9-4d2a-984f-e29c9ad3b51a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":3,"end":8,"exact":"CoWoS","quote":"## CoWoSとは何か","quote_start":0,"quote_end":12,"text_sha256":"34516cdd3632955cc82f667a4f954f997f89659aa165735240a26e8e09420da6","block_sha256":"34516cdd3632955cc82f667a4f954f997f89659aa165735240a26e8e09420da6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_99f6b28d-f180-48f0-9596-fe4f7cb09cd9"},{"id":"occ_4c87da8fa10a898c513ce2e2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_9a068776-3b7a-4d05-9d07-9aaeb31f3dde","section_id":"sec_f7d1119b-c08d-4c9a-856e-dd7d191c2d1d","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":5,"end":19,"exact":"Hybrid Bonding","quote":"したがってHybrid Bondingは、","quote_start":0,"quote_end":21,"text_sha256":"f8724831ac60473a7e34ae619b29c283f5a44706c38f6d88c67f3c33822802a5","block_sha256":"f8724831ac60473a7e34ae619b29c283f5a44706c38f6d88c67f3c33822802a5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_9a068776-3b7a-4d05-9d07-9aaeb31f3dde"},{"id":"occ_d38d3a1db83aca7ad5c0faff","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_9bcca5d7-63f9-4b67-b591-657082c7f11c","section_id":"sec_30f73fb5-a3bb-4de1-a558-e7ce6c31fff7","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICは**System on Integrated Chips**の略で、TSMCのフロントエンド3Dシリコン積層プラットフォームである。","quote_start":0,"quote_end":71,"text_sha256":"adea5ea65fdeead2fc5ced6c3f68074d52d50d26c9f2ab43b689a60780912303","block_sha256":"adea5ea65fdeead2fc5ced6c3f68074d52d50d26c9f2ab43b689a60780912303","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_9bcca5d7-63f9-4b67-b591-657082c7f11c"},{"id":"occ_ad66f055d27f15cc7b1059e4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_a1b79da8-baa4-409f-981f-bef4739d0700","section_id":"sec_4ef54890-ff58-4716-85d7-0a2e5bfc3de6","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":3,"end":8,"exact":"CoWoS","quote":"## CoWoS-R","quote_start":0,"quote_end":10,"text_sha256":"acda75225e198311d4c9dc832cb17c4d3f36cd695deca580c98d9ce4dab8e29e","block_sha256":"acda75225e198311d4c9dc832cb17c4d3f36cd695deca580c98d9ce4dab8e29e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_a1b79da8-baa4-409f-981f-bef4739d0700"},{"id":"occ_05c5ba1f1d8a1e33b19c769f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_a460758e-cb2e-47f1-93ec-c3d7d72d2dac","section_id":"sec_f7d1119b-c08d-4c9a-856e-dd7d191c2d1d","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingはそれより粗いが、マイクロバンプや2.5D接続よりは、はるかにモノリシック配線へ近い。","quote_start":0,"quote_end":57,"text_sha256":"dc6d86cad91692cfc6bd16f61b3fb4478457df1e54ed2eed1a0fd54865fa94e9","block_sha256":"dc6d86cad91692cfc6bd16f61b3fb4478457df1e54ed2eed1a0fd54865fa94e9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_a460758e-cb2e-47f1-93ec-c3d7d72d2dac"},{"id":"occ_ce841dfbab7bd0a02038a9ec","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_a9748bed-b368-4c4e-a999-e025fd4d5efb","section_id":"sec_4562cdc6-b457-45bb-be13-70dc378a8268","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS","EMIB","SoIC"],"evidence":{"text_basis":"markdown","start":18,"end":22,"exact":"EMIB","quote":"## Foveros Direct＋EMIBと、SoIC＋CoWoSの対応関係","quote_start":0,"quote_end":39,"text_sha256":"85565e2e228dd46c022961e2f83a104c22a45a334ce9a5f00d41580f18089fb3","block_sha256":"85565e2e228dd46c022961e2f83a104c22a45a334ce9a5f00d41580f18089fb3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_a9748bed-b368-4c4e-a999-e025fd4d5efb"},{"id":"occ_d99082cf8bc90fe7ff426f6a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_aa5aa1b4-61a6-4c79-843d-6d93e7bf1ab9","section_id":"sec_43ba5c3e-4b07-4574-b92e-7ba559f99412","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":20,"end":24,"exact":"SoIC","quote":"UCIeはFoveros Direct、SoIC、CoWoSの代替ではない。","quote_start":0,"quote_end":38,"text_sha256":"c611b96d6e7c65b4285919cfaf797a7979cc6e84014af64c2587873323b29e30","block_sha256":"c611b96d6e7c65b4285919cfaf797a7979cc6e84014af64c2587873323b29e30","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_aa5aa1b4-61a6-4c79-843d-6d93e7bf1ab9"},{"id":"occ_b56f4ab4d98a805d033db670","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_ac529911-63fd-4a03-bd18-de4c60b766f4","section_id":"sec_b9e8a954-9202-4827-b727-4d0eed0ce458","layer":"body","character_id":null,"count":2,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoIC-XとSoIC-Pは優劣だけでなく、必要な接続密度とコストに応じて使い分ける技術である。","quote_start":0,"quote_end":48,"text_sha256":"4dbf3c0a2d1a0b7043b2e26b320ab7a36c620d57c58462f8fd61faa94a0710f4","block_sha256":"4dbf3c0a2d1a0b7043b2e26b320ab7a36c620d57c58462f8fd61faa94a0710f4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_ac529911-63fd-4a03-bd18-de4c60b766f4"},{"id":"occ_1d55be6b21c5caed80e0fd6f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_adea4601-beab-4210-b815-511b3cb2ad7f","section_id":"sec_b75806f2-a812-476f-a610-2521b9a6f884","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":21,"end":25,"exact":"SoIC","quote":"TSMCの2025年年次報告では、3nm SoIC積層技術が2025年に量産へ入ったとされている。","quote_start":0,"quote_end":49,"text_sha256":"a56b56e9d2cd4507c0efbd7138722db617410c2371ec0f4462aed5ef817225ee","block_sha256":"a56b56e9d2cd4507c0efbd7138722db617410c2371ec0f4462aed5ef817225ee","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_adea4601-beab-4210-b815-511b3cb2ad7f"},{"id":"occ_1f594544a3d786d2c57110cf","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_ae09500a-0c52-45bf-be84-bf1fde4d8796","section_id":"sec_91ceb51e-4eb6-4605-b4b2-887d3fea4676","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"SoIC","quote":"## SoIC-X","quote_start":0,"quote_end":9,"text_sha256":"4024a70afab09373e91152bc415d97f53b8dc8436520356612696a9252d50d04","block_sha256":"4024a70afab09373e91152bc415d97f53b8dc8436520356612696a9252d50d04","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_ae09500a-0c52-45bf-be84-bf1fde4d8796"},{"id":"occ_8b537420d3b8801ec40e91c9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_b1dfefa3-c8af-49b6-b0c3-072a55600c75","section_id":"sec_0312c350-16b9-4d2a-984f-e29c9ad3b51a","layer":"body","character_id":null,"count":3,"matched_aliases":["2.5D","CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":10,"exact":"CoWoS","quote":"したがってCoWoS自体は、SoICやFoveros Directと同じ垂直ロジック積層ではなく、**2.5Dシステム統合技術**である。","quote_start":0,"quote_end":69,"text_sha256":"f3209c8a508144755e2c2148474c8be560c0e6d945ca6477ea7cd1f63675560c","block_sha256":"f3209c8a508144755e2c2148474c8be560c0e6d945ca6477ea7cd1f63675560c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_b1dfefa3-c8af-49b6-b0c3-072a55600c75"},{"id":"occ_af12b8ce22e6c330cfbcb404","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_b207e1b9-471b-441b-b269-90ebd2fb46bc","section_id":"sec_0312c350-16b9-4d2a-984f-e29c9ad3b51a","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":34,"end":38,"exact":"2.5D","quote":"主に、ロジックダイとHBMを高密度な中間配線基盤の上へ横方向に並べる2.5Dパッケージである。","quote_start":0,"quote_end":47,"text_sha256":"3012c8d5932571dcaebc4eebaaa4f700061a8e1dd0ecea99a9f914b513b63cbd","block_sha256":"3012c8d5932571dcaebc4eebaaa4f700061a8e1dd0ecea99a9f914b513b63cbd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_b207e1b9-471b-441b-b269-90ebd2fb46bc"},{"id":"occ_297c015e5f4178257e4d88e1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_b39a3171-7cb6-4f9d-ba08-1b02dc9ff75c","section_id":"sec_0312c350-16b9-4d2a-984f-e29c9ad3b51a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoSは**Chip on Wafer on Substrate**の略である。","quote_start":0,"quote_end":42,"text_sha256":"bdbcd51d7cf230e9b40d2eca5a54fe469978931c7044b4d54958742a0c91720b","block_sha256":"bdbcd51d7cf230e9b40d2eca5a54fe469978931c7044b4d54958742a0c91720b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_b39a3171-7cb6-4f9d-ba08-1b02dc9ff75c"},{"id":"occ_9fe2675002acb795501aa0f6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_b3ebd875-e96c-4787-b42e-96ef67659b2b","section_id":"sec_b75806f2-a812-476f-a610-2521b9a6f884","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICは研究技術だけではない。","quote_start":0,"quote_end":16,"text_sha256":"bf68ef943ea3cf490c06ebab426797f8ef6a0328768c4e5a8dfb2d999a47d69c","block_sha256":"bf68ef943ea3cf490c06ebab426797f8ef6a0328768c4e5a8dfb2d999a47d69c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_b3ebd875-e96c-4787-b42e-96ef67659b2b"},{"id":"occ_348e66f1b9e023df5b951322","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_b6e8c2d2-f027-47b5-9467-ad45b5214574","section_id":"sec_464398bd-71cb-47e6-abec-074074255ba2","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":2,"end":16,"exact":"Hybrid Bonding","quote":"- Hybrid Bonding：CPUダイとキャッシュダイの境界面を接続\n- TSV：積層ダイの厚さ方向へ信号や電源を通す","quote_start":0,"quote_end":62,"text_sha256":"9be21d8ea606bc3838a7ea55970baa31aa63d2749b3a4fc614ae9faed3a63e62","block_sha256":"9be21d8ea606bc3838a7ea55970baa31aa63d2749b3a4fc614ae9faed3a63e62","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_b6e8c2d2-f027-47b5-9467-ad45b5214574"},{"id":"occ_27948408d5c208e3686031ab","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_ba4df039-39c7-430a-b07a-730806fa374a","section_id":"sec_62edb1b9-6ba1-4bfd-883e-4e90f34d893a","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"SoIC","quote":"## SoICとCoWoSを組み合わせる3Dx3D","quote_start":0,"quote_end":25,"text_sha256":"91d40c1324a66e0a44a864883372734a8eb6e215f3cfff2d7da710c595c3797f","block_sha256":"91d40c1324a66e0a44a864883372734a8eb6e215f3cfff2d7da710c595c3797f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_ba4df039-39c7-430a-b07a-730806fa374a"},{"id":"occ_2bed93ae28df62d732f7cdfe","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_bee912db-567f-42d6-b4c5-ca79fdeb70ca","section_id":"sec_82a3adcb-7423-4c77-a34b-39ce8699a149","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":24,"end":28,"exact":"EMIB","quote":"Foveros Directが垂直方向を担当し、EMIBが横方向を担当する。Intelは、この組み合わせによってパッケージ面積、性能、電力、コストのバランスを取り、大規模なSystem of Chipsへ拡張できるとしている。([Intel](https:","quote_start":0,"quote_end":128,"text_sha256":"3f6aa6c6eb9a11669bb8ffb2c1afbd995b1f68365f8f9cf7f46d19c5005f3840","block_sha256":"3f6aa6c6eb9a11669bb8ffb2c1afbd995b1f68365f8f9cf7f46d19c5005f3840","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_bee912db-567f-42d6-b4c5-ca79fdeb70ca"},{"id":"occ_c8c7b09ee787ed62c8309d26","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_c0c0b2c8-fc9e-4a34-9f48-ecc378e14267","section_id":"sec_b75806f2-a812-476f-a610-2521b9a6f884","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICは、ロジック・オン・ロジックだけでなく、","quote_start":0,"quote_end":24,"text_sha256":"815841a7300c400b9d0722386a78b637c90a230ec5463c592747195afd2004ee","block_sha256":"815841a7300c400b9d0722386a78b637c90a230ec5463c592747195afd2004ee","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_c0c0b2c8-fc9e-4a34-9f48-ecc378e14267"},{"id":"occ_be52049713b6dcd1a497a1af","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_c5089334-719e-47f4-b156-70099821da95","section_id":"sec_516aa6bd-d4e3-4064-94fb-28bd94c12955","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoICには、接合方式の異なる2つの方向がある。","quote_start":0,"quote_end":24,"text_sha256":"313bd00233d7cf01350630611295942b7925f0a81fcde31222a78e0eaa5c8035","block_sha256":"313bd00233d7cf01350630611295942b7925f0a81fcde31222a78e0eaa5c8035","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_c5089334-719e-47f4-b156-70099821da95"},{"id":"occ_c5e03e959f6f88f1b8f03260","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_ccfffa2c-1d07-4855-9982-19bbb251638b","section_id":"sec_1990bcd4-f2e1-4c76-8890-9753d9c46ae3","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":50,"end":54,"exact":"SoIC","quote":"- AMD 3D V-Cache\n- Intel Foveros Direct 3D\n- TSMC SoIC\n- TSMC CoWoS","quote_start":0,"quote_end":67,"text_sha256":"82658e2ed9c39b13b1e21e42eb11f30955f0d95cc7568678841e16a7a64525ee","block_sha256":"82658e2ed9c39b13b1e21e42eb11f30955f0d95cc7568678841e16a7a64525ee","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_ccfffa2c-1d07-4855-9982-19bbb251638b"},{"id":"occ_625819ee1aa1a57316f3c42f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_d7d396c0-e1aa-448c-a3f7-610af7cf03c8","section_id":"sec_1990bcd4-f2e1-4c76-8890-9753d9c46ae3","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":19,"end":26,"exact":"先端パッケージ","quote":"ここからは、それらの技術が実際の製品や先端パッケージで、どのように組み合わされているのかを解説する。","quote_start":0,"quote_end":50,"text_sha256":"fe2ef2352d4e6b483cadac6929a28515c6c7f0e48e513a32a35a35c29aa2572c","block_sha256":"fe2ef2352d4e6b483cadac6929a28515c6c7f0e48e513a32a35a35c29aa2572c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_d7d396c0-e1aa-448c-a3f7-610af7cf03c8"},{"id":"occ_60d3c831f0e9e93f88ad5f39","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_dc0d0b94-c348-46a4-9a98-996865497b57","section_id":"sec_43ba5c3e-4b07-4574-b92e-7ba559f99412","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":8,"end":22,"exact":"Hybrid Bonding","quote":"UCIe-3DはHybrid Bonding向けに最適化され、10～25µm級から1µm以下までの接続ピッチを想定しているが、Hybrid Bondingを使うすべての製品がUCIe-3Dを使用するわけではない。([UCIe Consortiu","quote_start":0,"quote_end":122,"text_sha256":"0033151b5098ab440907ce872b5535d885d0e183fc2c3af2dff416a4f98ac62c","block_sha256":"0033151b5098ab440907ce872b5535d885d0e183fc2c3af2dff416a4f98ac62c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_dc0d0b94-c348-46a4-9a98-996865497b57"},{"id":"occ_b192a2e732c8bb4174204af2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_e45cb84e-27b0-4f35-80d7-6c8bc279db74","section_id":"sec_516aa6bd-d4e3-4064-94fb-28bd94c12955","layer":"body","character_id":null,"count":2,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"SoIC","quote":"## SoIC-XとSoIC-P","quote_start":0,"quote_end":16,"text_sha256":"383def1e871e1c92d71ef6dc26fa2fb71195c491561dae434e3473769694e971","block_sha256":"383def1e871e1c92d71ef6dc26fa2fb71195c491561dae434e3473769694e971","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_e45cb84e-27b0-4f35-80d7-6c8bc279db74"},{"id":"occ_dc627b84ac2b538713a71af9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_e4e5ede2-2ac9-4d3a-9ba8-571b1e675db9","section_id":"sec_b9e8a954-9202-4827-b727-4d0eed0ce458","layer":"code","character_id":null,"count":2,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":4,"end":8,"exact":"SoIC","quote":"```\nSoIC-X\n\nダイ\nCu SiO₂ Cu\n│        │\nCu SiO₂ Cu\nダイ\n\n\nSoIC-P\n\nダイ\n ●  ●  ●\n────────\nダイ\n```","quote_start":0,"quote_end":88,"text_sha256":"f64750e920062318ed235fe2abfeed3731c18f57aae12f1057915b2fb007014d","block_sha256":"f64750e920062318ed235fe2abfeed3731c18f57aae12f1057915b2fb007014d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_e4e5ede2-2ac9-4d3a-9ba8-571b1e675db9"},{"id":"occ_21dc7709cdf1f8efce459f98","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_e5c5f1c1-1d23-4a87-a3f5-931f169147fd","section_id":"sec_b9e8a954-9202-4827-b727-4d0eed0ce458","layer":"body","character_id":null,"count":2,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":22,"end":26,"exact":"SoIC","quote":"TSMCは2023年、従来のバンプレス方式をSoIC-Xと呼び、マイクロバンプによるコスト重視の方式をSoIC-Pとして追加した。([TSMC](https://pr.tsmc.com/english/news/3021))","quote_start":0,"quote_end":112,"text_sha256":"5f31dd7ecb1854c47f8ae844cab1ad8a62245f0de479b9e6f24cc4fd969ab9a1","block_sha256":"5f31dd7ecb1854c47f8ae844cab1ad8a62245f0de479b9e6f24cc4fd969ab9a1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_e5c5f1c1-1d23-4a87-a3f5-931f169147fd"},{"id":"occ_a6b422f81b0ed6b6bb223e05","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_f30f0b14-e5ff-4737-b8ea-1d9fc7265543","section_id":"sec_f7d1119b-c08d-4c9a-856e-dd7d191c2d1d","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingを使えば、ダイは1枚のSoCと同じになるのか","quote_start":0,"quote_end":39,"text_sha256":"bf7934a4a6b92fa4ebe0c78131b9de61647f6f4865361d2ad75f9eecece301ed","block_sha256":"bf7934a4a6b92fa4ebe0c78131b9de61647f6f4865361d2ad75f9eecece301ed","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_f30f0b14-e5ff-4737-b8ea-1d9fc7265543"},{"id":"occ_631cd728d47738d8382ae8e9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_fcadbb5e-26fb-4598-a2e4-aafcee8a8500","section_id":"sec_5f9e5e3c-3e1f-4a85-80cc-cc2b7ef03124","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"SoIC","quote":"## TSMC SoIC","quote_start":0,"quote_end":12,"text_sha256":"0e470d11dfc50f3609d9b38cdf897f2ccd2e4cf2687ec8e84752ffeab6c9aa56","block_sha256":"0e470d11dfc50f3609d9b38cdf897f2ccd2e4cf2687ec8e84752ffeab6c9aa56","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_fcadbb5e-26fb-4598-a2e4-aafcee8a8500"},{"id":"occ_ce06da2a1faccb4f22663d41","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_793e83db-98e9-4062-b995-36674ef0d72b","work_id":"wrk_3360cbbd-2ca7-4c81-b55c-c9ea15bca260","block_id":"blk_ff212724-784e-4d2f-88de-a24786e0660f","section_id":"sec_f7d1119b-c08d-4c9a-856e-dd7d191c2d1d","layer":"code","character_id":null,"count":2,"matched_aliases":["2.5D","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":25,"end":39,"exact":"Hybrid Bonding","quote":"```\nモノリシックBEOL\n最も細かい・短い\n\nHybrid Bonding\n非常に細かい・短い\n\nマイクロバンプ\n数十µm級\n\n2.5Dインターポーザー\nmm級横配線\n\n有機基板\nさらに長い\n```","quote_start":0,"quote_end":101,"text_sha256":"145813b29edba96be0ae44f5cdaaa5022de61bb8a6205ca3b5af79599c7656d0","block_sha256":"145813b29edba96be0ae44f5cdaaa5022de61bb8a6205ca3b5af79599c7656d0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_793e83db-98e9-4062-b995-36674ef0d72b/#blk_ff212724-784e-4d2f-88de-a24786e0660f"},{"id":"occ_1a962f51ffdb211e73704ca1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_7fd87260-401e-4d9b-830d-373e2a334bb7","work_id":"wrk_043383ac-e6be-4702-8cbf-cd5785e078f1","block_id":"blk_51657be2-dc30-424b-9ba6-0bb5e11f1950","section_id":"sec_87b47470-c4ae-4723-9f79-90fe4db7f9c9","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":53,"end":60,"exact":"先端パッケージ","quote":"もちろん、これは非常に難しい。半導体製造は、ロケットやEV工場以上に複雑で、EUV、歩留まり、材料、装置、先端パッケージ、HBM、熟練人材が絡む。","quote_start":0,"quote_end":73,"text_sha256":"d46ca4e47b027c42c9abdbdf8c6c77d163f332728a05148148a275ba25e37ba4","block_sha256":"d46ca4e47b027c42c9abdbdf8c6c77d163f332728a05148148a275ba25e37ba4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_7fd87260-401e-4d9b-830d-373e2a334bb7/#blk_51657be2-dc30-424b-9ba6-0bb5e11f1950"},{"id":"occ_0b58fcfe4f545dfd3e134d6b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_7fd87260-401e-4d9b-830d-373e2a334bb7","work_id":"wrk_043383ac-e6be-4702-8cbf-cd5785e078f1","block_id":"blk_8fd98ed9-de23-4937-82ca-88d9dacf992b","section_id":"sec_87b47470-c4ae-4723-9f79-90fe4db7f9c9","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":37,"end":44,"exact":"先端パッケージ","quote":"AIデータセンターにはGPUが必要だ。GPUにはHBMが必要だ。HBMには先端パッケージが必要だ。先端チップにはTSMC、Samsung、Intelのような製造能力が必要だ。","quote_start":0,"quote_end":87,"text_sha256":"f6c7ffb5ef133df061751c7cc3a94e95d254e73931505a93c63952f4e3c97e2b","block_sha256":"f6c7ffb5ef133df061751c7cc3a94e95d254e73931505a93c63952f4e3c97e2b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_7fd87260-401e-4d9b-830d-373e2a334bb7/#blk_8fd98ed9-de23-4937-82ca-88d9dacf992b"},{"id":"occ_af07e6bc3642c3a8325c131d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_7fd87260-401e-4d9b-830d-373e2a334bb7","work_id":"wrk_043383ac-e6be-4702-8cbf-cd5785e078f1","block_id":"blk_bf90fe61-0cf6-4e42-9071-fb3911d28a6e","section_id":"sec_e502158b-9f1d-4fae-9418-cf068f9be4d6","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":68,"end":75,"exact":"先端パッケージ","quote":"度が高すぎる。半導体製造は、Musk流の高速反復だけでは突破できない領域も多い。歩留まり、装置、材料、EUV、先端パッケージは、長年の蓄積を必要とする。","quote_start":13,"quote_end":89,"text_sha256":"20f4733323ee216e09aa38433cd1fd812cb786571c2f3eb6e9e8d2ef67864dde","block_sha256":"20f4733323ee216e09aa38433cd1fd812cb786571c2f3eb6e9e8d2ef67864dde","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_7fd87260-401e-4d9b-830d-373e2a334bb7/#blk_bf90fe61-0cf6-4e42-9071-fb3911d28a6e"},{"id":"occ_0d12ca04ce9d7d77a3f8602c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_84581296-2906-4b8b-9a12-fe071bf83ea5","work_id":"wrk_6a02fe90-8d9f-4a4d-9ecc-c990d2e53bd2","block_id":"blk_144b5918-61e3-4b5f-ab6f-f1b8a1affa32","section_id":"sec_8ea0feef-f86d-4812-a7d5-245f322e7fe0","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bonding pitchを縮める。","quote_start":0,"quote_end":25,"text_sha256":"8f08a7192053f2ac1882a3aa47cf5d2db62c0c1c1e07afcacdb43564e8bf0543","block_sha256":"8f08a7192053f2ac1882a3aa47cf5d2db62c0c1c1e07afcacdb43564e8bf0543","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_84581296-2906-4b8b-9a12-fe071bf83ea5/#blk_144b5918-61e3-4b5f-ab6f-f1b8a1affa32"},{"id":"occ_c40dbe459a7e644ce4f66d97","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_84581296-2906-4b8b-9a12-fe071bf83ea5","work_id":"wrk_6a02fe90-8d9f-4a4d-9ecc-c990d2e53bd2","block_id":"blk_82c26042-330f-4ba9-b3e9-2cd2a66d85a2","section_id":"sec_0516e778-da04-4df3-bac4-89c4cba7e69e","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"これがHybrid Bondingである。","quote_start":0,"quote_end":21,"text_sha256":"b4db709c9181947028e78951530c978fd1859877eb96e8bf9bccf77e9d3ea26a","block_sha256":"b4db709c9181947028e78951530c978fd1859877eb96e8bf9bccf77e9d3ea26a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_84581296-2906-4b8b-9a12-fe071bf83ea5/#blk_82c26042-330f-4ba9-b3e9-2cd2a66d85a2"},{"id":"occ_22b3b453624778549c16eb5d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_84581296-2906-4b8b-9a12-fe071bf83ea5","work_id":"wrk_6a02fe90-8d9f-4a4d-9ecc-c990d2e53bd2","block_id":"blk_9bada45d-84a4-4f8a-aaa6-cda5fe0da2f5","section_id":"sec_dfac767b-e53a-4608-8764-31d2ff0681af","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Xplore)","quote_start":5,"quote_end":142,"text_sha256":"d5496b4d4fbcc891db0d9e7f1bb7a6852a588bc8d81a92899dcb2a32f971d18f","block_sha256":"d5496b4d4fbcc891db0d9e7f1bb7a6852a588bc8d81a92899dcb2a32f971d18f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_84581296-2906-4b8b-9a12-fe071bf83ea5/#blk_a28df35a-553f-46a2-8e89-b18a28c2bcc4"},{"id":"occ_044de4531109bf3906b5cbb7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_84581296-2906-4b8b-9a12-fe071bf83ea5","work_id":"wrk_6a02fe90-8d9f-4a4d-9ecc-c990d2e53bd2","block_id":"blk_b5490cc9-7ff8-4c96-b764-d7811ae2bddb","section_id":"sec_0516e778-da04-4df3-bac4-89c4cba7e69e","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid bonding","quote":"Hybrid bondingはFEOLではなく、かなり後段の3D 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\n液冷。  \n原子力。  \nガス発電。  \nサイバー防衛。  \n政府・軍事向けAI。  \n国内半導体製造。  \nAIインフラの効率化技術。","quote_start":0,"quote_end":114,"text_sha256":"587ce5f25cbaae099424a609d00f52392719a69af96b1821ca69c2010f1f6913","block_sha256":"587ce5f25cbaae099424a609d00f52392719a69af96b1821ca69c2010f1f6913","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_84a77d25-ab82-4d74-abb1-c248dd75257f/#blk_19ff3d47-ac8c-45d9-9aca-af2bd603f9f4"},{"id":"occ_3a6ea0a7ab0a45b99c9527a5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_84a77d25-ab82-4d74-abb1-c248dd75257f","work_id":"wrk_81581cb4-a4e2-4f51-afae-e8f5e3c41099","block_id":"blk_3c5614d7-03a8-4b36-9c13-ef3006df5c9a","section_id":"sec_ea9657ad-cb82-4263-94b2-059953e1c522","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":24,"end":29,"exact":"CoWoS","quote":"GPUが足りない。  \nHBMが足りない。  \nCoWoSが足りない。  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\n電力が足りない。","quote_start":0,"quote_end":69,"text_sha256":"a319b417530ae182e467b8f41a11cfd8c9b715f2b788a13dc012fd5055097d8e","block_sha256":"a319b417530ae182e467b8f41a11cfd8c9b715f2b788a13dc012fd5055097d8e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_84a77d25-ab82-4d74-abb1-c248dd75257f/#blk_3c5614d7-03a8-4b36-9c13-ef3006df5c9a"},{"id":"occ_8dffa44bf7ed3098bac1c7d0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_84a77d25-ab82-4d74-abb1-c248dd75257f","work_id":"wrk_81581cb4-a4e2-4f51-afae-e8f5e3c41099","block_id":"blk_797f91c1-337b-4469-9356-bfec7a2ed04c","section_id":"sec_01761af6-c33f-416b-a595-aad2f9890121","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":68,"end":75,"exact":"先端パッケージ","quote":"ガス発電、原子力、対中AI競争、同盟国AI輸出、国内半導体製造が強くなる。  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PHYの違いを整理すると次のようになる。","quote_start":0,"quote_end":59,"text_sha256":"aabbbde4fd142804a12bc62f409bcd011824ed751c0dc3c4f9f8a9ca2d1e397b","block_sha256":"aabbbde4fd142804a12bc62f409bcd011824ed751c0dc3c4f9f8a9ca2d1e397b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_735e8940-b3ac-49a0-b552-5491ca0cfb1c"},{"id":"occ_0edd7ed854380fe8d2d7735a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_7f9c5cfa-4dd0-4e38-aec8-29edafefd3c8","section_id":"sec_d347a7c4-e13a-4b7a-bd1e-408c892a30b2","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":77,"end":91,"exact":"Hybrid Bonding","quote":"チップレット内部のデジタルデータを電気信号へ変換し、相手側で復元する回路である。\n- TSV、マイクロバンプ、Hybrid Bondingは信号が通る物理経路であり、PHYとは役割が異なる。\n- PHYには、送信ドライバー、受信回路、シリアライザー、デシリアライザー、クロック、タイミング調整、トレーニングなどが含まれる。\n- 多数の低速","quote_start":22,"quote_end":191,"text_sha256":"c981977771139e5e50040a83ccd2d84f984cac46d3abad268a645948de938ce3","block_sha256":"c981977771139e5e50040a83ccd2d84f984cac46d3abad268a645948de938ce3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_7f9c5cfa-4dd0-4e38-aec8-29edafefd3c8"},{"id":"occ_1ea1c0d55ac637c29e773f50","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_88061aea-0d0f-4bd8-b2c5-878d87cee80a","section_id":"sec_23cdb5ee-dee9-4d7c-8f38-1ed46c9b11c9","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":80,"end":94,"exact":"Hybrid Bonding","quote":" 1枚のシリコン内部を垂直に貫通する |\n| マイクロバンプ | 2つの部品の接合面を電気的につなぐ |\n| Hybrid Bonding | 銅と誘電体を直接接合する |\n| インターポーザー | ダイ間の信号を横方向へ運ぶ |\n| Die-to-Die PHY | 信号を送信・受信し、通信を成立させる |\n| UCIe | PHYよ","quote_start":25,"quote_end":194,"text_sha256":"bee6851d75071b510624bd628abfa9dc90540bac2db4d17185f2ed9af1149d56","block_sha256":"bee6851d75071b510624bd628abfa9dc90540bac2db4d17185f2ed9af1149d56","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_88061aea-0d0f-4bd8-b2c5-878d87cee80a"},{"id":"occ_72607c0847a58bf328129687","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_8930a864-7b99-4235-a812-23eaa033dbc8","section_id":"sec_e1a44a9a-8a21-4c47-98c5-08cc3c53b16d","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":10,"end":24,"exact":"Hybrid Bonding","quote":"## 3D PHYとHybrid Bonding","quote_start":0,"quote_end":24,"text_sha256":"7bdbb7845f59a048b95392743c652276e838a82fb17b8e41f6d0713cd25aae2d","block_sha256":"7bdbb7845f59a048b95392743c652276e838a82fb17b8e41f6d0713cd25aae2d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_8930a864-7b99-4235-a812-23eaa033dbc8"},{"id":"occ_dbb8a5e48499fd3906db5e9d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_a222c28d-972b-4fc7-9f39-132464d97fe3","section_id":"sec_ff1c03d4-7f08-45f3-9a49-34ee4dbe099f","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":162,"end":176,"exact":"Hybrid Bonding","quote":"e-to-Die PHY\n            ↓\n金属パッド\n            ↓\nマイクロバンプ／Hybrid Bonding\n            ↓\nインターポーザー／RDL／TSV\n            ↓\n相手側の接続端子\n            ↓\n相手側Die-to-Die PHY\n            ↓","quote_start":107,"quote_end":276,"text_sha256":"f927648c28d08d047c5b90a8457ec5f02525541517ef301127f876613bb5cfb5","block_sha256":"f927648c28d08d047c5b90a8457ec5f02525541517ef301127f876613bb5cfb5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_a222c28d-972b-4fc7-9f39-132464d97fe3"},{"id":"occ_117039f1cfd15ad02e63dbab","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_b3024cb9-1028-45d8-9181-f61ce5af9a4b","section_id":"sec_d17f0a97-9616-4658-9dbe-53d64ae256dc","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"2.5D","quote":"2D・2.5Dパッケージでは、PHYがダイの辺に沿って配置されることが多い。","quote_start":0,"quote_end":38,"text_sha256":"4bd2569870202b2222fcd4f2a19ce041bbf40b15ac4e63446876d18f71917b3b","block_sha256":"4bd2569870202b2222fcd4f2a19ce041bbf40b15ac4e63446876d18f71917b3b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_b3024cb9-1028-45d8-9181-f61ce5af9a4b"},{"id":"occ_c715f8f5ec58fd28f101f5c3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_b317e1f9-43d2-48da-980e-fcd5fa88e83e","section_id":"sec_e1a44a9a-8a21-4c47-98c5-08cc3c53b16d","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingでは、上下のダイを非常に細かなピッチで接続できる。","quote_start":0,"quote_end":39,"text_sha256":"6649a81bd25dabff27ef6fc331394734d2a3eebc78bd2bd1dfda5882d52462f8","block_sha256":"6649a81bd25dabff27ef6fc331394734d2a3eebc78bd2bd1dfda5882d52462f8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_b317e1f9-43d2-48da-980e-fcd5fa88e83e"},{"id":"occ_67fd6344735587a2d0525cc4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_b41c106b-a499-4cda-9874-49f80ef0d335","section_id":"sec_4fe72765-e766-4e3c-a659-c0cc1b77bdaa","layer":"code","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":4,"end":8,"exact":"2.5D","quote":"```\n2.5D接続\n\n┌────────────┐\n│            │PHY PHY PHY\n└────────────┘\n       ↑\n主にダイの辺を使用\n\n\n3D接続\n\n┌────────────","quote_start":0,"quote_end":108,"text_sha256":"693aa283c8a4416d900ef8a4ac61a7a6eeee074dbf066b4e94406de36d1a67e8","block_sha256":"693aa283c8a4416d900ef8a4ac61a7a6eeee074dbf066b4e94406de36d1a67e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_b41c106b-a499-4cda-9874-49f80ef0d335"},{"id":"occ_2ef236d81541e85df9d84bae","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_bfc148d2-39ba-4df9-b112-90b333046ff2","section_id":"sec_4ba610d2-9796-4580-bf12-c4fb8d8e46c2","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"**レチクル限界、Die-to-Die PHY、Hybrid Bonding、TSVから、3D V-Cache、Foveros Direct、SoIC**","quote_start":0,"quote_end":77,"text_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","block_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_bfc148d2-39ba-4df9-b112-90b333046ff2"},{"id":"occ_9afb19e0a3a1c0d316af5166","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89aecdf6-89fd-445d-a71c-7e189e82904d","work_id":"wrk_ba5a7d4f-28ea-48c9-9ce8-ad54ea806099","block_id":"blk_fd9ddde2-b168-41c8-b5f4-f9fa22309d28","section_id":"sec_e1a44a9a-8a21-4c47-98c5-08cc3c53b16d","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":73,"end":87,"exact":"Hybrid Bonding","quote":"HYより簡素な**3D I/O**や、極めて広い並列インターフェースを採用する余地が広がる。UCIe 2.0もHybrid Bondingを前提とした3D接続を規定している。([UCIe Consortium](https://www.uciexpress.org/specifications))","quote_start":18,"quote_end":167,"text_sha256":"9b0f21096d0987a10d1b78e68c5ef7457d6851bd098c1009d22c4b836e2bcbd0","block_sha256":"9b0f21096d0987a10d1b78e68c5ef7457d6851bd098c1009d22c4b836e2bcbd0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89aecdf6-89fd-445d-a71c-7e189e82904d/#blk_fd9ddde2-b168-41c8-b5f4-f9fa22309d28"},{"id":"occ_2f186599ed200b0369548c2b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499","work_id":"wrk_27247b5b-cd30-433f-9e72-ddf9cc560a98","block_id":"blk_015f4e8c-c34f-4c11-80cb-fcab25c1553d","section_id":"sec_258b1b75-cd98-4962-9d66-e345e774f966","layer":"code","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":123,"end":130,"exact":"先端パッケージ","quote":"\n先端ファブの稼働率上昇\n  ↓\n歩留まりと設計実績が改善\n  ↓\nSamsung HBM採用率上昇\n  ↓\n先端パッケージ受注\n  ↓\nDRAM / SSDへクロスセル\n  ↓\n次世代ASICも継続受注\n```","quote_start":68,"quote_end":174,"text_sha256":"3f9e73a0e4da5ae060816664d5a6e6cd452585506f44cd1af32815ece6b6ace7","block_sha256":"3f9e73a0e4da5ae060816664d5a6e6cd452585506f44cd1af32815ece6b6ace7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499/#blk_015f4e8c-c34f-4c11-80cb-fcab25c1553d"},{"id":"occ_ca726fa48fee3208da04e193","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499","work_id":"wrk_27247b5b-cd30-433f-9e72-ddf9cc560a98","block_id":"blk_0989c340-b24a-48cc-a594-cea894e28e36","section_id":"sec_13cad8a2-a2af-4171-aca0-fd6c9d8a1ef8","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":39,"end":43,"exact":"EMIB","quote":"そのためIntelのモデルは、Intel FoundryがASIC、SRAM、EMIB、Foveros、テスト、パッケージを担い、HBMはSK hynix、Samsung、Micronなど外部企業と組み合わせる**オープン統合型**である。Samsungのような完全垂直統合ではないが、","quote_start":0,"quote_end":143,"text_sha256":"afbbe2a6cd86388bb95694b6e40b7c2a778dafb8be7dd4a45e1c5b9eb568c5a4","block_sha256":"afbbe2a6cd86388bb95694b6e40b7c2a778dafb8be7dd4a45e1c5b9eb568c5a4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499/#blk_0989c340-b24a-48cc-a594-cea894e28e36"},{"id":"occ_942404e3733201b1cddf5114","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499","work_id":"wrk_27247b5b-cd30-433f-9e72-ddf9cc560a98","block_id":"blk_09c5772d-1f58-439d-9712-37f0e62275ff","section_id":"sec_97f97111-c5c3-43d1-9a0c-4aec7d679f79","layer":"code","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":114,"end":118,"exact":"2.5D","quote":"IC内部のSRAMもSamsung工程\n  ↓\nSamsung HBMを組み合わせる\n  ↓\nSamsungの2.5D / 3Dパッケージで統合\n  ↓\nラック側にSamsung DDR / SSDを供給\n```","quote_start":59,"quote_end":165,"text_sha256":"3e36b15f8d79b4a74917e8110c5da60d51302660f0b9e99bb8bd22df4c761466","block_sha256":"3e36b15f8d79b4a74917e8110c5da60d51302660f0b9e99bb8bd22df4c761466","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499/#blk_09c5772d-1f58-439d-9712-37f0e62275ff"},{"id":"occ_d29ca245118b09bbca45d7d5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499","work_id":"wrk_27247b5b-cd30-433f-9e72-ddf9cc560a98","block_id":"blk_13a4cb93-fbc3-4c92-bfc9-69835d734b61","section_id":"sec_bb74a2df-aa45-4b57-968e-4e6d1599013a","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":65,"end":72,"exact":"先端パッケージ","quote":"ーターには数十GBから数百GBのHBMが搭載される。複数のDRAMダイを積み、TSVで縦に接続し、ベースダイと先端パッケージを使い、GPUやAI ASICのすぐ横へ置く。部品一式の金額として見れば、HBMはGPU原価の中でも非常に目立つ。","quote_start":10,"quote_end":129,"text_sha256":"8e38b8b0d3167ff2bcb496212eeece055d204b23527cca5e8fbd0ee1b858d029","block_sha256":"8e38b8b0d3167ff2bcb496212eeece055d204b23527cca5e8fbd0ee1b858d029","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499/#blk_13a4cb93-fbc3-4c92-bfc9-69835d734b61"},{"id":"occ_b565300fc6fee5a39ac5185b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499","work_id":"wrk_27247b5b-cd30-433f-9e72-ddf9cc560a98","block_id":"blk_1b7a591a-c918-4e15-a434-9b59acf554ea","section_id":"sec_805cea77-5542-49ff-bf2b-a616968b7223","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":120,"end":127,"exact":"先端パッケージ","quote":"載容量の大きいHBMが最大になりやすい。\n3. **供給網の支配力**では、ファウンドリー、メモリーメーカー、先端パッケージをまとめられる企業が強くなる。","quote_start":65,"quote_end":142,"text_sha256":"78e579b9e04467f2ca14fa7d0eff2c0cacd042683f941684c9c18d4b08164b11","block_sha256":"78e579b9e04467f2ca14fa7d0eff2c0cacd042683f941684c9c18d4b08164b11","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499/#blk_1b7a591a-c918-4e15-a434-9b59acf554ea"},{"id":"occ_7f7e68f3521866dc45c7ad1b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499","work_id":"wrk_27247b5b-cd30-433f-9e72-ddf9cc560a98","block_id":"blk_457d560f-4a2d-4173-b9c1-3939d116201d","section_id":"sec_97f97111-c5c3-43d1-9a0c-4aec7d679f79","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":16,"end":23,"exact":"先端パッケージ","quote":"TSMCでもASIC、SRAM、先端パッケージまでは提供できる。しかしTSMCはHBM、DRAM、NANDを自社製品として製造していない。外部のSamsung、SK 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SRAM、HBM、先端パッケージ 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LSI、設計基盤がそろっている。Samsung自身も、メモリー、ロジック、ファウンドリー、先端パッケージを横断する「Total AI Solution」を提供できる企業であると説明している。([Samsung Global Newsroom][18])","quote_start":62,"quote_end":198,"text_sha256":"d9324d92f61cb26fef039848ddd805d30372d26d19ccec401064ee49fe626a16","block_sha256":"d9324d92f61cb26fef039848ddd805d30372d26d19ccec401064ee49fe626a16","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499/#blk_617c9b91-03a0-4a7b-8f37-14f6b7988ff7"},{"id":"occ_24aa11a3f89a4e8144f7cb5b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499","work_id":"wrk_27247b5b-cd30-433f-9e72-ddf9cc560a98","block_id":"blk_6504d05b-d793-40d0-8bd1-9b4c684cc377","section_id":"sec_450d6015-5af8-40d6-b039-b12df33fbe1e","layer":"body","character_id":null,"count":1,"matched_aliases":["ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":55,"end":67,"exact":"ハイブリッドボンディング","quote":"別の小型SRAMダイとして製造すれば、巨大な演算ダイをさらに拡大する必要はない。しかし、SRAMダイの製造費、ハイブリッドボンディング、Known 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([Reuters][16]) ([TrendForce][17])","quote_start":68,"quote_end":211,"text_sha256":"e5269b4b80b326147ec5d90ca337ac41f54bf266009f8ebe37286502833c78d2","block_sha256":"e5269b4b80b326147ec5d90ca337ac41f54bf266009f8ebe37286502833c78d2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499/#blk_8d2b7e22-643d-4aa9-b960-c4a656ddb110"},{"id":"occ_82d85275cd89f66dc4ad13a8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499","work_id":"wrk_27247b5b-cd30-433f-9e72-ddf9cc560a98","block_id":"blk_ab99f0a1-5747-44b0-823d-ffe568427ca8","section_id":"sec_b0c53337-d6e7-475e-9f3a-97e0a38b9138","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":49,"end":54,"exact":"CoWoS","quote":"1. 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インターポーザー | GPU / ASICとHBMを広い配線で接続 |\n| CoWoSなどの先端パッケージ | 大型パッケージの製造、組立、検査 |\n| HBMベースダイ | HBMスタック内部の制御、接続 |\n| テスト | HBMスタック、パッケージ全体の良品選別 |\n| 電源、熱","quote_start":13,"quote_end":173,"text_sha256":"fb87c6c7b850f5f6e8112c514c2424622700acb320b6d8cb6f88cbdeb1c5e1de","block_sha256":"fb87c6c7b850f5f6e8112c514c2424622700acb320b6d8cb6f88cbdeb1c5e1de","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499/#blk_c90e693f-aa22-49cf-b951-372b90977663"},{"id":"occ_b7da01793ad689622cbb1fd5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499","work_id":"wrk_27247b5b-cd30-433f-9e72-ddf9cc560a98","block_id":"blk_ca7feeb5-27a3-406e-95a2-859828f2d24e","section_id":"sec_afff5344-7d94-4186-95ff-5d2fe8975953","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":83,"end":90,"exact":"先端パッケージ","quote":"さらに大きな存在になる。1bit当たりの単価ではSRAMほど高くなくても、**AIシステムのBOMではHBMと先端パッケージが最も目立つ**。","quote_start":28,"quote_end":99,"text_sha256":"b4094e96a06b9f12b6f98ed8601042dda8852aebd04f6b1c4542d03cc9cdac8c","block_sha256":"b4094e96a06b9f12b6f98ed8601042dda8852aebd04f6b1c4542d03cc9cdac8c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499/#blk_ca7feeb5-27a3-406e-95a2-859828f2d24e"},{"id":"occ_3f4f0be0fcee9c71754a23af","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499","work_id":"wrk_27247b5b-cd30-433f-9e72-ddf9cc560a98","block_id":"blk_e7fa9455-fd57-4573-9974-33e241e0786e","section_id":"sec_13cad8a2-a2af-4171-aca0-fd6c9d8a1ef8","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","EMIB"],"evidence":{"text_basis":"markdown","start":104,"end":108,"exact":"EMIB","quote":"を採用し、AI、HPC向けの先端SRAM、ロジック、低電圧動作を提供する。Intel Foundryはさらに、EMIBとFoverosによる2.5D、3Dパッケージを外部顧客にも提供している。([Intel][13])","quote_start":49,"quote_end":158,"text_sha256":"87dea97f4456f8b6fb4a88de00906025f316c175e18ada19f6b0762131ba2c7a","block_sha256":"87dea97f4456f8b6fb4a88de00906025f316c175e18ada19f6b0762131ba2c7a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_89eb6a8e-70dd-4f87-9da4-213e9ac3f499/#blk_e7fa9455-fd57-4573-9974-33e241e0786e"},{"id":"occ_a0219c9a7ce8cc3ba7416d9d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_8c9a8f7a-e00e-4b6d-b58d-ba3e89e02608","work_id":"wrk_a3440338-a420-4877-947f-8193ae66700c","block_id":"blk_bdf590a2-0ef7-4f92-b5de-d5b734120937","section_id":"sec_74ad8966-bc82-490a-b673-ea77051b79bf","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":115,"end":122,"exact":"先端パッケージ","quote":"ではありません。AI単体には欲望も無意識もありません。しかし、AIという現象を成立させるには、GPU、HBM、先端パッケージ、データセンター、電力、冷却、ネットワーク、ストレージが必要です。","quote_start":60,"quote_end":155,"text_sha256":"3556bde458f61b5d64812fb21bd1ce62e721aefa9fb6d3b51cd5e2a235158bb4","block_sha256":"3556bde458f61b5d64812fb21bd1ce62e721aefa9fb6d3b51cd5e2a235158bb4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_8c9a8f7a-e00e-4b6d-b58d-ba3e89e02608/#blk_bdf590a2-0ef7-4f92-b5de-d5b734120937"},{"id":"occ_a8ff735117ecfb47fb08dc9c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_8f8ffd4e-00d7-47a6-9906-ce0fa86b3835","work_id":"wrk_eaab3954-2ccc-46a2-902f-fbbd679471b9","block_id":"blk_375abcf5-0544-4851-a7ed-d9f7e61cf6be","section_id":"sec_685e719e-7712-4bda-aded-4ab2ae280bc4","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":25,"end":32,"exact":"先端パッケージ","quote":"- 中国向けNVIDIA売上\n- HBM輸出\n- 先端パッケージ\n- 半導体製造装置\n- 第三国クラウド\n- 中国企業向け海外データセンター","quote_start":0,"quote_end":70,"text_sha256":"faf770467ae40f89ccd29e453b32b2e7e1d6feaa5a120f9688c8e16d247bc2ea","block_sha256":"faf770467ae40f89ccd29e453b32b2e7e1d6feaa5a120f9688c8e16d247bc2ea","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_8f8ffd4e-00d7-47a6-9906-ce0fa86b3835/#blk_375abcf5-0544-4851-a7ed-d9f7e61cf6be"},{"id":"occ_7376ae22ff193e71bde43d1c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_8f8ffd4e-00d7-47a6-9906-ce0fa86b3835","work_id":"wrk_eaab3954-2ccc-46a2-902f-fbbd679471b9","block_id":"blk_cae6f069-5de8-4c99-a64d-15dc7f271c05","section_id":"sec_9542819c-0a26-4298-ac66-03c386320e18","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":69,"end":76,"exact":"先端パッケージ","quote":" 第三国のデータセンター\n- クラウド経由の遠隔利用\n- 仲介企業\n- GPUの位置・利用者確認\n- HBMと先端パッケージ\n- モデル蒸留用の大量APIアクセス","quote_start":14,"quote_end":95,"text_sha256":"5e18cb0c518fe1452fc164b894159ab779e435894cd39a92cd4a8851dcfa1058","block_sha256":"5e18cb0c518fe1452fc164b894159ab779e435894cd39a92cd4a8851dcfa1058","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_8f8ffd4e-00d7-47a6-9906-ce0fa86b3835/#blk_cae6f069-5de8-4c99-a64d-15dc7f271c05"},{"id":"occ_a63850624181bec30e491379","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_90fb7b96-f10b-43df-a612-0c23e8a50740","work_id":"wrk_0c4c3acf-0221-4d96-87a4-771da7ba1e3a","block_id":"blk_6fe30772-1e8f-4e38-800d-23531d379f2c","section_id":"sec_1390d6ef-a922-4923-8410-04cbac5aff39","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":24,"end":31,"exact":"先端パッケージ","quote":"AI工場が増えるなら、GPUだけでなく、HBM、先端パッケージ、ABF基板、高多層PCB、HVLP/VLP銅箔、コネクタ、液冷部材、電源モジュール、VRM、MLCC、インダクタ、光トランシーバ、CPO、ラック、変圧器、データセンター建設、電力インフラまで需要が広","quote_start":0,"quote_end":131,"text_sha256":"d92245a423963be18d8c73552c7df0a509ddb092975a25473b0b48406c476e81","block_sha256":"d92245a423963be18d8c73552c7df0a509ddb092975a25473b0b48406c476e81","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_90fb7b96-f10b-43df-a612-0c23e8a50740/#blk_6fe30772-1e8f-4e38-800d-23531d379f2c"},{"id":"occ_65274a384fe8c6f28308ff13","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_91468364-fe9d-4ab5-a6dc-f203e89bc64a","work_id":"wrk_c22379bc-7081-4f8f-a3e9-4418f450cf96","block_id":"blk_fcd1cb79-460a-47c8-9b6d-6539b864a3bf","section_id":"sec_fcae4a11-267f-4617-8297-32eb74ebfb76","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":30,"end":35,"exact":"CoWoS","quote":"現状、AIインフラはNVIDIA GPU、TSMC、HBM、CoWoS、電力、冷却、ネットワークに強く依存しています。TeslaもxAIもSpaceXも、将来AIを巨大化させるにはチップが足りません。","quote_start":0,"quote_end":100,"text_sha256":"ac48a0fa45a559e04371d9db9ec5af801f65eb97d876c685ab1833ff5814ec08","block_sha256":"ac48a0fa45a559e04371d9db9ec5af801f65eb97d876c685ab1833ff5814ec08","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_91468364-fe9d-4ab5-a6dc-f203e89bc64a/#blk_fcd1cb79-460a-47c8-9b6d-6539b864a3bf"},{"id":"occ_684c6135ba620766b9e38110","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_1461217f-59f2-4a3b-a0db-6d6135186442","section_id":"sec_6791e185-d3c1-4beb-a51a-c616a6d5829a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":49,"end":54,"exact":"CoWoS","quote":"ただし、これはAI半導体市場にとって悪い話ではありません。\nむしろ、供給制約が続くことで、HBM、CoWoS、光通信、電源、冷却、変電設備の価格・利益率・長期契約が強くなりやすい。","quote_start":0,"quote_end":90,"text_sha256":"1d78292d20cf60f9dc73db00d4a5ef8fb17e1e37f730af2273273e44373f63de","block_sha256":"1d78292d20cf60f9dc73db00d4a5ef8fb17e1e37f730af2273273e44373f63de","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_1461217f-59f2-4a3b-a0db-6d6135186442"},{"id":"occ_33cba6efaf3c446bc839aed4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_381ba807-6dda-4c8a-a699-b3515258c909","section_id":"sec_56dd1691-fff8-4093-a7e6-52ce4f4ec3ee","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":22,"end":27,"exact":"CoWoS","quote":"このうち短期で最も強いのは、**HBM + CoWoS + 電力**です。","quote_start":0,"quote_end":37,"text_sha256":"8f33b2791d8204cc12851785d2c4f8d9c405a465b1877115adb53218e0db9779","block_sha256":"8f33b2791d8204cc12851785d2c4f8d9c405a465b1877115adb53218e0db9779","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_381ba807-6dda-4c8a-a699-b3515258c909"},{"id":"occ_fbd400bd339eb6d18472a9ba","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_3c839a2d-e989-43f6-98e7-3ae86c178234","section_id":"sec_a5513451-d834-4c9b-8dba-257496767a66","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":52,"end":57,"exact":"CoWoS","quote":"特に主権AI用の独自ASICが増えると、GPU需要を一部代替する一方で、**TSMC先端ノード、HBM、CoWoSを同じように奪い合う**ことになります。つまりASIC化はGPU不足を緩和しても、パッケージとHBM不足を緩和するとは限りません。","quote_start":0,"quote_end":122,"text_sha256":"bb960d7c3ee5580226db3d4bb66c24dfa20ea1213de31472ef1d8aa0522bed73","block_sha256":"bb960d7c3ee5580226db3d4bb66c24dfa20ea1213de31472ef1d8aa0522bed73","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_3c839a2d-e989-43f6-98e7-3ae86c178234"},{"id":"occ_bd8dd636bb7c2aa8c0f8b84b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_54325d84-7e1b-4bc5-9cfd-4015faf65ba1","section_id":"sec_6791e185-d3c1-4beb-a51a-c616a6d5829a","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":17,"end":22,"exact":"CoWoS","quote":"一番の制約は、短期では**HBMとCoWoS**。\n中期では**電力、変電、液冷、光通信**。\n長期では**運用人材と評価基盤**です。","quote_start":0,"quote_end":68,"text_sha256":"61cea8d73a3716482a3a8c658b1ec78d0920e29eed88a86d7679fc2ba44e4ba0","block_sha256":"61cea8d73a3716482a3a8c658b1ec78d0920e29eed88a86d7679fc2ba44e4ba0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_54325d84-7e1b-4bc5-9cfd-4015faf65ba1"},{"id":"occ_debd5f0aa01d9b2239df0853","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_6a26059f-54be-4145-a7e0-45c7163aaed4","section_id":"sec_a5513451-d834-4c9b-8dba-257496767a66","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":6,"end":11,"exact":"CoWoS","quote":"## 3. CoWoS/先端パッケージもまだ詰まる","quote_start":0,"quote_end":25,"text_sha256":"3f100e745474a397d7aa0f1b06e2b6ead3eaf2fd02ee858d72af2b6ab2551d9d","block_sha256":"3f100e745474a397d7aa0f1b06e2b6ead3eaf2fd02ee858d72af2b6ab2551d9d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_6a26059f-54be-4145-a7e0-45c7163aaed4"},{"id":"occ_8361d5584a1d0eaf83823f69","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_6adf485b-286f-4f1b-8f2b-ccfab3c63604","section_id":"sec_1a3c7ed6-0942-4f08-ba6c-52a6e0a02e56","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":232,"end":237,"exact":"CoWoS","quote":"要は、GPU、ASIC、HBM、光通信、電力、冷却への追加需要を作り得る。\n- 最大の制約は、短期ではHBMとCoWoS、中期では電力・変電・液冷・施工、長期では運用人材と評価基盤である。","quote_start":177,"quote_end":271,"text_sha256":"bb57825af9ab317e2ec9f683728c58579b1dc26943d4719ad2aa8f24dde5c3cf","block_sha256":"bb57825af9ab317e2ec9f683728c58579b1dc26943d4719ad2aa8f24dde5c3cf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_6adf485b-286f-4f1b-8f2b-ccfab3c63604"},{"id":"occ_79575559933fbd932f220e91","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_7d139998-5f25-445d-8ed1-46f7f9b1946c","section_id":"sec_39893bbf-0dd3-4a2f-9695-4497069d4b11","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":93,"end":98,"exact":"CoWoS","quote":"たくなる\n  ↓\nGPU / ASIC / HBM / eSSD / 光通信需要が増える\n  ↓\n電力、冷却、CoWoS、運用人材が制約になる\n  ↓\n主権AIはモデル政策からインフラ政策へ変わる\n```","quote_start":38,"quote_end":140,"text_sha256":"5ee8bfedf12abe10c46e5c05e64b655692e29697602a54e39ed44c6e1b46398e","block_sha256":"5ee8bfedf12abe10c46e5c05e64b655692e29697602a54e39ed44c6e1b46398e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_7d139998-5f25-445d-8ed1-46f7f9b1946c"},{"id":"occ_6ad62a1c5b50122159aa2530","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_807a6482-34c0-42b3-b804-6781ebab390c","section_id":"sec_317cfc6b-89ab-45c8-89b8-930029775bde","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":32,"end":39,"exact":"先端パッケージ","quote":"* HBM：SK hynix、Samsung、Micron\n* 先端パッケージ：TSMC、ASE、Amkor、素材・装置\n* 光通信：Broadcom、Marvell、Coherent、Lumentum、InP/SiPh関連\n* 電源：Delta、Vertiv、Schneide","quote_start":0,"quote_end":139,"text_sha256":"eac02fedb6de2e440d779b75cc5631f370a36aa706bfa009bbfed5bd42485980","block_sha256":"eac02fedb6de2e440d779b75cc5631f370a36aa706bfa009bbfed5bd42485980","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_807a6482-34c0-42b3-b804-6781ebab390c"},{"id":"occ_4396f4945ea7b6f686f9b726","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_9364d4fe-84a4-48bc-a6b0-4be6656fd452","section_id":"sec_a5513451-d834-4c9b-8dba-257496767a66","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":26,"end":31,"exact":"CoWoS","quote":"AIチップはロジックダイとHBMを近接接続するため、CoWoSなどの先端パッケージを必要とします。ここも強い制約です。","quote_start":0,"quote_end":59,"text_sha256":"55f15645099cd3779a8668f6d47c7a0a10e6fb0ddcedb6a31d39c1051c520c13","block_sha256":"55f15645099cd3779a8668f6d47c7a0a10e6fb0ddcedb6a31d39c1051c520c13","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_9364d4fe-84a4-48bc-a6b0-4be6656fd452"},{"id":"occ_945d0f00670e781bd3c6dd18","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_a60b8b5b-a0d1-4c0f-b8a3-1461e21f44b6","section_id":"sec_a5513451-d834-4c9b-8dba-257496767a66","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":5,"end":10,"exact":"CoWoS","quote":"TSMCはCoWoS能力を2022〜2027年に年率80%超で増やす見通しを示しています。([Reuters][16])\n一方で、Broadcomは2026年の供給制約について、TSMCの生産能力がボトルネックになってい","quote_start":0,"quote_end":110,"text_sha256":"cba47f34904f0e4ff872707e0619faee50da84efac1a5d59cf9e3b091d82748d","block_sha256":"cba47f34904f0e4ff872707e0619faee50da84efac1a5d59cf9e3b091d82748d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_a60b8b5b-a0d1-4c0f-b8a3-1461e21f44b6"},{"id":"occ_f344f57824d661d60ede0b2c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_a956f0ac-3f60-462f-8ddf-7c15a241ca74","section_id":"sec_1d4068ec-3624-4876-a806-21820b060b4d","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":279,"end":284,"exact":"CoWoS","quote":"    | 2026〜2028 | 2026供給は実質売り切れ。HBM4歩留まりも鍵 |\n|   3 | **CoWoS/先端パッケージ** | 2026〜2028 | 増産中だが需要も増える              |\n|   4 | **TSMC先端ノード**     | 2026〜2028 | GPU/ASIC","quote_start":224,"quote_end":384,"text_sha256":"3ae8a6c887135a8fefa7252e6b790b5c23644c788b5ef594092cdb3b253aaacf","block_sha256":"3ae8a6c887135a8fefa7252e6b790b5c23644c788b5ef594092cdb3b253aaacf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_a956f0ac-3f60-462f-8ddf-7c15a241ca74"},{"id":"occ_5dff4bc6253b9ee32576642a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_bac366e5-9e85-4c05-9762-edbe13fcd270","section_id":"sec_a5513451-d834-4c9b-8dba-257496767a66","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":22,"end":27,"exact":"CoWoS","quote":"TrendForce系の報道では、TSMCのCoWoS月産能力は2026年に12万〜14万枚、OSAT分を含めると業界全体で20万枚/月に近づく可能性が示されています。([TrendForce][18])\nただし、これは「全部が同じ難度で使える」という意","quote_start":0,"quote_end":127,"text_sha256":"ef711b77d7c772a28c9b9a817060577df9e27db210eb3e0abfdc8a48375e06b4","block_sha256":"ef711b77d7c772a28c9b9a817060577df9e27db210eb3e0abfdc8a48375e06b4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_bac366e5-9e85-4c05-9762-edbe13fcd270"},{"id":"occ_0d93ed65e020e5fc04388900","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_c66af031-318e-4fe1-a09f-65ed7ea07379","section_id":"sec_1d4068ec-3624-4876-a806-21820b060b4d","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":17,"end":22,"exact":"CoWoS","quote":"短期で価格を押し上げるのはHBMとCoWoS。\n中期で立ち上げを遅らせるのは電力・冷却・施工。\n長期で主権AIの実効性を左右するのは人材・運用・評価基盤です。","quote_start":0,"quote_end":79,"text_sha256":"eb1f3f06ce9b9a1043656b89df13e0eb8cba4fc6aa702f5c28486b0ad656b7a7","block_sha256":"eb1f3f06ce9b9a1043656b89df13e0eb8cba4fc6aa702f5c28486b0ad656b7a7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_c66af031-318e-4fe1-a09f-65ed7ea07379"},{"id":"occ_f3c6d79cb08662ad366ac889","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_92ff5158-6c34-4526-ab02-c8db8332951f","work_id":"wrk_ea89805e-b45e-4a9c-b22a-29b168da02ed","block_id":"blk_ee4e1b95-d1ae-4d17-a420-ac3ed562b9bb","section_id":"sec_56dd1691-fff8-4093-a7e6-52ce4f4ec3ee","layer":"body","character_id":null,"count":5,"matched_aliases":["CoWoS","EMIB","SoIC","先端パッケージ"],"evidence":{"text_basis":"markdown","start":222,"end":229,"exact":"先端パッケージ","quote":"HBM     | SK hynix、Samsung、MicronのHBM3E/HBM4供給     |\n| 先端パッケージ | CoWoS、CoWoS-L、SoIC、EMIB、OSAT能力           |\n| 基板・PCB  | 高多層基板、光トランシーバ用PCB                        |","quote_start":167,"quote_end":329,"text_sha256":"ca063e62e3df4075c7d8df2670646cf5b107cb4e87b77be7af1bf47eb1b70c4b","block_sha256":"ca063e62e3df4075c7d8df2670646cf5b107cb4e87b77be7af1bf47eb1b70c4b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_92ff5158-6c34-4526-ab02-c8db8332951f/#blk_ee4e1b95-d1ae-4d17-a420-ac3ed562b9bb"},{"id":"occ_7bf46517b475ea063bbac6f0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2","work_id":"wrk_228fe0c3-5d85-464c-a552-3fc44644e181","block_id":"blk_bbc2138f-7c03-44a3-b8cc-4c66a0eb03e7","section_id":"sec_d992ecbd-b1ad-4cbe-86b8-27885c89b89f","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":300,"end":305,"exact":"CoWoS","quote":"  | 中     |\n| 台湾  | TSMC            |     2330 | COUPE、CoWoS、CPO     | S   | 低     |\n| 台湾  | ASE             | 3711／ASX | CPOパッケージ            | S   | 低     |\n| ","quote_start":245,"quote_end":405,"text_sha256":"459caf946c5d73829d66e475cc099620a13d06cb7dc04e1975dc6c11d54f966a","block_sha256":"459caf946c5d73829d66e475cc099620a13d06cb7dc04e1975dc6c11d54f966a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9330c0a6-6c9f-45f7-a40e-ddd1678a57a2/#blk_bbc2138f-7c03-44a3-b8cc-4c66a0eb03e7"},{"id":"occ_aeb9444bedd66aae724aa36d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_9369ec68-2723-4ee0-81f8-c835d3d59ac8","work_id":"wrk_8f40984a-d96e-441d-8ace-83f20958435a","block_id":"blk_a98ad28e-95f9-4a3e-8730-05710bb19590","section_id":"sec_b3000ffa-b1f5-464d-bcc4-6067910395bc","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":36,"end":43,"exact":"先端パッケージ","quote":"主権AIは、半導体企業にとって追い風だ。  \nメモリ、GPU、ASIC、先端パッケージング、製造装置、データセンター、電力インフラには国家予算が流れる。","quote_start":0,"quote_end":76,"text_sha256":"0337635efc0e493a6fef9bb947356cae739c509bc4fd3e3f00a65d901fa21dd3","block_sha256":"0337635efc0e493a6fef9bb947356cae739c509bc4fd3e3f00a65d901fa21dd3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9369ec68-2723-4ee0-81f8-c835d3d59ac8/#blk_a98ad28e-95f9-4a3e-8730-05710bb19590"},{"id":"occ_718249052643476d5e881dc9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_1635bad8-6595-4629-8b2a-1e0d1fa9e708","section_id":"sec_8cc1538e-9ba8-4789-b55a-a22a135575a3","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":46,"end":51,"exact":"CoWoS","quote":"ただし、NVIDIAは供給網の支配力が強い一方で、必要な部材も最も多いです。GPU、HBM、CoWoS、NVSwitch、NIC、DPU、光接続、液冷ラック、電力まで絡むため、どこか一つが詰まるとラック全体の出荷に影響します。","quote_start":0,"quote_end":113,"text_sha256":"95c667b1e9e0dccaeb59642c33516129e39710c7281bfc2e2cff0f612868bc8e","block_sha256":"95c667b1e9e0dccaeb59642c33516129e39710c7281bfc2e2cff0f612868bc8e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_1635bad8-6595-4629-8b2a-1e0d1fa9e708"},{"id":"occ_ab7229885f1e7ddede4c0b4a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_23a1648b-b537-41c6-9497-ee5c614dc587","section_id":"sec_9678b8f9-82e3-4228-9162-e64119936cc3","layer":"code","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":106,"end":113,"exact":"先端パッケージ","quote":"ensando NIC、ROCm、Heliosを組み合わせる戦略\n・台湾エコシステムへの100億ドル超投資\n・先端パッケージ、基板、ODM連携の強化\n```","quote_start":51,"quote_end":129,"text_sha256":"8999a5e6954c6a531a86422e2667fe75a8c73348799968d8c951023c75da3882","block_sha256":"8999a5e6954c6a531a86422e2667fe75a8c73348799968d8c951023c75da3882","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_23a1648b-b537-41c6-9497-ee5c614dc587"},{"id":"occ_cc1f1fcfcbad4ccb202c9724","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_2c6b5451-5aa6-4c21-9a20-d513346d0e07","section_id":"sec_8cc1538e-9ba8-4789-b55a-a22a135575a3","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":20,"end":27,"exact":"先端パッケージ","quote":"これは、NVIDIAがTSMC、HBM、先端パッケージ、基板、サーバーODM、ネットワーク部品などをかなり先まで押さえていることを示します。単にGPUを売るだけでなく、Vera CPU、Rubin GPU、NVLink、ConnectX、BlueFiel","quote_start":0,"quote_end":127,"text_sha256":"3c69f145cbff2080fa48dfc406988b858cf05e2f6b2b6aaccf82b385fd887b8d","block_sha256":"3c69f145cbff2080fa48dfc406988b858cf05e2f6b2b6aaccf82b385fd887b8d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_2c6b5451-5aa6-4c21-9a20-d513346d0e07"},{"id":"occ_dc013660eb5efd6026b30458","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_32bb7908-5976-4f9f-bfe3-6fcbd901e97b","section_id":"sec_73474999-c3ed-43a9-8c63-e9b251832b04","layer":"code","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":16,"end":23,"exact":"先端パッケージ","quote":"```\nTSMC N2/N3枠\n先端パッケージ枠\n基板\nメモリ\nテスト/後工程\n```","quote_start":0,"quote_end":43,"text_sha256":"ad58ccce3e4b13cc192a789e3d571af196a96c1d1597fcb6c9008742e9a6edba","block_sha256":"ad58ccce3e4b13cc192a789e3d571af196a96c1d1597fcb6c9008742e9a6edba","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_32bb7908-5976-4f9f-bfe3-6fcbd901e97b"},{"id":"occ_7ceb32cf9dc07104cbba6c85","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_3d45886c-1f78-4f4f-b8e0-1b44ebd35c13","section_id":"sec_9678b8f9-82e3-4228-9162-e64119936cc3","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":9,"end":14,"exact":"CoWoS","quote":"```\n・HBM/CoWoS/基板/ODMの確保力はNVIDIAほど圧倒的ではない\n・MI400/MI450X、Heliosの供給網はこれから本格立ち上げ\n・ROCmやラック運用実績はNVIDIA CUDA/DGX系に比べて追う","quote_start":0,"quote_end":114,"text_sha256":"b7928f59d333a341b45019b51e3952acdc6a492dd8b7bc5dd55fcdbca21a7779","block_sha256":"b7928f59d333a341b45019b51e3952acdc6a492dd8b7bc5dd55fcdbca21a7779","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_3d45886c-1f78-4f4f-b8e0-1b44ebd35c13"},{"id":"occ_7fd0937f840f9eb9c2c8099c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_43805c29-0597-49cd-a983-d40fb2bdf146","section_id":"sec_92332045-5bba-42b3-8514-8957bb52a9a1","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":97,"end":102,"exact":"CoWoS","quote":"、SK Telecomなどの初期パートナー\n・TSMC 3nm採用で、N2よりは成熟した先端ノード\n・HBM/CoWoS依存が小さい\n・DDR5、PCIe、CXL中心で標準サーバー部材に近い\n・Lenovo、Quantaなどサーバーシステム協業の報道\n```","quote_start":42,"quote_end":171,"text_sha256":"71309dff53ce43a27b585c2c7c70fb0d3771c45a05573d42b1c61e30b5a34822","block_sha256":"71309dff53ce43a27b585c2c7c70fb0d3771c45a05573d42b1c61e30b5a34822","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_43805c29-0597-49cd-a983-d40fb2bdf146"},{"id":"occ_f796382482a578ef4051f964","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_57ecf609-7a9e-4640-8208-c8151e85a62d","section_id":"sec_73474999-c3ed-43a9-8c63-e9b251832b04","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":58,"end":65,"exact":"先端パッケージ","quote":"重要なのは、CPUだけでなくAI ASIC、GPU、ネットワークチップ、HBMベースダイなども同じ先端ノードや先端パッケージを取り合うことです。","quote_start":3,"quote_end":75,"text_sha256":"421f64f7cea9b672ed6f3c338e0f2144fe9d248577b0eb493bcb851a7e452d08","block_sha256":"421f64f7cea9b672ed6f3c338e0f2144fe9d248577b0eb493bcb851a7e452d08","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_57ecf609-7a9e-4640-8208-c8151e85a62d"},{"id":"occ_3c76847230f51e86b1250c2f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_60ac0458-b01a-448e-a400-76fc78b0b5ed","section_id":"sec_73c88c5c-d00f-4152-a231-fb3b751d4978","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":50,"end":57,"exact":"先端パッケージ","quote":"そして供給面では、NVIDIAが最も強いです。1190億ドル規模の供給関連コミットメントは、HBM、先端パッケージ、TSMC、基板、ODM、ラック全体を押さえる力を示します。([SEC](https://www.sec.gov/Archives/edgar/data/1045810/000104581026000","quote_start":0,"quote_end":157,"text_sha256":"0de20a5286c94fd7841b33a4c04b001aa1438a5e0935a44353f7dbe91a75ea6f","block_sha256":"0de20a5286c94fd7841b33a4c04b001aa1438a5e0935a44353f7dbe91a75ea6f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_60ac0458-b01a-448e-a400-76fc78b0b5ed"},{"id":"occ_e94b4cf7aa5c15085b325c89","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_7d6ceb4a-32f1-415c-b2eb-830da75df242","section_id":"sec_9678b8f9-82e3-4228-9162-e64119936cc3","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":95,"end":102,"exact":"先端パッケージ","quote":"ています。Reutersによると、AMDはASE、SPIL、PTI、Wiwynnなどの台湾パートナーと協力し、先端パッケージ、基板、製造インフラを拡大し、CPU需要の高まりに対応する方針です。Lisa Su氏は、CPU供給は2026年を通じて四半期ごとに増え、2027年から2029年にかけても大きな拡張を計画していると述べ","quote_start":40,"quote_end":202,"text_sha256":"654ec76cc42388b19e414a876d0931ba2e01ac9ecdbf18de719187df198cdd6a","block_sha256":"654ec76cc42388b19e414a876d0931ba2e01ac9ecdbf18de719187df198cdd6a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_7d6ceb4a-32f1-415c-b2eb-830da75df242"},{"id":"occ_a43ffbb0d82c503e46c6a2ea","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_8df89e6e-4b6c-41c5-91eb-01f9659993fd","section_id":"sec_8cc1538e-9ba8-4789-b55a-a22a135575a3","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":44,"end":49,"exact":"CoWoS","quote":"```\n・圧倒的な売上規模\n・高ASP、高粗利\n・HBMメーカーへの影響力\n・TSMC/CoWoS枠の優先確保\n・NVLink/NIC/DPU/スイッチまで自社で持つ\n・ハイパースケーラーからの長期需要\n```","quote_start":0,"quote_end":105,"text_sha256":"7d9e285679d717aeda8c66a143ef9489a231a470ba42ce7a8941f7669727cfcd","block_sha256":"7d9e285679d717aeda8c66a143ef9489a231a470ba42ce7a8941f7669727cfcd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_8df89e6e-4b6c-41c5-91eb-01f9659993fd"},{"id":"occ_8ca367bcae3f6463d82d367e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_9959062f-1614-4155-8579-46d6e0cd839d","section_id":"sec_9af95fb3-8aa0-4929-9174-d043cad8e302","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":213,"end":218,"exact":"CoWoS","quote":"給確度は非常に高い\n\nNVIDIA Vera / Rubin\n  = 供給確保力は最強\n  = ただしHBM、CoWoS、液冷、電力まで絡むため最も重い\n```","quote_start":158,"quote_end":238,"text_sha256":"89d698a28bd4afd29ea13f7b842a4bd500a095e7533386d15bb79cf53640fd1d","block_sha256":"89d698a28bd4afd29ea13f7b842a4bd500a095e7533386d15bb79cf53640fd1d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_9959062f-1614-4155-8579-46d6e0cd839d"},{"id":"occ_b017e658c352bbf1645825d9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_a7fcac5e-5edd-4c55-82f7-e61acd3739ae","section_id":"sec_71cadbe3-9c3b-4662-a80c-ee600da87d0e","layer":"code","character_id":null,"count":1,"matched_aliases":["先端実装"],"evidence":{"text_basis":"markdown","start":45,"end":49,"exact":"先端実装","quote":"```\n・18Aの歩留まり\n・先端量産の安定性\n・外部顧客の信頼獲得\n・Foverosなど先端実装の量産性\n・TSMCに対する性能/電力/コスト競争\n```","quote_start":0,"quote_end":78,"text_sha256":"1ed8fb88e83fd0812198ffc590ecab0f0466acf296e8299fd4a41acbce25d0f9","block_sha256":"1ed8fb88e83fd0812198ffc590ecab0f0466acf296e8299fd4a41acbce25d0f9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_a7fcac5e-5edd-4c55-82f7-e61acd3739ae"},{"id":"occ_956207c42849494a37fc5130","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_b9c41a80-784e-412b-8e48-2d56afd87069","section_id":"sec_86d7bb2e-0c83-40ee-bba4-4a5db8633469","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":33,"end":40,"exact":"先端パッケージ","quote":"つまりCPU競争は、**チップの設計競争であると同時に、TSMC・先端パッケージ・メモリ・基板・ODMを押さえる供給戦**です。","quote_start":0,"quote_end":64,"text_sha256":"98676466e6da27bb984f0410b695e3a1976c62de3041f9b77c75f3da1e145080","block_sha256":"98676466e6da27bb984f0410b695e3a1976c62de3041f9b77c75f3da1e145080","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_b9c41a80-784e-412b-8e48-2d56afd87069"},{"id":"occ_f7b5bad858b9c03f04cbaa2b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_c3e0e826-7e78-47ef-a88b-1315e917c748","section_id":"sec_a932bbdb-5dfe-4d72-8505-edbe95be1e34","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS","SoIC","先端パッケージ"],"evidence":{"text_basis":"markdown","start":51,"end":56,"exact":"CoWoS","quote":"NVIDIA Vera Rubinの場合は、Vera CPUだけでなく、Rubin GPU、HBM4、CoWoS/SoIC系先端パッケージ、NVLink Switch、ConnectX、BlueField、Spectrum、光接続、液冷ラックまで絡みます。したがって、部材構成はArm AGI CPUよりはるかに","quote_start":0,"quote_end":156,"text_sha256":"e8a228c7b40c625b3266ce59c27b4876171e13ef5f3d3d122ac102383dd017b2","block_sha256":"e8a228c7b40c625b3266ce59c27b4876171e13ef5f3d3d122ac102383dd017b2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_c3e0e826-7e78-47ef-a88b-1315e917c748"},{"id":"occ_9cd808c0bc26410c000ac8b1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_c706f5d2-2695-4927-b308-c6db3315a050","section_id":"sec_9af95fb3-8aa0-4929-9174-d043cad8e302","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":52,"end":57,"exact":"CoWoS","quote":"Arm AGI CPUは、製造面ではNVIDIA Vera Rubinほど重くありません。  \nHBMやCoWoSを大量に使うAI GPUではなく、TSMC 3nm、DDR5、PCIe Gen6、CXL 3.0を中心とした標準I/O型CPUだからです。","quote_start":0,"quote_end":126,"text_sha256":"e8601c9d04fe301d6808da10784524f22d4dbf6f9fa9b087f60322de21efc8b6","block_sha256":"e8601c9d04fe301d6808da10784524f22d4dbf6f9fa9b087f60322de21efc8b6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_c706f5d2-2695-4927-b308-c6db3315a050"},{"id":"occ_9af2983fe72f01f2be8c124f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_c8a8447a-4b3b-4770-b9de-51570b700947","section_id":"sec_5c8b4f0d-9789-4afb-8668-cb53f6628f5c","layer":"code","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":86,"end":93,"exact":"先端パッケージ","quote":"スできない\n・SMIC/Hua HongのDUV多重露光に依存\n・歩留まり、電力効率、コストが不利\n・HBM、先端パッケージ、EDA、検査装置にも制約\n```","quote_start":31,"quote_end":110,"text_sha256":"4d199296d994e995885f7de03e5497544d3520ea8f8342e864cd7904b02a663f","block_sha256":"4d199296d994e995885f7de03e5497544d3520ea8f8342e864cd7904b02a663f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_c8a8447a-4b3b-4770-b9de-51570b700947"},{"id":"occ_638912b7627a61a511040a8e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_d13e6d54-ae7b-4ec2-897b-c21cb7bff913","section_id":"sec_b797d78c-2c57-4558-840b-0d8b2e2b35dc","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":210,"end":217,"exact":"先端パッケージ","quote":"方向です。AMDは台湾エコシステムへの100億ドル超の投資で、Venice、MI450X、Heliosラック、先端パッケージ、基板、ODM製造能力を拡大すると説明しています。([Reuters](https://www.reuters.com/world/asia-pacific/amd-asking-partners-r","quote_start":155,"quote_end":317,"text_sha256":"6f5deb6d85c552edc99bbb63bbab8da6e225ffff91563e1ae6bd28bb209bc768","block_sha256":"6f5deb6d85c552edc99bbb63bbab8da6e225ffff91563e1ae6bd28bb209bc768","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_d13e6d54-ae7b-4ec2-897b-c21cb7bff913"},{"id":"occ_7279b9f5e243eb96832d5936","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_d356b7a7-a86c-42bc-ad75-1ae3fa453ab7","section_id":"sec_86d7bb2e-0c83-40ee-bba4-4a5db8633469","layer":"code","character_id":null,"count":3,"matched_aliases":["CoWoS","SoIC","先端パッケージ"],"evidence":{"text_basis":"markdown","start":55,"end":62,"exact":"先端パッケージ","quote":"```\n先端ロジック製造能力\n  TSMC N3 / N2 / N2P / A16、Intel 18Aなど\n\n先端パッケージ\n  CoWoS、SoIC、EFB、Foverosなど\n\nメモリ\n  DDR5、MRDIMM、LPDDR5X/SOCAMM、HBM\n\n基板\n  ABF基板、高多層基板、AIラック向け大型基板\n\nI/O","quote_start":0,"quote_end":162,"text_sha256":"8967db1fd9f4f8e1571382e915af10aa02e2aa433385ef4d2e60effaa36eb90a","block_sha256":"8967db1fd9f4f8e1571382e915af10aa02e2aa433385ef4d2e60effaa36eb90a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_d356b7a7-a86c-42bc-ad75-1ae3fa453ab7"},{"id":"occ_a999a7c4a552a414355b8035","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4","work_id":"wrk_95f3adb2-9ef8-4c60-8a3b-5ded0268dac4","block_id":"blk_df79287c-7d5e-4712-847e-99570146c8ed","section_id":"sec_9fe50131-e42b-4f64-8f05-8ae596cbb73e","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":94,"end":101,"exact":"先端パッケージ","quote":"inラック全体で見なければなりません。NVIDIAは供給関連コミットメントを巨額に積み上げ、HBM、TSMC、先端パッケージ、基板、ODM、ネットワーク部材を長期で押さえる力があります。一方、Vera RubinはHBM4やCoWoS、液冷、電力まで絡むため、供給網は最も重く複雑です。","quote_start":39,"quote_end":182,"text_sha256":"90b1c7910b9fe709769c99735984a9b6efb65d07f62c5a78f9ecc474d66a7052","block_sha256":"90b1c7910b9fe709769c99735984a9b6efb65d07f62c5a78f9ecc474d66a7052","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_93e994ee-fc71-4a2c-868a-e0b16e4b39b4/#blk_df79287c-7d5e-4712-847e-99570146c8ed"},{"id":"occ_a362a470da177264a33ef947","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_977092a4-68df-47ac-8de2-4e66567c8a95","work_id":"wrk_27b36bee-da31-4942-a5ea-33f6f77ddee3","block_id":"blk_573dc465-73f4-4273-95da-69580eb3de3f","section_id":"sec_efe5d727-e7e6-4075-9660-2ebcd104b507","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":20,"end":27,"exact":"先端パッケージ","quote":"AI半導体、HBM、DRAM、NAND、先端パッケージ、EDA、半導体製造装置、データセンター、発電、送電、液冷、光通信、クラウド、ロボット。これらはすべて、計算文明圏のインフラである。","quote_start":0,"quote_end":93,"text_sha256":"d431415a963da11864ff4fa481a7ff1e599d960965a81498ac13c7d20a6eb267","block_sha256":"d431415a963da11864ff4fa481a7ff1e599d960965a81498ac13c7d20a6eb267","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_977092a4-68df-47ac-8de2-4e66567c8a95/#blk_573dc465-73f4-4273-95da-69580eb3de3f"},{"id":"occ_829fe4263b6d4280696b7b32","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d","work_id":"wrk_f4b2ba6d-bd7a-4377-ba28-11230cbeac16","block_id":"blk_3cebbdde-bb8b-4c6c-a07e-15e23dfda377","section_id":"sec_2ce7537a-5b6c-4b2d-ace0-1f3e262d5045","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":26,"end":31,"exact":"CoWoS","quote":"TSMCは2026年4月時点で14-reticle級CoWoSを2028年量産予定とし、約10個の大型compute dieと最大20個のHBM stackを統合できる構想を示している。さらに14-reticle超の構造も2029年を視野に入れている。 (TSM","quote_start":0,"quote_end":131,"text_sha256":"00284d47af9541b3ded16815c8484c98d879a4f9049c78122e95c1ec7db8a3a1","block_sha256":"00284d47af9541b3ded16815c8484c98d879a4f9049c78122e95c1ec7db8a3a1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d/#blk_3cebbdde-bb8b-4c6c-a07e-15e23dfda377"},{"id":"occ_59594cc2154c4e46e566454b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d","work_id":"wrk_f4b2ba6d-bd7a-4377-ba28-11230cbeac16","block_id":"blk_41b91329-e442-45b3-bf47-f425e5369bd2","section_id":"sec_f123b610-dc5c-4e52-9e74-6dd1bdd08229","layer":"body","character_id":null,"count":1,"matched_aliases":["hybrid 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  ↓\nHybrid Bonding","quote_start":0,"quote_end":49,"text_sha256":"fcb0f9dc4ad6ed300487025f2a1ccb25d019f48c0c6874609cf60e7e1fe38798","block_sha256":"fcb0f9dc4ad6ed300487025f2a1ccb25d019f48c0c6874609cf60e7e1fe38798","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d/#blk_8bf491f5-6797-440d-9bdc-0425f386618a"},{"id":"occ_28d9d0963b738fbf277d0748","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d","work_id":"wrk_f4b2ba6d-bd7a-4377-ba28-11230cbeac16","block_id":"blk_8da4c2e9-bf23-42af-aff6-9ebae545a70f","section_id":"sec_def2e99d-090c-4292-8f77-485bcd825e2f","layer":"body","character_id":null,"count":1,"matched_aliases":["hybrid bonding"],"evidence":{"text_basis":"markdown","start":26,"end":40,"exact":"hybrid bonding","quote":"Besi自身も2026年Investor Dayで、hybrid bondingの新用途として、","quote_start":0,"quote_end":48,"text_sha256":"a13f449ecabdde157d5b8b0cc4603a01bb380f9a0b53c5f19d5cddeebf69cede","block_sha256":"a13f449ecabdde157d5b8b0cc4603a01bb380f9a0b53c5f19d5cddeebf69cede","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d/#blk_8da4c2e9-bf23-42af-aff6-9ebae545a70f"},{"id":"occ_5e1c7dfccbd6a6bb69e16a5f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d","work_id":"wrk_f4b2ba6d-bd7a-4377-ba28-11230cbeac16","block_id":"blk_976418a8-51b6-472b-8b33-21329a6bbd11","section_id":"sec_0ad4e216-9226-4afa-9d08-0a337af43ec5","layer":"body","character_id":null,"count":1,"matched_aliases":["hybrid bonding"],"evidence":{"text_basis":"markdown","start":27,"end":41,"exact":"hybrid bonding","quote":"3D SRAM・HBM・CPOでfine-pitch hybrid bondingが本格普及する","quote_start":0,"quote_end":48,"text_sha256":"a0c6b3c7474af0a7904ebdc9026f1a9d6118197fa20f557ec4b2e884bdbf9398","block_sha256":"a0c6b3c7474af0a7904ebdc9026f1a9d6118197fa20f557ec4b2e884bdbf9398","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d/#blk_976418a8-51b6-472b-8b33-21329a6bbd11"},{"id":"occ_022522aa6a3932bd0665cd19","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_9832039f-aefc-4f9c-a4d2-d9fc943e8b1d","work_id":"wrk_f4b2ba6d-bd7a-4377-ba28-11230cbeac16","block_id":"blk_a56cd9bc-0143-421e-9144-00603151fefe","section_id":"sec_f123b610-dc5c-4e52-9e74-6dd1bdd08229","layer":"body","character_id":null,"count":1,"matched_aliases":["hybrid bonding"],"evidence":{"text_basis":"markdown","start":27,"end":41,"exact":"hybrid 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bondingである。","quote_start":0,"quote_end":37,"text_sha256":"eb9bc6ec872842fa79fd4e7eff8a043f8551724add9769fad598d08ba03aeda2","block_sha256":"eb9bc6ec872842fa79fd4e7eff8a043f8551724add9769fad598d08ba03aeda2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9a79fb7c-7189-4703-9970-53ae7a5a375d/#blk_706ecb74-d55f-4b3c-8322-0b7108bb2f30"},{"id":"occ_f529d89a9e45e558565bdf16","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_9a79fb7c-7189-4703-9970-53ae7a5a375d","work_id":"wrk_77a86f6d-d3e4-4b48-8e1e-f1abfca4d053","block_id":"blk_770328d6-d94c-4da2-a49c-2886a0e59fb7","section_id":"sec_341c0c97-9c7b-4801-8a6a-ce53ed5fd45f","layer":"body","character_id":null,"count":1,"matched_aliases":["3D実装"],"evidence":{"text_basis":"markdown","start":18,"end":22,"exact":"3D実装","quote":"微細化、CFET、SRAM、HBM、3D実装、Optical 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│ │ │ Package / CoWoS      │ │ │  │\n│  │ │ │ ┌──────────────────┐ │ │ │  │\n│  │ │ │ │ HBM / XBM       │ │ │ │  │\n│  │ │ │","quote_start":238,"quote_end":398,"text_sha256":"89dbcf9a3ad993fba05fcede370a08bb0601c862c945dd1c9c9d71525e7ec01c","block_sha256":"89dbcf9a3ad993fba05fcede370a08bb0601c862c945dd1c9c9d71525e7ec01c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_9a79fb7c-7189-4703-9970-53ae7a5a375d/#blk_9e6fee7b-eba5-4620-999f-8a61b24048f1"},{"id":"occ_6bd50156ff2c84a86f81a634","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_9a79fb7c-7189-4703-9970-53ae7a5a375d","work_id":"wrk_77a86f6d-d3e4-4b48-8e1e-f1abfca4d053","block_id":"blk_a7b7957e-4831-43a5-9dcd-d3d0bd15e445","section_id":"sec_dce8ac4b-9a7b-4635-be83-6ec3b4b1bd33","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":16,"end":20,"exact":"SoIC","quote":"TSMCもA14-to-A14 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I/O die、Rubinの周辺die、CoWoSなどを含まない。","quote_start":0,"quote_end":50,"text_sha256":"3a2a5ec513e60b17de85debda17954c6099e7f4ec3a47b3f09c3e13491a44e02","block_sha256":"3a2a5ec513e60b17de85debda17954c6099e7f4ec3a47b3f09c3e13491a44e02","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a165cefe-658c-456f-b164-71170f172e7c/#blk_f9d69206-85dc-4281-8cda-6a7350ccc0ba"},{"id":"occ_814c47cc7788224fb2a7c7e6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a30fdebb-6a5f-4491-8480-bc05cbb21f96","work_id":"wrk_97fc23be-d3e1-4a2a-986e-b33ae2fd0697","block_id":"blk_534d37d1-ab17-4397-a96e-1f309b306171","section_id":"sec_12ac0b48-3364-4c77-bcd9-4164aeabb84e","layer":"body","character_id":null,"count":2,"matched_aliases":["SoIC","ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":60,"end":64,"exact":"SoIC","quote":"SRAMブーム」は、単体SRAMメーカーだけの話ではない。TSMCやSamsung Foundryの先端工程、SoICやX-Cubeなどの3D積層、ハイブリッドボンディング、SRAM設計IP、MBIST、半導体テスターへの需要増として現れる。","quote_start":5,"quote_end":126,"text_sha256":"8e179db1a7c2cee866bebd953292b76592dc9fa42f4a90c8c89ea23a7169f551","block_sha256":"8e179db1a7c2cee866bebd953292b76592dc9fa42f4a90c8c89ea23a7169f551","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a30fdebb-6a5f-4491-8480-bc05cbb21f96/#blk_534d37d1-ab17-4397-a96e-1f309b306171"},{"id":"occ_153a0cc37661dbca4843b64a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a30fdebb-6a5f-4491-8480-bc05cbb21f96","work_id":"wrk_97fc23be-d3e1-4a2a-986e-b33ae2fd0697","block_id":"blk_64932a95-47db-4266-9df8-6c4afda48be2","section_id":"sec_c28387d1-4fe7-4d54-9fa5-72a0ba849813","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":70,"end":74,"exact":"2.5D","quote":"と、HBM3EではAIアクセラレーターとHBMの間に1000本以上の信号線が必要となり、一般的な基板ではなく、2.5Dパッケージが必要になる。([SemiAnalysis][1])","quote_start":15,"quote_end":105,"text_sha256":"76e73a54c0f7face5dbe40fc4bae630ae750b1a098c4b92f07777fdfa97fc6cc","block_sha256":"76e73a54c0f7face5dbe40fc4bae630ae750b1a098c4b92f07777fdfa97fc6cc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a30fdebb-6a5f-4491-8480-bc05cbb21f96/#blk_64932a95-47db-4266-9df8-6c4afda48be2"},{"id":"occ_3c37a11683faf99b6d08b6c3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a30fdebb-6a5f-4491-8480-bc05cbb21f96","work_id":"wrk_97fc23be-d3e1-4a2a-986e-b33ae2fd0697","block_id":"blk_7812fee4-d8de-4215-a1b6-bf3d7679c16c","section_id":"sec_3e0fe865-2b90-4ccd-a4de-0deb5127350f","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":71,"end":78,"exact":"先端パッケージ","quote":"、分野 |\n| --- | --- | --- |\n| 演算器直近 | SRAM、積層SRAM、先端ロジック、先端パッケージ | TSMC、Samsung Foundry、Intel Foundry、EDA、テスト、接合装置 |\n| 作業用メモリー | HBM、DDR5、RDIMM、LPDDR、CXLメモリー | Sams","quote_start":16,"quote_end":178,"text_sha256":"101c030b7dad26f4981ae4f04d9fa87c13422dc8ade9168b309bae786711dabb","block_sha256":"101c030b7dad26f4981ae4f04d9fa87c13422dc8ade9168b309bae786711dabb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a30fdebb-6a5f-4491-8480-bc05cbb21f96/#blk_7812fee4-d8de-4215-a1b6-bf3d7679c16c"},{"id":"occ_720862f47eec0d0cc296e721","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a30fdebb-6a5f-4491-8480-bc05cbb21f96","work_id":"wrk_97fc23be-d3e1-4a2a-986e-b33ae2fd0697","block_id":"blk_a2596acd-9b54-49af-99b0-0a84c87d2c04","section_id":"sec_12ac0b48-3364-4c77-bcd9-4164aeabb84e","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMCのSoICは、CPU上にSRAMをL3キャッシュとして積層した実用例を持つ。SamsungのX-Cubeも、ロジックダイ上にSRAMを積層し、配線距離の短縮と電力効率向上を狙う技術である。([TSMC][3])","quote_start":0,"quote_end":109,"text_sha256":"0d1c5df7201440d0aab04be8583f452951b0e79916a574aebb20457ca93c94e5","block_sha256":"0d1c5df7201440d0aab04be8583f452951b0e79916a574aebb20457ca93c94e5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a30fdebb-6a5f-4491-8480-bc05cbb21f96/#blk_a2596acd-9b54-49af-99b0-0a84c87d2c04"},{"id":"occ_9b457c0ef497caf1546e436e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a30fdebb-6a5f-4491-8480-bc05cbb21f96","work_id":"wrk_97fc23be-d3e1-4a2a-986e-b33ae2fd0697","block_id":"blk_d805aeba-d44a-48fe-b491-3e7ccbdf1cac","section_id":"sec_c28387d1-4fe7-4d54-9fa5-72a0ba849813","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":169,"end":174,"exact":"CoWoS","quote":" | 高歩留まりで組み立てる |\n| インターポーザー | GPU / ASICと広い配線で接続する |\n| CoWoSなどの先端パッケージ | HBMとロジックを一体化する |","quote_start":114,"quote_end":203,"text_sha256":"cc07c6262eee8f656b32303c0579dbbb187e71a9661ca4597c1c83eef433f3ac","block_sha256":"cc07c6262eee8f656b32303c0579dbbb187e71a9661ca4597c1c83eef433f3ac","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a30fdebb-6a5f-4491-8480-bc05cbb21f96/#blk_d805aeba-d44a-48fe-b491-3e7ccbdf1cac"},{"id":"occ_4ea98564cf5628b5f8db64eb","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a3938e39-c989-454c-9e91-c75a6d9b8277","work_id":"wrk_d932af79-c726-4edb-b80c-7dd5b33ae877","block_id":"blk_0bf3f8f7-a09d-4dee-a9cb-26d3ab2ccac3","section_id":"sec_5cc78442-e5bc-4ad9-9816-5f5b72792dc6","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bonding"],"evidence":{"text_basis":"markdown","start":7,"end":21,"exact":"Hybrid Bonding","quote":"## XBMはHybrid Bondingを使うのか","quote_start":0,"quote_end":26,"text_sha256":"d55c358636897276bcba806eab63fabfeb305fadfa1889b38740af51d548fa70","block_sha256":"d55c358636897276bcba806eab63fabfeb305fadfa1889b38740af51d548fa70","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3938e39-c989-454c-9e91-c75a6d9b8277/#blk_1f2a342e-add9-4864-8528-f74524df4b99"},{"id":"occ_3c4534697590e830aeec6fea","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a3938e39-c989-454c-9e91-c75a6d9b8277","work_id":"wrk_d932af79-c726-4edb-b80c-7dd5b33ae877","block_id":"blk_21b20cf4-6e5e-47af-b693-ad97451f4faf","section_id":"sec_ef9c4284-d0c3-4431-86d7-ea84e7a403d0","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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↓\nUC","quote_start":10,"quote_end":169,"text_sha256":"07c0dc87fe581f88f600a816b8e01e264c9c242c13bbc2512a341ce3488374e9","block_sha256":"07c0dc87fe581f88f600a816b8e01e264c9c242c13bbc2512a341ce3488374e9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3938e39-c989-454c-9e91-c75a6d9b8277/#blk_3285b1ad-739d-4a5e-af34-50f04f76232b"},{"id":"occ_7d2f0e38fef64de41ea14edf","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a3938e39-c989-454c-9e91-c75a6d9b8277","work_id":"wrk_d932af79-c726-4edb-b80c-7dd5b33ae877","block_id":"blk_447a4049-0c2c-49b9-97bf-018b61b62f04","section_id":"sec_ef9c4284-d0c3-4431-86d7-ea84e7a403d0","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"XBMとHybrid Bondingは、同じものではない。","quote_start":0,"quote_end":29,"text_sha256":"66eb24ab1f8b68204d1319196a9694470c23e9cbb620b8f0014fa8cf1303d269","block_sha256":"66eb24ab1f8b68204d1319196a9694470c23e9cbb620b8f0014fa8cf1303d269","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3938e39-c989-454c-9e91-c75a6d9b8277/#blk_447a4049-0c2c-49b9-97bf-018b61b62f04"},{"id":"occ_74082ca181ce75aa9e7f0765","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a3938e39-c989-454c-9e91-c75a6d9b8277","work_id":"wrk_d932af79-c726-4edb-b80c-7dd5b33ae877","block_id":"blk_4c826ecc-eb3b-46cb-94d2-950282dacfad","section_id":"sec_ac02ce93-2feb-4c52-ad2f-da2050855401","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":7,"end":21,"exact":"Hybrid Bonding","quote":"### 図解｜Hybrid Bondingとの関係","quote_start":0,"quote_end":25,"text_sha256":"d7180519a4b1fd2cb1ad444ce89eb4dde6076d0d8e033afc54f870107ee23adf","block_sha256":"d7180519a4b1fd2cb1ad444ce89eb4dde6076d0d8e033afc54f870107ee23adf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3938e39-c989-454c-9e91-c75a6d9b8277/#blk_4c826ecc-eb3b-46cb-94d2-950282dacfad"},{"id":"occ_fe72dbc055fddd7ec1ee76b6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a3938e39-c989-454c-9e91-c75a6d9b8277","work_id":"wrk_d932af79-c726-4edb-b80c-7dd5b33ae877","block_id":"blk_5252dc76-a2ba-40a7-9ba4-95c5e5d4cb98","section_id":"sec_ef9c4284-d0c3-4431-86d7-ea84e7a403d0","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":129,"end":143,"exact":"Hybrid Bonding","quote":"ルの構造 |\n| TSV gutter | 積層内の垂直配線 |\n| HBI | ダイ間の高帯域接続 |\n| Hybrid Bonding | ダイ接合に利用できる技術 |\n| UCIe | メモリと演算ダイを結ぶ通信方式 |\n| ベースダイ | 通信、制御、検査、修復 |","quote_start":74,"quote_end":211,"text_sha256":"dcf06cc3023f0d761ea7f2bee4a2b0901e7c97e318933bb4c394d7a18cde5032","block_sha256":"dcf06cc3023f0d761ea7f2bee4a2b0901e7c97e318933bb4c394d7a18cde5032","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3938e39-c989-454c-9e91-c75a6d9b8277/#blk_5252dc76-a2ba-40a7-9ba4-95c5e5d4cb98"},{"id":"occ_7e0fca2c6a43ebaadd57bb2d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a3938e39-c989-454c-9e91-c75a6d9b8277","work_id":"wrk_d932af79-c726-4edb-b80c-7dd5b33ae877","block_id":"blk_801c7f74-9c0d-4f8e-978a-67ae119f1539","section_id":"sec_e45d6e54-e254-41b1-8f43-f3366914110b","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":41,"end":55,"exact":"Hybrid Bonding","quote":"TSVは、1枚のシリコンを厚さ方向へ貫通し、ダイの表側と裏側を接続する配線である。Hybrid Bondingやマイクロバンプはダイ境界面の接続を担当し、TSVはダイ内部の垂直配線を担当する。","quote_start":0,"quote_end":96,"text_sha256":"c8327784fcdcb9c43b42e84e1dbf851ebdc300f5bda085b4e9c2cc97e61699a4","block_sha256":"c8327784fcdcb9c43b42e84e1dbf851ebdc300f5bda085b4e9c2cc97e61699a4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3938e39-c989-454c-9e91-c75a6d9b8277/#blk_801c7f74-9c0d-4f8e-978a-67ae119f1539"},{"id":"occ_ecbdda69df98fb30d6657888","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a3938e39-c989-454c-9e91-c75a6d9b8277","work_id":"wrk_d932af79-c726-4edb-b80c-7dd5b33ae877","block_id":"blk_86fa330f-37aa-4a71-8e37-b64fb651d6e6","section_id":"sec_ac02ce93-2feb-4c52-ad2f-da2050855401","layer":"caption","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":2,"end":16,"exact":"Hybrid Bonding","quote":"![Hybrid Bondingとの関係 01](media/a4fc4fd1be317985333a6718dc3008c0e54e452088f8ea595b3ed2fdd79e2e39.webp)","quote_start":0,"quote_end":101,"text_sha256":"24a14977abb6948de64864dedc7a5ce9fc5bcfdb58c0d1baed767c43c007178d","block_sha256":"24a14977abb6948de64864dedc7a5ce9fc5bcfdb58c0d1baed767c43c007178d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3938e39-c989-454c-9e91-c75a6d9b8277/#blk_86fa330f-37aa-4a71-8e37-b64fb651d6e6"},{"id":"occ_01fd292c3734f263e5c4ab2f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a3938e39-c989-454c-9e91-c75a6d9b8277","work_id":"wrk_d932af79-c726-4edb-b80c-7dd5b33ae877","block_id":"blk_90c9a154-861f-4df0-b31c-5fef5443b2c8","section_id":"sec_ef9c4284-d0c3-4431-86d7-ea84e7a403d0","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingは、","quote_start":0,"quote_end":16,"text_sha256":"e11d08c7140ee178b246f8b995bc147df62f6c0946b69fa2b0b5c4e543f069ec","block_sha256":"e11d08c7140ee178b246f8b995bc147df62f6c0946b69fa2b0b5c4e543f069ec","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3938e39-c989-454c-9e91-c75a6d9b8277/#blk_be9f1c5b-1763-40c7-91a0-abad465d22d1"},{"id":"occ_f42e05169ec5aa0b88d494f3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a3938e39-c989-454c-9e91-c75a6d9b8277","work_id":"wrk_d932af79-c726-4edb-b80c-7dd5b33ae877","block_id":"blk_c852fddf-36d2-46cf-b985-78d93df69a2f","section_id":"sec_ef9c4284-d0c3-4431-86d7-ea84e7a403d0","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":97,"end":111,"exact":"Hybrid Bonding","quote":"両方が例示され、ダイ薄化や両面インターコネクトが記載されている。しかし、将来の商用品が特定のCu-to-Cu Hybrid Bonding方式を必ず採用すると確定しているわけではない。","quote_start":42,"quote_end":134,"text_sha256":"0234e2efde66fc09de25e52cda9efa25871f172c02087ba83923ea901baa178e","block_sha256":"0234e2efde66fc09de25e52cda9efa25871f172c02087ba83923ea901baa178e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3938e39-c989-454c-9e91-c75a6d9b8277/#blk_c852fddf-36d2-46cf-b985-78d93df69a2f"},{"id":"occ_4a3201ea558e5a240faa3ee4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6","work_id":"wrk_1c297a15-bc80-4f59-ae19-6b025b2c95a1","block_id":"blk_1ec3fdae-65fa-47b7-a44c-da7329286dd1","section_id":"sec_4252a979-7826-42e7-8367-88775749c7a2","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":107,"end":114,"exact":"先端パッケージ","quote":"けるなら800VDC・液冷。**  \n> **Rubin Ultraの総出荷に賭けるならFC-BGA・HBM・先端パッケージ。**","quote_start":52,"quote_end":117,"text_sha256":"df415b7e7fb27e5ea5577164d9e06673c7e96eb21e5d511906454b5f3198c8a2","block_sha256":"df415b7e7fb27e5ea5577164d9e06673c7e96eb21e5d511906454b5f3198c8a2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a3e9cc84-29ea-4e2f-8ea0-a01272094ec6/#blk_1ec3fdae-65fa-47b7-a44c-da7329286dd1"},{"id":"occ_6bf91fbfda354fc74741588c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_04d00aed-e2f5-446b-ab35-ca0550f36665","section_id":"sec_c3d9d676-74ae-4c0b-a790-ea9af1f9cd2e","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":34,"end":41,"exact":"先端パッケージ","quote":"Samsung自身も2026年、メモリー、ロジック、ファウンドリー、先端パッケージを横断する「Total AI Solution」を提供できる企業であると説明しています。([Samsung Global Newsroom](https://news.samsung.com/glob","quote_start":0,"quote_end":141,"text_sha256":"5dd98cbcdba1615521d219bc1e1e06f39638f257fa9a83cbd80e291eeb412164","block_sha256":"5dd98cbcdba1615521d219bc1e1e06f39638f257fa9a83cbd80e291eeb412164","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_04d00aed-e2f5-446b-ab35-ca0550f36665"},{"id":"occ_3ff61015a0039a1f97d0c08f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_1ea465cf-9e52-4f42-94f6-250eb7ade094","section_id":"sec_00749093-feed-4075-90b3-02fc2f52c640","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":12,"end":19,"exact":"先端パッケージ","quote":"SamsungはHBM、先端パッケージ、ファウンドリーを組み合わせたカスタム・ターンキーサービスを以前から掲げています。([Samsung Semiconductor Global](https://semiconductor.samsu","quote_start":0,"quote_end":119,"text_sha256":"1ebe5f297022952f07bcfbff2c00d1c8f670c3e094fe34f09fafb76f8f077e3d","block_sha256":"1ebe5f297022952f07bcfbff2c00d1c8f670c3e094fe34f09fafb76f8f077e3d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_1ea465cf-9e52-4f42-94f6-250eb7ade094"},{"id":"occ_3a519692f99bb39814c6e866","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_2a9a0341-2b3f-41c7-bdfe-f4d40b037805","section_id":"sec_d8d37ef2-eae0-4994-9e13-ea1913d05f34","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":24,"end":29,"exact":"CoWoS","quote":"もう一つは、ASICと複数のHBMを接続する**CoWoSなどの先端パッケージ能力**です。","quote_start":0,"quote_end":46,"text_sha256":"4e0d7580ec2085df8f6678a62f745f53d952e4a8dccac7b47a0ce28bd4f7e3de","block_sha256":"4e0d7580ec2085df8f6678a62f745f53d952e4a8dccac7b47a0ce28bd4f7e3de","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_2a9a0341-2b3f-41c7-bdfe-f4d40b037805"},{"id":"occ_d3a9e5493f1e5890f32f002a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_33ee5abf-2a2a-40f1-a47f-7745817bb60b","section_id":"sec_e90ce8ba-9a50-4d91-b1e3-efb6046fbbf4","layer":"code","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":147,"end":154,"exact":"先端パッケージ","quote":"     ↓\n歩留まりと設計実績が改善\n       ↓\nSamsung HBM採用率上昇\n       ↓\n先端パッケージ受注\n       ↓\nDRAM・SSDへクロスセル\n       ↓\n次世代ASICも継続受注\n```","quote_start":92,"quote_end":206,"text_sha256":"5e275e8efe5f386341ea469814aed3d9a6924e9e7cfe60defc944a4aa0336dc9","block_sha256":"5e275e8efe5f386341ea469814aed3d9a6924e9e7cfe60defc944a4aa0336dc9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_33ee5abf-2a2a-40f1-a47f-7745817bb60b"},{"id":"occ_940fe458a88bc3b689b36330","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_403bb069-ff18-4703-9c66-b969b0d2f509","section_id":"sec_c3d9d676-74ae-4c0b-a790-ea9af1f9cd2e","layer":"code","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":150,"end":154,"exact":"2.5D","quote":"            ↓\nSamsung HBMを組み合わせる\n            ↓\nSamsungの2.5Dパッケージで統合\n            ↓\nラック側にSamsung DDR・SSDを供給\n```","quote_start":95,"quote_end":204,"text_sha256":"c9d63f3d1403cd46a47fc21334ba969465fda94a139618bc2956272b009bd9e1","block_sha256":"c9d63f3d1403cd46a47fc21334ba969465fda94a139618bc2956272b009bd9e1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_403bb069-ff18-4703-9c66-b969b0d2f509"},{"id":"occ_265c750d93c513738f3b5394","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_411a456a-3f41-49fe-9d10-5884e1ff63df","section_id":"sec_b9c06a6c-26c3-4e09-9cc0-ba38e4bb2382","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":38,"end":42,"exact":"EMIB","quote":"- 米国内製造能力\n- 18A・14Aロードマップ\n- 高密度SRAM\n- EMIB\n- Foveros\n- 大型チップレットパッケージ\n- UCIeを利用したオープンな統合","quote_start":0,"quote_end":87,"text_sha256":"7111cf0be6462c5e1af5ab923c07c98429b92067738612c8511c1b4eab4e7f06","block_sha256":"7111cf0be6462c5e1af5ab923c07c98429b92067738612c8511c1b4eab4e7f06","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_411a456a-3f41-49fe-9d10-5884e1ff63df"},{"id":"occ_de9a637430be6bb002be182d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_445b7f86-d84b-47a0-939c-f9768d2dea34","section_id":"sec_b9c06a6c-26c3-4e09-9cc0-ba38e4bb2382","layer":"code","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":34,"end":38,"exact":"EMIB","quote":"```\nIntel Foundry\n├─ ASIC・SRAM\n├─ EMIB・Foveros\n└─ テスト・パッケージ\n\n外部企業\n├─ SK hynix HBM\n├─ Samsung HBM\n└─ Micron HBM\n```","quote_start":0,"quote_end":114,"text_sha256":"a66a62bebb9ee80051a4ab700f6f8d808ecc1188e99683032d5a0068a0b37076","block_sha256":"a66a62bebb9ee80051a4ab700f6f8d808ecc1188e99683032d5a0068a0b37076","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_445b7f86-d84b-47a0-939c-f9768d2dea34"},{"id":"occ_a1d0fa2af97cc1711e297327","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_484125f4-7af6-442a-b9f2-67920569a9ae","section_id":"sec_07bd0190-4541-49ed-9cd5-889bebd958c9","layer":"code","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":33,"end":40,"exact":"先端パッケージ","quote":"```\nGPUロジックダイ　○○ドル\nHBM　　　　　　○○ドル\n先端パッケージ　○○ドル\n```","quote_start":0,"quote_end":49,"text_sha256":"e3568a83c33d5298c54aa7226e4803ebf529d0f4bc3c36b26f8876d299947f2f","block_sha256":"e3568a83c33d5298c54aa7226e4803ebf529d0f4bc3c36b26f8876d299947f2f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_484125f4-7af6-442a-b9f2-67920569a9ae"},{"id":"occ_8ea6772510ecb04c7a272093","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_4f53c7c8-62d7-4000-8b7a-a766ce709507","section_id":"sec_c51734dd-a052-4910-9d7c-7eeba851456d","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":19,"end":26,"exact":"先端パッケージ","quote":"そして2026年、TSMCの先端工程と先端パッケージ能力がAI需要で逼迫していることは、Samsung FoundryとIntel Foundryにとって大きな商機になりつつあります。","quote_start":0,"quote_end":92,"text_sha256":"c185b24dba7c32edcdc7e73ba0a19984f2ac29b47b7594ffb25a07f674b893b3","block_sha256":"c185b24dba7c32edcdc7e73ba0a19984f2ac29b47b7594ffb25a07f674b893b3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_4f53c7c8-62d7-4000-8b7a-a766ce709507"},{"id":"occ_48cb07ba51e3854d1e15fc63","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_53d6c4fb-de1d-4c72-922b-b9a76720adb5","section_id":"sec_b4ad4f5d-283f-4303-abcd-1ecc7ed5b30e","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":28,"end":32,"exact":"2.5D","quote":"- シリコンインターポーザー\n- HBMベースダイ\n- 2.5Dパッケージ\n- 高密度基板\n- HBMとASICの実装\n- Known Good Dieの選別\n- 完成後のテスト\n- パッケージ歩留まり","quote_start":0,"quote_end":101,"text_sha256":"c21ecaefd9a6ad2a9392b4b3b52eefbbf87ea8d2409c584ef7174ccd3cf6a4e8","block_sha256":"c21ecaefd9a6ad2a9392b4b3b52eefbbf87ea8d2409c584ef7174ccd3cf6a4e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_53d6c4fb-de1d-4c72-922b-b9a76720adb5"},{"id":"occ_9240e07fd6d632259311a72d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_6035bfde-7663-41df-8f29-5c1d711d3c64","section_id":"sec_b9c06a6c-26c3-4e09-9cc0-ba38e4bb2382","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","EMIB"],"evidence":{"text_basis":"markdown","start":84,"end":88,"exact":"EMIB","quote":"採用し、AI・HPC向けの先端SRAM、ロジック、低電圧動作を提供します。Intel 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SRAMダイの製造費\n- ハイブリッドボンディング\n- Known Good Dieの選別\n- 積層後テスト\n- 熱設計\n- 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**Flash**：NAND、エンタープライズSSD\n- **Advanced Packaging**：2.5D、3D、チップレット統合\n- **System LSI・設計基盤**：コントローラー、設計支援","quote_start":58,"quote_end":164,"text_sha256":"e467949e4e34abea9bb30f5f513b48a9223664f3c3b7cd3bffa9b1bb6f495d97","block_sha256":"e467949e4e34abea9bb30f5f513b48a9223664f3c3b7cd3bffa9b1bb6f495d97","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_87ca5169-fffe-4dbf-bda9-a7553985ccf6"},{"id":"occ_b2a04090cef8e22c940cef37","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_96b81f50-4151-4327-b392-d776efa9f45b","section_id":"sec_ac4b4c22-4c11-4b12-a644-21c993adb108","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":25,"end":30,"exact":"CoWoS","quote":"- シリコンインターポーザー\n- ベースダイ\n- CoWoSなどの先端パッケージ\n- 実装・テスト\n- パッケージ歩留まり","quote_start":0,"quote_end":61,"text_sha256":"f823e117d76dff9b02c53fa7b7fcb49df1994c19482d68cf77ccb6e4762ffdab","block_sha256":"f823e117d76dff9b02c53fa7b7fcb49df1994c19482d68cf77ccb6e4762ffdab","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_96b81f50-4151-4327-b392-d776efa9f45b"},{"id":"occ_ff3eab797efb9d9662291137","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_a95f32f2-b18a-4f88-80a5-ae0bf6b33f49","section_id":"sec_b7ad2c90-4688-43ef-8047-5689af4f8de2","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":23,"end":30,"exact":"先端パッケージ","quote":"> **十分な歩留まり、設計IP、EDA環境、先端パッケージ、量産実績を持つ代替ファブ**","quote_start":0,"quote_end":45,"text_sha256":"2ab02a1ef95000dbb7e0180caab9a26ec995096366f5e0b3fc98013400b1d617","block_sha256":"2ab02a1ef95000dbb7e0180caab9a26ec995096366f5e0b3fc98013400b1d617","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_a95f32f2-b18a-4f88-80a5-ae0bf6b33f49"},{"id":"occ_c92fd67c39b2541c5c428503","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_a966969d-c0de-422d-b75e-c5d3dd4574bf","section_id":"sec_eb8730d4-5638-43b2-953c-2fc634bffdcb","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":10,"end":15,"exact":"CoWoS","quote":"TSMCの先端工程とCoWoS能力が逼迫する局面では、SamsungとIntelが代替供給先として評価される余地が広がります。","quote_start":0,"quote_end":63,"text_sha256":"df0b6eb3870e54711748ebdef1a5ba0973b11e936b28f8767b77c8e44b54c250","block_sha256":"df0b6eb3870e54711748ebdef1a5ba0973b11e936b28f8767b77c8e44b54c250","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_a966969d-c0de-422d-b75e-c5d3dd4574bf"},{"id":"occ_ddaf48d8ffb66140f8b792f7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_cca008e4-4822-47a5-aed3-3aef8ba79687","section_id":"sec_d8d37ef2-eae0-4994-9e13-ea1913d05f34","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":48,"end":55,"exact":"先端パッケージ","quote":"TSMC自身も2025年から2026年にかけて能力増強を加速し、2030年までにウェハーファブと先端パッケージを合わせて九つのフェーズを建設する計画を示しています。2026年の設備投資計画も520億～560億ドル規模です。([Reuters](https://www.reuters.com/world/asi","quote_start":0,"quote_end":155,"text_sha256":"33fe55db62669878a423ad225c37c264bc1113e0388d15c47f15afd5be4128dc","block_sha256":"33fe55db62669878a423ad225c37c264bc1113e0388d15c47f15afd5be4128dc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_cca008e4-4822-47a5-aed3-3aef8ba79687"},{"id":"occ_77c073b5cf0c40a35372101f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_cd62b9f3-d2f8-4409-b299-0b4098965a43","section_id":"sec_e90ce8ba-9a50-4d91-b1e3-efb6046fbbf4","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":66,"end":73,"exact":"先端パッケージ","quote":"ェハー\n2. ASIC内部のSRAM面積\n3. HBM\n4. HBMベースダイ\n5. インターポーザー\n6. 先端パッケージ\n7. テスト\n8. サーバーDRAM\n9. eSSD・NAND","quote_start":11,"quote_end":105,"text_sha256":"07d1c69072f374a6bbb6cecd60c86f6e68d0a02e5aef8ea7312d24dc1e080207","block_sha256":"07d1c69072f374a6bbb6cecd60c86f6e68d0a02e5aef8ea7312d24dc1e080207","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_cd62b9f3-d2f8-4409-b299-0b4098965a43"},{"id":"occ_d94d58b6cadac31219662802","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_d5798894-9e75-4917-ac79-5588a944b5e8","section_id":"sec_221201a2-56b7-4747-9817-08d16afe222f","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":26,"end":33,"exact":"先端パッケージ","quote":"Samsung Foundryは、ロジック、HBM、先端パッケージを統一した開発環境で共同最適化することを明示しています。([Samsung Semiconductor 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**ASIC内部のSRAMから、外付けHBM、サーバーDRAM、NAND、SSD、先端パッケージまで一社で持っていること**","quote_start":0,"quote_end":64,"text_sha256":"e43f784d4e02a017f783246189f027ed997d04a2737c1087b501858a32721dd4","block_sha256":"e43f784d4e02a017f783246189f027ed997d04a2737c1087b501858a32721dd4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_da1f0454-bbef-43a4-877b-fc27ad12b178"},{"id":"occ_f866aa8277dc6d217fa69941","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_df5dcebf-246a-42d7-9c6b-4af1e28a82da","section_id":"sec_bb0794d1-8be0-490e-84ae-7f37014fbcd9","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":27,"end":34,"exact":"先端パッケージ","quote":"この価格は主にHBMスタック自体で、インターポーザーや先端パッケージ費用は含めません。","quote_start":0,"quote_end":43,"text_sha256":"26de5c67c070ac22a248c886ef924fec134478f1b56589d8639d75a8e92dddfe","block_sha256":"26de5c67c070ac22a248c886ef924fec134478f1b56589d8639d75a8e92dddfe","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_df5dcebf-246a-42d7-9c6b-4af1e28a82da"},{"id":"occ_77dc9b92c22c7ca8fd3eb6a4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_e1ec3b7f-ae90-40b3-a78b-d88e20cee1e1","section_id":"sec_8f313445-f40a-4b64-b1d0-fd75a3c714bd","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":55,"end":62,"exact":"先端パッケージ","quote":"実際、AIアクセラレーターには数十GBから数百GBのHBMが搭載され、複数のDRAMダイ、TSV、ベースダイ、先端パッケージまで必要になる。GPUの部品コストの中でも、HBMは非常に大きな割合を占める。","quote_start":0,"quote_end":101,"text_sha256":"089108544658034e27145facac28f01402664559f12478d644f4b5bd455124c9","block_sha256":"089108544658034e27145facac28f01402664559f12478d644f4b5bd455124c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_e1ec3b7f-ae90-40b3-a78b-d88e20cee1e1"},{"id":"occ_54f49b71f17fb98725523c30","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a4cce969-13d1-46b4-be66-954788627617","work_id":"wrk_2beaf3ee-732b-4a38-b298-4a26d607c8fc","block_id":"blk_e2433bfd-78f3-4aea-99bf-70c6884a7f5f","section_id":"sec_0badf3fc-e4d1-4d91-92af-f039cf2e2e5f","layer":"body","character_id":null,"count":2,"matched_aliases":["SoIC","ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":26,"end":30,"exact":"SoIC","quote":"- SRAMチップレット\n- 3D積層SRAM\n- SoICやハイブリッドボンディング\n- 複数のSRAM中心ASICをネットワーク接続","quote_start":0,"quote_end":68,"text_sha256":"c5f8740804c62bd542eff958e16d86e704e997af673ce6485c77ced7f3ac60e2","block_sha256":"c5f8740804c62bd542eff958e16d86e704e997af673ce6485c77ced7f3ac60e2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a4cce969-13d1-46b4-be66-954788627617/#blk_e2433bfd-78f3-4aea-99bf-70c6884a7f5f"},{"id":"occ_0cd2ca1c114c23b8c0efe391","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":null,"section_id":null,"layer":"title","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"title","start":23,"end":27,"exact":"2.5D","quote":"第4回　チップレットはどこに載るのか――2D・2.5D・3Dパッケージの基本","quote_start":0,"quote_end":38,"text_sha256":"b6207ad151d34ec3510fbec7a6151faa7b34125fc0163fc4e261e4e6b0e61aaf","block_sha256":null,"offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/"},{"id":"occ_afdc6d3ff4ab733db0ce8d29","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_015de213-2e0c-4dff-af82-82d98e267914","section_id":"sec_699be11c-0f23-4ca9-9184-41a4f579cd77","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIBでは局所的なブリッジだけを使うため、パッケージ基板を通じた電源供給の自由度を残しやすい。","quote_start":0,"quote_end":48,"text_sha256":"b530372c15d17e99106660bfc2adbf716777536722444916815aa694d9dd3057","block_sha256":"b530372c15d17e99106660bfc2adbf716777536722444916815aa694d9dd3057","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_015de213-2e0c-4dff-af82-82d98e267914"},{"id":"occ_8d271abad85f34868bc9e195","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_01dd8912-9824-4f54-83c0-ed14a1861a53","section_id":"sec_37fe3199-34f2-4aa4-8a93-957a790be687","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":6,"end":10,"exact":"2.5D","quote":"## 2D、2.5D、3Dとは何か","quote_start":0,"quote_end":17,"text_sha256":"4e6f57819367d62d81c34f62587f06c30b39455e94a4a17bbbefe754332d79a4","block_sha256":"4e6f57819367d62d81c34f62587f06c30b39455e94a4a17bbbefe754332d79a4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_01dd8912-9824-4f54-83c0-ed14a1861a53"},{"id":"occ_2b40f6fba9d60ed2f8409a1c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_042a698f-76ef-46cd-8a00-42129c758048","section_id":"sec_f89e6340-642d-413a-9636-6b986a985325","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":14,"end":18,"exact":"2.5D","quote":"シリコンインターポーザー型の2.5Dパッケージが適する。","quote_start":0,"quote_end":28,"text_sha256":"1e6a88165f7d1939de67a0bd098eea573ee763f672ed8b64a031f3b30013df41","block_sha256":"1e6a88165f7d1939de67a0bd098eea573ee763f672ed8b64a031f3b30013df41","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_042a698f-76ef-46cd-8a00-42129c758048"},{"id":"occ_fb274838d168c18ab0c0610c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_06ccf33c-e5d2-4b3d-a53c-c987a07b4152","section_id":"sec_b3c50cc6-e4f8-4266-9725-a416961717c7","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"2.5D","quote":"## 2.5Dと3Dは競合するのか","quote_start":0,"quote_end":17,"text_sha256":"458787033b9fe7a6c95cb3fda5ad1b67bde3b3b1133f7dbf9de34d8914f11c9b","block_sha256":"458787033b9fe7a6c95cb3fda5ad1b67bde3b3b1133f7dbf9de34d8914f11c9b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_06ccf33c-e5d2-4b3d-a53c-c987a07b4152"},{"id":"occ_faf7bc36d98f20e31035f248","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_0d7f0703-13bb-46df-a5c4-fbdcdb3338e4","section_id":"sec_8de64c70-1eba-4539-b2ed-582f09ddbc5f","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":3,"end":10,"exact":"先端パッケージ","quote":"## 先端パッケージの弱点","quote_start":0,"quote_end":13,"text_sha256":"2e9af6e5b8b6469d6ffa8153ff612a8c8417bbabc42d4614d3577216222cb155","block_sha256":"2e9af6e5b8b6469d6ffa8153ff612a8c8417bbabc42d4614d3577216222cb155","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_0d7f0703-13bb-46df-a5c4-fbdcdb3338e4"},{"id":"occ_9a9f242d374edff2a514bb76","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_0e56443a-87db-4b76-b715-5d1734a00686","section_id":"sec_699be11c-0f23-4ca9-9184-41a4f579cd77","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":6,"end":10,"exact":"EMIB","quote":"IntelはEMIBについて、ロジック同士、またはロジックとHBMを接続するための、効率的かつコスト効果の高い方式と説明している。ブリッジ部分だけ細かなマイクロバンプピッチを使い、それ以外のダイ領域では比較的粗いピッチを","quote_start":0,"quote_end":110,"text_sha256":"8b392ee10cb7ba542ad1b5db0991a4e7125fc6cdd4a0c3d1b9ace594ba80b8f7","block_sha256":"8b392ee10cb7ba542ad1b5db0991a4e7125fc6cdd4a0c3d1b9ace594ba80b8f7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_0e56443a-87db-4b76-b715-5d1734a00686"},{"id":"occ_ad7c1a539375821b0f86a24a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_114779ba-b2b2-41ab-bf2f-740e888ba40c","section_id":"sec_b3c50cc6-e4f8-4266-9725-a416961717c7","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":6,"end":10,"exact":"SoIC","quote":"TSMCは、SoICで作った3D積層チップを、CoWoSやInFOへ統合する「3Dx3D」構成を示している。([3DFabric](https://3dfabric.tsmc.com/english/dedicatedF","quote_start":0,"quote_end":110,"text_sha256":"8c8ab9a45124c99064a72aacdd3f233130924f460b30484862792c43b5011463","block_sha256":"8c8ab9a45124c99064a72aacdd3f233130924f460b30484862792c43b5011463","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_114779ba-b2b2-41ab-bf2f-740e888ba40c"},{"id":"occ_e65e3adbd6a049d0b14ac6fc","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_13f71a3b-3034-4b9c-b79b-358e25cc76d1","section_id":"sec_b3c50cc6-e4f8-4266-9725-a416961717c7","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":31,"end":35,"exact":"2.5D","quote":"- 演算ダイとキャッシュを3D積層\n- その積層ダイとHBMを2.5D接続\n- 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Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"**レチクル限界、Die-to-Die PHY、Hybrid Bonding、TSVから、3D V-Cache、Foveros Direct、SoIC**","quote_start":0,"quote_end":77,"text_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","block_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_1c212ea7-1da3-4cc0-a287-b60f3850e25c"},{"id":"occ_4be064f8e1ea70b92a1560b6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_1d9054a3-ee80-4339-817d-464f02a5b86f","section_id":"sec_b3c50cc6-e4f8-4266-9725-a416961717c7","layer":"body","character_id":null,"count":2,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":24,"end":28,"exact":"EMIB","quote":"Intelも、Foverosによる3DスタックとEMIBによる横方向の接続を組み合わせたEMIB 3.5Dを提供している。([Intel](https://www.intel.com/content/www/us/en/foundry/packaging.","quote_start":0,"quote_end":128,"text_sha256":"58b9a8b8fc8b292fade15750b58d7a7f49adc1cf2527fcfa81dcd2bfc6b7cdcc","block_sha256":"58b9a8b8fc8b292fade15750b58d7a7f49adc1cf2527fcfa81dcd2bfc6b7cdcc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_1d9054a3-ee80-4339-817d-464f02a5b86f"},{"id":"occ_1ce41f93aa85bfaff19f59fd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_1f0369e0-8f53-4d43-9f2e-5414b7d43aeb","section_id":"sec_b3c50cc6-e4f8-4266-9725-a416961717c7","layer":"code","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":82,"end":86,"exact":"2.5D","quote":"      │ 3D積層\n       Compute Die\n              │\nHBM ＝＝ 2.5Dインターポーザー ＝＝ HBM\n```","quote_start":27,"quote_end":105,"text_sha256":"739074538d396e0a9932c818e3d538acf528ebc2657c0b7c385ca7f4b180c077","block_sha256":"739074538d396e0a9932c818e3d538acf528ebc2657c0b7c385ca7f4b180c077","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_1f0369e0-8f53-4d43-9f2e-5414b7d43aeb"},{"id":"occ_e7bbd12f4345efdef5ce8475","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_225ee9cd-f1c5-4baa-8e07-cb73b05fceb8","section_id":"sec_699be11c-0f23-4ca9-9184-41a4f579cd77","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":9,"end":13,"exact":"EMIB","quote":"## Intel EMIB","quote_start":0,"quote_end":13,"text_sha256":"a66188c0dfe6d0c06cf02ebdc69ecfabdf292d3cba6f6880b7e5506993912dfe","block_sha256":"a66188c0dfe6d0c06cf02ebdc69ecfabdf292d3cba6f6880b7e5506993912dfe","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_225ee9cd-f1c5-4baa-8e07-cb73b05fceb8"},{"id":"occ_43098f8728df82f42280195a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_22acb1bf-916b-42be-b404-391164fc9b13","section_id":"sec_43b7f244-2f8b-4cb7-a1f1-cb191d491aaf","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":5,"end":10,"exact":"CoWoS","quote":"TSMCはCoWoS-Lについて、RDLベースのインターポーザーと、細かな銅配線を持つLSIを組み合わせる方式として説明している。([3DFabric](https://3dfabric.tsmc.com/english","quote_start":0,"quote_end":110,"text_sha256":"0d2865ab9e49a1c268c285b3305ac73dcd08bf2fd6ef05c706cfda59a258a1d8","block_sha256":"0d2865ab9e49a1c268c285b3305ac73dcd08bf2fd6ef05c706cfda59a258a1d8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_22acb1bf-916b-42be-b404-391164fc9b13"},{"id":"occ_8da0bb2f44167de539797650","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_23f3c1d1-3b55-4770-b523-8720adc5c67e","section_id":"sec_19004bfb-4995-4a75-82e1-07f923eec46b","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":58,"end":72,"exact":"Hybrid Bonding","quote":"elのFoveros Direct 3Dは、アクティブ・ベースダイ上へチップレットを積層し、Cu-to-Cu Hybrid Bondingによる高密度・低抵抗のダイ間接続を実現する方式である。([Intel](https://www.intel.co.jp/content/www/jp/ja/foundry/packaging.html","quote_start":3,"quote_end":172,"text_sha256":"b2edff65145870e03327273ba363c8727c32e89bf1cacaf32ec55217d1600a25","block_sha256":"b2edff65145870e03327273ba363c8727c32e89bf1cacaf32ec55217d1600a25","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_23f3c1d1-3b55-4770-b523-8720adc5c67e"},{"id":"occ_50937cab87c2091bae360706","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_394ab9f5-31ac-43e6-ba00-21405ec1098f","section_id":"sec_2d1f9016-5169-4dbf-90f6-02b90d7d5d6d","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":47,"end":51,"exact":"2.5D","quote":"しかし、通常の平面的なパッケージ基板に加え、半導体製造に近い微細配線層を使うため、慣例的に**2.5D**と呼ばれる。","quote_start":0,"quote_end":59,"text_sha256":"6a6abd53ed31ada3b8eb30198b3a8a7c6f4090bb2ac6e556f47b4dc30a47e401","block_sha256":"6a6abd53ed31ada3b8eb30198b3a8a7c6f4090bb2ac6e556f47b4dc30a47e401","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_394ab9f5-31ac-43e6-ba00-21405ec1098f"},{"id":"occ_c38f25d524d62bae44d081f5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_4cf0f6a3-4ac7-407d-aa65-9124578347a4","section_id":"sec_43b7f244-2f8b-4cb7-a1f1-cb191d491aaf","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":3,"end":8,"exact":"CoWoS","quote":"## CoWoS-L","quote_start":0,"quote_end":10,"text_sha256":"fb21014b5d12b2a322e557d0f69dd64a1864843af9fc33b4e9f93d3e01b1e430","block_sha256":"fb21014b5d12b2a322e557d0f69dd64a1864843af9fc33b4e9f93d3e01b1e430","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_4cf0f6a3-4ac7-407d-aa65-9124578347a4"},{"id":"occ_8d238226be03a5e10417a127","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_54564dd6-1d3f-4979-924c-3d02bdd839c6","section_id":"sec_699be11c-0f23-4ca9-9184-41a4f579cd77","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":14,"end":18,"exact":"EMIB","quote":"Intelは2017年以降、EMIBをIntel製および外部製シリコンを含む製品で量産しているとしている。([Intel](https://www.intel.co.jp/content/www/jp/ja/foundry/packag","quote_start":0,"quote_end":118,"text_sha256":"f089e89547e5680c524c08c4864d812faa4d7e2f014a2de77ccfa97d0a77a15c","block_sha256":"f089e89547e5680c524c08c4864d812faa4d7e2f014a2de77ccfa97d0a77a15c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_54564dd6-1d3f-4979-924c-3d02bdd839c6"},{"id":"occ_d417ff0d5c34df6d83f3cc3e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_5623c7a2-f62d-47d6-a340-7a8420d5a2b8","section_id":"sec_b3c50cc6-e4f8-4266-9725-a416961717c7","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"2.5D","quote":"2.5Dと3Dは、どちらか一方へ置き換わる関係ではない。","quote_start":0,"quote_end":28,"text_sha256":"01a7a73231005e6afb525315b915cac560dc002417247fcddd357b216d840416","block_sha256":"01a7a73231005e6afb525315b915cac560dc002417247fcddd357b216d840416","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_5623c7a2-f62d-47d6-a340-7a8420d5a2b8"},{"id":"occ_379bfd91d6ad9d720f76eed3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_5bcb459e-84b8-46b4-a653-c84603994e84","section_id":"sec_731486c1-3751-4f27-8582-1e61aa4a446c","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":6,"end":13,"exact":"先端パッケージ","quote":"UCIeも、先端パッケージの選択肢として、シリコンインターポーザー、シリコンブリッジ、ファンアウト／RDLを想定している。([UCIe Consortium](https://www.uciexpress.org/webina","quote_start":0,"quote_end":113,"text_sha256":"4b021432e15d7c9ff4a548b048585aaea85fcac9b7e9b3d4f8fe717e888f0c97","block_sha256":"4b021432e15d7c9ff4a548b048585aaea85fcac9b7e9b3d4f8fe717e888f0c97","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_5bcb459e-84b8-46b4-a653-c84603994e84"},{"id":"occ_8ffd0edddfd84f3aa1d61c34","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_5daa6cbb-55d0-4ee3-a679-3e7659ed617a","section_id":"sec_699be11c-0f23-4ca9-9184-41a4f579cd77","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":41,"end":45,"exact":"2.5D","quote":"パッケージ基板へ小型シリコンブリッジを埋め込み、隣接するダイ同士を高密度に接続する2.5D技術である。","quote_start":0,"quote_end":51,"text_sha256":"b345d0f3eab88e991f2832354e614325acf9f7a0e39ace758c63ec60a1064cfe","block_sha256":"b345d0f3eab88e991f2832354e614325acf9f7a0e39ace758c63ec60a1064cfe","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_5daa6cbb-55d0-4ee3-a679-3e7659ed617a"},{"id":"occ_b9c50d438209aeb44258ab36","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_633051cd-cab0-49f8-b710-d01a7af259d4","section_id":"sec_37fe3199-34f2-4aa4-8a93-957a790be687","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":31,"end":35,"exact":"2.5D","quote":"方式ダイの配置主な接続基盤2D横方向に並べる有機パッケージ基板2.5D横方向に並べるインターポーザーやシリコンブリッジ3D上下方向に積むベースダイ、Hybrid Bondingなど","quote_start":0,"quote_end":90,"text_sha256":"4aa274d629a902901999a3622524bca9208b8d23f1bcdbe02e9a6c970b93afc8","block_sha256":"4aa274d629a902901999a3622524bca9208b8d23f1bcdbe02e9a6c970b93afc8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_633051cd-cab0-49f8-b710-d01a7af259d4"},{"id":"occ_9b04e6ad05a0b58d7d6d891e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_6926392e-5b3e-4f67-9930-0e554352a05c","section_id":"sec_f0ad356a-367b-4867-a895-81d297477bbc","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":11,"end":15,"exact":"2.5D","quote":"高発熱ダイを横に並べた2.5D構成の方が扱いやすい場合がある。","quote_start":0,"quote_end":31,"text_sha256":"c7811869dd148424ff94230226c53efe8c7f774e971053891b0f49ab8fe03516","block_sha256":"c7811869dd148424ff94230226c53efe8c7f774e971053891b0f49ab8fe03516","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_6926392e-5b3e-4f67-9930-0e554352a05c"},{"id":"occ_8fba5086ad80896ad21ca3e1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_6b764a5c-d538-4130-99c5-dcc58885d139","section_id":"sec_37fe3199-34f2-4aa4-8a93-957a790be687","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"2.5D","quote":"ただし「2D」「2.5D」という呼び方には、企業や技術資料によって多少の表現差がある。","quote_start":0,"quote_end":43,"text_sha256":"5dc06f6b31e41aacd6342408b5131dc0302677e9b775f5abdaa644a7dee36ca3","block_sha256":"5dc06f6b31e41aacd6342408b5131dc0302677e9b775f5abdaa644a7dee36ca3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_6b764a5c-d538-4130-99c5-dcc58885d139"},{"id":"occ_a320cc4dffad5081ebae819a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_742c4718-efb6-4b71-b90a-6177501e374a","section_id":"sec_fa976a17-07d7-4466-81ea-b6a16052c049","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":3,"end":8,"exact":"CoWoS","quote":"## CoWoS-S","quote_start":0,"quote_end":10,"text_sha256":"88944b6a65e4f556a7afbaeb2e531d7f9f4175da7c7d2259d58c77a4687852cf","block_sha256":"88944b6a65e4f556a7afbaeb2e531d7f9f4175da7c7d2259d58c77a4687852cf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_742c4718-efb6-4b71-b90a-6177501e374a"},{"id":"occ_58a16495d839f3ecc2c8db8c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_8dc7d2f4-3453-4ad2-9090-deb82a8e0352","section_id":"sec_2d1f9016-5169-4dbf-90f6-02b90d7d5d6d","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"2.5D","quote":"## 2.5Dパッケージ","quote_start":0,"quote_end":12,"text_sha256":"63fc02810832eac7c4d42a861f8c13d01cb0bdcdd41e732291722d7b86f66280","block_sha256":"63fc02810832eac7c4d42a861f8c13d01cb0bdcdd41e732291722d7b86f66280","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_8dc7d2f4-3453-4ad2-9090-deb82a8e0352"},{"id":"occ_41af5c9e688ebf29ac57c459","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_8f4919d1-cf95-4880-bc42-c0a3962d7cd7","section_id":"sec_fa976a17-07d7-4466-81ea-b6a16052c049","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":6,"end":11,"exact":"CoWoS","quote":"TSMCは、CoWoS-Sで最大3.3倍レチクル規模、約2,700mm²のインターポーザーへ対応すると説明しており、それを超える規模にはCoWoS-LまたはCoWoS-Rを推奨している。([3DFabric](https:","quote_start":0,"quote_end":111,"text_sha256":"10d8f09626bcfd69679b4e63cac790ddc35d07937ebccce2164ca515e7161ba1","block_sha256":"10d8f09626bcfd69679b4e63cac790ddc35d07937ebccce2164ca515e7161ba1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_8f4919d1-cf95-4880-bc42-c0a3962d7cd7"},{"id":"occ_7a61af903fe6f168110ffe58","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_9119cfc5-8971-4d3b-bf52-531184fb8852","section_id":"sec_b7963fa4-a2df-49a6-b0b6-397715d9c607","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":3,"end":8,"exact":"CoWoS","quote":"## CoWoS-R","quote_start":0,"quote_end":10,"text_sha256":"acda75225e198311d4c9dc832cb17c4d3f36cd695deca580c98d9ce4dab8e29e","block_sha256":"acda75225e198311d4c9dc832cb17c4d3f36cd695deca580c98d9ce4dab8e29e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_9119cfc5-8971-4d3b-bf52-531184fb8852"},{"id":"occ_d4c087dae942f4f28a6295de","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_a9d567f2-917b-4d59-a83d-2ce94d32c948","section_id":"sec_19004bfb-4995-4a75-82e1-07f923eec46b","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":34,"end":38,"exact":"SoIC","quote":"これらの詳細は、3D V-Cache、Foveros Direct、SoICを扱う回で改めて解説する。","quote_start":0,"quote_end":51,"text_sha256":"9f2801c7a5748edb39051b046c22c20eb251b4e27dc8ae2526839c75b6d3e2d4","block_sha256":"9f2801c7a5748edb39051b046c22c20eb251b4e27dc8ae2526839c75b6d3e2d4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_a9d567f2-917b-4d59-a83d-2ce94d32c948"},{"id":"occ_09e030ab7439300df2503a85","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_aafb2fff-c907-4dbf-99b2-437a7bde7185","section_id":"sec_2d1f9016-5169-4dbf-90f6-02b90d7d5d6d","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"2.5D","quote":"2.5Dパッケージでは、複数のダイを横方向へ並べる点は2D構成と同じである。","quote_start":0,"quote_end":38,"text_sha256":"713bb5ef8b6191b62e7e245d39d85bd83cf63efd9067707ff508a6ee829106c1","block_sha256":"713bb5ef8b6191b62e7e245d39d85bd83cf63efd9067707ff508a6ee829106c1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_aafb2fff-c907-4dbf-99b2-437a7bde7185"},{"id":"occ_c062c2c29d4dea52a006972e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_b5e3d045-5470-4d29-a0e5-fcb378c43b61","section_id":"sec_1b226022-dfb3-4f18-81d9-889c23cc376c","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","先端パッケージ"],"evidence":{"text_basis":"markdown","start":19,"end":26,"exact":"先端パッケージ","quote":"シリコンインターポーザーを使う代表的な先端パッケージが、TSMCの**CoWoS**である。","quote_start":0,"quote_end":46,"text_sha256":"197292db732bfa136ef079db082d5073ebecc14805a8822daacaacd8ff34cb6b","block_sha256":"197292db732bfa136ef079db082d5073ebecc14805a8822daacaacd8ff34cb6b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_b5e3d045-5470-4d29-a0e5-fcb378c43b61"},{"id":"occ_76f7f67ce995c1b8f5ff8928","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_b6911d08-52b8-4b61-992c-63ab872127bb","section_id":"sec_ef7f0403-310e-4f53-9c1e-a3edd7defcf0","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":26,"end":30,"exact":"2.5D","quote":"## 第4回　チップレットはどこに載るのか――2D・2.5D・3Dパッケージの基本","quote_start":0,"quote_end":41,"text_sha256":"bd70f61a8f294e57782ab7f39e3690ddc9efc607836a147fb7838f74bb50bda4","block_sha256":"bd70f61a8f294e57782ab7f39e3690ddc9efc607836a147fb7838f74bb50bda4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_b6911d08-52b8-4b61-992c-63ab872127bb"},{"id":"occ_8ef6c41989cb010393f3c2d0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_bb181efc-8c9f-47b8-8638-4326214f82c5","section_id":"sec_1b226022-dfb3-4f18-81d9-889c23cc376c","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":3,"end":8,"exact":"CoWoS","quote":"現在のCoWoSには、接続基盤の違いによって複数の方式がある。","quote_start":0,"quote_end":31,"text_sha256":"91b31cd4e64621543c2173581cf02442d50d394914cef3273443accf6058ef38","block_sha256":"91b31cd4e64621543c2173581cf02442d50d394914cef3273443accf6058ef38","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_bb181efc-8c9f-47b8-8638-4326214f82c5"},{"id":"occ_3b08bd5b992fce9a317f0687","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_d1a52a17-91ca-421e-bae1-e56e03463c44","section_id":"sec_19004bfb-4995-4a75-82e1-07f923eec46b","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMCのSoICは、異なるサイズ、機能、製造ノードの良品ダイを高密度に垂直統合し、短いダイ間接続によって帯域、電力、信号品質を改善する3D統合技術である。([3DFabric](https://3dfabric.ts","quote_start":0,"quote_end":109,"text_sha256":"2e06fb67ff8d5d1ffb3fab6a1c53c4ab235344689d173f90831f9dd459d6a703","block_sha256":"2e06fb67ff8d5d1ffb3fab6a1c53c4ab235344689d173f90831f9dd459d6a703","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_d1a52a17-91ca-421e-bae1-e56e03463c44"},{"id":"occ_dcaad13d6fb1f41b3ee6892e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_e5d7ad95-5706-4690-b4da-567ba2ebd5e3","section_id":"sec_4bffc99f-e7ed-496f-9917-5ff34745c0b0","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"2.5D","quote":"2Dと2.5Dでは、ダイを基本的に横へ並べる。","quote_start":0,"quote_end":23,"text_sha256":"f5020d77d5921d969b0ab2edbc88308242831a41d9117fc3b20cd5af789040eb","block_sha256":"f5020d77d5921d969b0ab2edbc88308242831a41d9117fc3b20cd5af789040eb","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_e5d7ad95-5706-4690-b4da-567ba2ebd5e3"},{"id":"occ_3edd6ede1d2f4017f04835e6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_e82f9051-bb43-4305-9d95-6b18a6666af2","section_id":"sec_5365b45d-cf90-4529-bd52-b7bdd7dfca19","layer":"body","character_id":null,"count":6,"matched_aliases":["2.5D","CoWoS","EMIB","先端パッケージ"],"evidence":{"text_basis":"markdown","start":122,"end":126,"exact":"2.5D","quote":"ackage**は、主に有機基板でダイを横方向へ接続する。低コストだが、配線密度と距離に制約がある。\n- **2.5D**では、シリコンインターポーザー、シリコンブリッジ、RDLなどを使い、横並びのダイを高密度に接続する。\n- **CoWoS**は、ロジックダイとHBMを統合するTSMCの代表的な先端パッケージである","quote_start":67,"quote_end":226,"text_sha256":"5dcaa34390d7ebc62332c437507138763a0687aeb2f1cf71439c063c8b2aef15","block_sha256":"5dcaa34390d7ebc62332c437507138763a0687aeb2f1cf71439c063c8b2aef15","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_e82f9051-bb43-4305-9d95-6b18a6666af2"},{"id":"occ_55dc3c3336ac4fe3412b0ac0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_e90d95a4-97e7-4b37-9d9a-802f4431c8e5","section_id":"sec_19004bfb-4995-4a75-82e1-07f923eec46b","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":17,"end":31,"exact":"Hybrid Bonding","quote":"3D積層では、マイクロバンプまたはHybrid Bondingによって上下のダイを接続する。","quote_start":0,"quote_end":46,"text_sha256":"e08359704c0f672bea7864ef196e9672d011bcb82b89e9ed7652933ea6c4e3f3","block_sha256":"e08359704c0f672bea7864ef196e9672d011bcb82b89e9ed7652933ea6c4e3f3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_e90d95a4-97e7-4b37-9d9a-802f4431c8e5"},{"id":"occ_6bb2798ce3d5eed475c6eaed","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_eec15edd-ae52-42a5-bc30-3708dc30f67b","section_id":"sec_1b226022-dfb3-4f18-81d9-889c23cc376c","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoSは、Chip on Wafer on Substrateの略称である。","quote_start":0,"quote_end":40,"text_sha256":"09669918221b4de6021bab16a932ada8ee199ca395c74d0e7e0481d3a9ccab19","block_sha256":"09669918221b4de6021bab16a932ada8ee199ca395c74d0e7e0481d3a9ccab19","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_eec15edd-ae52-42a5-bc30-3708dc30f67b"},{"id":"occ_3cfb2bd7cf057e440a1f4a24","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_f064b112-b0a1-49d6-8e19-7baa96b37ff9","section_id":"sec_1b226022-dfb3-4f18-81d9-889c23cc376c","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":8,"end":13,"exact":"CoWoS","quote":"## TSMC CoWoS","quote_start":0,"quote_end":13,"text_sha256":"f4022fd0daa79f4c894ec11c97caf2a63368dff3e8d758248e7b412df5c2709a","block_sha256":"f4022fd0daa79f4c894ec11c97caf2a63368dff3e8d758248e7b412df5c2709a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b/#blk_f064b112-b0a1-49d6-8e19-7baa96b37ff9"},{"id":"occ_56da31b1d15b48dd8d050be8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_a576fa5a-37e6-4ec1-abf6-a1f85dd3b36b","work_id":"wrk_f10d5b53-68f1-4910-99da-a417455c7877","block_id":"blk_faf929f3-de2b-4aae-8f99-f38d486ab0f8","section_id":"sec_699be11c-0f23-4ca9-9184-41a4f579cd77","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"EMIB","quote":"Intelの**EMIB**は、Embedded Multi-die Interconnect 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dieとHBMをインターポーザ上に横並びで配置する。\nHBM内部のDRAMダイは縦積みだが、GPU/ASIC本体とHBMスタックは基本的に横に並ぶ。","quote_start":0,"quote_end":92,"text_sha256":"1a7de18d85570f0febd424f8b4f1b631705d21c4a51b3fe34f26e483ad3f80d8","block_sha256":"1a7de18d85570f0febd424f8b4f1b631705d21c4a51b3fe34f26e483ad3f80d8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_1116ecb9-93fe-44fc-90a8-ca80dc98fd44"},{"id":"occ_a54680613296437280de48cc","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_183b194c-4ccf-4428-a93f-7a117b96fb5e","section_id":"sec_7a046ff0-65f5-4c58-b6d1-b4b98ff6f304","layer":"caption","character_id":null,"count":1,"matched_aliases":["Hybrid 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必要な部分だけを縦に近づける](media/50483417d6b78b8be0bd282ca401a94f67f31fda2ddec16d0104b190cc5fd737.png)","quote_start":0,"quote_end":109,"text_sha256":"ad4d2841cf948821143b1112f26e6247b6f41af119a315425db9a2beea2c7278","block_sha256":"ad4d2841cf948821143b1112f26e6247b6f41af119a315425db9a2beea2c7278","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_183b194c-4ccf-4428-a93f-7a117b96fb5e"},{"id":"occ_4022792971eef01c6ec3f97d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_1b5a83d1-19d6-4a87-8d75-c9b88bb9da86","section_id":"sec_91b5eea7-9d9c-44d5-a67e-1e1fa33a4803","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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COUPEのような光電融合パッケージ基盤。","quote_start":0,"quote_end":123,"text_sha256":"b3ffced48c65161a0b99aa1300d496a298d00e32bb460841de60ec85bd3f8f66","block_sha256":"b3ffced48c65161a0b99aa1300d496a298d00e32bb460841de60ec85bd3f8f66","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_1b5a83d1-19d6-4a87-8d75-c9b88bb9da86"},{"id":"occ_ca69bd83f510450ad11b964f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_1e49ce2e-92e5-4da3-9f9e-25efbd977a08","section_id":"sec_34f23542-6830-45bf-8deb-025bdc67429c","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"2.5D","quote":"2.5Dの限界は、シリコン面積、HBM数、I/O密度、die-to-die電力、パッケージサイズにある。Broadcomは従来2.5Dを、最大2500mm²級のシリコン、最大8 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接合方法。\n3D stacking = ダイを縦に積む構造。\n3.5D XDSiP = 2.5D横並びと3D積層を組み合わせたパッケージ全体設計。","quote_start":0,"quote_end":90,"text_sha256":"0248a0c34612999081a0c62954c76d0f972d7955b212d1c4e0a27d1e41a44d75","block_sha256":"0248a0c34612999081a0c62954c76d0f972d7955b212d1c4e0a27d1e41a44d75","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_27611ba9-6345-4bb2-86f2-64562b09f3f6"},{"id":"occ_38c3668676339356260805c0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_2c77adc7-9195-457a-857c-88ff528a818f","section_id":"sec_7a046ff0-65f5-4c58-b6d1-b4b98ff6f304","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid 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XDSiP、将来の光エンジン統合の一部として使われる。","quote_start":0,"quote_end":96,"text_sha256":"d1bcd550d9c7767016784edde4e198d76628f1ce0d2d0d6225f831c4cb8ed522","block_sha256":"d1bcd550d9c7767016784edde4e198d76628f1ce0d2d0d6225f831c4cb8ed522","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_2c77adc7-9195-457a-857c-88ff528a818f"},{"id":"occ_b36bc46bba336bb6aed930ac","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_321e97eb-2655-4006-9c47-5c52fa03fd7d","section_id":"sec_74a7f3dd-0ad5-48e1-8731-6ad1cfd8c229","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":164,"end":169,"exact":"CoWoS","quote":"光I/OとPhotonic Fabricで、複数ラックscale-upと分散メモリの未来を狙う。\nTSMCは、CoWoS、SoIC、COUPEで、そのすべてを物理的に作る土台になる。","quote_start":109,"quote_end":200,"text_sha256":"6915fef6480adbe4ca101d9e27ef71fc325deda3cd97796f310c7e300cba7df1","block_sha256":"6915fef6480adbe4ca101d9e27ef71fc325deda3cd97796f310c7e300cba7df1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_321e97eb-2655-4006-9c47-5c52fa03fd7d"},{"id":"occ_378cc1a840cd8ca9a04d672f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_604cb5fd-7905-44a0-a2dd-cbe8b9091137","section_id":"sec_91b5eea7-9d9c-44d5-a67e-1e1fa33a4803","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Fabric、COUPEまでをつなげて読む\nAIインフラの競争は、もはや「GPUを誰が多く買えるか」だけではなくなっている。","quote_start":0,"quote_end":110,"text_sha256":"d0db56c716adad81377bc457b75d2bb6aa92daabc2f0267e8f65c4ca234c0cb2","block_sha256":"d0db56c716adad81377bc457b75d2bb6aa92daabc2f0267e8f65c4ca234c0cb2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_604cb5fd-7905-44a0-a2dd-cbe8b9091137"},{"id":"occ_ab5f0fe1c234d8ea5b81c59f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_a78d5451-55b8-444e-b612-68d6fc81556a","section_id":"sec_74a7f3dd-0ad5-48e1-8731-6ad1cfd8c229","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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fabricを組み合わせ、AIファクトリーの演算とネットワークをまとめて取ろうとしている。","quote_start":4,"quote_end":149,"text_sha256":"1d362404318b46076d5d8ab2ba74b27937a4ed979bcf96a779f0cc381c356bfd","block_sha256":"1d362404318b46076d5d8ab2ba74b27937a4ed979bcf96a779f0cc381c356bfd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_a78d5451-55b8-444e-b612-68d6fc81556a"},{"id":"occ_ea26f9bf8429dd9d9816d776","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_cc557422-2f6a-4e80-baee-3caedbd5b857","section_id":"sec_7a046ff0-65f5-4c58-b6d1-b4b98ff6f304","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":6,"end":20,"exact":"Hybrid Bonding","quote":"## 5. Hybrid Bondingの基本","quote_start":0,"quote_end":23,"text_sha256":"e8b64d51e887d102c49ecf0099d4c794167b1f90fa53d5ab67a7bc298f2ef0d1","block_sha256":"e8b64d51e887d102c49ecf0099d4c794167b1f90fa53d5ab67a7bc298f2ef0d1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_abe6b561-f51c-4549-a97f-aab2b725492e/#blk_cc557422-2f6a-4e80-baee-3caedbd5b857"},{"id":"occ_5125a44cc709f8aa4c77fdea","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_abe6b561-f51c-4549-a97f-aab2b725492e","work_id":"wrk_f31c79fd-b257-498a-9ee1-d344ac94ffc7","block_id":"blk_cfbe50ea-57c4-46e6-b1f4-bb857091fe42","section_id":"sec_7a046ff0-65f5-4c58-b6d1-b4b98ff6f304","layer":"caption","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":2,"end":6,"exact":"2.5D","quote":"![2.5Dパッケージ: compute 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 \nGPUにはHBMが必要だ。  \nHBMには先端パッケージが必要だ。  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 \n半導体製造は、ロケットやEV工場以上に複雑で、EUV、歩留まり、材料、装置、先端パッケージ、HBM、熟練人材が絡む。","quote_start":1,"quote_end":76,"text_sha256":"ce1b9143ab1e1b0a45d5d1344d49a26b4b087dc644cf406939ded3b43c62fbcc","block_sha256":"ce1b9143ab1e1b0a45d5d1344d49a26b4b087dc644cf406939ded3b43c62fbcc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bde0c156-c5e8-4c02-a4c1-11e282359f67/#blk_bed6f025-b070-46e0-8270-d65ab129865b"},{"id":"occ_7dada44ff680a8f503b4e866","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_bf97dda8-b55b-4e4d-b1cf-b775474af9b2","work_id":"wrk_72fede57-1e40-4a22-81c2-67b2328ba457","block_id":"blk_009219d6-64aa-4694-b161-3762372154bb","section_id":"sec_70c35e08-c949-4b70-8898-890fbcaf6571","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid 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Bonding、テスト、光接続まで同じモデルに載せて計算してみます。","quote_start":3,"quote_end":107,"text_sha256":"c036e375ff4836bc4710cd14f60e357714c398573e09176cb6fda1c143b6ea55","block_sha256":"c036e375ff4836bc4710cd14f60e357714c398573e09176cb6fda1c143b6ea55","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bf97dda8-b55b-4e4d-b1cf-b775474af9b2/#blk_5498ff19-da41-4577-8085-41f6a6ef715b"},{"id":"occ_dbdb68f666cf27fe92f96a4a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_bf97dda8-b55b-4e4d-b1cf-b775474af9b2","work_id":"wrk_72fede57-1e40-4a22-81c2-67b2328ba457","block_id":"blk_61499794-bafe-40c3-a960-fa6c9f186553","section_id":"sec_a793b785-9bb0-481a-8615-ad4200c3a748","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":24,"end":29,"exact":"CoWoS","quote":"TSMC自身も2028年に14-reticle CoWoSで約10個の大型compute dieと20 HBM stacksを統合し、2029年には14 reticle超へ拡大するroadmapを示しています。(TSMC)","quote_start":0,"quote_end":111,"text_sha256":"08e81c553b73f5147c02ef9da8845e0cd91704932f90fad50233fefb57b7b56b","block_sha256":"08e81c553b73f5147c02ef9da8845e0cd91704932f90fad50233fefb57b7b56b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bf97dda8-b55b-4e4d-b1cf-b775474af9b2/#blk_61499794-bafe-40c3-a960-fa6c9f186553"},{"id":"occ_24bf1943f77ae5404b963656","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_bf97dda8-b55b-4e4d-b1cf-b775474af9b2","work_id":"wrk_72fede57-1e40-4a22-81c2-67b2328ba457","block_id":"blk_82d7629a-aa1e-443f-b0c0-b49ed2d4694e","section_id":"sec_0d60af77-604e-46b8-a7e2-b31ffabea918","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"が同時にHybrid Bondingを使い始めます。","quote_start":0,"quote_end":26,"text_sha256":"a2ccaaecf990f8694e55b9a8ed59bc03aa42fb2d48b0214f93fa8c6767eda3bc","block_sha256":"a2ccaaecf990f8694e55b9a8ed59bc03aa42fb2d48b0214f93fa8c6767eda3bc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bf97dda8-b55b-4e4d-b1cf-b775474af9b2/#blk_82d7629a-aa1e-443f-b0c0-b49ed2d4694e"},{"id":"occ_43ec273cb69df719d6996e37","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_bf97dda8-b55b-4e4d-b1cf-b775474af9b2","work_id":"wrk_72fede57-1e40-4a22-81c2-67b2328ba457","block_id":"blk_b0d5a426-9c73-441d-ac5f-eece0c2b7591","section_id":"sec_0d60af77-604e-46b8-a7e2-b31ffabea918","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"28．Hybrid Bondingは製造業の新しいボトルネックになる","quote_start":0,"quote_end":34,"text_sha256":"3c978430a4760e979cea7a19352bf824baf61b7cd9aa4c4ef3984284c2d73ebc","block_sha256":"3c978430a4760e979cea7a19352bf824baf61b7cd9aa4c4ef3984284c2d73ebc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_bf97dda8-b55b-4e4d-b1cf-b775474af9b2/#blk_b0d5a426-9c73-441d-ac5f-eece0c2b7591"},{"id":"occ_40fd0d17800e993905a2951a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c0f60d6c-f786-4c21-bf93-b517ab98e464","work_id":"wrk_6f052560-2a04-4f53-b80d-4f1c5a329637","block_id":"blk_312595a7-e649-4a9b-8370-717027aaa33e","section_id":"sec_77321219-ef9f-41e2-9033-ce2082a718c0","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":44,"end":51,"exact":"先端パッケージ","quote":"Camtekは2026年にAIアプリケーション向けHawkシステムの注文を発表しており、先端パッケージ/HBM/チップレット系の検査需要が実際に装置需要として現れている。([Camtek](https://www.camtek.com/news-and-events/camtek-receives-m","quote_start":0,"quote_end":151,"text_sha256":"ae5f372913b4039aa2cbd5e702c20b7c1f8ce05b258a55acd88d7c8cd6748054","block_sha256":"ae5f372913b4039aa2cbd5e702c20b7c1f8ce05b258a55acd88d7c8cd6748054","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c0f60d6c-f786-4c21-bf93-b517ab98e464/#blk_312595a7-e649-4a9b-8370-717027aaa33e"},{"id":"occ_e835bb7fe00e05c2280373f4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c0f60d6c-f786-4c21-bf93-b517ab98e464","work_id":"wrk_6f052560-2a04-4f53-b80d-4f1c5a329637","block_id":"blk_591a5f86-e5bd-48f8-8193-0ac4db1ff5b5","section_id":"sec_5638f57d-ce8e-42b7-9baa-c9c32e44e5d4","layer":"body","character_id":null,"count":1,"matched_aliases":["ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":26,"end":38,"exact":"ハイブリッドボンディング","quote":"最も見えやすい。HBM4、HBM4E、チップレット、ハイブリッドボンディングが進むほど、Camtek、Onto、Nova、KLAの領域は伸びやすい。","quote_start":0,"quote_end":74,"text_sha256":"2c58572bf7dff1c2def0c90b3bf92ef64e960d14179dda7cb93f8e2563cc9263","block_sha256":"2c58572bf7dff1c2def0c90b3bf92ef64e960d14179dda7cb93f8e2563cc9263","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c0f60d6c-f786-4c21-bf93-b517ab98e464/#blk_591a5f86-e5bd-48f8-8193-0ac4db1ff5b5"},{"id":"occ_16131880a721f0ff5ffa12f4","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c0f60d6c-f786-4c21-bf93-b517ab98e464","work_id":"wrk_6f052560-2a04-4f53-b80d-4f1c5a329637","block_id":"blk_823b1a0f-be55-433a-8e40-9cdb2612fdd9","section_id":"sec_77321219-ef9f-41e2-9033-ce2082a718c0","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS","ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":40,"end":45,"exact":"CoWoS","quote":"AI/HBM時代に特に重要なのが、**3D計測**である。HBM、チップレット、CoWoS、ハイブリッドボンディングでは、半導体が平面から立体へ進化している。すると、2D画像だけでは不十分で、バンプ高さ、共面性、反り、接合面、TSV、マイクロバンプ、ハイブリッドボンディング面まで見る必要が","quote_start":0,"quote_end":145,"text_sha256":"d679500720f989b9ff7bb8566311d84f8629e6592413617151e4e1bd87644993","block_sha256":"d679500720f989b9ff7bb8566311d84f8629e6592413617151e4e1bd87644993","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c0f60d6c-f786-4c21-bf93-b517ab98e464/#blk_823b1a0f-be55-433a-8e40-9cdb2612fdd9"},{"id":"occ_b4dab19558b61fe7db01722f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c0f60d6c-f786-4c21-bf93-b517ab98e464","work_id":"wrk_6f052560-2a04-4f53-b80d-4f1c5a329637","block_id":"blk_c3af849e-d99f-49e9-a19b-d200c16cdd68","section_id":"sec_7368c624-13b3-4447-9911-4f93e708b8b3","layer":"body","character_id":null,"count":2,"matched_aliases":["ハイブリッドボンディング","先端パッケージ"],"evidence":{"text_basis":"markdown","start":78,"end":90,"exact":"ハイブリッドボンディング","quote":"Iパッケージ全体を失う。だから、積む前、貼る前、封止する前に不良を見つける価値が上がる。HBM4、HBM4E、ハイブリッドボンディング、将来の3D DRAM/ロジック積層が進むほど、3D計測と先端パッケージ検査は伸びやすい。","quote_start":23,"quote_end":135,"text_sha256":"d7f3624c8f26728f4e68526d2aaddfc073ba99c87d7c2402359ed3add6d6c751","block_sha256":"d7f3624c8f26728f4e68526d2aaddfc073ba99c87d7c2402359ed3add6d6c751","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c0f60d6c-f786-4c21-bf93-b517ab98e464/#blk_c3af849e-d99f-49e9-a19b-d200c16cdd68"},{"id":"occ_0532aea3fc0ae86b839b56f1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c0f60d6c-f786-4c21-bf93-b517ab98e464","work_id":"wrk_6f052560-2a04-4f53-b80d-4f1c5a329637","block_id":"blk_d60e2984-90ea-484e-b23b-6b24b681cfbb","section_id":"sec_a82918b7-7a3b-40bf-9463-2a371600fd8c","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":86,"end":93,"exact":"先端パッケージ","quote":"抵抗、高周波対応、熱膨張への追従、ウェハー反りへの対応である。FormFactorは、ロジック、メモリ、5G、先端パッケージ、シリコンフォトニクス、量子など幅広いオンウェハーテスト領域を対象にしている。([FormFactor, Inc.](https://www.formfactor.com/?utm_source=ch","quote_start":31,"quote_end":193,"text_sha256":"a853a9f9264d617674274c23a202bf770f3eaeeba878b4f762dcb99b989bab26","block_sha256":"a853a9f9264d617674274c23a202bf770f3eaeeba878b4f762dcb99b989bab26","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c0f60d6c-f786-4c21-bf93-b517ab98e464/#blk_d60e2984-90ea-484e-b23b-6b24b681cfbb"},{"id":"occ_5a5d4d21a5855a61fdd95622","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c0f60d6c-f786-4c21-bf93-b517ab98e464","work_id":"wrk_6f052560-2a04-4f53-b80d-4f1c5a329637","block_id":"blk_e55d61a0-de93-464f-9a91-30e4521e5016","section_id":"sec_5638f57d-ce8e-42b7-9baa-c9c32e44e5d4","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":11,"end":18,"exact":"先端パッケージ","quote":"## \\1. HBM・先端パッケージ検査/3D計測","quote_start":0,"quote_end":25,"text_sha256":"d8f04a44c3d8133d03c11b0e1f349661b9f71fb02994657475a571dc4d580dce","block_sha256":"d8f04a44c3d8133d03c11b0e1f349661b9f71fb02994657475a571dc4d580dce","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c0f60d6c-f786-4c21-bf93-b517ab98e464/#blk_e55d61a0-de93-464f-9a91-30e4521e5016"},{"id":"occ_361c7bf430cee0ffa0bf3a1b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c1530075-b9e3-4144-b8ce-f6e480c778fa","work_id":"wrk_50367f10-59d7-41cc-990d-213cec7e7f79","block_id":"blk_6f0877f3-b4f8-4c85-ab18-ad3d18d9a614","section_id":"sec_bcd70ef8-3578-4856-8b37-f4d224ce2396","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":8,"end":15,"exact":"先端パッケージ","quote":"GPU\nHBM\n先端パッケージ\n800G/1.6T光通信\nInPレーザー\nCPO/外部光源\nCDN\nWAF\nBot Management\nゼロトラスト\n電力設備\n変圧器\n冷却\nデータセンター建設\nロボティクス基盤\nシミュレーション","quote_start":0,"quote_end":115,"text_sha256":"9e2a71e13198cf919512bf39c699e202cdc296ba1180468aca9e8eed26feb357","block_sha256":"9e2a71e13198cf919512bf39c699e202cdc296ba1180468aca9e8eed26feb357","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c1530075-b9e3-4144-b8ce-f6e480c778fa/#blk_6f0877f3-b4f8-4c85-ab18-ad3d18d9a614"},{"id":"occ_08aa307da46a6dc2bcaa5d51","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_0242cef8-460a-47a9-867d-2743a3edfe8f","section_id":"sec_95533c05-fa6e-4b18-9b7c-1357a54efa0b","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"2.5D","quote":"## 2.5Dパッケージでのマイクロバンプ","quote_start":0,"quote_end":21,"text_sha256":"7fe90f2b3a13139a6114ba872d21e534790fdc1e5bf73f3dc662ebffefb709dc","block_sha256":"7fe90f2b3a13139a6114ba872d21e534790fdc1e5bf73f3dc662ebffefb709dc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_0242cef8-460a-47a9-867d-2743a3edfe8f"},{"id":"occ_171f75b88a3639e0b9a8c1a6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_0999e83c-05d3-4cca-af9f-0910ed734831","section_id":"sec_d29eed28-781a-4d6b-92d0-13e097eaa653","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":66,"end":80,"exact":"Hybrid 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Bondingが有力になる。([imec](https://www.imec-int.com/en/press/nanoic-opens-access-first-ever-fine-pitch-rdl-and-d","quote_start":11,"quote_end":180,"text_sha256":"eb218d4ad378bbafe52ca7ec9d272bb5d4038e4c33dd75952eb7e5f616bec228","block_sha256":"eb218d4ad378bbafe52ca7ec9d272bb5d4038e4c33dd75952eb7e5f616bec228","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_0999e83c-05d3-4cca-af9f-0910ed734831"},{"id":"occ_bc431396c3a2370548bc899d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_0b719f11-096b-469b-a14b-ba56c5193f2e","section_id":"sec_84b1a7f5-3c23-4603-aaea-05eff84c5175","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bonding**への移行が進んでいる。","quote_start":0,"quote_end":60,"text_sha256":"03f0377b723816ed101589b6b9b8ae0ad2cef5ef74d8d0fbe741c68d5e742038","block_sha256":"03f0377b723816ed101589b6b9b8ae0ad2cef5ef74d8d0fbe741c68d5e742038","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_0b719f11-096b-469b-a14b-ba56c5193f2e"},{"id":"occ_351f2646aeed5649ba31b9bd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_0e3d7591-47b1-460f-8993-4b328c1b9571","section_id":"sec_84b1a7f5-3c23-4603-aaea-05eff84c5175","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingには、","quote_start":0,"quote_end":17,"text_sha256":"32e95d36e31c2e200fbcbbc7202369e02c7af1cf1fc9ab3d68615b198ef19d74","block_sha256":"32e95d36e31c2e200fbcbbc7202369e02c7af1cf1fc9ab3d68615b198ef19d74","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_0e3d7591-47b1-460f-8993-4b328c1b9571"},{"id":"occ_c8ae6dceda505b6c3a51d737","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_1ccc7c8f-e216-4575-ba8d-6ef8dae16b5e","section_id":"sec_95533c05-fa6e-4b18-9b7c-1357a54efa0b","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":7,"end":12,"exact":"CoWoS","quote":"TSMCの初期CoWoS試作例では、ロジックダイとシリコンインターポーザーの間に45µmピッチのマイクロバンプを使用し、インターポーザーと有機基板の間には180µmピッチのC4バンプを使用していた。これは一つの試作例であり、","quote_start":0,"quote_end":112,"text_sha256":"a76cf0991b77f04590c9a99ebc4158f58b4c2b5146a0f0085c0790cc8baa4641","block_sha256":"a76cf0991b77f04590c9a99ebc4158f58b4c2b5146a0f0085c0790cc8baa4641","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_1ccc7c8f-e216-4575-ba8d-6ef8dae16b5e"},{"id":"occ_0758368acd7c9a0877c0609f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_215f1fa7-f994-4b12-a5d5-d7bd25eebda7","section_id":"sec_2db9cb78-cbdc-4a46-806f-977b4d3f27c7","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"**レチクル限界、Die-to-Die PHY、Hybrid Bonding、TSVから、3D V-Cache、Foveros Direct、SoIC**","quote_start":0,"quote_end":77,"text_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","block_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_215f1fa7-f994-4b12-a5d5-d7bd25eebda7"},{"id":"occ_f2fe7d13645b34f498e3be09","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_35b5099e-4843-42f5-9c25-5576b022360a","section_id":"sec_2d4468aa-36b8-4407-955b-b4e38d6fa151","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":6,"end":13,"exact":"先端パッケージ","quote":"しかし実際の先端パッケージでは、単純な球形のはんだだけでなく、**銅ピラーとはんだキャップを組み合わせた構造**が広く使われる。","quote_start":0,"quote_end":64,"text_sha256":"f453a948ed8224560de2358a58b7ed2f44f8bfd2b47c8c0546783a8f33fcdf66","block_sha256":"f453a948ed8224560de2358a58b7ed2f44f8bfd2b47c8c0546783a8f33fcdf66","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_35b5099e-4843-42f5-9c25-5576b022360a"},{"id":"occ_f6abe04935b5f5870e585743","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_58aff9c7-06ef-4a55-adc0-348b68bfd4f2","section_id":"sec_2849e1fb-aa72-4339-9bb2-cdc162a5dbfe","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":78,"end":82,"exact":"SoIC","quote":"-Cu接合と誘電体接合、CMP、銅のディッシング、表面平坦度、接合温度、位置合わせ、マイクロバンプとの性能差、SoICやFoveros Directとの関係を詳しく見ていく。","quote_start":23,"quote_end":110,"text_sha256":"db7f7924ab4e355bf8caf789bcd7b3464b697b3a254c943ba9e1708e08dfbf05","block_sha256":"db7f7924ab4e355bf8caf789bcd7b3464b697b3a254c943ba9e1708e08dfbf05","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_58aff9c7-06ef-4a55-adc0-348b68bfd4f2"},{"id":"occ_785f7989b979c89528c8a8c7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_65254876-8013-4337-aff7-88ee7e64ef9a","section_id":"sec_2849e1fb-aa72-4339-9bb2-cdc162a5dbfe","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":372,"end":386,"exact":"Hybrid Bonding","quote":"ると帯域密度を高められるが、短絡、位置合わせ、電流密度、熱疲労、検査が難しくなる。\n- 最高密度の3D接続ではHybrid Bondingへの移行が進むが、マイクロバンプはコストと量産性の面から今後も使われる。","quote_start":317,"quote_end":422,"text_sha256":"064beb275c2be9955ea8060c2624467e0e0c0b1e7880d5484f556658b6090733","block_sha256":"064beb275c2be9955ea8060c2624467e0e0c0b1e7880d5484f556658b6090733","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_65254876-8013-4337-aff7-88ee7e64ef9a"},{"id":"occ_267f731eda14cd26de0cecde","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_797cf16a-3b13-4b4c-a886-64da596ad452","section_id":"sec_84b1a7f5-3c23-4603-aaea-05eff84c5175","layer":"code","character_id":null,"count":2,"matched_aliases":["2.5D","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":20,"end":34,"exact":"Hybrid Bonding","quote":"```\n超高密度・極短距離3D接続\n→ Hybrid Bonding\n\n一般的な2.5D・3D接続\n→ マイクロバンプ\n\nインターポーザーと基板\n→ C4\n\nパッケージとマザーボード\n→ BGA\n```","quote_start":0,"quote_end":101,"text_sha256":"6dba1583e62a4d0cfe5c18457c0852f6b341ebc2ed4c091a1d1849fa8aa8e395","block_sha256":"6dba1583e62a4d0cfe5c18457c0852f6b341ebc2ed4c091a1d1849fa8aa8e395","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_797cf16a-3b13-4b4c-a886-64da596ad452"},{"id":"occ_1e31b92ad5c4d27197b934cb","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_856bf1cd-fc0d-4408-bc35-758b1ce97df8","section_id":"sec_76e76a54-2615-4700-97b9-827d6da4c826","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":34,"end":38,"exact":"2.5D","quote":"前回は、有機基板を使う2Dパッケージ、シリコンインターポーザーを使う2.5Dパッケージ、そしてダイを上下に重ねる3D積層について解説した。","quote_start":0,"quote_end":69,"text_sha256":"41fbe2f67e5f29d1cd145a7e687bb22b0782689e54e603e357fab45693325f23","block_sha256":"41fbe2f67e5f29d1cd145a7e687bb22b0782689e54e603e357fab45693325f23","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_856bf1cd-fc0d-4408-bc35-758b1ce97df8"},{"id":"occ_3b7d0135e708e8ec639aa1e3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_8a67352f-00ca-4212-a5de-fd0ce071e418","section_id":"sec_76e76a54-2615-4700-97b9-827d6da4c826","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":14,"end":18,"exact":"2.5D","quote":"チップレット、高帯域メモリ、2.5Dパッケージ、従来型の3D積層を理解するうえで、マイクロバンプは基本となる接続技術である。","quote_start":0,"quote_end":62,"text_sha256":"3f1fac7b233078129f379b93d76a37a513c0b3c635e0eb73347ee50311f53bb6","block_sha256":"3f1fac7b233078129f379b93d76a37a513c0b3c635e0eb73347ee50311f53bb6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_8a67352f-00ca-4212-a5de-fd0ce071e418"},{"id":"occ_b10beca0e1a5b31df0f92d2f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_bf1ae871-4fa4-4b28-966d-67effed26d53","section_id":"sec_288e251f-29f5-4e33-9bfb-bfa6e9fa1f02","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":16,"end":20,"exact":"2.5D","quote":"IntelのFoveros-S 2.5Dでは36µmピッチが示され、AmkorもシリコンパッケージやChip-on-Chip向けに30µm級の銅ピラー／マイクロバンプを提供している。([Intel](https://www.intel.co","quote_start":0,"quote_end":120,"text_sha256":"53acfcf672bb47bbdb88bc548f712f1f263a8ff47cdb0059be38558403a056ce","block_sha256":"53acfcf672bb47bbdb88bc548f712f1f263a8ff47cdb0059be38558403a056ce","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_bf1ae871-4fa4-4b28-966d-67effed26d53"},{"id":"occ_66d0627e6296ee5db14d82e8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_c07c7553-b5e3-4b72-b095-b5903b56fac4","section_id":"sec_2849e1fb-aa72-4339-9bb2-cdc162a5dbfe","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":32,"end":46,"exact":"Hybrid Bonding","quote":"次回は、はんだバンプを使わず、銅パッドと絶縁膜を直接接合する**Hybrid Bonding**を解説する。","quote_start":0,"quote_end":54,"text_sha256":"7546b901961f87f876735dd9ee98be38631397c1bfd92eb9596e1e296a6d2773","block_sha256":"7546b901961f87f876735dd9ee98be38631397c1bfd92eb9596e1e296a6d2773","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_c07c7553-b5e3-4b72-b095-b5903b56fac4"},{"id":"occ_7dedb77f3ea934a7ec611aa6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_da85b84b-c807-4381-8176-fdd9f0fcf8cc","section_id":"sec_84b1a7f5-3c23-4603-aaea-05eff84c5175","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":34,"end":48,"exact":"Hybrid Bonding","quote":"IntelのFoveros Direct 3Dは、Cu-to-Cu Hybrid Bondingによって10µm未満のピッチを実現し、従来のマイクロバンプより高い接続密度を提供する。([Intel](https://www.intel.com/content/dam/www/central-li","quote_start":0,"quote_end":148,"text_sha256":"85f6f2594cb128f3177780e6df0a509ec57cb39f32a3d6d8d74ff02e2f946505","block_sha256":"85f6f2594cb128f3177780e6df0a509ec57cb39f32a3d6d8d74ff02e2f946505","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_da85b84b-c807-4381-8176-fdd9f0fcf8cc"},{"id":"occ_56a56d3f4b108cde0afa9d4d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_db5ef012-e855-4d2f-9506-d33ce40f8524","section_id":"sec_84b1a7f5-3c23-4603-aaea-05eff84c5175","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":38,"end":52,"exact":"Hybrid Bonding","quote":"```\nマイクロバンプ\n\nダイ\n● ● ● ●\n────────\nダイ\n\n\nHybrid Bonding\n\nダイ\nCu SiO₂ Cu\n│        │\nCu SiO₂ Cu\nダイ\n```","quote_start":0,"quote_end":96,"text_sha256":"6bf242c67a951ad9b345184745208994098f86819a95683d4c5b4ce84ea38164","block_sha256":"6bf242c67a951ad9b345184745208994098f86819a95683d4c5b4ce84ea38164","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_db5ef012-e855-4d2f-9506-d33ce40f8524"},{"id":"occ_1d6c0d316cf72221076b8167","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_f8885ad2-fe48-41f7-b526-c0ec61263a8c","section_id":"sec_95533c05-fa6e-4b18-9b7c-1357a54efa0b","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":15,"end":19,"exact":"2.5D","quote":"シリコンインターポーザーを使う2.5Dパッケージでは、ロジックダイやHBMをインターポーザーへ接続するためにマイクロバンプを使う。","quote_start":0,"quote_end":65,"text_sha256":"1a93dbee72737e80378ab9748568f2b1ed0e65e182a0e1889ce2ed561fc8d70b","block_sha256":"1a93dbee72737e80378ab9748568f2b1ed0e65e182a0e1889ce2ed561fc8d70b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_f8885ad2-fe48-41f7-b526-c0ec61263a8c"},{"id":"occ_76006356bad3951e2d76f8ed","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c3791796-7fb7-4aa8-a70b-bf30979f4726","work_id":"wrk_d8ac95cd-fc69-48bd-b1c9-0f1180c20086","block_id":"blk_fd3d63b2-5ef5-46b0-b046-9f0ba033515b","section_id":"sec_84b1a7f5-3c23-4603-aaea-05eff84c5175","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":15,"end":29,"exact":"Hybrid Bonding","quote":"ただし、マイクロバンプがすべてHybrid Bondingへ置き換わるわけではない。","quote_start":0,"quote_end":42,"text_sha256":"5cd2acf1edea3d454d1e7b284740465ad66b241a937ae88d311be06f031d00ab","block_sha256":"5cd2acf1edea3d454d1e7b284740465ad66b241a937ae88d311be06f031d00ab","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c3791796-7fb7-4aa8-a70b-bf30979f4726/#blk_fd3d63b2-5ef5-46b0-b046-9f0ba033515b"},{"id":"occ_64461ed404b8f08c1fd60c57","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_2a487fc7-b854-4610-84d7-2292611b7f49","section_id":"sec_b97fcb58-5f9b-4a8e-8352-2fa86e26e634","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":190,"end":197,"exact":"先端パッケージ","quote":"善、製造ノードの使い分け、設計再利用、製品展開の柔軟性が主な利点である。\n- 一方で、ダイ間通信の遅延と電力、先端パッケージ費用、熱、テスト、完成品歩留まりが課題になる。\n- **SoC**はシステム機能、**SiP**はパッケージ全体、**MCM**は複数ダイ構造、**チップレット**は機能分割と再統合の設計思想を表す。","quote_start":135,"quote_end":297,"text_sha256":"d672bd4d90414749cbc588db7a12d84efe7e4e1cd323a6e3742a95af043b4a4b","block_sha256":"d672bd4d90414749cbc588db7a12d84efe7e4e1cd323a6e3742a95af043b4a4b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_2a487fc7-b854-4610-84d7-2292611b7f49"},{"id":"occ_7b941af95e987d9109e21458","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_308ae37a-ae03-4b78-91f9-0d0231be75de","section_id":"sec_570d2448-bc8a-4810-96cd-0a5d8915bbf1","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":74,"end":88,"exact":"Hybrid Bonding","quote":"    ↓\nDie-to-Die PHY\n        ↓\n金属パッド\n        ↓\nマイクロバンプ／Hybrid Bonding\n        ↓\n有機基板／インターポーザー／ブリッジ\n        ↓\n相手側の接続端子\n        ↓\n相手側Die-to-Die PHY\n```","quote_start":19,"quote_end":168,"text_sha256":"1a96816b7b7f71f7a4ccd137d54d53e7412dab8aef40eebd8bc74d7e9a94c490","block_sha256":"1a96816b7b7f71f7a4ccd137d54d53e7412dab8aef40eebd8bc74d7e9a94c490","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_308ae37a-ae03-4b78-91f9-0d0231be75de"},{"id":"occ_0a7149cf1db3f752bcbdba30","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_5d391570-4718-4aae-939a-5ae1bcf35fa2","section_id":"sec_ff79c093-e2b7-457c-bf88-74c39be40c9c","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":57,"end":71,"exact":"Hybrid Bonding","quote":"微細な有機基板\n- シリコンインターポーザー\n- シリコンブリッジ\n- 高密度RDL\n- マイクロバンプ\n- Hybrid Bonding\n- TSV","quote_start":2,"quote_end":77,"text_sha256":"80e5c4c86b2f4ace868f13aef0fdaad84a33062fe3f172463dee445f58b311ae","block_sha256":"80e5c4c86b2f4ace868f13aef0fdaad84a33062fe3f172463dee445f58b311ae","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_5d391570-4718-4aae-939a-5ae1bcf35fa2"},{"id":"occ_7d61caeb8a6b4183387210e9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_5ddbefb6-c91d-472c-b9f0-793ad6d32307","section_id":"sec_e02a6b7c-893a-4ea0-b5f5-303951b50dc9","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"**レチクル限界、Die-to-Die PHY、Hybrid Bonding、TSVから、3D V-Cache、Foveros Direct、SoIC**","quote_start":0,"quote_end":77,"text_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","block_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_5ddbefb6-c91d-472c-b9f0-793ad6d32307"},{"id":"occ_ef526f3f89c6fb7ebf49137e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_77d15a3e-b009-4522-bd62-8ede1dba87f5","section_id":"sec_570d2448-bc8a-4810-96cd-0a5d8915bbf1","layer":"body","character_id":null,"count":5,"matched_aliases":["2.5D","CoWoS","EMIB","SoIC","先端パッケージ"],"evidence":{"text_basis":"markdown","start":7,"end":11,"exact":"EMIB","quote":"Intelは、EMIBやFoverosなどの先端パッケージを、複数チップレットを高密度に統合するための基盤として提供している。TSMCもCoWoS、InFO、SoICなどを通じて、2D、2.5D、3Dの異種統合を展開してい","quote_start":0,"quote_end":111,"text_sha256":"97540a06613407cd1a1fd31e78e7064d8e8d073217d2d17edf3198c639b7e857","block_sha256":"97540a06613407cd1a1fd31e78e7064d8e8d073217d2d17edf3198c639b7e857","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_77d15a3e-b009-4522-bd62-8ede1dba87f5"},{"id":"occ_164cf5172a59557f09b4994a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_7824d9f2-a8bb-4639-b890-1c6ffd05c9fa","section_id":"sec_ff79c093-e2b7-457c-bf88-74c39be40c9c","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":3,"end":10,"exact":"先端パッケージ","quote":"## 先端パッケージが高価になる","quote_start":0,"quote_end":16,"text_sha256":"14d9b6be147d1bee926222cf63e5a7f193299f0c3f5623615bd7516615375eca","block_sha256":"14d9b6be147d1bee926222cf63e5a7f193299f0c3f5623615bd7516615375eca","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_7824d9f2-a8bb-4639-b890-1c6ffd05c9fa"},{"id":"occ_c4f2339690891a68595e9133","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_7c1b5b5e-7613-4632-ab1e-cff6006d973b","section_id":"sec_5645fb7d-a6dd-42a4-9404-d50f2f3df73b","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":25,"end":29,"exact":"2.5D","quote":"TSMCとIntelはいずれも、AI・HPC向けに2.5D、3D、ブリッジ、RDL、Hybrid Bondingを組み合わせ、複数の機能ダイを一つの高密度システムへ統合する方向を示している。","quote_start":0,"quote_end":95,"text_sha256":"56ca1c71771a9116fcefff084ee82f0808a95a6059d3838046880214c422fe03","block_sha256":"56ca1c71771a9116fcefff084ee82f0808a95a6059d3838046880214c422fe03","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_7c1b5b5e-7613-4632-ab1e-cff6006d973b"},{"id":"occ_42fa5da2b62c605dc9fbef96","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_e0562bb8-5eb4-42f6-8c37-5edb431e10bc","section_id":"sec_e3815f94-95fd-4b3a-9c9b-6ccd27dc4423","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":7,"end":14,"exact":"先端パッケージ","quote":"Intelも、先端パッケージによって複数チップレットを1つの高密度パッケージへ統合し、AI・HPC向けの大規模な「systems of chips」を構成する方向を示している。","quote_start":0,"quote_end":88,"text_sha256":"9927ba205828905d874da9d6de64ac419c040bdb1c039518c3e50fae916308c4","block_sha256":"9927ba205828905d874da9d6de64ac419c040bdb1c039518c3e50fae916308c4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_e0562bb8-5eb4-42f6-8c37-5edb431e10bc"},{"id":"occ_fd98ae6d9249ec80529fbfc8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_e4aafdd5-8b82-45d6-8f1d-0ce00cf91d70","section_id":"sec_b97fcb58-5f9b-4a8e-8352-2fa86e26e634","layer":"body","character_id":null,"count":3,"matched_aliases":["2.5D","CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":80,"end":84,"exact":"2.5D","quote":"配線するのかを理解するため、**Standard Package、シリコンインターポーザー、シリコンブリッジ、2.5D、3D積層、CoWoS、EMIB**などのパッケージ方式を詳しく見ていく。","quote_start":25,"quote_end":121,"text_sha256":"f22a70e33b8d086e13111b29b06b0ddc2ba852f43be6a8707bb63b26b140bacf","block_sha256":"f22a70e33b8d086e13111b29b06b0ddc2ba852f43be6a8707bb63b26b140bacf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_e4aafdd5-8b82-45d6-8f1d-0ce00cf91d70"},{"id":"occ_df61f6e2e68ee31d8be70008","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c70dba8d-8c2a-4c07-934b-5920ce54c240","work_id":"wrk_cf92e285-09db-4e9a-9a37-a886a43a8bcc","block_id":"blk_f58e61eb-54f0-4f15-a013-9c92c1b25555","section_id":"sec_37fa94da-31e7-4703-b1d9-2ea16c59b0d7","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","SoIC"],"evidence":{"text_basis":"markdown","start":6,"end":10,"exact":"2.5D","quote":"TSMCは、2.5Dインターポーザーや3D積層を利用して、ロジック同士、ロジックとHBM、異なる製造ノードのダイなどを統合する技術を異種統合として展開している。SoICでは、均質・異種チップレットをSoCのような一体構造","quote_start":0,"quote_end":110,"text_sha256":"db13ae18cb3c8cb01d2f686caeb7d1f7d5537952c87a1ededfa83eca3c13df52","block_sha256":"db13ae18cb3c8cb01d2f686caeb7d1f7d5537952c87a1ededfa83eca3c13df52","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c70dba8d-8c2a-4c07-934b-5920ce54c240/#blk_f58e61eb-54f0-4f15-a013-9c92c1b25555"},{"id":"occ_8500b814b30941a4e1e1fcfa","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c720ff79-9532-414c-ab0c-c6caec3e9331","work_id":"wrk_8d913e5f-cd3d-4488-9ff4-07fe3dd89c98","block_id":"blk_deb4b8f9-260b-4121-aa3f-4da78cdba24b","section_id":"sec_7c3a4888-eddc-4698-a7fa-33728e521224","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":20,"end":24,"exact":"2.5D","quote":"下記のマガジンと記事では、チップレット、2.5D・3Dパッケージ、マイクロバンプ、Hybrid Bonding、TSV、Die-to-Die PHY、UCIe、Logic Folding、HBM、XBMを順に見てきた。","quote_start":0,"quote_end":109,"text_sha256":"7039e869cdac2febc74542931c3196829788963af810b74a0d492ee9ff651188","block_sha256":"7039e869cdac2febc74542931c3196829788963af810b74a0d492ee9ff651188","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c720ff79-9532-414c-ab0c-c6caec3e9331/#blk_deb4b8f9-260b-4121-aa3f-4da78cdba24b"},{"id":"occ_bf1d23d87f1f4bcd7bc6710a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c720ff79-9532-414c-ab0c-c6caec3e9331","work_id":"wrk_8d913e5f-cd3d-4488-9ff4-07fe3dd89c98","block_id":"blk_f62a0b04-7e1f-4c65-be9f-8d20aa397ce1","section_id":"sec_a650a12a-270d-4a61-b0f9-544d33475521","layer":"code","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","先端パッケージ"],"evidence":{"text_basis":"markdown","start":18,"end":32,"exact":"Hybrid Bonding","quote":"```\nダイの外側\n\nチップレット\nHybrid Bonding\nTSV\nUCIe\n先端パッケージ\n光I/O\n```","quote_start":0,"quote_end":58,"text_sha256":"7ca36290875dcf0f8afa0b37b6fd0a6aab59d798f938ebeb8d9508a7fa4d2a82","block_sha256":"7ca36290875dcf0f8afa0b37b6fd0a6aab59d798f938ebeb8d9508a7fa4d2a82","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c720ff79-9532-414c-ab0c-c6caec3e9331/#blk_f62a0b04-7e1f-4c65-be9f-8d20aa397ce1"},{"id":"occ_931c23731c417693fb20097f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c74e591e-d929-42b5-8c6c-04563fae77c3","work_id":"wrk_fee40c18-6b9b-4c23-9b8c-9b73d44984f3","block_id":"blk_82396374-a925-4b78-b0ee-337bee5fdc7e","section_id":"sec_f4eeb854-a32c-45db-ba72-abecc70e2d63","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":17,"end":21,"exact":"2.5D","quote":"BroadcomはHBM PHY、2.5D/3D Packaging、Network I/O、Custom XPUを自社で統合できるためCustom ASIC拡大自体は追い風です。一方NVLink Fusion＋NVHBMがCustom 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XDSiPによる2nm custom compute SoCの出荷開始を発表した。XDSiPは6,000平方mm超のsilic","quote_start":0,"quote_end":121,"text_sha256":"0f819c1d3a126e4655a000476ce8269d78d1fbcbcfa8c316f6b4fe17c3391dda","block_sha256":"0f819c1d3a126e4655a000476ce8269d78d1fbcbcfa8c316f6b4fe17c3391dda","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c89081f7-eb04-4049-a4a4-68cbe681a3f5/#blk_272c8f46-0424-49cc-b1d5-7c8cef9cefdd"},{"id":"occ_0b59c289fe98d2d24ccca616","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c89081f7-eb04-4049-a4a4-68cbe681a3f5","work_id":"wrk_08ecb116-f4c7-4c99-9574-e485a5adb41f","block_id":"blk_39c1fb7b-f574-477d-bc8d-a4928d293703","section_id":"sec_8b702ce6-e310-4e31-8cdc-26610663173e","layer":"body","character_id":null,"count":1,"matched_aliases":["3D実装"],"evidence":{"text_basis":"markdown","start":16,"end":20,"exact":"3D実装","quote":"MoE、KVキャッシュ、HBM、3D実装、Optical 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/ package wiring\n ↓","quote_start":0,"quote_end":59,"text_sha256":"0dc6d8478a8659e6f21100cf3bbff70b177fbf0bc5fa1909fe372aedf39bc6d0","block_sha256":"0dc6d8478a8659e6f21100cf3bbff70b177fbf0bc5fa1909fe372aedf39bc6d0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c89081f7-eb04-4049-a4a4-68cbe681a3f5/#blk_427cb835-43b8-4552-9607-206e85852f81"},{"id":"occ_31e7ff50cb8532a9e48bb571","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c89081f7-eb04-4049-a4a4-68cbe681a3f5","work_id":"wrk_08ecb116-f4c7-4c99-9574-e485a5adb41f","block_id":"blk_799a1c41-fc28-4fd0-a797-de2622e94d66","section_id":"sec_84ba78f3-e532-4cbf-a830-f11fb2a743de","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":22,"end":26,"exact":"SoIC","quote":"TSMCもこの方向へ動いている。COUPEはSoICを使って電子dieとphotonic dieを統合する技術で、2026年にはCOUPE-on-substrateによるtrue co-packaged opticsの生産開始を予定している。TSMCは","quote_start":0,"quote_end":126,"text_sha256":"826d8fbde339f1e0ec897beee82dc5d2462f45d35b59128dacdb6f4c9d5986b4","block_sha256":"826d8fbde339f1e0ec897beee82dc5d2462f45d35b59128dacdb6f4c9d5986b4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c89081f7-eb04-4049-a4a4-68cbe681a3f5/#blk_799a1c41-fc28-4fd0-a797-de2622e94d66"},{"id":"occ_27d8ee4cf7532132fe819fd0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c89081f7-eb04-4049-a4a4-68cbe681a3f5","work_id":"wrk_08ecb116-f4c7-4c99-9574-e485a5adb41f","block_id":"blk_a432197b-3f09-420b-bcb8-1b9ba9f05c2a","section_id":"sec_84346931-0010-4b55-a814-25c460db98f2","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":13,"end":17,"exact":"2.5D","quote":"## 2．Chiplet、2.5D、3D、3.5Dは、この壁を突破する技術である","quote_start":0,"quote_end":40,"text_sha256":"18c0eb99a8c42b0b6a549df74d05b4db261385b5486dea872177ca014ae75f7c","block_sha256":"18c0eb99a8c42b0b6a549df74d05b4db261385b5486dea872177ca014ae75f7c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c89081f7-eb04-4049-a4a4-68cbe681a3f5/#blk_a432197b-3f09-420b-bcb8-1b9ba9f05c2a"},{"id":"occ_c5511f58d2556d1f888e204b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c89081f7-eb04-4049-a4a4-68cbe681a3f5","work_id":"wrk_08ecb116-f4c7-4c99-9574-e485a5adb41f","block_id":"blk_ada221f8-bbd1-44f9-a615-9dcd8d1940d5","section_id":"sec_4b544497-a01b-4492-897e-3553bc6f35c5","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS、","quote_start":0,"quote_end":6,"text_sha256":"2020741d704b9f6fd0c637936b1364e11bb8bb33100d43f9a7aff0dc5d8da742","block_sha256":"2020741d704b9f6fd0c637936b1364e11bb8bb33100d43f9a7aff0dc5d8da742","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c89081f7-eb04-4049-a4a4-68cbe681a3f5/#blk_ada221f8-bbd1-44f9-a615-9dcd8d1940d5"},{"id":"occ_86678c995a7980f510910225","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_c89081f7-eb04-4049-a4a4-68cbe681a3f5","work_id":"wrk_08ecb116-f4c7-4c99-9574-e485a5adb41f","block_id":"blk_b04a48ac-a3ab-476f-bdf9-43b44219157d","section_id":"sec_84346931-0010-4b55-a814-25c460db98f2","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":5,"end":10,"exact":"CoWoS","quote":"TSMCもCoWoSを巨大化し続けている。2026年時点では5.5-reticle規模を生産しており、2028年には14-reticle規模、約10個の大型compute 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**味の素（ABF樹脂）** – 世界シェア95%以上。首都直下地震で川崎工場が被災すると**先端パッケージ基板が世界的に供給不能**となる。GPU/CPUの出荷停止に直結し、**生成AI用チップ供給の最大ボトルネック**。\n- **東京エレクトロン（半導体製造装置）** – 世界シェア約10%（総合）、分","quote_start":141,"quote_end":303,"text_sha256":"7e1b91857097a58a7540c15323b341fbb30a2675e0b65605b92cc1a4dd145a15","block_sha256":"7e1b91857097a58a7540c15323b341fbb30a2675e0b65605b92cc1a4dd145a15","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_c8a89daf-c91d-4b06-8c19-b87b474452c0/#blk_e895a76a-a500-4024-b4e5-c01f062429e9"},{"id":"occ_8ce5b57f9a0157820e7d5376","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":null,"section_id":null,"layer":"title","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bondingでは、上下の銅配線を短いCu-to-Cu接合で直接接続できる。","quote_start":0,"quote_end":45,"text_sha256":"c0995cc1098ba0976dcc760b6d9d1c0ca112cfeb6e48f31740a14e39cdfc59e6","block_sha256":"c0995cc1098ba0976dcc760b6d9d1c0ca112cfeb6e48f31740a14e39cdfc59e6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_0a65fd38-185a-471e-95a7-fe0a2e431907"},{"id":"occ_518026741c8cc422cf2a7ee1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_10d78b16-5db1-48d7-838e-57046b3cd0da","section_id":"sec_cc3ce903-ad13-4968-8975-07f6c073f437","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"次回は、Hybrid Bondingと組み合わせて使われる、シリコン内部の垂直配線である**TSV**を解説する。","quote_start":0,"quote_end":57,"text_sha256":"adc8a909755745395a7943467cfe0891259c1f46d3c89a6726c0a8e546e3dfa3","block_sha256":"adc8a909755745395a7943467cfe0891259c1f46d3c89a6726c0a8e546e3dfa3","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_10d78b16-5db1-48d7-838e-57046b3cd0da"},{"id":"occ_6d650a1c269825fd1e21bba6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_1249d0fe-e93a-43c8-a9cc-653e960d4b91","section_id":"sec_e62286da-d8f1-47e7-aca0-4b3250d9fe10","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMCはSoICについて、sub-10µmからの接合ピッチ、短いDie-to-Die接続によって、帯域、電力、電源品質、信号品質、遅延を改善できるとしている。([3DFabric](https://3dfabric.","quote_start":0,"quote_end":109,"text_sha256":"6e3309c7ca09e06c1cd21000c35e758dc48a2192189374ea19a627a696c6483c","block_sha256":"6e3309c7ca09e06c1cd21000c35e758dc48a2192189374ea19a627a696c6483c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_1249d0fe-e93a-43c8-a9cc-653e960d4b91"},{"id":"occ_0ea7bf7b8d5efccb1028ac03","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_12cfb4e6-093b-4697-9011-27975fdb1a65","section_id":"sec_59cda719-8581-4e8e-a573-534d58014857","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","ハイブリッドボンディング"],"evidence":{"text_basis":"markdown","start":5,"end":19,"exact":"Hybrid Bonding","quote":"それが**Hybrid Bonding、ハイブリッドボンディング**である。","quote_start":0,"quote_end":38,"text_sha256":"9fd4983000a4002577983d85cca33811b936a52955dafb14ddaf029700547df6","block_sha256":"9fd4983000a4002577983d85cca33811b936a52955dafb14ddaf029700547df6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_12cfb4e6-093b-4697-9011-27975fdb1a65"},{"id":"occ_dd026498daa57e6b6e18f827","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_145b3969-f175-4fad-a869-ecab83598f05","section_id":"sec_efde62f8-9672-4f38-8c7e-420755874ef0","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"```\nHybrid Bonding\n＝別々のダイの接合面をつなぐ\n\n\nTSV\n＝1枚のシリコン内部を貫通する\n```","quote_start":0,"quote_end":59,"text_sha256":"37507458018faeddb2150b20b588b57e4286bc4abc94d298c02d315fe81b1012","block_sha256":"37507458018faeddb2150b20b588b57e4286bc4abc94d298c02d315fe81b1012","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_145b3969-f175-4fad-a869-ecab83598f05"},{"id":"occ_3cd6808626f5165e3f6173c5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_14a50fed-de68-4a36-939d-1f9458fd65d6","section_id":"sec_1fdf0483-da99-4c36-9cf4-67b254b2255f","layer":"code","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"```\nHybrid Bonding\n＝接合面の技術\n\nSoIC\n＝3D積層を製造する仕組み全体\n```","quote_start":0,"quote_end":52,"text_sha256":"4bc108b6a73fa708e1d104344ce9aabdf5e54edebd190945167c144f7be9a596","block_sha256":"4bc108b6a73fa708e1d104344ce9aabdf5e54edebd190945167c144f7be9a596","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_14a50fed-de68-4a36-939d-1f9458fd65d6"},{"id":"occ_42cf658c72cb49d094a9200e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_17f61eac-f181-4fbb-acc6-6f0db1ce4a7f","section_id":"sec_bd2f8acb-1fa2-46b7-adff-13718eab82d4","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":7,"end":21,"exact":"Hybrid Bonding","quote":"## 第6回　Hybrid Bondingとは何か――はんだを使わず、銅と絶縁膜を直接つなぐ","quote_start":0,"quote_end":46,"text_sha256":"18ed99728322e3182d5f394162bcf4925bef5382a7216c61e1aec446b1e51662","block_sha256":"18ed99728322e3182d5f394162bcf4925bef5382a7216c61e1aec446b1e51662","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_17f61eac-f181-4fbb-acc6-6f0db1ce4a7f"},{"id":"occ_570e02af4a815c2e38745fff","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_18b774e2-be89-4236-82d8-c6d4d905ea7b","section_id":"sec_db2b2f0c-7f1d-42a1-850d-fc4e1de244f8","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingでは、上下のダイ表面がほぼ全面で接触しなければならない。","quote_start":0,"quote_end":42,"text_sha256":"1a17fa57a9441c8ec5743780f52bab543048be52af1661991430fda5ab335e96","block_sha256":"1a17fa57a9441c8ec5743780f52bab543048be52af1661991430fda5ab335e96","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_18b774e2-be89-4236-82d8-c6d4d905ea7b"},{"id":"occ_bbb513093b65c3d885feb6f8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_19cc50c9-a03c-4c1b-9d61-f9238cd1a614","section_id":"sec_bfcdab04-2502-450e-bedf-89d282c9fa3f","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":58,"end":72,"exact":"Hybrid Bonding","quote":"\n上側Compute／Memory Die\n          │\n   Foveros Direct\n   Hybrid Bonding\n          │\nActive Base Die\n          │\nパッケージ基板\n```","quote_start":3,"quote_end":124,"text_sha256":"b3776b5e55d78eedb0860badb5018b47008d8ea2fd0d4de69164643e8960869b","block_sha256":"b3776b5e55d78eedb0860badb5018b47008d8ea2fd0d4de69164643e8960869b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_19cc50c9-a03c-4c1b-9d61-f9238cd1a614"},{"id":"occ_e4c1fd08d88568d41de349cb","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_1e85263f-d97b-471d-b728-69b7d6078806","section_id":"sec_62fc3168-606d-4cda-96b6-6d1bf17a4c0e","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingはマイクロバンプを完全に置き換えるのか","quote_start":0,"quote_end":36,"text_sha256":"66907129ea58db83ac6c8c2f30f64e7fa67c1bd832d6e39191a0ce9044415390","block_sha256":"66907129ea58db83ac6c8c2f30f64e7fa67c1bd832d6e39191a0ce9044415390","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_1e85263f-d97b-471d-b728-69b7d6078806"},{"id":"occ_f78bc06a4442d5dcacf9e2b5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_1ec18d8c-d729-4fc6-a40b-2523c04b4f21","section_id":"sec_efde62f8-9672-4f38-8c7e-420755874ef0","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid BondingとTSVの違い","quote_start":0,"quote_end":24,"text_sha256":"07636b58dd4509ed4fb48867a8417a9e6a6bcea3035f575ce56b16e0edcd1ede","block_sha256":"07636b58dd4509ed4fb48867a8417a9e6a6bcea3035f575ce56b16e0edcd1ede","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_1ec18d8c-d729-4fc6-a40b-2523c04b4f21"},{"id":"occ_6c2809e4cfb97c6eade1671d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_207fd6c5-856d-40b9-b0ab-90eb6c765231","section_id":"sec_db2b2f0c-7f1d-42a1-850d-fc4e1de244f8","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingでは、ウェハー全体にわたってナノメートル級の表面形状を管理する必要がある。","quote_start":0,"quote_end":51,"text_sha256":"bbe7a8d97c45a8f8d32343955e50b72905a23bdd58be6b9d279973737d3b1d9a","block_sha256":"bbe7a8d97c45a8f8d32343955e50b72905a23bdd58be6b9d279973737d3b1d9a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_207fd6c5-856d-40b9-b0ab-90eb6c765231"},{"id":"occ_62db90a0a943d2698cd8a900","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_22186872-a375-4763-bfa6-e9bd32f9eabb","section_id":"sec_36958830-a043-4578-b695-1c932421a923","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingの不良","quote_start":0,"quote_end":20,"text_sha256":"3e543e8b35c63e9a8e8bf0910fcf8ba7d553a06a0b1dcb34c4858c445bf0763a","block_sha256":"3e543e8b35c63e9a8e8bf0910fcf8ba7d553a06a0b1dcb34c4858c445bf0763a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_22186872-a375-4763-bfa6-e9bd32f9eabb"},{"id":"occ_9468118f9efd475d09a056bb","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_28dc2339-4977-486d-b40f-acf8bea75db5","section_id":"sec_5fb076f6-aceb-407b-a97e-17e2bceaea14","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingの電気的な利点","quote_start":0,"quote_end":24,"text_sha256":"351567f35368558406813fa7657bde453e2a442d4262e93debd324923849a35a","block_sha256":"351567f35368558406813fa7657bde453e2a442d4262e93debd324923849a35a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_28dc2339-4977-486d-b40f-acf8bea75db5"},{"id":"occ_1645a85fbe32f9d306f69dc7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_2b3c5cde-4b27-4e94-a358-35c2a3712b30","section_id":"sec_11c0f000-9322-4e3c-9876-ec9b2a28de38","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":38,"end":52,"exact":"Hybrid Bonding","quote":"```\n上側ダイの裏面\n──────────\n上側回路面\n↓↓↓↓↓↓↓↓\nHybrid Bonding\n↑↑↑↑↑↑↑↑\n下側回路面\n──────────\n下側ダイの裏面\n```","quote_start":0,"quote_end":90,"text_sha256":"5e98635cfa02626a2d2d86fef6e9345b4cbfb509cd3ea399f49eadfc61ae20e2","block_sha256":"5e98635cfa02626a2d2d86fef6e9345b4cbfb509cd3ea399f49eadfc61ae20e2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_2b3c5cde-4b27-4e94-a358-35c2a3712b30"},{"id":"occ_0a9bbff5236ce74f242c56cf","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_2c53fc6c-bdb9-4728-bb2e-d8696b76bbb8","section_id":"sec_d47b0ecc-bf1e-4776-8547-2bb2d1c1c433","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingの製造工程","quote_start":0,"quote_end":22,"text_sha256":"59a68c14058dd5d97c1f26ade0a312ff2a736f85050b68673e57e71f54972139","block_sha256":"59a68c14058dd5d97c1f26ade0a312ff2a736f85050b68673e57e71f54972139","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_2c53fc6c-bdb9-4728-bb2e-d8696b76bbb8"},{"id":"occ_3db6826c61f4f5a4bed214b5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_2fead71f-c50d-426a-bfa6-0bbf74b57471","section_id":"sec_cde04de0-68bc-4b7f-bdd1-23a637556857","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingの主な課題","quote_start":0,"quote_end":22,"text_sha256":"2d9094c3acd39a3d68ec2474536d5885988e669430829745b27ab21152952a0f","block_sha256":"2d9094c3acd39a3d68ec2474536d5885988e669430829745b27ab21152952a0f","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_2fead71f-c50d-426a-bfa6-0bbf74b57471"},{"id":"occ_bffd425052a15b3909b4dadb","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_3273436c-1d71-4626-8b29-2ba0cadcc68f","section_id":"sec_62fc3168-606d-4cda-96b6-6d1bf17a4c0e","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":0,"end":7,"exact":"先端パッケージ","quote":"先端パッケージでは、1つの製品内で複数の接続技術を使い分ける。","quote_start":0,"quote_end":31,"text_sha256":"2b51ae300cd23a73014e3da90294d9995984ea8bda9d7af6a77cf9722068814e","block_sha256":"2b51ae300cd23a73014e3da90294d9995984ea8bda9d7af6a77cf9722068814e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_3273436c-1d71-4626-8b29-2ba0cadcc68f"},{"id":"occ_135889f4a0baebf3e7b79535","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_36d28665-820e-4b9b-ad05-87d22ba3f1e8","section_id":"sec_efde62f8-9672-4f38-8c7e-420755874ef0","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid BondingとTSVは、どちらも3D積層で使われるが、役割が異なる。","quote_start":0,"quote_end":42,"text_sha256":"7bc4d61cf4d84ca792ff07d2ac6cb319c836838cf7c4ed01fa218945dfe0ed20","block_sha256":"7bc4d61cf4d84ca792ff07d2ac6cb319c836838cf7c4ed01fa218945dfe0ed20","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_36d28665-820e-4b9b-ad05-87d22ba3f1e8"},{"id":"occ_92a8032fdcaeff9bc5084aad","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_38e62142-210e-43fa-8147-9680ec8654dc","section_id":"sec_311ffbb7-cca1-44f4-9cdc-acd6707c6ba5","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"しかしHybrid Bondingは接合面同士を直接合わせるため、表面粒子への許容度が非常に低い。","quote_start":0,"quote_end":49,"text_sha256":"1306bb2ce4b0e1607942781006ca7156b61dee8cb6526a20de9d19b5806e1c81","block_sha256":"1306bb2ce4b0e1607942781006ca7156b61dee8cb6526a20de9d19b5806e1c81","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_38e62142-210e-43fa-8147-9680ec8654dc"},{"id":"occ_f2272a2f580a28e82c1fafc6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_3f011bfa-fc99-490e-90fc-6f8faf9fb25c","section_id":"sec_62fc3168-606d-4cda-96b6-6d1bf17a4c0e","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingが有力なのは、","quote_start":0,"quote_end":21,"text_sha256":"1f2b97d9e9924dcc03f4d5c6df7e8be062de6de36b4ccacd7499078ebd4d46ea","block_sha256":"1f2b97d9e9924dcc03f4d5c6df7e8be062de6de36b4ccacd7499078ebd4d46ea","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_3f011bfa-fc99-490e-90fc-6f8faf9fb25c"},{"id":"occ_392db6f7b78643e2d2cb1684","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_40179e13-3906-4037-8ba6-2c8f8d788c80","section_id":"sec_8e661448-ea8b-40b9-9fb1-745838409314","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingでは、","quote_start":0,"quote_end":17,"text_sha256":"6d5151cec53fb0c89e572b90a329b49902c70bf5252c58841b52398b860a7e8e","block_sha256":"6d5151cec53fb0c89e572b90a329b49902c70bf5252c58841b52398b860a7e8e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_40179e13-3906-4037-8ba6-2c8f8d788c80"},{"id":"occ_6ae902fff2bc19e62414ec3e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_409a654d-c1ca-470a-b7a3-a78b6923829d","section_id":"sec_220fc9cc-5898-4cc1-bc5d-88377515a4c9","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"**レチクル限界、Die-to-Die PHY、Hybrid Bonding、TSVから、3D V-Cache、Foveros Direct、SoIC**","quote_start":0,"quote_end":77,"text_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","block_sha256":"66980f342fdfebd1139efcb264c7997025af7451957f2f31fd5938d70ad9c0c9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_409a654d-c1ca-470a-b7a3-a78b6923829d"},{"id":"occ_efa950fda55aa46968077a7c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_43693cf6-443a-4414-a4c6-d42a939651fc","section_id":"sec_efde62f8-9672-4f38-8c7e-420755874ef0","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":49,"end":63,"exact":"Hybrid Bonding","quote":"```\n上側ダイの回路\n      ↓\nTSV\n      ↓\n接合用Cuパッド\n      ↓\nHybrid Bonding\n      ↓\n下側ダイのCuパッド\n      ↓\n下側ダイの回路\n```","quote_start":0,"quote_end":102,"text_sha256":"213cac5292a238decd0f7f23757a161be86020c896f631327fa4ff9c9761fd62","block_sha256":"213cac5292a238decd0f7f23757a161be86020c896f631327fa4ff9c9761fd62","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_43693cf6-443a-4414-a4c6-d42a939651fc"},{"id":"occ_aecce850ed076999f789c0c5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_438b2e91-5a05-4c57-811c-d305374d4a30","section_id":"sec_0db2162e-4a79-430f-859e-52bb6f097e8e","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":55,"end":69,"exact":"Hybrid Bonding","quote":"IntelはFoveros Direct 3Dについて、従来のはんだマイクロバンプをなくし、Cu-to-Cu Hybrid Bondingを使うことで、sub-10µmの接続ピッチと高密度・低抵抗なダイ間接続を実現すると説明している。([Intel](https://www.intel.com/content/dam/www/centr","quote_start":0,"quote_end":169,"text_sha256":"ae364fc485cbad300c4a14b882c1e2685d1186d8b0c00d45bf11750a08bc7d3d","block_sha256":"ae364fc485cbad300c4a14b882c1e2685d1186d8b0c00d45bf11750a08bc7d3d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_438b2e91-5a05-4c57-811c-d305374d4a30"},{"id":"occ_e3a8f5e3a1acf3aebfa5159b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_45be2c65-f07b-4539-a074-37b03a7f7c60","section_id":"sec_cec3e12d-149f-4d6f-b620-3da70beea250","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMC SoICとIntel Foveros Directはsub-10µm級の接続を掲げている。imecはD2Wで2µm、W2Wで400nm、2026年には研究用テストビークルで200nmピッチを実証している。これ","quote_start":0,"quote_end":109,"text_sha256":"f9870c46609f1e543f414392d0772c5d8ab3603b5ec7d91a5e23ea190ab3494c","block_sha256":"f9870c46609f1e543f414392d0772c5d8ab3603b5ec7d91a5e23ea190ab3494c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_45be2c65-f07b-4539-a074-37b03a7f7c60"},{"id":"occ_a163e7ff0dd1829e6f92d004","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_470f5d72-8b72-4bf2-a107-398f7bde6e68","section_id":"sec_392b3dfc-f082-46fd-9a6d-668b6fecd583","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bonding\n\n別々のダイの表面を\n一体の接合界面へ変える\n```","quote_start":0,"quote_end":74,"text_sha256":"489bb377db0e5c886e247de3eb6aa66f97089536fd9bcb3d0dc8f56e6b4c051a","block_sha256":"489bb377db0e5c886e247de3eb6aa66f97089536fd9bcb3d0dc8f56e6b4c051a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_470f5d72-8b72-4bf2-a107-398f7bde6e68"},{"id":"occ_da89c49bd7d026ba29713ed7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_4f7669d3-5068-49de-9aae-7898a1b706c5","section_id":"sec_82555538-c26d-449c-9045-2a10a8a4a7c3","layer":"code","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":60,"end":74,"exact":"Hybrid Bonding","quote":"イクロバンプ\n\n配線\n ↓\nパッド\n ↓\nUBM\n ↓\n銅ピラー\n ↓\nはんだ\n ↓\nパッド\n ↓\n配線\n\n\nHybrid Bonding\n\n配線\n ↓\nCu\n │\nCu\n ↓\n配線\n```","quote_start":5,"quote_end":100,"text_sha256":"a3e2bcc077508830ae4f3d778fd50d9be3777b914f106e1ed4c237d8290c31c5","block_sha256":"a3e2bcc077508830ae4f3d778fd50d9be3777b914f106e1ed4c237d8290c31c5","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_4f7669d3-5068-49de-9aae-7898a1b706c5"},{"id":"occ_692e96c089d6b71163263251","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_5953a27d-a26f-4dbe-af83-f089aa61bd5b","section_id":"sec_3d6d9286-de9f-4857-9e1b-d994bf6e65e2","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bonding"],"evidence":{"text_basis":"markdown","start":67,"end":81,"exact":"Hybrid Bonding","quote":"級\n\nC4\n100µm前後～数百µm級\n\nマイクロバンプ\n数十µm級\n研究・先端開発では10µm以下へ\n\n量産Hybrid Bonding\nsub-10µm級から\n\n研究段階D2W\n2µm級\n\n研究段階W2W\n400nm～200nm級\n```","quote_start":12,"quote_end":133,"text_sha256":"ef4658db803a818bd55e0211373f4f987f821be5cd5687e114f7d5106dbf3bbf","block_sha256":"ef4658db803a818bd55e0211373f4f987f821be5cd5687e114f7d5106dbf3bbf","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_59f38dbd-ffea-46fe-8470-c089ac51aa77"},{"id":"occ_fbf62835284026e97f2360aa","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_653f0019-46ed-48d2-98ea-813a74382ed3","section_id":"sec_26c784b4-432f-43ac-a846-65aebdac0096","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"D2W Hybrid Bondingでは、積層前にダイを検査し、Known Good Dieだけを選べる。","quote_start":0,"quote_end":53,"text_sha256":"e228451b577d60551256d982088b5dbbbe8ea997726d2d4e88eef3c6ac9ae7dc","block_sha256":"e228451b577d60551256d982088b5dbbbe8ea997726d2d4e88eef3c6ac9ae7dc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_653f0019-46ed-48d2-98ea-813a74382ed3"},{"id":"occ_3c075a34ffc8c8a2cae918a0","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_69c7f715-f457-4c3a-92e8-826da2fd8595","section_id":"sec_541c83fd-8cc8-41c4-b5a8-33ea694c5546","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":2,"end":16,"exact":"Hybrid Bonding","quote":"- Hybrid Bonding：CPUダイとキャッシュダイの接合面\n- TSV：ダイ内部を通る垂直配線\n- SRAM：実際に積層される記憶回路\n- 3D V-Cache：完成した製品アーキテクチャ","quote_start":0,"quote_end":99,"text_sha256":"3aa1c157f605e5cb104f228d1c1068a9bd294948442d36b00f871c21ca323b53","block_sha256":"3aa1c157f605e5cb104f228d1c1068a9bd294948442d36b00f871c21ca323b53","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_69c7f715-f457-4c3a-92e8-826da2fd8595"},{"id":"occ_061a2bfd624752ab0b3dd130","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_6a085c4e-8e3d-491a-b4c6-7fd7d481574f","section_id":"sec_9d9140c4-cf3e-4792-ab18-41e9987940d6","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bondingのピッチ縮小によって、将来的には回路ブロックや標準セルに近い階層でSoCを上下に分割する方向を示している。([imec](https://www.imec-int.com/en/articles/wa","quote_start":0,"quote_end":120,"text_sha256":"3478e5c379ef7fa85d52fed307d7562894118428e370623d8f4c225f49a5152b","block_sha256":"3478e5c379ef7fa85d52fed307d7562894118428e370623d8f4c225f49a5152b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_6a085c4e-8e3d-491a-b4c6-7fd7d481574f"},{"id":"occ_a16e673e40b84e669a5616a6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_70a71fe5-7eb9-4cc5-8a25-ebdff622df5f","section_id":"sec_1fdf0483-da99-4c36-9cf4-67b254b2255f","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid 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Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bonding","quote_start":0,"quote_end":17,"text_sha256":"f450189af9e3d313686fb8c25767e99794091ee80bad15f3bff9b07d8297f936","block_sha256":"f450189af9e3d313686fb8c25767e99794091ee80bad15f3bff9b07d8297f936","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_7701d7fd-d140-4b66-a995-3d9237f121a7"},{"id":"occ_61cb67a42c9f364a0f945313","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_7f8d19c3-1f65-4c54-ac6a-f1cdeae337a2","section_id":"sec_1fdf0483-da99-4c36-9cf4-67b254b2255f","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":5,"end":9,"exact":"SoIC","quote":"TSMC SoICは、Chip-on-WaferとWafer-on-Waferの双方へ対応し、異なる機能、サイズ、製造ノードのチップレットをSoCのように再統合する。さらに、SoICで積層したダイをCoWoSやInFO","quote_start":0,"quote_end":109,"text_sha256":"f95f5174e1036f07f2b19fc6ad9df1ce7816480b9b4ef56bafc31ea30d4b478b","block_sha256":"f95f5174e1036f07f2b19fc6ad9df1ce7816480b9b4ef56bafc31ea30d4b478b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_7f8d19c3-1f65-4c54-ac6a-f1cdeae337a2"},{"id":"occ_8c9cb06dc1f8a9fdcfe772bd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_82ba84f4-7d7c-476b-9262-1de9a5960943","section_id":"sec_570db1b8-bcf9-41f5-a162-c956d93be35a","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":5,"end":19,"exact":"Hybrid Bonding","quote":"imecはHybrid Bondingを、**Cu-to-Cuと誘電体-to-誘電体を組み合わせた接合技術**と説明している。微細な銅パッドをダマシン工程で絶縁膜中へ形成するため、マイクロバンプより大幅に細かな接続ピッチへ拡張できる。([","quote_start":0,"quote_end":119,"text_sha256":"6c0468a4dbddbaf7043d0e5a4290620e2b2d0443fa23fe19a296453f289de719","block_sha256":"6c0468a4dbddbaf7043d0e5a4290620e2b2d0443fa23fe19a296453f289de719","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_82ba84f4-7d7c-476b-9262-1de9a5960943"},{"id":"occ_9a0fc40f473a7ff5f190f6ce","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_90485fab-8633-4f97-8c73-1539e2c38fbc","section_id":"sec_d47b0ecc-bf1e-4776-8547-2bb2d1c1c433","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"imecの標準的なWafer-to-Wafer Hybrid Bondingフローでは、接合用絶縁膜へ微細な穴を形成し、バリア、シード、銅で充填した後、CMPで表面を極めて平坦にする。位置合わせ後、まず室温で接触させ、その後の加熱によって誘電体間とCu間の永久接合を形成する。","quote_start":0,"quote_end":138,"text_sha256":"6bb5c0a4998e820ca75c1950fac810404790628ad74823ab62e3dc614e5a4155","block_sha256":"6bb5c0a4998e820ca75c1950fac810404790628ad74823ab62e3dc614e5a4155","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_90485fab-8633-4f97-8c73-1539e2c38fbc"},{"id":"occ_03eee8c73601b5f3291339f6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_948573e6-a145-4ef5-8043-768df3641bc9","section_id":"sec_071d540b-f899-4c56-858b-8c68796b0788","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bondingは接合界面の熱経路を改善できるが、","quote_start":0,"quote_end":31,"text_sha256":"77704eadf9e885e1038b5fc759cbf160aa1dffcfac001762b9cd28a7bfe8776a","block_sha256":"77704eadf9e885e1038b5fc759cbf160aa1dffcfac001762b9cd28a7bfe8776a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_948573e6-a145-4ef5-8043-768df3641bc9"},{"id":"occ_89cf5f9866ec3dde128ec494","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_966a55a7-dfea-4b16-bfa1-61d42988a494","section_id":"sec_1fdf0483-da99-4c36-9cf4-67b254b2255f","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":2,"end":6,"exact":"SoIC","quote":"**SoIC**は、TSMCが提供する3D積層・異種統合プラットフォームである。","quote_start":0,"quote_end":40,"text_sha256":"609aeb73498b56c78248a1bfa42ea6b5ee369f14a74206569887594bc450fcce","block_sha256":"609aeb73498b56c78248a1bfa42ea6b5ee369f14a74206569887594bc450fcce","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_966a55a7-dfea-4b16-bfa1-61d42988a494"},{"id":"occ_d84616509e44c8b8ff199414","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_967c6067-49dd-4772-876e-5d2f4648681a","section_id":"sec_8e47740e-b479-42d7-8940-cc4b6ff1f27e","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bonding"],"evidence":{"text_basis":"markdown","start":45,"end":59,"exact":"Hybrid Bonding","quote":"```\n内部回路\n   ↓\nDie-to-Die PHY\n   ↓\nCuパッド\n   ↓\nHybrid Bonding\n   ↓\nCuパッド\n   ↓\n相手側PHY\n```","quote_start":0,"quote_end":86,"text_sha256":"7dcd2976a885531a7759708c054d8eee77e26cb2a69f066193fa6eb00a8d0b6b","block_sha256":"7dcd2976a885531a7759708c054d8eee77e26cb2a69f066193fa6eb00a8d0b6b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_99ec9209-ce52-4312-85f2-8c919a32d492"},{"id":"occ_12bab22f26f9128de7698be9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_9d3c516f-11e9-4f4e-acc7-1bc02461fd54","section_id":"sec_570db1b8-bcf9-41f5-a162-c956d93be35a","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingは、2枚のダイまたはウェハーの接合面に形成された、","quote_start":0,"quote_end":39,"text_sha256":"61d4cf47497dee0351bb7612add164365edc83e4f75ccd335f6dc1911b92276d","block_sha256":"61d4cf47497dee0351bb7612add164365edc83e4f75ccd335f6dc1911b92276d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_9d3c516f-11e9-4f4e-acc7-1bc02461fd54"},{"id":"occ_2e3edd74bebb9f695b6b8413","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_a3c10f8a-7d86-4d62-8210-42c72233af7d","section_id":"sec_bfcdab04-2502-450e-bedf-89d282c9fa3f","layer":"body","character_id":null,"count":2,"matched_aliases":["EMIB","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":11,"end":25,"exact":"Hybrid Bonding","quote":"- Cu-to-Cu Hybrid Bonding\n- sub-10µm接続ピッチ\n- 高帯域\n- 低消費電力\n- 低抵抗\n- アクティブ・ベースダイ\n- EMIBとの組み合わせ","quote_start":0,"quote_end":89,"text_sha256":"e4e93ef73c157f3d766f8290296b075f831a8d7f424ff4014cc65b2ba67e23b8","block_sha256":"e4e93ef73c157f3d766f8290296b075f831a8d7f424ff4014cc65b2ba67e23b8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_a3c10f8a-7d86-4d62-8210-42c72233af7d"},{"id":"occ_89d83c1625be0f5091a1e368","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_a4cd6f94-f4a2-4c87-b388-c7c5bf052001","section_id":"sec_cc3ce903-ad13-4968-8975-07f6c073f437","layer":"body","character_id":null,"count":5,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"- **Hybrid Bonding**は、Cu-to-Cuと誘電体-to-誘電体を同時に接合する技術である。\n- マイクロバンプのような銅ピラー、はんだ、接合部の大きな隙間を必要としない。\n- 配線距離、接続抵抗、寄生容量・インダクタ","quote_start":0,"quote_end":118,"text_sha256":"8af2170e434839d9fd890195fc716ab1273bbae53948cc00f9c092ec29015b6c","block_sha256":"8af2170e434839d9fd890195fc716ab1273bbae53948cc00f9c092ec29015b6c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_a4cd6f94-f4a2-4c87-b388-c7c5bf052001"},{"id":"occ_d2ae6f0b9bbe5ac945b96c26","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_a6b69791-2da4-4f92-9664-b3c100dd2ec0","section_id":"sec_9d9140c4-cf3e-4792-ab18-41e9987940d6","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingによって接続ピッチを数µm、さらにsub-µmへ縮小できれば、","quote_start":0,"quote_end":45,"text_sha256":"a45968a67bdee414d2200c4fd36332ce1431f4235118c78bf1192726a3cbf98a","block_sha256":"a45968a67bdee414d2200c4fd36332ce1431f4235118c78bf1192726a3cbf98a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_a6b69791-2da4-4f92-9664-b3c100dd2ec0"},{"id":"occ_83118af0160b0036622f8885","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_a9b7e1f3-ad98-4dca-b81f-b6396d6fc968","section_id":"sec_34ce463e-2408-4d36-8916-e1ba80d0a7cb","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"そのためHybrid Bondingでは、十分な接合強度と低抵抗を保ちながら、接合・アニール温度を下げることが重要になる。","quote_start":0,"quote_end":61,"text_sha256":"a7584c8e5e97a4e0f46e49228fecfeb67d0df912457f3bee813bc316d4b6ab0b","block_sha256":"a7584c8e5e97a4e0f46e49228fecfeb67d0df912457f3bee813bc316d4b6ab0b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_a9b7e1f3-ad98-4dca-b81f-b6396d6fc968"},{"id":"occ_8fa85470771ea9be9df4b08f","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_acdcd1f0-9f20-42bf-84a0-99d30913a6e4","section_id":"sec_bfcdab04-2502-450e-bedf-89d282c9fa3f","layer":"body","character_id":null,"count":2,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":29,"end":33,"exact":"EMIB","quote":"Foveros Directで積層した3Dスタック同士を、EMIBで横方向に接続する構成は、IntelによってEMIB 3.5Dと呼ばれている。","quote_start":0,"quote_end":72,"text_sha256":"5bffdea9f464c1daa63be24b8efd0e30f1b0fc4fb84a2f7cf63ac5f1252de434","block_sha256":"5bffdea9f464c1daa63be24b8efd0e30f1b0fc4fb84a2f7cf63ac5f1252de434","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_acdcd1f0-9f20-42bf-84a0-99d30913a6e4"},{"id":"occ_49fd311bb59178f109f1e926","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_ae611b10-3908-4e82-8156-8d32fe9d1f88","section_id":"sec_8e47740e-b479-42d7-8940-cc4b6ff1f27e","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"これが、Hybrid Bondingによって「別々のダイを、電気的には1枚のSoCへ近づけられる」といわれる理由である。","quote_start":0,"quote_end":60,"text_sha256":"d1557a35a6c3f0532de5ae42ff9a2828e0cd9ff6fc48abc66b64f910de35b0fd","block_sha256":"d1557a35a6c3f0532de5ae42ff9a2828e0cd9ff6fc48abc66b64f910de35b0fd","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_ae611b10-3908-4e82-8156-8d32fe9d1f88"},{"id":"occ_801b5560277dd0c8f776b162","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_aeb06661-56c1-4d08-8b83-bfc9f46ff7f5","section_id":"sec_392b3dfc-f082-46fd-9a6d-668b6fecd583","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingは、単に「はんだを銅へ置き換える技術」ではない。","quote_start":0,"quote_end":38,"text_sha256":"5a81aed84b1f46e97af676fb99656115cd8222f57c70f83c1612c1fe7d5d3cba","block_sha256":"5a81aed84b1f46e97af676fb99656115cd8222f57c70f83c1612c1fe7d5d3cba","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_aeb06661-56c1-4d08-8b83-bfc9f46ff7f5"},{"id":"occ_7f888bb0b62af33e2f07f9d1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_b0e3c2ff-d6f4-4ffd-8240-d915aba73ac5","section_id":"sec_0db2162e-4a79-430f-859e-52bb6f097e8e","layer":"code","character_id":null,"count":2,"matched_aliases":["2.5D","Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":21,"end":35,"exact":"Hybrid Bonding","quote":"```\n| 項目 | マイクロバンプ | Hybrid Bonding |\n| 主な電気接続 | 銅ピラー＋はんだ | Cu-to-Cu直接接合 |\n| 機械的固定 | バンプ＋アンダーフィル | 誘電体面全体 |\n| ダイ間距離 | 比較的長い | 非常に短い |\n|","quote_start":0,"quote_end":135,"text_sha256":"44ec36a994cb07294ce1e683e4ac6f0f975f67a7cfe99f34a7553a9ee595ca2a","block_sha256":"44ec36a994cb07294ce1e683e4ac6f0f975f67a7cfe99f34a7553a9ee595ca2a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_b0e3c2ff-d6f4-4ffd-8240-d915aba73ac5"},{"id":"occ_16bd772e16b80bb87c155837","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_b633fbb3-b8a0-4ad4-9b4a-8e97d2cce76e","section_id":"sec_392b3dfc-f082-46fd-9a6d-668b6fecd583","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingの本質","quote_start":0,"quote_end":20,"text_sha256":"8524b63d9b946369e5355f0ce6a2350716cb2166bc9454f4924b511de375c456","block_sha256":"8524b63d9b946369e5355f0ce6a2350716cb2166bc9454f4924b511de375c456","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_b633fbb3-b8a0-4ad4-9b4a-8e97d2cce76e"},{"id":"occ_e71a39a7bab57acd9e474ee7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_bea92d16-5dfb-4940-8d12-29f392b8f8d5","section_id":"sec_570db1b8-bcf9-41f5-a162-c956d93be35a","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingとは何か","quote_start":0,"quote_end":21,"text_sha256":"2b20a37e3e90443f9601719e0df815e9666a7553c48dff3206b6b6dcee59cbcc","block_sha256":"2b20a37e3e90443f9601719e0df815e9666a7553c48dff3206b6b6dcee59cbcc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_bea92d16-5dfb-4940-8d12-29f392b8f8d5"},{"id":"occ_13a62975134bac725359d6a1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_c004f595-07ef-4862-bd4b-a140525afbd3","section_id":"sec_efde62f8-9672-4f38-8c7e-420755874ef0","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid Bonding","quote":"Hybrid Bondingを使えば必ずTSVが必要になるわけではない。","quote_start":0,"quote_end":36,"text_sha256":"f3a6c0899b1848fa36f50f38dbeb1850a905dc00da27e7dfbf573336dfffa32a","block_sha256":"f3a6c0899b1848fa36f50f38dbeb1850a905dc00da27e7dfbf573336dfffa32a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_c004f595-07ef-4862-bd4b-a140525afbd3"},{"id":"occ_f3ee748020ae0fc9e72e111c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_c1afab72-4a49-462b-b61c-35e9e3f6f962","section_id":"sec_4e60fb8e-741f-4f45-93e3-b3c788231866","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":60,"end":74,"exact":"Hybrid Bonding","quote":"、接合強度と微細ピッチへの拡張性を高める材料として研究されている。imecは、SiCNを用いたCu／SiCN Hybrid Bondingで、400nm、さらに研究段階では200nmの接続ピッチを実証している。([imec](https://www.imec-int.com/en/articles/wafer-wafer-hybrid-","quote_start":5,"quote_end":174,"text_sha256":"d3c58d2be087941f70e3f59f374bf4654f734021f33923cd3b7a9785f62b8e96","block_sha256":"d3c58d2be087941f70e3f59f374bf4654f734021f33923cd3b7a9785f62b8e96","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_c1afab72-4a49-462b-b61c-35e9e3f6f962"},{"id":"occ_ea41c6c766b988c86f4468a8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_d26c2c2c-a116-47ac-b5db-5498d0f972ea","section_id":"sec_1fdf0483-da99-4c36-9cf4-67b254b2255f","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"SoIC","quote":"## TSMC SoICとの関係","quote_start":0,"quote_end":16,"text_sha256":"d37c818c749255deeff0b18aa0aea8e457985a9adce0fdcf475b285166694134","block_sha256":"d37c818c749255deeff0b18aa0aea8e457985a9adce0fdcf475b285166694134","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_d26c2c2c-a116-47ac-b5db-5498d0f972ea"},{"id":"occ_c5028b9401de3544e6c0fb1b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_d27e53a6-7eef-4724-b558-f2f0829d925f","section_id":"sec_bfcdab04-2502-450e-bedf-89d282c9fa3f","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":38,"end":52,"exact":"Hybrid Bonding","quote":"**Foveros Direct 3D**は、IntelのCu-to-Cu Hybrid Bondingを使用する3D積層プラットフォームである。","quote_start":0,"quote_end":73,"text_sha256":"dcfa0249363a70778e9f6f649b3a2b8088755d3419e750059b95c8da3b26319e","block_sha256":"dcfa0249363a70778e9f6f649b3a2b8088755d3419e750059b95c8da3b26319e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_d27e53a6-7eef-4724-b558-f2f0829d925f"},{"id":"occ_41394382498950a86c70fb0c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_d3992c7f-7880-4ad0-9e7f-afa2dd465c2b","section_id":"sec_05787475-9964-41a4-8f86-5160401b69c5","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":15,"end":29,"exact":"Hybrid Bonding","quote":"Wafer-to-Wafer Hybrid Bondingでは、位置合わせした2枚のウェハーを室温付近で接触させる。","quote_start":0,"quote_end":58,"text_sha256":"4b506679dd8c0d1d579f205c70fc0e0e92c2294c7d686577a073723acdaaa5c4","block_sha256":"4b506679dd8c0d1d579f205c70fc0e0e92c2294c7d686577a073723acdaaa5c4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_d3992c7f-7880-4ad0-9e7f-afa2dd465c2b"},{"id":"occ_350e3739611fa732a7a8b568","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_d55eb238-63b9-4147-a3df-642d76bce48b","section_id":"sec_34ce463e-2408-4d36-8916-e1ba80d0a7cb","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bondingは、パッケージングを「部品の組み立て」から、「シリコン配線の延長」へ近づける技術である。","quote_start":0,"quote_end":60,"text_sha256":"f3aabff3a7145cfa2e270986d56c5c5386e901e8d6dc48741c44a4aca550f984","block_sha256":"f3aabff3a7145cfa2e270986d56c5c5386e901e8d6dc48741c44a4aca550f984","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_dfcc63d5-974a-4e44-bcf8-3f066afff6b4"},{"id":"occ_8be31a6660ca17d75b53e1d5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_e3232d2b-2a65-4f46-899f-0b0c678d4025","section_id":"sec_071d540b-f899-4c56-858b-8c68796b0788","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"Hybrid 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Bonding"],"evidence":{"text_basis":"markdown","start":4,"end":18,"exact":"Hybrid Bonding","quote":"```\nHybrid Bonding\n→ 超高密度・極短距離・3D積層\n\nマイクロバンプ\n→ 成熟量産・2.5D・比較的低コスト\n\nC4\n→ インターポーザー／ダイと基板\n\nBGA\n→ パッケージとマザーボード\n```","quote_start":0,"quote_end":109,"text_sha256":"34dd15665d33a4b12b3f958e1a7f26598e871866bc5dd69f5bb93a53eb774893","block_sha256":"34dd15665d33a4b12b3f958e1a7f26598e871866bc5dd69f5bb93a53eb774893","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_e3cd6d02-c54c-441e-9e04-1cf1c5febed1"},{"id":"occ_4cd1711bf2259935c7128d2c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_e6d53c88-04d5-4fab-b5c0-ff9e9ca29d68","section_id":"sec_541c83fd-8cc8-41c4-b5a8-33ea694c5546","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":62,"end":76,"exact":"Hybrid Bonding","quote":"て説明している。AMDの技術資料では、この方式を「銅同士を直接接合するバンプレスのChip-on-Wafer Hybrid Bonding」と明記している。([AMD](https://www.amd.com/en/products/processors/technologies/3d-v-cache.html?utm_source=c","quote_start":7,"quote_end":176,"text_sha256":"f51c41e1831a2ce8800ee9a4afeffc1348a77663b0c0a5a623013cfe14c1f60d","block_sha256":"f51c41e1831a2ce8800ee9a4afeffc1348a77663b0c0a5a623013cfe14c1f60d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_e6d53c88-04d5-4fab-b5c0-ff9e9ca29d68"},{"id":"occ_ca0792507ee44d50e155018e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_f0807c30-8eca-45ce-a65d-e85cae9f1cc4","section_id":"sec_04bb8144-8ef3-4ed1-b86e-a80fd8b5ae26","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":3,"end":17,"exact":"Hybrid Bonding","quote":"## Hybrid Bondingの断面構造","quote_start":0,"quote_end":22,"text_sha256":"4dfa4857763081a5dc9d3e23c02e458cd2f740c648bc44232c56785feadb630e","block_sha256":"4dfa4857763081a5dc9d3e23c02e458cd2f740c648bc44232c56785feadb630e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_f0807c30-8eca-45ce-a65d-e85cae9f1cc4"},{"id":"occ_fceba3b0717ce9ed7ae5dbb6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30","work_id":"wrk_c758193e-1b38-456f-813c-ec485338d79a","block_id":"blk_f0e56ee5-ec27-43fc-9ecd-aa755ce649af","section_id":"sec_8e47740e-b479-42d7-8940-cc4b6ff1f27e","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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Bondingの基本工程は、半導体のBEOL配線を形成するダマシン工程と似ている。","quote_start":0,"quote_end":48,"text_sha256":"e604ed26e8294ebfa0ebc331be1a44f4a916a19da2f6d69f8c520bf2e5ee7462","block_sha256":"e604ed26e8294ebfa0ebc331be1a44f4a916a19da2f6d69f8c520bf2e5ee7462","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cd09d63d-aa63-4e93-bc42-e8db09f09c30/#blk_f95da056-8dd5-419a-a067-588769fbccdc"},{"id":"occ_0d9e123ae5a509f8dd817ac3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cfe5b9e3-26a7-41f5-bf9e-934074846f04","work_id":"wrk_32710c09-9463-4267-9e64-b41e736195fc","block_id":"blk_23293a67-e5f4-45d2-a5d7-10ae1e827ee7","section_id":"sec_1a66fffd-9c64-4115-9795-3554eae9049e","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":19,"end":24,"exact":"CoWoS","quote":"TSMCは現在5.5-reticle CoWoSを生産中で、2028年には14-reticle sizeへ拡大し、約10個の大型compute dieと20 HBM stackを統合する計画を示している。","quote_start":0,"quote_end":102,"text_sha256":"9ae6a8b9639e9bf843a1f431461ec23b87395e280a6e7a7a9f7d25e1183a3c62","block_sha256":"9ae6a8b9639e9bf843a1f431461ec23b87395e280a6e7a7a9f7d25e1183a3c62","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cfe5b9e3-26a7-41f5-bf9e-934074846f04/#blk_23293a67-e5f4-45d2-a5d7-10ae1e827ee7"},{"id":"occ_aca8b12979b4491b2de85c68","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cfe5b9e3-26a7-41f5-bf9e-934074846f04","work_id":"wrk_32710c09-9463-4267-9e64-b41e736195fc","block_id":"blk_38525e36-dec8-4895-8589-865131e4d832","section_id":"sec_1a66fffd-9c64-4115-9795-3554eae9049e","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS。","quote_start":0,"quote_end":6,"text_sha256":"940acf130cc8885cafdc807e1a97a9e4125b16cc2f79bded41a16eec03491475","block_sha256":"940acf130cc8885cafdc807e1a97a9e4125b16cc2f79bded41a16eec03491475","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cfe5b9e3-26a7-41f5-bf9e-934074846f04/#blk_38525e36-dec8-4895-8589-865131e4d832"},{"id":"occ_9bafb24208ec6adc3beefb07","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cfe5b9e3-26a7-41f5-bf9e-934074846f04","work_id":"wrk_32710c09-9463-4267-9e64-b41e736195fc","block_id":"blk_58f8b101-e533-42f3-9c86-7ab35cf921cf","section_id":"sec_1a66fffd-9c64-4115-9795-3554eae9049e","layer":"body","character_id":null,"count":1,"matched_aliases":["SoIC"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"SoIC","quote":"SoIC。","quote_start":0,"quote_end":5,"text_sha256":"75b053e100ebb6588adfc161e8a90cdc6244edd09543e10c420cda5aa745b93e","block_sha256":"75b053e100ebb6588adfc161e8a90cdc6244edd09543e10c420cda5aa745b93e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cfe5b9e3-26a7-41f5-bf9e-934074846f04/#blk_58f8b101-e533-42f3-9c86-7ab35cf921cf"},{"id":"occ_2f349c0469d16e15d17a2476","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cfe5b9e3-26a7-41f5-bf9e-934074846f04","work_id":"wrk_32710c09-9463-4267-9e64-b41e736195fc","block_id":"blk_7bdd1c38-abd6-4ab2-b16a-ffcc63719f61","section_id":"sec_a11f23a6-701d-4f23-8ae0-e350dce36f79","layer":"body","character_id":null,"count":1,"matched_aliases":["hybrid 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↓\n2.5D / 3D\n ↓\nShort Electrical Scale-Up\n ↓\nOptical Scale-Up\n ↓\nOptical Scale-Out","quote_start":0,"quote_end":107,"text_sha256":"df17710bbfb0d5583cba079dc00b1d70b6992a6b0e0351217456ab1de3d08787","block_sha256":"df17710bbfb0d5583cba079dc00b1d70b6992a6b0e0351217456ab1de3d08787","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_cfe5b9e3-26a7-41f5-bf9e-934074846f04/#blk_8ba82730-3e3f-4fce-b274-f9a081826834"},{"id":"occ_de8b5605673b9efbfaff9cdd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_cfe5b9e3-26a7-41f5-bf9e-934074846f04","work_id":"wrk_32710c09-9463-4267-9e64-b41e736195fc","block_id":"blk_dfb13626-4476-4b82-9f4f-5489c7ece0d8","section_id":"sec_1a66fffd-9c64-4115-9795-3554eae9049e","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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EUV・HBM・先端パッケージが強い | 建設・電力・量産・融資が強い |\n| **性能・コスト** | 高性能・高効率 | 十分な性能・低価格 |\n| **提供形態** | 開発者エコシステム | ターンキー国家インフラ 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Samsung Foundry\n- Rapidus\n- 日本・米国・欧州の先端パッケージ拠点\n- 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**Rubin 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Packageが必須ではない。","quote_start":0,"quote_end":37,"text_sha256":"49e11b640b5ea0d2a391209813c34617492a77a66a1d6959237afc37629274ff","block_sha256":"49e11b640b5ea0d2a391209813c34617492a77a66a1d6959237afc37629274ff","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_df2ff134-3d7b-48d0-82b5-c341fa1dc646/#blk_b216db7d-61cf-4903-9dc0-22a117b2ca8d"},{"id":"occ_525f63656ba48da4c37c59b9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_df2ff134-3d7b-48d0-82b5-c341fa1dc646","work_id":"wrk_4c390ee8-19a9-47a2-baff-32ac4e8e79ad","block_id":"blk_cabed260-3b9b-416f-b81e-b480ff35ca5d","section_id":"sec_6a36aec6-16cf-4f4b-a124-9d6e144a495f","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS――Chip-on-Wafer-on-Substrate。  \nGPU/XPUとHBMを高密度接続するTSMCの先端Packaging技術。","quote_start":0,"quote_end":75,"text_sha256":"12e89d12bb600497db059b46e2120316078b9413cea5272d9d7c90339e8a4c62","block_sha256":"12e89d12bb600497db059b46e2120316078b9413cea5272d9d7c90339e8a4c62","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_df2ff134-3d7b-48d0-82b5-c341fa1dc646/#blk_cabed260-3b9b-416f-b81e-b480ff35ca5d"},{"id":"occ_b4a45734dc66845118ddac17","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_df2ff134-3d7b-48d0-82b5-c341fa1dc646","work_id":"wrk_4c390ee8-19a9-47a2-baff-32ac4e8e79ad","block_id":"blk_fe8d0d57-790a-4ccb-ad59-cfa65f0bda8b","section_id":"sec_6a36aec6-16cf-4f4b-a124-9d6e144a495f","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":6,"end":11,"exact":"CoWoS","quote":"**HBM/CoWoS需要**","quote_start":0,"quote_end":15,"text_sha256":"7d5c4ca06f8af2fb018156f4814ab0c711b01a52cabbfe5d2aa11992f9f0cadc","block_sha256":"7d5c4ca06f8af2fb018156f4814ab0c711b01a52cabbfe5d2aa11992f9f0cadc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_df2ff134-3d7b-48d0-82b5-c341fa1dc646/#blk_fe8d0d57-790a-4ccb-ad59-cfa65f0bda8b"},{"id":"occ_7d5559b499c08abf3fef45a9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_1841fc62-58b5-4af0-b61d-184c43b52c59","section_id":"sec_46c52456-d7c9-4f0d-ae28-b76358f12643","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":30,"end":35,"exact":"CoWoS","quote":"> **限られたlogic wafer、HBM wafer、CoWoS、電力、ネットワークから、最も多くの有効tokenを作れるAI Factoryを構築できるか**","quote_start":0,"quote_end":83,"text_sha256":"6ef23108e137fdbf953b49e672b6c68b4c85fc0739ce596f79cbb1d86d4a337b","block_sha256":"6ef23108e137fdbf953b49e672b6c68b4c85fc0739ce596f79cbb1d86d4a337b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_1841fc62-58b5-4af0-b61d-184c43b52c59"},{"id":"occ_5ad1e067cfa2e944848f473e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_204fb759-7b5e-41bf-9e9a-58a9a944a4b0","section_id":"sec_0a9f188a-75ff-4ea7-9452-faa3ec17295f","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":6,"end":11,"exact":"CoWoS","quote":"## 32．CoWoSが空いていてもlogic waferがなければ何も作れない","quote_start":0,"quote_end":40,"text_sha256":"1f528f82f78550fec9a8fbb37403d120a9391b20cab605f0bc353b09b572e84e","block_sha256":"1f528f82f78550fec9a8fbb37403d120a9391b20cab605f0bc353b09b572e84e","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_204fb759-7b5e-41bf-9e9a-58a9a944a4b0"},{"id":"occ_71e822b616d20c5570140d98","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_2ca0f1c0-9f3d-455f-8533-1426a8621301","section_id":"sec_518f1f7c-ffb8-48bf-96e9-5a47ee4f2aef","layer":"body","character_id":null,"count":3,"matched_aliases":["3D実装","SoIC","先端パッケージ"],"evidence":{"text_basis":"markdown","start":163,"end":170,"exact":"先端パッケージ","quote":"PUそのものを一から設計するという話ではない。SemiAnalysisがAMDの候補理由として挙げたのは、**先端パッケージ、SoICを使った3D実装、そしてCPU IP**だった。Googleとその顧客が、強化学習などCPU負荷の大きい処理のため、TPUとCPU coreを同一パッケージへ近づけようとしているとの観測であ","quote_start":108,"quote_end":270,"text_sha256":"c9e8d5a4cb1af367076620f25803c57a23056fc6cfd2412f02cd69a0a4b5d9cc","block_sha256":"c9e8d5a4cb1af367076620f25803c57a23056fc6cfd2412f02cd69a0a4b5d9cc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_2ca0f1c0-9f3d-455f-8533-1426a8621301"},{"id":"occ_14666b7b435f46a394266bd6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_2f5c516d-133e-4fb3-9e2a-4859a067a1c1","section_id":"sec_a6dd0732-8c0d-486d-8ac3-fe8fc0cfb143","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid Bonding"],"evidence":{"text_basis":"markdown","start":84,"end":98,"exact":"Hybrid Bonding","quote":"、将来的なHBM5 20-Hiでは、stack height、I/O density、thermalの制約からHybrid Bondingを使う方向が強いとTrendForceは報告している。 ([TrendForce](https://www.trendforce.com/presscenter/news/20241030-12343","quote_start":29,"quote_end":198,"text_sha256":"5d932f414d91ff24c1b9c14ab5b5af4134dc4f72b518ac2a1506b3fe6b29e8b0","block_sha256":"5d932f414d91ff24c1b9c14ab5b5af4134dc4f72b518ac2a1506b3fe6b29e8b0","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_2f5c516d-133e-4fb3-9e2a-4859a067a1c1"},{"id":"occ_a7586627640f38cf218c3963","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_6b40b27f-96fe-46c1-8368-ed93e2311fdd","section_id":"sec_e52b1f02-d0f0-48ee-80f0-2521c8607e6b","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":16,"end":21,"exact":"CoWoS","quote":"へ引き下げられたとされる。原因はCoWoS-S rampの難しさだという。 ([データセンターのダイナミクス](https://www.datacenterdynamics.com/en/news/google-rumored-to-have","quote_start":0,"quote_end":121,"text_sha256":"0521ee9a011c707873d7a229d1d66148b108f4f872cdea6e0ef3d0d3af162547","block_sha256":"0521ee9a011c707873d7a229d1d66148b108f4f872cdea6e0ef3d0d3af162547","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_6b40b27f-96fe-46c1-8368-ed93e2311fdd"},{"id":"occ_cb9b3b20de7f3c86fff20ce6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_70acfc75-0b8d-4a5c-937d-f6f2719e036c","section_id":"sec_be7432ee-b8ab-4e6f-aa50-3c2cce8d1635","layer":"code","character_id":null,"count":2,"matched_aliases":["CoWoS","SoIC"],"evidence":{"text_basis":"markdown","start":108,"end":113,"exact":"CoWoS","quote":" ↓\n完成logic wafer\n    ↓\ndicing\n    ↓\nAdvanced Packaging\nCoWoS / SoIC\n    ↓\nHBM\n    ↓\nsubstrate\n    ↓\nNIC / switch\n    ↓\nrack\n```","quote_start":53,"quote_end":180,"text_sha256":"30b60cf023144d2efb466c743854b13e11b3353f0a085959d44fd6d48a07b8e1","block_sha256":"30b60cf023144d2efb466c743854b13e11b3353f0a085959d44fd6d48a07b8e1","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_70acfc75-0b8d-4a5c-937d-f6f2719e036c"},{"id":"occ_8fbac99a716cfc7ca47a064e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_72bd3844-d8c1-4969-8c57-d717ba4810f6","section_id":"sec_0a9f188a-75ff-4ea7-9452-faa3ec17295f","layer":"code","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":4,"end":9,"exact":"CoWoS","quote":"```\nCoWoS capacity ↑\n```","quote_start":0,"quote_end":24,"text_sha256":"925dd52bdd96162594c0e2b12924050141af01c5ed094290bf6c418049b54767","block_sha256":"925dd52bdd96162594c0e2b12924050141af01c5ed094290bf6c418049b54767","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_72bd3844-d8c1-4969-8c57-d717ba4810f6"},{"id":"occ_4849e67a8d2853c6fbf18465","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_7e2ffe31-8b08-44cd-a8ef-5615717223b4","section_id":"sec_15119925-0267-4f30-bb95-2720f441057b","layer":"body","character_id":null,"count":1,"matched_aliases":["先端実装"],"evidence":{"text_basis":"markdown","start":65,"end":69,"exact":"先端実装","quote":"を欲しがる可能性が面白いのは、**ArmのようなCustom SoCの世界へ、AMDがx86＋chiplet＋先端実装を持って入ってくる可能性**があるからだ。","quote_start":10,"quote_end":90,"text_sha256":"9014ec8e540f57084dd26e1b631b7b9ea8e47f0a0b2aae10f46663280b40d5a4","block_sha256":"9014ec8e540f57084dd26e1b631b7b9ea8e47f0a0b2aae10f46663280b40d5a4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_7e2ffe31-8b08-44cd-a8ef-5615717223b4"},{"id":"occ_13add262824ef1bcd71908c5","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_7eb8b2bc-052e-4004-b529-6c695e95d41b","section_id":"sec_a6dd0732-8c0d-486d-8ac3-fe8fc0cfb143","layer":"code","character_id":null,"count":1,"matched_aliases":["hybrid bonding"],"evidence":{"text_basis":"markdown","start":155,"end":169,"exact":"hybrid bonding","quote":"GPU/XPU + HBM\n同一package\n\n        ↓\n\n第4段階\nlogic die\n  ↕ hybrid bonding\nlogic / cache / I/O die\n  ↕\nHBM logic base die\n  ↕\nDRAM stack\n\n        ↓\n\n第5段階\nmemory-on-logic\nnear","quote_start":100,"quote_end":269,"text_sha256":"8cd72d44a03ec42ce91aa18cb80f1518b2c5201bd0c3bb15bc2b8a651333f114","block_sha256":"8cd72d44a03ec42ce91aa18cb80f1518b2c5201bd0c3bb15bc2b8a651333f114","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_7eb8b2bc-052e-4004-b529-6c695e95d41b"},{"id":"occ_7d087aa81b4a7b2e7f5a2dbc","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_be283053-99f5-4298-9e61-8aff969d1ef5","section_id":"sec_0a9f188a-75ff-4ea7-9452-faa3ec17295f","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":20,"end":25,"exact":"CoWoS","quote":"以前AI半導体で最も有名なボトルネックはCoWoSだった。","quote_start":0,"quote_end":29,"text_sha256":"0d16c9a65bd2318a3f3e99acc198427d5ed46faef1d74cdb1dc1159a8d3b5428","block_sha256":"0d16c9a65bd2318a3f3e99acc198427d5ed46faef1d74cdb1dc1159a8d3b5428","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_be283053-99f5-4298-9e61-8aff969d1ef5"},{"id":"occ_a74f1faaafdc0bf070ee15d2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753","work_id":"wrk_88c25067-a100-4eee-96f7-180120d2ac61","block_id":"blk_dfb62f4d-6e89-4aec-a3ce-519357cc8f33","section_id":"sec_e52b1f02-d0f0-48ee-80f0-2521c8607e6b","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":9,"end":14,"exact":"CoWoS","quote":"BroadcomのCoWoS wafer outputも、","quote_start":0,"quote_end":29,"text_sha256":"fe2a69d5c5da68f7ae664bb0145dc36a4e9e1d3278a119a903cfb8c95b9fcee6","block_sha256":"fe2a69d5c5da68f7ae664bb0145dc36a4e9e1d3278a119a903cfb8c95b9fcee6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e1c0a212-5ad0-4fbc-81f6-60d2df49d753/#blk_dfb62f4d-6e89-4aec-a3ce-519357cc8f33"},{"id":"occ_5316bd6e82d3219ea3dd784b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_06155e53-974e-47c5-abd0-cf43ef32d02b","section_id":"sec_7a6b4d4b-d83f-48a4-96cc-b519334292bb","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":32,"end":37,"exact":"CoWoS","quote":"添付資料が示すように、CerebrasはHBMを使わず、HBM/CoWoS/3nmの制約を避ける一方、ほぼwafer-sizeのlogic siliconを投入する。","quote_start":0,"quote_end":83,"text_sha256":"50e82100a7557eea931863bbfb842f153872d0faebb55f9def0ca0c6d688a323","block_sha256":"50e82100a7557eea931863bbfb842f153872d0faebb55f9def0ca0c6d688a323","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_06155e53-974e-47c5-abd0-cf43ef32d02b"},{"id":"occ_28f291b9b37d35b48b268c38","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_156700bb-65e5-4de1-8824-d1dfbe67a3bc","section_id":"sec_a6a1b773-f55f-43ee-b308-b985bc02783e","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":4,"end":9,"exact":"CoWoS","quote":"### CoWoS equivalent","quote_start":0,"quote_end":20,"text_sha256":"f82b70851bd2fe1c38ba4c7b796d7499110a505aa080db53d075e078eadc50d7","block_sha256":"f82b70851bd2fe1c38ba4c7b796d7499110a505aa080db53d075e078eadc50d7","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_156700bb-65e5-4de1-8824-d1dfbe67a3bc"},{"id":"occ_46d23ac8214f54bba44fc87c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_1620fea7-9090-4680-9b75-38efa146b497","section_id":"sec_f001fae5-67b2-41da-84d5-56c5eb0131e3","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":70,"end":75,"exact":"CoWoS","quote":"では独自Base Dieだったが、HBM4からTSMC advanced logic processを採用し、CoWoS integrationまで共同最適化する。([SK hynix Newsroom](https://news.skhynix.com/en/sk-hynix-partners-with-tsmc-t","quote_start":15,"quote_end":175,"text_sha256":"75e8e78d35c67716796eef83a4f73324f0643bba2828e2bcf7a1de18d730eb7b","block_sha256":"75e8e78d35c67716796eef83a4f73324f0643bba2828e2bcf7a1de18d730eb7b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_1620fea7-9090-4680-9b75-38efa146b497"},{"id":"occ_99d4d4b0f5beff68d762bc56","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_225eaf60-481e-4c8e-9d7e-f26364ca7608","section_id":"sec_888fd887-96b1-4369-b6a1-a8c12d34ea2e","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":25,"end":30,"exact":"CoWoS","quote":"TrendForceの2026年推定ではTSMC CoWoS capacityは、","quote_start":0,"quote_end":41,"text_sha256":"23036ca7e6bad9a2b81622c65ab702c965d936e66a0c4941b548f3d04f62584a","block_sha256":"23036ca7e6bad9a2b81622c65ab702c965d936e66a0c4941b548f3d04f62584a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_225eaf60-481e-4c8e-9d7e-f26364ca7608"},{"id":"occ_fefd476cc0c484ef6c46ce81","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_39723578-7f1c-43b6-b061-6c54540cae0a","section_id":"sec_5ff700da-51df-48c3-8042-52c08a04c16c","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":175,"end":180,"exact":"CoWoS","quote":"N3/N2のGross Dies Per Wafer、つまりGDPWが落ちる。Logic waferを増やせばCoWoSが必要になり、HBM4からはHBMの底にあるLogic Base DieまでTSMCやSamsung Foundryの先端ノードを使い始める。","quote_start":120,"quote_end":251,"text_sha256":"97859327a71777a0196cd47dd3a16291f643fc751ee505856674a6682d5ec814","block_sha256":"97859327a71777a0196cd47dd3a16291f643fc751ee505856674a6682d5ec814","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_39723578-7f1c-43b6-b061-6c54540cae0a"},{"id":"occ_584e3993e1ca7ea1fa58de38","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_780d7e95-d110-482a-8c05-66ed32434517","section_id":"sec_12083e2a-b6be-4486-a4ab-01aa1d1ed674","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":10,"end":15,"exact":"CoWoS","quote":"今回の6社モデルではCoWoS equivalent demandが、","quote_start":0,"quote_end":35,"text_sha256":"16f9537c64e8d5431622f0241439275fbfaf227885dfffe4d25cd43fabdbf881","block_sha256":"16f9537c64e8d5431622f0241439275fbfaf227885dfffe4d25cd43fabdbf881","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_780d7e95-d110-482a-8c05-66ed32434517"},{"id":"occ_bbe7c6c33ff35a4d6975d9d9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_8f8644e0-b3e2-4997-b332-3250bd07f89e","section_id":"sec_e005cb51-0a17-4320-82c5-40ee24a4d034","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":26,"end":31,"exact":"CoWoS","quote":"## Completed Accelerators/CoWoS Capacity。","quote_start":0,"quote_end":41,"text_sha256":"d836e9d92378a7fb117cff3bad53421c0a0aab0108700c01e620508206b7e907","block_sha256":"d836e9d92378a7fb117cff3bad53421c0a0aab0108700c01e620508206b7e907","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_8f8644e0-b3e2-4997-b332-3250bd07f89e"},{"id":"occ_3f239b15f495eef64e9aa2ef","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_98366817-920b-411f-8c33-d9a3cddd0856","section_id":"sec_f1231053-0c11-4075-89a4-afc366f1172e","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":4,"end":9,"exact":"CoWoS","quote":"そのためCoWoS WPMが60%増えても、","quote_start":0,"quote_end":22,"text_sha256":"49d1b0ed8c14eed6a989dbdc5560b0b1a8630171eaf51213f602ce04e3538709","block_sha256":"49d1b0ed8c14eed6a989dbdc5560b0b1a8630171eaf51213f602ce04e3538709","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_98366817-920b-411f-8c33-d9a3cddd0856"},{"id":"occ_ba8811f3f087a4484e745127","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_d4d9b941-ec54-4c9f-9620-ce4cb88d07d1","section_id":"sec_bc92d00e-1516-48ac-9ea8-f40f43b04ba6","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoS equivalent。","quote_start":0,"quote_end":17,"text_sha256":"d936cd48c40b2f36ad79d96af34f339792465e649d08c3ddc57c009bafacb434","block_sha256":"d936cd48c40b2f36ad79d96af34f339792465e649d08c3ddc57c009bafacb434","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_d4d9b941-ec54-4c9f-9620-ce4cb88d07d1"},{"id":"occ_02a88c654a3c807fa2955bcb","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_dcad1a2e-4531-484b-98ce-ff396ccd759e","section_id":"sec_12083e2a-b6be-4486-a4ab-01aa1d1ed674","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":13,"end":18,"exact":"CoWoS","quote":"つまり6社だけでTSMCのCoWoS capacityにかなり接近する。","quote_start":0,"quote_end":36,"text_sha256":"49387bd32b306efc9eab880cf1b2388751567d4c98268a06be8c0a1615547f97","block_sha256":"49387bd32b306efc9eab880cf1b2388751567d4c98268a06be8c0a1615547f97","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_dcad1a2e-4531-484b-98ce-ff396ccd759e"},{"id":"occ_8523b6505f5045b9a4af1bf6","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e2c369be-a992-44a9-bbc1-81ed4928e89f","work_id":"wrk_d2f61eaa-5ee5-4d1f-b70d-7356a79ea61d","block_id":"blk_e833e2cf-742c-436c-80be-ce7ead1ad386","section_id":"sec_888fd887-96b1-4369-b6a1-a8c12d34ea2e","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":6,"end":11,"exact":"CoWoS","quote":"## 50．CoWoSはLogic Wafer以上に危ない","quote_start":0,"quote_end":29,"text_sha256":"9f1d2b1629bc959e948429cd1371727ae9dadd576084491b9d90408d0f5f96bc","block_sha256":"9f1d2b1629bc959e948429cd1371727ae9dadd576084491b9d90408d0f5f96bc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e2c369be-a992-44a9-bbc1-81ed4928e89f/#blk_e833e2cf-742c-436c-80be-ce7ead1ad386"},{"id":"occ_21dd3ba14d1105c71a1f6a0b","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e3f21c07-c5c6-40a4-add2-45c9479bb52a","work_id":"wrk_9aa9bb3d-e631-443f-990f-961dddfcc673","block_id":"blk_268b4a3a-21cc-49db-bb8c-913016841d6f","section_id":"sec_ef09394b-65ae-4728-b155-ab70e95a4fd8","layer":"body","character_id":null,"count":2,"matched_aliases":["Hybrid Bonding","SoIC"],"evidence":{"text_basis":"markdown","start":24,"end":38,"exact":"Hybrid Bonding","quote":"**レチクル限界、Die-to-Die 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PHY、UCIeといった技術が必要になる。","quote_start":0,"quote_end":74,"text_sha256":"80e81d148586982b9245a39045ee561ff2cc600e9eae05e68802dd57731f0c70","block_sha256":"80e81d148586982b9245a39045ee561ff2cc600e9eae05e68802dd57731f0c70","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_e3f21c07-c5c6-40a4-add2-45c9479bb52a/#blk_2e83e1b5-1885-4546-b1b5-1daa81fb8be6"},{"id":"occ_d3d342b5b31e5e6fe0af4c1d","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_e3f21c07-c5c6-40a4-add2-45c9479bb52a","work_id":"wrk_9aa9bb3d-e631-443f-990f-961dddfcc673","block_id":"blk_f9c42991-5bdc-4b93-ba8d-cfe188b4950a","section_id":"sec_86ce7270-64f4-48bc-bf2f-66a98a360656","layer":"body","character_id":null,"count":1,"matched_aliases":["先端パッケージ"],"evidence":{"text_basis":"markdown","start":22,"end":29,"exact":"先端パッケージ","quote":"- ダイ間通信の消費電力\n- 通信遅延\n- 先端パッケージ費用\n- 接合不良\n- 熱密度\n- テストの複雑化\n- 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CoWoSと芝浦メカトロニクスの関連性","quote_start":0,"quote_end":23,"text_sha256":"adf1ffee0940219479078404958170d954e7c576f47dc1bcdd41b37715063d77","block_sha256":"adf1ffee0940219479078404958170d954e7c576f47dc1bcdd41b37715063d77","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec6cc502-640e-4fef-a24c-82386eb57344/#blk_7d245948-5d5e-4d9b-bab7-be365ff77495"},{"id":"occ_a04439dbd7ae09f2e74c35fc","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec6cc502-640e-4fef-a24c-82386eb57344","work_id":"wrk_a4a974fa-91dc-443a-80e8-17400ac231f3","block_id":"blk_816a53af-266e-4bfc-be79-3241751bae4a","section_id":"sec_e91a7fc5-ac42-4116-95a4-98cda57e9553","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":30,"end":35,"exact":"CoWoS","quote":"調査の過程で、以下の情報源から芝浦メカトロニクスがTSMCのCoWoS生産に関与していることが確認されました：","quote_start":0,"quote_end":55,"text_sha256":"8bf161935009c2f21e68a2293f5df6d8671e6463c69a2357a402df1a67534a57","block_sha256":"8bf161935009c2f21e68a2293f5df6d8671e6463c69a2357a402df1a67534a57","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec6cc502-640e-4fef-a24c-82386eb57344/#blk_816a53af-266e-4bfc-be79-3241751bae4a"},{"id":"occ_b520a4db4cc374300f67b9fa","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec6cc502-640e-4fef-a24c-82386eb57344","work_id":"wrk_a4a974fa-91dc-443a-80e8-17400ac231f3","block_id":"blk_8cdd0913-4329-4928-80f9-ac761d9bdc0f","section_id":"sec_8c2bc11c-c9e1-40c3-9d7b-bfe12a80da44","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":33,"end":38,"exact":"CoWoS","quote":"2023年の報告では、芝浦メカトロニクスの設備供給遅延がTSMCのCoWoS容量拡大に影響を与えたとされており、これは同社がCoWoS生産に重要な役割を果たしている証拠です。ただし、具体的なモデルや技術の詳細は公開情報では限定的であり、公式発表や顧客ケーススタディで確認する必","quote_start":0,"quote_end":138,"text_sha256":"31ab40ca038e57d95135156859e5e0ccc0d3f370f1644e161311db5fa8951368","block_sha256":"31ab40ca038e57d95135156859e5e0ccc0d3f370f1644e161311db5fa8951368","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec6cc502-640e-4fef-a24c-82386eb57344/#blk_8cdd0913-4329-4928-80f9-ac761d9bdc0f"},{"id":"occ_a8068732950726e722b77fb3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec6cc502-640e-4fef-a24c-82386eb57344","work_id":"wrk_a4a974fa-91dc-443a-80e8-17400ac231f3","block_id":"blk_968d0fff-548d-481e-bdbe-941bfe66f5e4","section_id":"sec_44855ed0-a661-433c-822e-38a88227182e","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoSの製造プロセスでは、インターポーザーの準備段階でクリーニングやエッチングが必要なため、芝浦メカトロニクスのクリーニング装置（例：300mmウェハ対応シングルウェハクリーニング装置）やエッチング装置（例","quote_start":0,"quote_end":105,"text_sha256":"40d07605acebb8391b54c0b9370e4b3f7345d66cbc30face75ac987defbaf778","block_sha256":"40d07605acebb8391b54c0b9370e4b3f7345d66cbc30face75ac987defbaf778","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec6cc502-640e-4fef-a24c-82386eb57344/#blk_968d0fff-548d-481e-bdbe-941bfe66f5e4"},{"id":"occ_a91229f17db42531aaf72369","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec6cc502-640e-4fef-a24c-82386eb57344","work_id":"wrk_a4a974fa-91dc-443a-80e8-17400ac231f3","block_id":"blk_993dbaa9-75e0-4d56-a726-567f490f37df","section_id":"sec_991d205f-defe-4bbe-b3a2-c30964de0168","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":2,"end":7,"exact":"CoWoS","quote":"- 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Substrate）は、芝浦メカトロニクスのフリップチップボンダー（特にソルダーリフロー対応のもの）が使用されているようで、これはパッケージの組み立てに重要です。\n","quote_start":0,"quote_end":107,"text_sha256":"4036154befd4fd9ad249ed9c304c2e6d579fb699b8762327f0372afb446b8697","block_sha256":"4036154befd4fd9ad249ed9c304c2e6d579fb699b8762327f0372afb446b8697","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec6cc502-640e-4fef-a24c-82386eb57344/#blk_993dbaa9-75e0-4d56-a726-567f490f37df"},{"id":"occ_132b108039026a34c2a5cdd7","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec6cc502-640e-4fef-a24c-82386eb57344","work_id":"wrk_a4a974fa-91dc-443a-80e8-17400ac231f3","block_id":"blk_9f44ef2a-e4b9-4f60-b623-2af974fab3e0","section_id":"sec_cd87ea7f-a5d5-4683-a9c6-488597abe913","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":23,"end":28,"exact":"CoWoS","quote":"情報源によれば、芝浦メカトロニクスはTSMCのCoWoS生産に設備を提供しており、ボンディング機器が主要な貢献者であるとされています。ただし、具体的なモデルや技術の詳細は公開情報では限定的です。","quote_start":0,"quote_end":97,"text_sha256":"9a8e9a6f04f3cbc3be2c96725fa2c8002894cf6bff5a044ecaa265a2a0d6e03c","block_sha256":"9a8e9a6f04f3cbc3be2c96725fa2c8002894cf6bff5a044ecaa265a2a0d6e03c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec6cc502-640e-4fef-a24c-82386eb57344/#blk_9f44ef2a-e4b9-4f60-b623-2af974fab3e0"},{"id":"occ_30e6b982b94a52a378acfe7a","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec6cc502-640e-4fef-a24c-82386eb57344","work_id":"wrk_a4a974fa-91dc-443a-80e8-17400ac231f3","block_id":"blk_a2e765f5-b800-45db-9a0a-3f02c3e2d5da","section_id":"sec_bbb6f0a6-e038-411f-91cd-0fab46f72c6c","layer":"body","character_id":null,"count":2,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":249,"end":253,"exact":"2.5D","quote":"-|  \n| フリップチップボンダー | TFC-6100                        | 2.5D/3Dパッケージ向け、高精度、COW対応         |  \n| フリップチップボンダー | TFC-6000                        | COC、COW、TSV、FC-BG","quote_start":194,"quote_end":353,"text_sha256":"05448517281d2bf53c5ec518b8db375820dc109a942fb27e1be80fd5a5325f0b","block_sha256":"05448517281d2bf53c5ec518b8db375820dc109a942fb27e1be80fd5a5325f0b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec6cc502-640e-4fef-a24c-82386eb57344/#blk_a2e765f5-b800-45db-9a0a-3f02c3e2d5da"},{"id":"occ_63e8a5af675d8e5d5cccd400","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec6cc502-640e-4fef-a24c-82386eb57344","work_id":"wrk_a4a974fa-91dc-443a-80e8-17400ac231f3","block_id":"blk_ba7055ec-f026-45bb-9300-1f9fa06bd4cc","section_id":"sec_bbb6f0a6-e038-411f-91cd-0fab46f72c6c","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoSの製造におけるボンディングプロセスは、チップをインターポーザーに接続する際にソルダーバンプ（マイクロバンプ）を使用するため、芝浦メカトロニクスのフリップチップボンダーが特に関連性が高いと考えられます。","quote_start":0,"quote_end":105,"text_sha256":"d871a33cfee5eb7c8e945307d6844727cd817faa7d98d7d3d25840cf9e2d1972","block_sha256":"d871a33cfee5eb7c8e945307d6844727cd817faa7d98d7d3d25840cf9e2d1972","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec6cc502-640e-4fef-a24c-82386eb57344/#blk_ba7055ec-f026-45bb-9300-1f9fa06bd4cc"},{"id":"occ_7739a8f1e511bf6738647610","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec6cc502-640e-4fef-a24c-82386eb57344","work_id":"wrk_a4a974fa-91dc-443a-80e8-17400ac231f3","block_id":"blk_c8a9298e-e33c-4260-adfd-2ce60adf0790","section_id":"sec_dcf45c7a-df40-411a-b3ce-2d0ad4c32d4d","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":111,"end":116,"exact":"CoWoS","quote":"ww.shibaura.co.jp/e/products/)\n- 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CoWoS には芝浦メカトロニクスのどの技術や製品が活用されていますか？","quote_start":0,"quote_end":40,"text_sha256":"1ef1d823d795d27d81275ea8a4d29541cb4f2024f9249f869eec966ffa7bd20b","block_sha256":"1ef1d823d795d27d81275ea8a4d29541cb4f2024f9249f869eec966ffa7bd20b","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec6cc502-640e-4fef-a24c-82386eb57344/#blk_f2e5ff1c-f9f7-4749-aa05-76daec6ead09"},{"id":"occ_12a3d43b83ad3fc65cc06b27","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec6cc502-640e-4fef-a24c-82386eb57344","work_id":"wrk_a4a974fa-91dc-443a-80e8-17400ac231f3","block_id":"blk_fbbe8dda-a0e9-4dd0-87dc-964e61cc7d77","section_id":"sec_e91a7fc5-ac42-4116-95a4-98cda57e9553","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":448,"end":453,"exact":"CoWoS","quote":"ダーであるShibaura 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    │   EMIB   │\n     └──────────┘","quote_start":0,"quote_end":48,"text_sha256":"a7b916bc05775c645af703fec69bb90f916589aedf472a5394ecf0a985f8dbd8","block_sha256":"a7b916bc05775c645af703fec69bb90f916589aedf472a5394ecf0a985f8dbd8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_063669d4-0c82-4d67-a346-4f389bfb2342"},{"id":"occ_fc59088b4c7edf3da8a12354","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_08717db5-ecc2-4afb-a2f2-c7909b9a93db","section_id":"sec_4505c3a3-552c-4b4d-a55f-17c89f3d9c69","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tは、","quote_start":0,"quote_end":8,"text_sha256":"cc78bb82488a21bb3f197df2b34ce5f656153f4ab4fb87dac2e7559118bb79b9","block_sha256":"cc78bb82488a21bb3f197df2b34ce5f656153f4ab4fb87dac2e7559118bb79b9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_08717db5-ecc2-4afb-a2f2-c7909b9a93db"},{"id":"occ_1a43fce6fc222824a7438ef9","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_0875151a-6e4a-4081-a941-e5ac76dd6380","section_id":"sec_41c2e18b-fabc-43ab-b567-3931d14e537d","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":1,"end":5,"exact":"EMIB","quote":"「EMIB-Tを採用した」というニュースだけではない。","quote_start":0,"quote_end":27,"text_sha256":"31d3ba014dec97e9aa9d089b6f1445f41a4ac97fc5e51d6b83235680975d9c2a","block_sha256":"31d3ba014dec97e9aa9d089b6f1445f41a4ac97fc5e51d6b83235680975d9c2a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_0875151a-6e4a-4081-a941-e5ac76dd6380"},{"id":"occ_a740c52f80107fe64a2f2452","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_08ba2bd1-34ac-4647-a393-6c7b53235229","section_id":"sec_5e2cac46-0d52-4df3-bb2e-9be813cfbd90","layer":"caption","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":2,"end":7,"exact":"CoWoS","quote":"![CoWoSと局所ブリッジ方式の比較 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第2章　EMIBの基本原理","quote_start":0,"quote_end":16,"text_sha256":"29bf8b4978520a6585fa9e62ba6fffe9c542aefb6d389b92ec9c98b15b317113","block_sha256":"29bf8b4978520a6585fa9e62ba6fffe9c542aefb6d389b92ec9c98b15b317113","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_3e7d554c-56fc-4ef4-8a4b-caef81ec0e18"},{"id":"occ_e4a26aa181a8f70b0d81992e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_3ff1cd5c-e3c6-4ba3-a80a-273eae071c74","section_id":"sec_4af021aa-c35a-404d-b6e8-dbc3ba26f91f","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-T backlog continues to grow","quote_start":0,"quote_end":32,"text_sha256":"4ffc29ba16f59b8c811413ff1e68c11d31b0fe33977991aacf09f97d1e3dbfab","block_sha256":"4ffc29ba16f59b8c811413ff1e68c11d31b0fe33977991aacf09f97d1e3dbfab","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_3ff1cd5c-e3c6-4ba3-a80a-273eae071c74"},{"id":"occ_0fe3a88ae383d91ae680ed85","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_4083934e-2c4b-4b33-a10a-6c90cf7263e4","section_id":"sec_dc93c221-05a1-48c3-8721-0883e34129dd","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":8,"end":12,"exact":"EMIB","quote":"# Intel EMIB-T徹底解説――AI半導体の後工程が主戦場になる","quote_start":0,"quote_end":36,"text_sha256":"f2b80ef8067d46765b8f029cecfcbb3cbc689f207a6d01ca2f3219b906538191","block_sha256":"f2b80ef8067d46765b8f029cecfcbb3cbc689f207a6d01ca2f3219b906538191","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_4083934e-2c4b-4b33-a10a-6c90cf7263e4"},{"id":"occ_91c4a8b1c5605acecdfa2f3c","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_447187ce-418c-491f-9d5c-4d826cc9fbf3","section_id":"sec_aa3141d3-1cbd-45ec-8686-fb5b200ebdc4","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":1,"end":5,"exact":"EMIB","quote":"「EMIB-Tに興味があります」","quote_start":0,"quote_end":16,"text_sha256":"8a8276d54080b1b380f9ef88ac0c3fc80dbbebf7adb0e5503a7b10c19fe2fee4","block_sha256":"8a8276d54080b1b380f9ef88ac0c3fc80dbbebf7adb0e5503a7b10c19fe2fee4","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_447187ce-418c-491f-9d5c-4d826cc9fbf3"},{"id":"occ_b3614c4ecac965309573b4bd","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_461621be-5e14-4b7e-8ab9-76b24996d1d2","section_id":"sec_d9f261ed-1b78-4e09-861b-88ca53d33607","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":217,"end":221,"exact":"EMIB","quote":"         │\n     └──── Silicon Bridge ───┘\n             EMIB","quote_start":162,"quote_end":221,"text_sha256":"4a27b198490f1c47346ba687a669cbe6090124350dc13b7ae8eabefdd068dcab","block_sha256":"4a27b198490f1c47346ba687a669cbe6090124350dc13b7ae8eabefdd068dcab","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_461621be-5e14-4b7e-8ab9-76b24996d1d2"},{"id":"occ_8525f0ca4883aafffee47741","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_46cdcea0-bc18-44e0-9b71-dce82f43fba7","section_id":"sec_4505c3a3-552c-4b4d-a55f-17c89f3d9c69","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":16,"end":20,"exact":"EMIB","quote":"この案件が予定通り立ち上がれば、EMIB-Tにとって最大級の量産validationになる。","quote_start":0,"quote_end":46,"text_sha256":"523579f9e5e026801a8ee0398407b277a0d27de6cfaa020ac8edaa77a8c778e8","block_sha256":"523579f9e5e026801a8ee0398407b277a0d27de6cfaa020ac8edaa77a8c778e8","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_46cdcea0-bc18-44e0-9b71-dce82f43fba7"},{"id":"occ_30286850b7ffd75f3be69172","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_47836f01-ea2b-4529-b75b-5fd06a1656f9","section_id":"sec_dc93c221-05a1-48c3-8721-0883e34129dd","layer":"body","character_id":null,"count":1,"matched_aliases":["2.5D"],"evidence":{"text_basis":"markdown","start":39,"end":43,"exact":"2.5D","quote":"AI半導体の巨大化によって、「巨大なシリコンインターポーザを敷く」という従来の2.5Dパッケージ思想そのものが再検討され始めた可能性がある。","quote_start":0,"quote_end":70,"text_sha256":"8b203fc3f549cd290ee1e1feb9a345fa1d62938466c19eab624d31fa2ba45041","block_sha256":"8b203fc3f549cd290ee1e1feb9a345fa1d62938466c19eab624d31fa2ba45041","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_47836f01-ea2b-4529-b75b-5fd06a1656f9"},{"id":"occ_040513e6c085b8e16a9388cf","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_4a90f1f2-03e3-4672-af53-82dea28c5634","section_id":"sec_9b632a79-f1ae-4b15-b1c4-70967dc47c58","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":11,"end":15,"exact":"EMIB","quote":"## 第26章　なぜ今EMIB-Tが突然注目されているのか","quote_start":0,"quote_end":29,"text_sha256":"ee9973d164ad599bab2d5e558805e69e66fb918c1daf6307c815dfb5866bca7a","block_sha256":"ee9973d164ad599bab2d5e558805e69e66fb918c1daf6307c815dfb5866bca7a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_4a90f1f2-03e3-4672-af53-82dea28c5634"},{"id":"occ_fbd07029669758b3b86bf8a1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_4bb79fe0-ebfc-4c39-b3e7-3701c579caa4","section_id":"sec_41c2e18b-fabc-43ab-b567-3931d14e537d","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-TやCoWoSはもはや完成したチップを箱へ入れる工程ではない。","quote_start":0,"quote_end":36,"text_sha256":"720b52917d331771bb8d4b0b429bfd147fc8a569c409d9db2a06e97d3521687a","block_sha256":"720b52917d331771bb8d4b0b429bfd147fc8a569c409d9db2a06e97d3521687a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_4bb79fe0-ebfc-4c39-b3e7-3701c579caa4"},{"id":"occ_b74f13b5510cd9e5175dfbf2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_4c6693a8-ac63-4f6f-b2ed-57f10b28f05c","section_id":"sec_48b69c1f-4c21-4d62-bbd1-64526839c539","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":38,"end":42,"exact":"EMIB","quote":"HBM          GPU\n │            │\n └── EMIB-T ──┘","quote_start":0,"quote_end":48,"text_sha256":"050938b24dcfc2d9158a6ee525048bb7d333040a0cd11531da0295b93ff528ad","block_sha256":"050938b24dcfc2d9158a6ee525048bb7d333040a0cd11531da0295b93ff528ad","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_4c6693a8-ac63-4f6f-b2ed-57f10b28f05c"},{"id":"occ_b7e50296f96d95e0cd662df3","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_4d003be8-fbf1-4ab1-95d8-cf63705e09b9","section_id":"sec_32777b73-01b1-4a05-85c5-261e6189bd6b","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":7,"end":11,"exact":"EMIB","quote":"## 第7章　EMIB-T最大の問題――実はSilicon Bridgeではない","quote_start":0,"quote_end":40,"text_sha256":"1d3bd12868287bb251f3e837f766317fa11317647371471c58fbbb84b18bc74d","block_sha256":"1d3bd12868287bb251f3e837f766317fa11317647371471c58fbbb84b18bc74d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_4d003be8-fbf1-4ab1-95d8-cf63705e09b9"},{"id":"occ_dddc7ed2a7f925f7723ef312","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_4d5d1b4c-2519-4e4a-b219-9a5c0b8d9661","section_id":"sec_62f1641e-8093-4ad4-bd21-3ada37b6a90e","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":15,"end":19,"exact":"EMIB","quote":"## 第4章　2026年時点でEMIB-Tはどこまで来たのか","quote_start":0,"quote_end":30,"text_sha256":"5b0fae640e3f1839e9c359eadba6b868a8ac35ae6dff94140096de045d19ea63","block_sha256":"5b0fae640e3f1839e9c359eadba6b868a8ac35ae6dff94140096de045d19ea63","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_4d5d1b4c-2519-4e4a-b219-9a5c0b8d9661"},{"id":"occ_d1b553ce4163353cee67dc8e","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_4d77d282-8938-459f-9209-67e10211b40a","section_id":"sec_b047b7fb-8eb5-4b51-a6b7-59f22f66f964","layer":"body","character_id":null,"count":2,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tが優れているからCoWoSが消える、という考え方も極端である。","quote_start":0,"quote_end":37,"text_sha256":"dd1bf8fe2dbe8f5ee99cf0572f2d8edaec6585b14c4b717ac45a4b1394f9bba2","block_sha256":"dd1bf8fe2dbe8f5ee99cf0572f2d8edaec6585b14c4b717ac45a4b1394f9bba2","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_4d77d282-8938-459f-9209-67e10211b40a"},{"id":"occ_a3d6ea2b83d9a09cfa8d1818","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_4eb10d3d-947c-4db5-b4ed-5b8ef0132f21","section_id":"sec_f7389ab4-7e56-4068-a3ee-047783248455","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":10,"end":14,"exact":"EMIB","quote":"その意味では新しい「EMIB-like」が目指す可能性があるのは、","quote_start":0,"quote_end":33,"text_sha256":"811b97dbbb6a20114f1ff56b02d2a5db18445cf2c13ebb183a005c7bd61970ae","block_sha256":"811b97dbbb6a20114f1ff56b02d2a5db18445cf2c13ebb183a005c7bd61970ae","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_4eb10d3d-947c-4db5-b4ed-5b8ef0132f21"},{"id":"occ_cda249633d61c95e18b54c37","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_4ec8f97b-7764-4a07-a42e-f70057db9d49","section_id":"sec_d9f261ed-1b78-4e09-861b-88ca53d33607","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":2,"end":6,"exact":"EMIB","quote":"通常EMIBはすでに2017年から量産されており、FPGA、Xeon、GPUなど多数のIntel製品で実績を持つ。(Intel)","quote_start":0,"quote_end":64,"text_sha256":"2407b94578dfecdb04b39ae6b66e5050237ddb434ca5bbecefa955195bcdff42","block_sha256":"2407b94578dfecdb04b39ae6b66e5050237ddb434ca5bbecefa955195bcdff42","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_4ec8f97b-7764-4a07-a42e-f70057db9d49"},{"id":"occ_f995c605145131df2c31afd1","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_513aace8-c829-42af-baba-2002d5966173","section_id":"sec_03f348d1-f2c5-459b-8607-fad7b90f59d0","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":0,"end":4,"exact":"EMIB","quote":"EMIB-Tの経済性は、シリコン使用面積を減らす利点と、埋め込み精度、反り、25µm接続、TSV、基板検査の追加難度の差で決まる。全面インターポーザーを避ければ材料費を下げられる可能性があるが、基板工程の失敗","quote_start":0,"quote_end":104,"text_sha256":"f3cd5f09c5b98e564a49d67a3ae6275a27785a63e8ef4e862b1daf852d9131f6","block_sha256":"f3cd5f09c5b98e564a49d67a3ae6275a27785a63e8ef4e862b1daf852d9131f6","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_513aace8-c829-42af-baba-2002d5966173"},{"id":"occ_09533d931562a73d4265c9f2","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_54554ee7-5070-4439-b69f-39dd3c8799a7","section_id":"sec_4bb39b94-6583-4d5f-b8aa-b873803b2a2d","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":18,"end":23,"exact":"CoWoS","quote":"## 第30章　なぜTSMCが自分でCoWoSをカニバライズするのか","quote_start":0,"quote_end":34,"text_sha256":"bdbc4ff78a2e428442e930eddc07bac695b4eb906149f607a21ff22b2020bbdc","block_sha256":"bdbc4ff78a2e428442e930eddc07bac695b4eb906149f607a21ff22b2020bbdc","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_54554ee7-5070-4439-b69f-39dd3c8799a7"},{"id":"occ_d9a4a098ffc6bd2ca6fdceec","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_545a29fc-777f-4a58-a148-d518c34eeaea","section_id":"sec_8acb656d-933c-4ef2-b9f0-b12e0263045e","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":21,"end":25,"exact":"EMIB","quote":"一部報道では、次世代MediaTek案件でEMIB-Tを使用し2027年Q4量産とする情報もある。(IT之家)","quote_start":0,"quote_end":55,"text_sha256":"efebe4955583d0c3c309bbbc365ddc0fb0acf948ea041eb6a0ad47b22846f0b9","block_sha256":"efebe4955583d0c3c309bbbc365ddc0fb0acf948ea041eb6a0ad47b22846f0b9","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_545a29fc-777f-4a58-a148-d518c34eeaea"},{"id":"occ_f79aacf8996f90dad7590389","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_594daf5a-db11-46ba-bb1e-27d942ec2686","section_id":"sec_b047b7fb-8eb5-4b51-a6b7-59f22f66f964","layer":"body","character_id":null,"count":3,"matched_aliases":["CoWoS","EMIB"],"evidence":{"text_basis":"markdown","start":72,"end":77,"exact":"CoWoS","quote":"g\n       │\n ┌─────┼────────────┐\n ↓     ↓            ↓\nCoWoS-S CoWoS-L    EMIB-T\n ↓       ↓           ↓\n高密度   大型AI      大型・低コスト\n全面Si   RDL+LSI     Local Bridge","quote_start":17,"quote_end":176,"text_sha256":"9a82d7aaf870e618c9f7319e5774618be42bb01c229d34652aecafab7fb7ad3d","block_sha256":"9a82d7aaf870e618c9f7319e5774618be42bb01c229d34652aecafab7fb7ad3d","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_594daf5a-db11-46ba-bb1e-27d942ec2686"},{"id":"occ_11419d6dbb3b13d73da63505","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_5d45cdc2-2a39-4bdc-95c3-27e210e0aaff","section_id":"sec_41c2e18b-fabc-43ab-b567-3931d14e537d","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":7,"end":11,"exact":"EMIB","quote":"## 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図解｜CoWoSと局所ブリッジ方式の比較","quote_start":0,"quote_end":24,"text_sha256":"fbead9575eb68faccbbdefc216f44e4faa796edafbbbcc2fd06ed990504f777c","block_sha256":"fbead9575eb68faccbbdefc216f44e4faa796edafbbbcc2fd06ed990504f777c","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_5ddbf51c-e37b-4361-869f-ce1a400c6b2d"},{"id":"occ_4239272c9efe014117a96bd8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_5e1e5f7f-9045-463f-b8d1-1b21192493a8","section_id":"sec_3fcbe2a9-37a1-4a95-8ce1-3fb8602dfa73","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":3,"end":7,"exact":"EMIB","quote":"つまりEMIB-Tが成功しても、次のボトルネックが、","quote_start":0,"quote_end":26,"text_sha256":"49c7a40c0bbd23cc8fc47b6d375433d0b94be280751a5296ffc1138fd4b8d592","block_sha256":"49c7a40c0bbd23cc8fc47b6d375433d0b94be280751a5296ffc1138fd4b8d592","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa/#blk_5e1e5f7f-9045-463f-b8d1-1b21192493a8"},{"id":"occ_b43d3fd97a30708353b105a8","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_ec8dcee2-8cfa-47fc-b563-9c677fad17fa","work_id":"wrk_3f51fe9a-c519-4877-8cca-a97c9f8d7d8e","block_id":"blk_5e31da2b-c30c-4627-9d12-e142b12bdace","section_id":"sec_12d4cdff-4f3e-4e61-a0cb-7bbe533e8a97","layer":"body","character_id":null,"count":1,"matched_aliases":["EMIB"],"evidence":{"text_basis":"markdown","start":32,"end":36,"exact":"EMIB","quote":"═══════╗      ╔═══════\n       ║ EMIB ║\n═══════╝      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Die、修理性、熱密度という未解決問題も生じる。","quote_start":13,"quote_end":118,"text_sha256":"01ef40ab3578cbad901e17a01986001a50ed142546fe447ec3dd0c7f89c01476","block_sha256":"01ef40ab3578cbad901e17a01986001a50ed142546fe447ec3dd0c7f89c01476","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_f3a5d7c9-6dfa-4c38-8bf2-a37063801332/#blk_c2792e20-f9fc-4256-bd1a-6e3146881d94"},{"id":"occ_470e2a1d32c94dae5e0ad475","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_f76185ef-dd8b-44e4-a82a-7b8cc8225b9a","work_id":"wrk_72f5f141-da8e-4f5b-a337-f46180c37f2e","block_id":"blk_3d876670-1559-406f-973a-92faadc6e760","section_id":"sec_67adfe27-dc13-4969-8a55-d6a0d6bbe376","layer":"body","character_id":null,"count":1,"matched_aliases":["hybrid bonding"],"evidence":{"text_basis":"markdown","start":0,"end":14,"exact":"hybrid bonding","quote":"hybrid 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wafer supplyも確保したと説明している。([Cerebras](https://investors.cerebras.ai/","quote_start":0,"quote_end":120,"text_sha256":"2c8160456fda17a7d968a408238bd0cb485d7d00dc125c482f54dbbdac4b3874","block_sha256":"2c8160456fda17a7d968a408238bd0cb485d7d00dc125c482f54dbbdac4b3874","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_f76185ef-dd8b-44e4-a82a-7b8cc8225b9a/#blk_76107beb-352a-4936-ac08-04574d0c6398"},{"id":"occ_27d30b908d90dd406ff46134","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_f76185ef-dd8b-44e4-a82a-7b8cc8225b9a","work_id":"wrk_72f5f141-da8e-4f5b-a337-f46180c37f2e","block_id":"blk_e10c3be9-d7e3-4588-ba34-eedf5f9238f7","section_id":"sec_53a312b6-1f1e-4cd5-ac49-436b6583ab96","layer":"code","character_id":null,"count":4,"matched_aliases":["Hybrid 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Factoryの最新構造を、\n技術・製造・需給・経済性・企業業績の5方向から徹底調査してください。\n\n過去の記事や事前資料が存在することを前提にし","quote_start":338,"quote_end":507,"text_sha256":"d0317e48e4b1d07ef5f65318f00612f0383f8a1fc5a3cb0eff562f64288a732a","block_sha256":"d0317e48e4b1d07ef5f65318f00612f0383f8a1fc5a3cb0eff562f64288a732a","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_f76185ef-dd8b-44e4-a82a-7b8cc8225b9a/#blk_e10c3be9-d7e3-4588-ba34-eedf5f9238f7"},{"id":"occ_ec32819da1c5e674c2b8e384","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_f76185ef-dd8b-44e4-a82a-7b8cc8225b9a","work_id":"wrk_72f5f141-da8e-4f5b-a337-f46180c37f2e","block_id":"blk_e2d08c30-8ac1-45e8-bf40-25a0df695abb","section_id":"sec_be3bad09-7445-4d81-a42e-57107780330b","layer":"body","character_id":null,"count":1,"matched_aliases":["CoWoS"],"evidence":{"text_basis":"markdown","start":0,"end":5,"exact":"CoWoS","quote":"CoWoSを使わない。","quote_start":0,"quote_end":11,"text_sha256":"006e9bd1cd01b446a56422ec2156cc63281604041866303c07175f70366d3b97","block_sha256":"006e9bd1cd01b446a56422ec2156cc63281604041866303c07175f70366d3b97","offset_unit":"unicode_code_point"},"detection_method":"deterministic_literal","dictionary_revision":"topics-20260909-v1","review_status":"automatic_match","role":"unassessed","href":"articles/rev_f76185ef-dd8b-44e4-a82a-7b8cc8225b9a/#blk_e2d08c30-8ac1-45e8-bf40-25a0df695abb"},{"id":"occ_9f18838d9b499e9af4055f15","topic_id":"top_520e9a13-d7f7-4005-b2d9-c85982519e30","revision_id":"rev_f76185ef-dd8b-44e4-a82a-7b8cc8225b9a","work_id":"wrk_72f5f141-da8e-4f5b-a337-f46180c37f2e","block_id":"blk_e9bae879-3d67-4ce4-96de-ba08105c0839","section_id":"sec_997a80a1-58f7-46f0-8c72-ae88723eb1cb","layer":"body","character_id":null,"count":1,"matched_aliases":["Hybrid 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**先端パッケージング技術の進化:** 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パッケージング技術    | CoWoS-L                       | CoWoS-L (推定)               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